Temperature sensing probe mounting structure and air conditioner

Abstract

The utility model relates to a temperature sensing probe mounting structure and an air conditioner, the temperature sensing probe mounting structure comprises a first pipe fitting and a second pipe fitting, the first pipe fitting or the second pipe fitting is a temperature sensing pipe, and the interior of the temperature sensing pipe is used for mounting a temperature sensing probe; a nugget formed by spot welding and a solder layer arranged on the periphery of the nugget are arranged between the first pipe fitting and the second pipe fitting, and the first pipe fitting and the second pipe fitting are welded and fixed through the nugget and the solder layer. In the welding process of the first pipe fitting and the second pipe fitting, the nugget can firstly fix the first pipe fitting and the second pipe fitting in a spot welding manner, so that the first pipe fitting and the second pipe fitting do not need to be bound together by using an iron wire in the prior art, and the production efficiency of the temperature sensing probe mounting structure is further improved. Meanwhile, the first pipe fitting and the second pipe fitting do not need to be fixed by an iron wire, so that the element diffusion phenomenon among the first pipe fitting, the second pipe fitting and the iron wire is avoided, and the yield of the temperature sensing probe mounting structure is further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of pipe connection, in particular to a temperature sensing probe mounting structure and an air conditioner. BACKGROUND

[0002] In an air conditioning system, the connection between two pipes is often involved, such as connecting a temperature sensing pipe to a pipe to be measured. The temperature sensing pipe is internally provided with a temperature sensor or a temperature sensing probe. The core function of the temperature sensing probe is to monitor the surface temperature of the pipe to be measured in real time and feed back the data to the control system in the air conditioner to realize accurate adjustment of the refrigeration / heating cycle. To achieve this function, the temperature sensing pipe needs to be in close contact with the surface of the pipe to be measured, and the fixing method between the temperature sensing pipe and the pipe to be measured needs to ensure the long-term stability between the two.

[0003] In the traditional technology, the two pipes are usually fixed together by welding. In order to avoid the welding deviation caused by the sliding of the contact surface between the two pipes during welding, the two pipes are usually bound together by a wire first, and then the wire is removed after the two pipes are welded by seam welding (continuous spot welding to form a sealed weld).

[0004] However, since the wire is tightly bound to the pipe, some element diffusion will occur between the wire and the pipe during welding. When the wire is removed, the pipe may be damaged, and some wire marks may remain on the pipe, affecting the appearance. In addition, the proficiency of winding and removing the wire will affect the production efficiency of the pipe connection structure and the air conditioner. Invention content

[0005] Therefore, it is necessary to provide a temperature sensing probe mounting structure and an air conditioner which can improve the production efficiency and product yield.

[0006] A temperature sensing probe mounting structure, comprising a first pipe and a second pipe, the first pipe or the second pipe being a temperature sensing pipe, the temperature sensing pipe being internally provided with a temperature sensing probe; a nugget formed by spot welding is arranged between the first pipe and the second pipe, and a solder layer is arranged outside the nugget, and the first pipe and the second pipe are welded and fixed through the nugget and the solder layer.

[0007] In one of the embodiments, the axial direction of the first pipe is parallel to the axial direction of the second pipe, and the nugget is arranged on the outer peripheral wall of the first pipe.

[0008] In one of the embodiments, a wire is arranged between the first pipe and the second pipe, part of the wire forms the nugget after spot welding, and the part of the wire which is not spot welded is defined as a remaining part, and the remaining part is arranged in the solder layer.

[0009] In one of the embodiments, the molten core is a point-shaped molten core.

[0010] And / or, the molten core is a filament-shaped molten core, and an extending direction of the filament-shaped molten core intersects with an axial direction of the first pipe.

[0011] In one of the embodiments, the molten core is a filament-shaped molten core, and an angle between an extending direction of the filament-shaped molten core and an axial direction of the first pipe is α,

[0012] A length of any one of the remaining portions is L1, a shortest distance between an end of the filament-shaped molten core and an end of the first pipe is L2, a shortest distance between the end of the filament-shaped molten core and an end of the second pipe is L3, L1*Sinα≤L3≤L2.

[0013] In one of the embodiments, the molten core is a sheet-shaped molten core, and the sheet-shaped molten core is located in the solder layer.

[0014] In one of the embodiments, a length of the sheet-shaped molten core along a circumferential direction of the first pipe is L, and 1mm≤L≤3mm.

[0015] In one of the embodiments, along a radial direction of the first pipe, a thickness of the molten core is H, and 0.05mm≤H≤0.1mm.

[0016] In one of the embodiments, the molten core is provided as at least two, and a plurality of the molten cores are sequentially and spacedly provided along an axial direction of the first pipe.

[0017] In one of the embodiments, the first pipe and the second pipe are pipes made of different metals.

[0018] And / or, a length of the first pipe is greater than a length of the second pipe, and the second pipe is a temperature-sensing pipe.

[0019] The application further provides an air conditioner comprising the temperature-sensing probe mounting structure as described in any one of the above embodiments.

[0020] Compared with the prior art, the temperature sensing probe mounting structure provided in the application has the first pipe or the second pipe being a temperature sensing pipe for mounting the temperature sensing probe; during welding of the first pipe and the second pipe, a nugget is arranged between the first pipe and the second pipe, and the second pipe is welded to the first pipe at the nugget through a solder layer, so that the nugget can first fix the first pipe and the second pipe in the form of resistance spot welding, thereby eliminating the need to use a wire to preliminarily bind the first pipe and the second pipe together, and further improving the production efficiency of the temperature sensing probe mounting structure. Meanwhile, since the first pipe and the second pipe do not need to be fixed by using a wire, the element diffusion phenomenon between the first pipe, the second pipe and the wire is avoided, and further the yield of the temperature sensing probe mounting structure is improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0022] Figure 1 It is a perspective view of the temperature sensing probe mounting structure of an embodiment of the present application;

[0023] Figure 2 It is another perspective view of the temperature sensing probe mounting structure of an embodiment of the present application from another angle;

[0024] Figure 3 It is a sectional view of the temperature sensing probe mounting structure of an embodiment of the present application;

[0025] Figure 4 It is Figure 3 It is a local enlarged view of position A in FIG. 5;

[0026] Figure 5 It is a position schematic view of the wire in an embodiment of the present application;

[0027] Figure 6 It is a schematic view of the wire nugget and the first pipe in an embodiment of the present application;

[0028] Figure 7 It is a sectional view of the temperature sensing probe mounting structure in an embodiment of the present application;

[0029] Figure 8 It is a structure diagram of an air conditioner provided in an embodiment of the present application.

[0030] Reference numerals: 1, air conditioner; 10, temperature probe mounting structure; 110, first pipe; 120, second pipe; 130, nugget; 1301, filament nugget; 140, solder layer; 150, remaining portion; 20, condenser; 30, compressor; 40, evaporator; 50, throttling device; 60, pipe. DETAILED DESCRIPTION

[0031] In order to make the above objectives, features and advantages of the present application more clear and easily understood, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application can be practiced without using some or all of these specific details, and that the present application is not limited to the specific embodiments disclosed below.

[0032] It is to be noted that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements can also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. It will be understood by those skilled in the art that, when a device or structure is referred to as being "on" or "connected to" another device or structure, it can be directly on or connected to the other device or structure, or intervening devices or structures can also be present. The term "vertical", "horizontal", "up", "down", "left", "right", and similar terms used in the description of the present application are used for the purpose of illustration only and do not indicate the only orientation of the present application.

[0033] In addition, the terms "first", "second", etc. are used herein only to describe various elements, but do not imply or suggest relative importance or a number of the indicated technical features. Thus, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0034] In the present application, unless otherwise explicitly specified and limited, the "on" or "under" of the first feature to the second feature can be that the first feature is directly in contact with the second feature, or the first feature is indirectly in contact with the second feature through an intermediate medium. Moreover, the "over", "above" and "on" of the first feature to the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "under", "below" and "under" of the first feature to the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0035] Unless otherwise defined, all technical and scientific terms used in the application's specification are intended to have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the application's specification is for describing particular embodiments only and is not intended to be limiting of the application. The use of the terms "and / or" includes a combination of one or more of the associated listed items.

[0036] Referring to Figures 1 to 7 The application provides a temperature sensing probe mounting structure 10, comprising a first pipe 110 and a second pipe 120, the first pipe 110 or the second pipe 120 is a temperature sensing pipe, the inside of the temperature sensing pipe is used for mounting a temperature sensing probe; a nugget 130 formed by spot welding is arranged between the first pipe 110 and the second pipe 120, and a solder layer 140 is arranged outside the nugget 130, the first pipe 110 and the second pipe 120 are fixed by welding through the nugget 130 and the solder layer 140.

[0037] It can be understood that, in the welding process of the first pipe 110 and the second pipe 120, since the nugget 130 is arranged between the first pipe 110 and the second pipe 120, and the second pipe 120 is fixed at the nugget 130 by welding through the solder layer 140 and the first pipe 110, the nugget 130 can first fix the first pipe 110 and the second pipe 120 in the form of resistance spot welding, so that it is not necessary to use a wire to bind the first pipe 110 and the second pipe 120 together as in the prior art, thereby improving the production efficiency of the temperature sensing probe mounting structure 10. At the same time, since the first pipe 110 and the second pipe 120 do not need to be fixed by using a wire, the element diffusion phenomenon between the first pipe 110, the second pipe 120 and the wire is avoided, thereby improving the yield of the temperature sensing probe mounting structure 10.

[0038] It should be noted that the welding method of the first pipe 110 and the second pipe 120 of the temperature sensing probe mounting structure 10 is that a first material is added between the first pipe 110 and the second pipe 120 to act as a protrusion, the first material is melted between the first pipe 110 and the second pipe 120 to form a nugget 130 in a resistance spot welding manner, a second material is arranged at the outer periphery of the nugget 130, and the second material is melted into a solder layer 140 in a brazing manner, so that the first pipe 110 and the second pipe 120 are welded and fixed through the nugget 130 and the solder layer 140. Illustratively, the first material is metal, wire, foil or other materials selected according to the materials of the first pipe 110 and the second pipe 120, which is not limited in the present application, as long as the first material can be melted into the nugget 130 between the first pipe 110 and the second pipe 120. Illustratively, the second material is a copper-tin soldering paste or other materials selected according to the materials of the first pipe 110 and the second pipe 120, which is not limited in the present application, as long as the second material can weld and fix the first pipe 110 and the second pipe 120.

[0039] It can be understood that, compared with the method of punching a protrusion on the first pipe 110 or the second pipe 120 and then resistance welding, since the embodiment adds a first material between the first pipe 110 and the second pipe 120 to make the first material act as a protrusion, thus, not only the process of punching a protrusion on the first pipe 110 or the second pipe 120 is saved, the production efficiency is improved, but also the risk of local cracks on the first pipe 110 or the second pipe 120 caused by punching a protrusion is avoided, and the yield of the temperature sensing probe mounting structure 10 is improved.

[0040] It should be noted that the axial direction of the first pipe 110 and the axial direction of the second pipe 120 are arranged in cross, or the axial direction of the first pipe 110 and the axial direction of the second pipe 120 are arranged in parallel, as long as the first pipe 110 and the second pipe 120 can be welded and fixed. Further, when the axial direction of the first pipe 110 and the axial direction of the second pipe 120 are arranged in parallel, the first pipe 110 can be arranged in parallel with the second pipe 120, or can be connected in sequence along the axial direction of the first pipe 110, which is not limited in the present application, as long as the first pipe 110 and the second pipe 120 can be welded and fixed.

[0041] In one embodiment, the first pipe 110 and the second pipe 120 are pipes made of different metals. In this way, the temperature-sensing probe mounting structure 10 can be applied to the connection between two pipes made of different metals in an air conditioning system. For example, the first pipe 110 is a steel pipe, and the second pipe 120 is a copper pipe, or the first pipe 110 is a copper pipe, and the second pipe 120 is a steel pipe, or one of the first pipe 110 and the second pipe 120 is a metal pipe, and the other is a stainless steel pipe.

[0042] In other embodiments, the temperature-sensing probe mounting structure 10 can also be applied to the connection between two pipes made of the same metal in an air conditioning system. For example, the first pipe 110 and the second pipe 120 are both stainless steel pipes, both copper pipes, or both steel pipes. Pipes made of the same metal are easy to weld, and the welding effect is good. After welding, the connection strength is high, and the structure is stable.

[0043] Further, the length of the first pipe 110 is greater than the length of the second pipe 120, and the second pipe 120 is a temperature-sensing pipe. It can be understood that, at this time, the first pipe 110 is a pipe in a heat exchanger. By using the second pipe 120 in the present embodiment as a temperature-sensing pipe, the temperature-sensing pipe can be in close contact with the surface of the heat exchanger pipe, and the fixing method of the temperature-sensing probe mounting structure 10 in the present embodiment can ensure the long-term stability between the temperature-sensing pipe and the heat exchanger pipe. In addition, as described above, when the temperature-sensing pipe and the heat exchanger pipe are the temperature-sensing probe mounting structure 10 described above, the production efficiency of the temperature-sensing pipe and the heat exchanger pipe is high, and the risk of local cracks on the temperature-sensing pipe or the heat exchanger pipe due to the bumping during the welding process of the temperature-sensing pipe and the heat exchanger pipe can be avoided.

[0044] In one embodiment, the axial direction of the first pipe 110 is parallel to the axial direction of the second pipe 120, and the nugget 130 is arranged on the outer peripheral wall of the first pipe 110. In this way, the contact surface between the first pipe 110 and the second pipe 120 is larger, which is more conducive to the arrangement of the nugget 130 and the solder layer 140, thereby reducing the difficulty of processing the temperature-sensing probe mounting structure 10.

[0045] It should be noted that, when at least one of the first pipe 110 and the second pipe 120 is a circular pipe, since the first pipe 110 and the second pipe 120 are in line contact or tangent contact, at this time, the contact surface between the first pipe 110 and the second pipe 120 refers to the tangent line of the first pipe 110 and the second pipe 120.

[0046] Further, with reference to Figure 5 and Figure 7, the plurality of nuggets 130 are arranged along the axial direction of the first pipe 110. It should be noted that each welding point is a nugget. In this way, the second pipe 120 can be prevented from being skewed relative to the first pipe 110, and the number of nuggets 130 between the first pipe 110 and the second pipe 120 can be increased, thereby increasing the firmness between the second pipe 120 and the first pipe 110 and preventing the second pipe 120 from falling off the first pipe 110. It should be understood that, regardless of whether the nuggets 130 are point-shaped, wire-shaped, or sheet-shaped, each independent nugget can be regarded as a complete nugget. It should be noted that, in the nuggets 130 in Figure 5 , Figure 5 , the nuggets 130 are formed by wire after welding, and when the wire is two, the number of nuggets 130 formed is two. In other embodiments, the number of nuggets is not limited.

[0047] In one embodiment, referring to Figure 4 , the first pipe 110 and the second pipe 120 are provided with wire, part of the wire is welded to form the nuggets 130, and the part of the wire that is not welded is defined as the remaining part 150, which is arranged in the solder layer 140. It should be understood that the wire is the first material in the above examples. Before the first pipe 110 and the second pipe 120 are welded into the temperature probe mounting structure 10, the wire is arranged between the first pipe 110 and the second pipe 120 to act as a bump, so that the wire can be melted between the first pipe 110 and the second pipe 120 in the form of resistance spot welding to form the nuggets 130. Before welding, the first pipe 110 and the second pipe 120 are in tangential contact, and because the nuggets 130 are small, the wire that is relatively long relative to the nuggets 130 is more easily placed on the first pipe 110 or the second pipe 120, thereby reducing the difficulty of welding the wire. After resistance spot welding, the remaining part of the wire is exposed outside the welding seam, and the remaining part is directly folded on the surface of the welding seam and covered with the solder layer 140. In this way, the treatment of the remaining part is relatively simple, which is beneficial to improve the production efficiency and will not damage the integrity of the nuggets 130 after spot welding.

[0048] It should be noted that Figure 5 , the part of the wire that is not welded, i.e., the remaining part 150, is shown. Referring to Figure 6 , the remaining part 150 is folded on the surface of the welding seam, and after brazing between the first pipe 110 and the second pipe 120 to form the welding layer, the remaining part is hidden inside the solder layer 140.

[0049] Further, the nugget 130 is a point nugget, so that the first pipe 110 and the second pipe 120 can be fixed by resistance spot welding, which is beneficial to subsequent brazing of the first pipe 110 and the second pipe 120 by using the solder.

[0050] In one embodiment, the nugget 130 is a wire nugget 1301, and the extending direction of the wire nugget 1301 intersects the axial direction of the first pipe 110. It can be understood that, before the first pipe 110 and the second pipe 120 are welded into the temperature probe mounting structure 10, the extending direction of the wire is the first direction, and the wire nugget 1301 can be equivalent to a plurality of point nuggets on the wire being connected together along the first direction.

[0051] Further, referring to Figure 5 , Figure 6 and Figure 7 , the included angle between the extending direction of the wire nugget 1301 and the axial direction of the first pipe 110 is α, the length of the remaining part 150 is L1, the shortest distance between the end of the wire nugget 1301 and the end of the first pipe 110 is L2, and the shortest distance between the end of the wire nugget 1301 and the end of the second pipe 120 is L3. L1*Sinα≤L3≤L2. In this way, the remaining part 150 of the wire can be completely wrapped inside the solder layer 140 without being exposed from the outside of the temperature probe mounting structure 10. It should be noted that, after the wire is welded into the nugget 130, the remaining part 150 can be bent to avoid the remaining part 150 being exposed from the outside of the temperature probe mounting structure 10, and after the remaining part 150 is bent, the solder required to completely wrap the remaining part 150 can be saved.

[0052] In one embodiment, the nugget 130 is a sheet nugget, and the sheet nugget is located inside the solder layer 140. In this embodiment, the first material is a foil, and since the foil has a certain surface area, the foil can be more easily placed on the first pipe 110 or the second pipe 120, reducing the processing difficulty of resistance spot welding.

[0053] It should be noted that the foil does not need to have a fixed shape, as long as the foil can be melted into the nugget 130 by resistance spot welding and can be covered by the solder layer 140.

[0054] In one embodiment, the length of the sheet-shaped molten core along the circumference of the first pipe 110 is L3, and 1mm≤L3≤3mm. In this way, it can be ensured that the solder layer 140 can completely cover the sheet-shaped molten core. Illustratively, the length of the sheet-shaped molten core along the circumference of the first pipe 110 is 1mm, 1.25mm, 1.5mm, 1.75mm, 2mm, 2.25mm, 2.5mm, 2.75mm, 3mm, or any other value within the range of 1mm≤L≤3mm. It should be noted that the circumference of the first pipe 110 is not limited to a circular pipe, and the cross section of the first pipe 110 can also be of other shapes.

[0055] In one embodiment, with reference to Figure 7 , along the radial direction of the first pipe 110, the thickness of the molten core 130 is H, and 0.05mm≤H≤0.1mm. In this way, it can be avoided that the thickness of the molten core 130 is too thick, and thus it can be avoided that the first pipe 110 cannot be closely attached to the second pipe 120 due to the molten core 130. Illustratively, the thickness of the molten core 130 is 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, or any other value within the range of 0.05mm≤H≤0.1mm.

[0056] With reference to Figure 8 , the present application also provides an air conditioner comprising the temperature probe mounting structure 10 according to any one of the above embodiments. It can be understood that the air conditioner 1 further comprises a condenser 20, a compressor 30, an evaporator 40, and a throttling device 50, which are connected in sequence through a pipe 60. The condenser 20 and the evaporator 40 are both used for refrigeration / heating cycle, and the first pipe 110 in the above temperature probe mounting structure 10 is a pipe of at least one of the condenser 20 or the evaporator 40, and the second pipe 120 is a temperature sensing pipe, which can thus be in close contact with the pipe of at least one of the condenser 20 or the evaporator 40, so as to detect the temperature of the condenser 20 or the evaporator 40 in real time.

[0057] The technical features of the above embodiments can be combined in any manner. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described, and it should be considered that any combination of the technical features is within the scope of the present disclosure as long as the combination does not result in contradictions.

[0058] The above-described embodiments are merely illustrative of several embodiments of the present application, which are described in more detail and in a specific manner, but should not be construed as limiting the scope of the patent application. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A temperature sensing probe mounting structure, characterized by, The temperature sensing probe mounting structure comprises a first pipe (110) and a second pipe (120), wherein the first pipe (110) or the second pipe (120) is a temperature sensing pipe, and the temperature sensing pipe is internally provided with a temperature sensing probe; A nugget (130) formed by spot welding is arranged between the first pipe (110) and the second pipe (120), and a solder layer (140) is arranged outside the nugget (130), so that the first pipe (110) and the second pipe (120) are fixedly connected by the nugget (130) and the solder layer (140).

2. The temperature sensing probe mounting structure according to claim 1, wherein The axial direction of the first pipe (110) is parallel to the axial direction of the second pipe (120), and the nugget (130) is arranged on the outer circumferential wall of the first pipe (110).

3. The temperature sensing probe mounting structure according to claim 2, wherein The first pipe (110) and the second pipe (120) are provided with a wire, and part of the wire forms the nugget (130) after spot welding, and the part of the wire that is not spot welded is defined as a remaining part (150), and the remaining part (150) is arranged in the solder layer (140).

4. The temperature sensing probe mounting structure according to claim 3, wherein The nugget (130) is a point-shaped nugget; Alternatively, the nugget (130) is a wire-shaped nugget (1301), and the extension direction of the wire-shaped nugget (1301) intersects the axial direction of the first pipe (110).

5. The temperature sensing probe mounting structure according to claim 4, wherein The nugget (130) is a wire-shaped nugget (1301), and the included angle between the extension direction of the wire-shaped nugget (1301) and the axial direction of the first pipe (110) is α, The length of any one of the remaining parts is L1, the shortest distance from the end of the wire-shaped nugget (1301) to the end of the first pipe (110) is L2, and the shortest distance from the end of the wire-shaped nugget (1301) to the end of the second pipe (120) is L3, and L1*Sinα≤L3≤L2.

6. The temperature sensing probe mounting structure according to claim 2, wherein The nugget (130) is a sheet-shaped nugget, and the sheet-shaped nugget is arranged in the solder layer (140).

7. The temperature sensing probe mounting structure according to claim 6, wherein The length of the sheet-shaped nugget along the circumferential direction of the first pipe (110) is L, and 1mm≤L≤3mm.

8. The temperature sensing probe mounting structure according to any one of claims 1 to 7, characterized by In the radial direction of the first pipe (110), the thickness of the nugget (130) is H, and 0.05mm≤H≤0.1mm.

9. The temperature sensing probe mounting structure according to any one of claims 1 to 7, characterized by The nugget (130) is arranged in at least two, and a plurality of nuggets (130) are sequentially and spacedly arranged in the axial direction of the first pipe (110).

10. The temperature sensing probe mounting structure according to any one of claims 1 to 7, characterized by The first pipe (110) and the second pipe (120) are pipes made of different metals. And / or, the length of the first pipe (110) is greater than the length of the second pipe (120), and the second pipe (120) is a temperature sensing pipe.

11. An air conditioner characterized by comprising: The temperature sensing probe mounting structure comprises a first pipe (110) and a second pipe (120), wherein the first pipe (110) or the second pipe (120) is a temperature sensing pipe, and the temperature sensing pipe is internally provided with a temperature sensing probe;

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