Electroplating solution circulating filtration system

Abstract

The utility model discloses a circulating filtration system for electroplating liquid. Comprising an electroplating bath, a first circulating pump connected with the bottom of the electroplating bath, a bag type filter connected with the first circulating pump, a circulating tank connected with a liquid outlet of the bag type filter, a second circulating pump connected with the circulating tank, and a filter element type filter connected with the second circulating pump, and a liquid outlet of the filter element type filter is connected with the electroplating bath. The electroplating liquid circulating filtration system provided by the utility model can effectively improve the filtration efficiency, improve the cleanliness of the electroplating liquid and reduce the operation cost.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating equipment technical field, concretely relates to a kind of electroplating solution circulation filtration system. BACKGROUND

[0002] Electroplating solution has the following effects in electroplating process: 1, provide metal ions: electroplating solution contains the metal ions (such as copper, tin, nickel, etc.) to be electroplated, these ions are reduced and deposited on the workpiece surface under the action of electric field, form electroplating layer;2, conduct electricity: electroplating solution as electrolyte, can conduct current, ensure that electroplating process is carried out normally;3, stabilize electroplating process: through buffer, complexing agent and other additives, maintain stable PH value and ion concentration, ensure that plating layer is uniform;4, ensure plating layer quality: additives (such as gloss agent, inhibitor, leveling agent, etc.) in electroplating solution can optimize plating layer gloss, flatness and adhesion;5, prevent side reaction: additives in electroplating solution can inhibit unnecessary side reaction, reduce plating layer defect;6, adjust deposition rate: by controlling the composition of electroplating solution and process parameters, the deposition speed of metal ions can be adjusted, so as to affect the thickness and quality of plating layer.In electroplating process, with the continuous electroplating operation, often have impurities such as dust, solid particles fall into electroplating tank, pollute electroplating solution, and then fall into the product to be plated, cause the quality problem such as burr, roughness of product after electroplating.Therefore, in the existing electroplating process, usually need to filter electroplating solution to ensure electroplating quality.

[0003] The existing electroplating solution filter, usually adopt filter core type filter to filter.But its filter core is easy to block, after blocking, affect filtration efficiency and electroplating solution cleanliness.In order to ensure the cleanliness of electroplating solution, filter core needs to be replaced in time, thereby increase operating cost.

[0004] In view of this, the utility model aims at providing a new electroplating solution circulation filtration system to solve the above technical problems. UTILITY MODEL CONTENT

[0005] The utility model aims at providing an electroplating solution circulation filtration system, which can effectively improve the filtration efficiency, improve the cleanliness of electroplating solution and reduce the operating cost.

[0006] The technical scheme of the utility model is as follows:

[0007] An electroplating solution circulation filtration system, comprising electroplating tank, first circulating pump connected with the bottom of the electroplating tank, bag filter connected with the first circulating pump, circulating tank connected with the liquid outlet of the bag filter, second circulating pump connected with the bottom of the circulating tank, filter core type filter connected with the second circulating pump, and the liquid outlet of the filter core type filter is connected with the electroplating tank.

[0008] Further, the number of the bag filters is multiple, and the bag filters are distributed in parallel.

[0009] Further, the first circulating pump and the second circulating pump are respectively provided with a frequency converter, and a flow meter and a flow valve are respectively arranged on a connecting pipeline of the first circulating pump and the bag filter and a connecting pipeline of the second circulating pump and the filter element filter, and the flow meter is electrically connected with the frequency converter of the corresponding circulating pump.

[0010] Further, the bottom of the electroplating tank is a sloping plane, and the connecting position of the first circulating pump and the electroplating tank is located at the lowest position of the sloping plane of the electroplating tank.

[0011] Further, the bottom of the circulating tank is a sloping plane, and the connecting position of the second circulating pump and the circulating tank is located at the lowest position of the sloping plane of the circulating tank.

[0012] Compared with the prior art, the electroplating liquid circulating filtration system has the beneficial effects that:

[0013] Firstly, the electroplating liquid circulating filtration system connects the bag filter and the filter element filter in series, the electroplating liquid first enters the bag filter, so that large-particle pollutants are intercepted, and then the electroplating liquid passes through the filter element filter for filtration, thereby further ensuring that fine-particle pollutants in the electroplating liquid are intercepted.

[0014] Secondly, the electroplating liquid circulating filtration system has multiple bag filters, and the bag filters are distributed in parallel, so that the filtration efficiency is further improved.

[0015] Thirdly, the electroplating liquid circulating filtration system controls the motor rotating speed of the first circulating pump and the second circulating pump to control the flow of the bag filter and the filter element filter, so that the flow of the two-stage filter is adjusted according to specific working conditions, and problems such as insufficient flow or excessive pressure loss are avoided, thereby ensuring efficient operation of the filtration circulating system.

[0016] Fourthly, the electroplating liquid circulating filtration system has a sloping plane at the bottom of the electroplating tank and the circulating tank, and the first circulating pump and the second circulating pump are respectively connected to the lowest position of the sloping plane of the electroplating tank and the circulating tank, so that the electroplating liquid in the electroplating tank and the circulating tank is completely replaced and filtered, and the cleanliness of the electroplating liquid is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed in the following embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort.

[0018] Figure 1 The figure is a structural schematic diagram of the electroplating solution circulating filtration system of the present application. DETAILED DESCRIPTION

[0019] In order to make the person skilled in the art better understand the technical scheme in the embodiments of the present application, and make the above-mentioned purpose, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be further described below with reference to the drawings.

[0020] It should be noted that the description of these embodiments is used to help understand the present application, but does not constitute a limitation of the present application. In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as they do not conflict with each other.

[0021] Please refer to Figure 1 The figure is a structural schematic diagram of the electroplating solution circulating filtration system of the present application. The electroplating solution circulating filtration system of the present application comprises an electroplating tank 1, a first circulating pump 2 connected to the bottom of the electroplating tank 1, a bag filter 3 connected to the first circulating pump 2, a circulating tank 4 connected to the liquid outlet of the bag filter, a second circulating pump 5 connected to the bottom of the circulating tank 4, and a filter element filter 6 connected to the second circulating pump 5. The liquid outlet of the filter element filter is connected to the electroplating tank 1, so that the filtered electroplating solution can be delivered into the electroplating tank, realizing the filtration and circulation of the electroplating solution.

[0022] In the present application, the bottom of the electroplating solution 1 is a sloping plane, and the connection position of the first circulating pump 2 and the electroplating tank is located at the lowest part of the sloping plane of the electroplating tank, which can ensure that the electroplating solution in the electroplating tank is completely replaced and filtered, avoiding the problem of insufficient filtration caused by the bottom electroplating solution not flowing.

[0023] The first circulating pump 2 is used to deliver the electroplating solution into the bag filter. A flow meter 7a and a flow valve 8a are arranged on the connecting pipeline of the first circulating pump and the bag filter. The first circulating pump 2 is provided with a frequency converter (not shown). The flow meter 7a is electrically connected to the frequency converter of the first circulating pump. The flow meter 7a sends the detected flow signal to the frequency converter. The frequency converter is used to control the motor speed of the first circulating pump 2, so as to control the output flow of the first circulating pump.

[0024] In the embodiment, the number of the bag filters 3 is multiple, and is distributed in parallel, so that the processing capacity of the electroplating solution is increased, and the filtering efficiency is improved. Correspondingly, the number of the first circulating pumps can also be multiple. In the utility model, the bag filter is used as the first-stage filter, and is used for filtering the large particles in the electroplating solution, so that the particles contained in the electroplating solution entering the next-stage filter are smaller.

[0025] The circulating tank 4 is used as a buffer storage tank, and is used for storing the electroplating solution filtered by the bag filter 3, so that the flow of the electroplating solution entering the second-stage filter is stable. In the embodiment, the bottom of the circulating tank 4 is also a slanted plane, and the connecting position of the second circulating pump 5 with the circulating tank is located at the lowest position of the slanted plane of the circulating tank, so that the electroplating solution in the circulating tank is completely replaced and filtered, and the problem of insufficient filtering caused by the electroplating solution at the bottom not flowing is avoided.

[0026] The second circulating pump 5 is used for conveying the electroplating solution to the filter core filter 6, so as to perform secondary filtering. The connecting pipeline of the second circulating pump 5 with the filter core filter is provided with a flow meter 7b and a flow valve 8b, and the second circulating pump 5 is provided with a frequency converter (not shown in the figure). The flow meter 7b is electrically connected with the frequency converter of the second circulating pump, the flow meter 7b sends the detected flow signal to the frequency converter, and the frequency converter is used for controlling the rotating speed of the motor of the second circulating pump 5, so as to control the output flow of the second circulating pump.

[0027] In the embodiment, the filter core filter 6 is used as the second-stage filter, and is used for filtering the small particle pollutants in the electroplating solution. According to the process requirement, the number of the filter core filters 6 can be multiple, and is distributed in parallel, so as to improve the filtering efficiency. Since the filtering system of the utility model adopts the two-stage filtering mode, the pollutants contained in the electroplating solution entering the filter core filter are smaller, so that the filter is not easy to be blocked, and the filtering efficiency of the electroplating solution is improved. The two-stage filtering can respectively intercept pollutants of different particle sizes, so as to ensure the cleanliness of the electroplating solution. Since the filter core filter is used as the second-stage filter, the filter core is not easy to be blocked, so that the frequency of replacing the filter core is reduced, and the operation cost is reduced.

[0028] The embodiments of the utility model are described in detail in combination with the drawings, but the utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, replacements and modifications of the embodiments without departing from the principles and spirits of the utility model still fall within the protection scope of the utility model.

Claims

1. An electroplating solution recirculation filtration system characterized by, The electroplating tank is connected with a first circulating pump at the bottom, the first circulating pump is connected with a bag filter, the bag filter is connected with a circulating tank at the liquid outlet, the circulating tank is connected with a second circulating pump at the bottom, and the second circulating pump is connected with a filter element filter, and the liquid outlet of the filter element filter is connected with the electroplating tank.

2. The electroplating solution circulation filtration system of claim 1, wherein, The number of the bag filters is multiple, and the bag filters are distributed in parallel.

3. The electroplating solution circulation filtration system of claim 2, wherein, The first circulating pump and the second circulating pump are respectively provided with a frequency converter, and the connecting pipeline of the first circulating pump and the bag filter and the connecting pipeline of the second circulating pump and the filter element filter are respectively provided with a flow meter and a flow valve, and the flow meter is electrically connected with the frequency converter of the corresponding circulating pump.

4. The electroplating solution circulation filtration system of claim 1, wherein, The bottom of the electroplating tank is a sloping plane, and the connecting position of the first circulating pump and the electroplating tank is located at the lowest part of the sloping plane of the electroplating tank.

5. The electroplating solution circulation filtration system of claim 1, wherein, The bottom of the circulating tank is a sloping plane, and the connecting position of the second circulating pump and the circulating tank is located at the lowest part of the sloping plane of the circulating tank. The bottom of the electroplating tank is a sloping plane, and the connecting position of the first circulating pump and the electroplating tank is located at the lowest part of the sloping plane of the electroplating tank. The bottom of the circulating tank is a sloping plane, and the connecting position of the second circulating pump and the circulating tank is located at the lowest part of the sloping plane of the circulating tank.

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