Semiconductor refrigeration waist-hanging fan

By employing a dual-fan design and semiconductor cooling structure in the waist-mounted fan with semiconductor cooling, the problems of low efficiency, complex structure, and limited wind power adjustment in portable cooling and heat dissipation devices are solved, achieving both high-efficiency cooling and heat dissipation and portability.

CN223952905UActive Publication Date: 2026-02-27YAOYUAN (SHENZHEN) TECH CO LTD
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Patent Information

Application Number
CN202520695959.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-14
Publication Date
2026-02-27
Estimated Expiration
2035-04-14

AI Technical Summary

Technical Problem

Existing portable cooling and heat dissipation devices suffer from low cooling and heat dissipation efficiency, complex structure, large weight, high cost, and limited wind power adjustment function.

Method used

It adopts a semiconductor-cooled waist-mounted fan, combining a dual-fan design, a semiconductor cooling structure, and adjustable airflow output. It achieves efficient cooling and heat dissipation through thermal coupling between semiconductor components and heat-conducting plates, simplifying the device structure and increasing portability.

Benefits of technology

It improves cooling and heat dissipation efficiency, simplifies equipment structure, expands the range of wind power adjustment, reduces equipment weight and cost, and meets the usage needs of different environments.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a semiconductor refrigeration waist-hanging fan, which belongs to the field of refrigeration equipment and comprises a shell, a control mechanism, an air blowing mechanism, a cold conduction mechanism and a power supply, and the control mechanism, the air blowing mechanism, the cold conduction mechanism and the power supply are arranged in the shell and are electrically connected to form a closed circuit. The two symmetrical ends of the outer side wall of the shell are fixedly connected with the two ends of the hanging rope correspondingly to form an annular structure, the cold conduction mechanism comprises a semiconductor element electrically connected with the control mechanism and a heat conduction piece embedded in the side wall of the shell, and the semiconductor element is thermally coupled with the heat conduction piece. The portable air conditioner has remarkable advantages in the aspects of refrigeration and heat dissipation efficiency, structural design, wind power adjusting range, power supply cruising ability and the like, can effectively meet the portable refrigeration and heat dissipation requirements of a user, can achieve an ideal refrigeration or heat dissipation effect in a short time, and is reasonable in layout, simple in structure and high in portability and reliability.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a fan, concretely relates to a semiconductor refrigeration waist-hung fan and belongs to the field of refrigeration equipment. BACKGROUND

[0002] With the continuous progress of science and technology and the increasing improvement of people's living standards, the demand for portable refrigeration and heat dissipation equipment gradually increases. Such products were initially designed to provide instant refrigeration or heat dissipation functions in environments without fixed refrigeration or heat dissipation equipment, such as outdoor activities, travel, temporary work sites, etc. Existing portable refrigeration and heat dissipation equipment usually uses a small-sized compressor or a semiconductor refrigeration sheet as the core refrigeration element, and cooperates with a fan and a heat sink to achieve the refrigeration and heat dissipation functions. Although these devices meet the portability requirements to some extent, they still have many limitations in design and performance.

[0003] The existing portable refrigeration and heat dissipation equipment generally has the problem of low refrigeration and heat dissipation efficiency. Traditional equipment mostly uses a single refrigeration or heat dissipation method, which cannot simultaneously and efficiently perform refrigeration and heat dissipation. For example, many devices rely only on fans and heat sinks for heat dissipation, while the refrigeration part relies on refrigerant circulation or semiconductor refrigeration sheets. This separate design results in low overall efficiency. In addition, the structural design of existing equipment is relatively complex, with numerous internal components and unreasonable layout, which not only increases the volume and weight of the equipment, but also increases the manufacturing cost and maintenance difficulty. At the same time, the wind power adjustment function of existing equipment is usually limited, only allowing switching between several fixed gears, which cannot meet the fine adjustment needs of users in different environments.

[0004] Therefore, how to improve the refrigeration and heat dissipation efficiency of portable refrigeration and heat dissipation equipment, simplify the equipment structure to reduce cost and weight, and expand the wind power adjustment range to adapt to different environmental needs has become a technical problem that needs to be solved by technical personnel in the field. SUMMARY

[0005] Therefore, the utility model provides a semiconductor refrigeration waist-hung fan to solve the above-mentioned problems existing in the prior art.

[0006] The technical solution of the utility model to solve the above-mentioned technical problems is as follows:

[0007] A semiconductor refrigeration waist-hung fan, comprising: a shell and a control mechanism, a blowing mechanism, a cold conduction mechanism and a power supply arranged in the shell and electrically connected to form a closed circuit;

[0008] The upper end face and the lower end face of the shell are respectively provided with air outlets and air inlets matched with the air blowing mechanism, the outer side wall of the shell is fixedly connected with the two ends of the hanging rope to form an annular structure, the cold conducting mechanism comprises a semiconductor element electrically connected with the control mechanism and a heat conducting sheet embedded on the side wall of the shell, and the semiconductor element is thermally coupled with the heat conducting sheet.

[0009] On the basis of the above technical scheme, the utility model further can make improvement as follows.

[0010] Further, the control mechanism comprises a circuit board arranged in the shell and a display screen and control buttons embedded on the shell.

[0011] Further, the air blowing mechanism comprises at least one motor and a fan blade arranged on the output shaft of the motor.

[0012] Further, the number of the air blowing mechanism is 2, and the air blowing mechanism is symmetrically arranged around the central axis of the inner cavity of the shell.

[0013] Further, the air outlet is flatly arranged on the upper end face of the shell.

[0014] Further, at least one fixing buckle is arranged on the side of the shell away from the heat conducting sheet.

[0015] Further, at least one side wall of the shell is bent to be in line with the curve of the waist.

[0016] Further, the heat conducting sheet is a metal heat conducting sheet or an ice porcelain heat conducting sheet.

[0017] The utility model has the advantages of:

[0018] The utility model has remarkable advantages in refrigeration and heat dissipation efficiency, structural design, wind force adjusting range and power endurance, can effectively meet the portable refrigeration and heat dissipation demand of user, on the basis that the equipment realizes high -efficient air blowing by adopting double fan, big air outlet, is equipped with semiconductor heat conducting structure, adopts semiconductor refrigeration, and temperature conduction is carried out with heat conducting sheet, and the refrigeration and heat dissipation efficiency is remarkably improved, can reach ideal refrigeration or heat dissipation effect in short time, and the layout is reasonable, and the structure is simple, and the portability and reliability are high. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is overall structure schematic view of the utility model;

[0020] Figure 2 It is bottom structure schematic view of the utility model;

[0021] Figure 3 It is structure explosion drawing of the utility model;

[0022] Figure 4 It is structure sectional view of the utility model.

[0023] The attached diagram lists the components represented by each number as follows:

[0024] 1. Housing, 2. Air outlet, 3. Air inlet, 4. Semiconductor component, 5. Heat sink, 6. Circuit board, 7. Display screen, 8. Control button, 9. Motor, 10. Fan blade, 11. Fixing clip, 12. Power supply. Detailed Implementation

[0025] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.

[0026] like Figures 1-4 As shown, a semiconductor cooling waist fan includes: a housing 1 and a control mechanism, a blower mechanism, a cooling mechanism, and a power supply 12 disposed within the housing 1 and electrically connected to form a closed circuit;

[0027] The upper and lower ends of the housing 1 are respectively provided with an air outlet 2 and an air inlet 3 that cooperate with the blower mechanism. The two ends of the outer side wall of the housing 1 are respectively fixedly connected to the two ends of the hanging rope to form a ring structure. The cooling mechanism includes a semiconductor element 4 electrically connected to the control mechanism and a heat-conducting plate 5 embedded in the side wall of the housing 1. The semiconductor element 4 and the heat-conducting plate 5 are thermally coupled.

[0028] Thermal coupling refers to the phenomenon of heat exchange between two or more thermodynamic systems. This heat exchange can be carried out through heat conduction, heat convection or heat radiation, and does not require physical contact. That is, the semiconductor element 4 and the heat-conducting plate 5 can be physically attached or there can be a certain gap between them.

[0029] After the cooling mechanism is cooled by semiconductor, heat is transferred through heat-conducting plate 5. Semiconductor cooling, also known as thermoelectric cooling, is a technology that uses the Peltier effect of semiconductor materials to achieve cooling or heating. By driving the semiconductor element 4 with current, heat is transferred from the cold end to the hot end, thereby achieving the effect of cooling or heating. It has the advantages of no noise and vibration, small size, light weight, precise temperature control, long life and low maintenance cost.

[0030] In another embodiment of this utility model, the control mechanism includes a circuit board 6 disposed in the housing 1 and a display screen 7 and control buttons 8 embedded in the housing 1, for displaying the device status and adjusting the device parameters, such as displaying the working status and remaining power through the display screen 7, and controlling the air volume, fan on / off status, cooling mode, etc. through the control buttons 8.

[0031] In another embodiment of the present invention, the blower mechanism includes at least one motor 9 and a fan blade 10 disposed on the output shaft of the motor 9.

[0032] In another embodiment of the utility model, the number of blowing mechanism is 2, is arranged around the axis of symmetry in the inner chamber of casing 1, can realize air volume regulation through control mechanism, namely control the working number of motor 9, realizes different air outlet effect.

[0033] In another embodiment of the utility model, air outlet 2 is laid on the upper end surface of casing 1.

[0034] In another embodiment of the utility model, power supply 12 is rechargeable power supply, and forms charging socket on casing 1 through wire.

[0035] In another embodiment of the utility model, casing 1 has at least one fixed buckle 11 on the side away from heat conduction sheet 5, is directly fixed in waist by waistband etc. with the user, makes it more conformal, and can make it more firm with the use of hanging rope.

[0036] In another embodiment of the utility model, at least one side wall of casing 1 is bent to the curve of conforming to waist, makes it more conformal to the waist of user, improves cooling effect, wherein " at least one side wall " refers to at least the side wall conforming to the waist of user, namely the side wall embedded with heat conduction sheet 5, simultaneously, the side wall with hanging buckle can also be set to the same shape, makes the whole more beautiful and coordinated.

[0037] In another embodiment of the utility model, heat conduction sheet 5 is used for conducting cold to shell, adopts metal material or ice porcelain material, also can adopt other material with excellent heat conduction performance, wherein, ice porcelain material is a composite material prepared from ceramic powder and ice porcelain filler, realizes the absorption and emission of thermal energy based on the characteristics of material, has good thermal conductivity, heat capacity and adsorption performance, can quickly absorb thermal energy and conduct it to ice porcelain filler, then releases thermal energy through the mode of heat dissipation, realizes the effect of cooling.

[0038] When using, control button 8 controls its working state, such as switch, air volume (motor 9 output power), refrigeration mode (motor 9 opening number, whether semiconductor element 4 works or not), after being turned on, motor 9 output drives fan blade 10 to rotate, air enters casing 1 by lower end surface air inlet 3 of casing 1, and is blown out by upper end surface air outlet 2 of casing 1, forms air circulation, current can pass through semiconductor element 4 at this time, makes it cool down quickly, and carries out heat conduction through heat conduction sheet 5, heat conduction sheet 5 is used to conform to the waist of user, can carry out the rapid cooling of conformal surface.

[0039] The above only is the preferred embodiment of the utility model, and does not use to limit the utility model, any modification, equivalent replacement, improvement etc. that is made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A semiconductor-cooled waist-mounted fan, characterized in that, Includes: a housing and a control mechanism, a blower mechanism, a cooling mechanism, and a power supply disposed within the housing and electrically connected to form a closed circuit; The upper and lower surfaces of the housing are respectively provided with an air outlet and an air inlet that cooperate with the blower mechanism. The two ends of the outer side wall of the housing are symmetrically connected to the two ends of the hanging rope to form a ring structure. The cooling mechanism includes a semiconductor element electrically connected to the control mechanism and a heat-conducting plate embedded in the side wall of the housing. The semiconductor element and the heat-conducting plate are thermally coupled.

2. The semiconductor-cooled waist-mounted fan according to claim 1, characterized in that, The control mechanism includes a circuit board disposed within the housing and a display screen and control buttons embedded in the housing.

3. The semiconductor-cooled waist-mounted fan according to claim 1, characterized in that, The blower mechanism includes at least one motor and fan blades disposed on the output shaft of the motor.

4. The semiconductor-cooled waist-mounted fan according to claim 1 or 3, characterized in that, The number of blower mechanisms is two, which are symmetrically arranged around the central axis of the inner cavity of the housing.

5. The semiconductor-cooled waist-mounted fan according to claim 1, characterized in that, The air outlet is laid flat on the upper surface of the housing.

6. The semiconductor-cooled waist-mounted fan according to claim 1, characterized in that, The housing has at least one retaining clip on the side away from the heat-conducting sheet.

7. The semiconductor-cooled waist-mounted fan according to claim 1, characterized in that, At least one side wall of the housing is bent into a curve that fits the waist.

8. The semiconductor-cooled waist-mounted fan according to claim 1, characterized in that, The heat-conducting sheet is a metal heat-conducting sheet or a ceramic heat-conducting sheet.