Edge ring flatness detection device
By using an edge ring flatness detection device, the unevenness of the edge ring is identified and corrected, which solves the problem of poor deposition effect caused by edge ring unevenness during substrate thin film deposition, and achieves more efficient substrate thin film deposition.
Patent Information
- Application Number
- CN202520796406.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-24
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-04-24
AI Technical Summary
In existing chemical vapor deposition equipment, unevenness of the edge ring during substrate thin film deposition causes the substrate to come into contact with the edge ring, affecting the deposition effect.
An edge ring flatness detection device is provided, including a detection body and a contact indicator structure. The detection body is rotated at a preset position by a positioning and rotating device, and the contact indicator structure is used to indicate the contact status of the edge ring, identify flatness problems and make corrections.
By promptly identifying and correcting unevenness issues in the edge ring, the substrate is prevented from contacting the edge ring, thus improving the deposition effect of the substrate thin film.
Smart Images
Figure CN223954906U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Embodiments of the present application relate to the technical field of semiconductor technology, and in particular to an edge ring flatness detection device. BACKGROUND
[0002] In the field of semiconductor manufacturing, a chemical vapor deposition (CVD) apparatus is one of the important tools for performing film deposition processes. The apparatus is usually equipped with a vapor deposition chamber surrounded by a chamber sidewall, which provides a special deposition environment for a substrate. Inside the vapor deposition chamber, a susceptor and a heater embedded in the susceptor are provided. During the chemical vapor deposition process, the substrate is placed on the susceptor and heated by the heater to deposit a thin film.
[0003] However, the deposition effect of the substrate thin film deposition using the apparatus needs to be improved. CONTENT OF THE UTILITY MODEL
[0004] Therefore, embodiments of the present application provide an edge ring flatness detection device to detect the flatness of the edge ring, thereby improving the deposition effect of the substrate thin film deposition.
[0005] To achieve the above object, embodiments of the present application provide the following technical solutions.
[0006] Embodiments of the present application provide an edge ring flatness detection device applied to a vapor deposition chamber, the vapor deposition chamber comprising a susceptor and an edge ring located at the edge of the susceptor, the susceptor being provided with a heater inside for heating the susceptor, and the edge ring flatness detection device comprising:
[0007] a detection main body and a contact indication structure surrounding the edge of the detection main body; wherein the projection of the detection main body along the vertical direction coincides with the projection of the susceptor along the vertical direction;
[0008] a positioning and rotating device located on the detection main body, the positioning and rotating device being used to position the detection main body to a preset position on the side of the susceptor facing away from the heater, at which the outer edge of the detection main body matches the outer edge of the susceptor; and rotate the detection main body at the preset position.
[0009] Optionally, the contact indication structure covers an area inward from the edge of the detection main body by a preset distance.
[0010] Optionally, the preset distance ranges from 2mm to 5mm.
[0011] Optionally, the contact indicating structure has a thickness ranging from 0.08mm to 0.25mm.
[0012] Optionally, the contact indicating structure is sandpaper.
[0013] Optionally, the surface of the edge ring is treated by a sandblasting process.
[0014] Optionally, the edge ring is composed of multiple ring bodies combined by screwing.
[0015] Optionally, the projection of the detection body in the vertical direction is circular.
[0016] Optionally, the device further comprises:
[0017] a sensor for detecting the pressure between the base and the detection body.
[0018] Optionally, the flatness of the surface of the detection body is within a preset error range.
[0019] Compared with the prior art, the technical scheme of the embodiments of the present application has the following advantages:
[0020] The embodiments of the present application provide an edge ring flatness detection device applied to a vapor deposition chamber, the vapor deposition chamber comprising a base and an edge ring located at the edge of the base, the base being provided with a heater for heating the base, the edge ring flatness detection device comprising: a detection body, and a contact indicating structure surrounding the edge of the detection body; wherein the projection of the detection body in the vertical direction coincides with the projection of the base in the vertical direction; a positioning and rotating device located on the detection body, the positioning and rotating device being used for positioning the detection body to a preset position on the side of the base facing away from the heater, at the preset position, the outer edge of the detection body matches the outer edge of the base; and rotating the detection body at the preset position.
[0021] As can be seen, the edge ring flatness detection device provided by the embodiments of the present application can indicate the contact between the detection body and the edge ring by rotating the detection body at the preset position, so as to intuitively identify the flatness of the edge ring. Therefore, the present application can timely find the unevenness problem of the edge ring, so as to take measures to correct it, ensure that the subsequent substrate will not contact the edge ring, and thus improve the deposition effect of the substrate film deposition. BRIEF DESCRIPTION OF DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on the provided drawings.
[0023] Figure 1 is a use schematic diagram of the edge ring flatness detection device provided by the embodiments of the present application;
[0024] Figure 2 is a top view of the edge ring flatness detection device provided by the embodiments of the present application.
[0025] In the drawings:
[0026] 100 - base; 101 - edge ring; 1011 - inner ring; 1012 - outer ring; 102 - heater; 103 - detection main body; 1031 - contact indication structure; 104 - positioning rotating device. DETAILED DESCRIPTION
[0027] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0028] As described in the background, in the field of semiconductor manufacturing, a chemical vapor deposition (CVD) device is one of the important tools for performing film forming processes. The device is usually equipped with a vapor deposition chamber surrounded by a cavity side wall, which provides a special deposition environment for a substrate. Inside the vapor deposition chamber, a base is provided, and a heater embedded in the base. In the chemical vapor deposition process, the substrate is placed on the base, and the substrate is heated by the heater to deposit a thin film. However, the deposition effect of the substrate thin film deposition using the device needs to be improved.
[0029] The inventor believes that the reason affecting the deposition effect of the substrate thin film deposition is that the position of the heater in the heating process needs to be set to be higher than the edge ring by 500um-1000um to ensure process stability. However, once the edge ring is deformed, it may cause the substrate placed on the base to contact the edge ring, thereby affecting the deposition effect of the substrate thin film deposition.
[0030] In view of this, this application provides an edge ring flatness detection device applied to a vapor deposition chamber. The vapor deposition chamber includes a base and an edge ring located at the edge of the base. A heater is disposed inside the base for heating the base. The edge ring flatness detection device includes: a detection body and a contact indicator structure surrounding the edge of the detection body; wherein the projection of the detection body in the vertical direction coincides with the projection of the base in the vertical direction; a positioning and rotating device located on the detection body, the positioning and rotating device being used to position the detection body to a preset position on the side of the base away from the heater, at the preset position, the outer edge of the detection body matches the outer edge of the base; and to rotate the detection body at the preset position.
[0031] As can be seen, the edge ring flatness detection device provided in this application, by rotating the detection body at a preset position, allows the contact indicator structure surrounding the edge of the detection body to indicate the contact status between the detection body and the edge ring, thereby intuitively identifying the flatness of the edge ring. Therefore, this application can promptly detect edge ring unevenness issues, thereby taking corrective measures to ensure that the subsequent substrate does not contact the edge ring, thus improving the deposition effect of the substrate thin film.
[0032] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0033] refer to Figure 1 , Figure 1 This is a schematic diagram illustrating the use of the edge ring flatness detection device provided in this application embodiment. Figure 1 As shown, the edge ring flatness detection device is applied to a vapor deposition chamber. The vapor deposition chamber includes a base 100 and an edge ring 101 located at the edge of the base 100. A heater 102 is provided inside the base 100 to heat the base 100, so that the substrate subsequently placed on the base can be maintained within a predetermined temperature range.
[0034] In an optional implementation, the surface of the edge ring 101 is treated with a sandblasting process. Specifically, sandblasting is a surface treatment technology that uses compressed air to propel abrasive materials (such as quartz sand, corundum, etc.) at high speed onto the workpiece surface. Through the impact and cutting action of the abrasive materials on the workpiece surface, it achieves the purposes of cleaning, roughening, deburring, and increasing surface roughness. Through sandblasting, impurities such as oil, rust, and old coatings on the surface of the edge ring 101 can be removed, while simultaneously increasing its surface roughness.
[0035] Further, the edge ring 101 can be combined by screwing a plurality of ring bodies. In the embodiment, the edge ring 101 is combined by screwing an inner ring 1011 and an outer ring 1012. In a chemical vapor deposition (CVD) process, the edge ring can weaken the edge effect, making the process more uniform. Especially in the edge region of the substrate, the edge ring can reduce the fluctuation of process parameters such as gas flow and temperature, thereby ensuring the consistency of film thickness, composition and performance on the entire substrate surface. The edge ring is usually kept a certain distance from the edge of the substrate (i.e. wafer), preventing the plasma, reaction gas or deposit generated during the process from directly contacting the edge of the substrate, which helps to reduce damage and contamination of the edge of the substrate, and improve the quality and yield of the substrate.
[0036] As shown in Figure 1 The edge ring flatness detection device comprises:
[0037] A detection body 103 and a contact indication structure 1031 surrounding the edge of the detection body 103; wherein the projection of the detection body 103 in the vertical direction coincides with the projection of the base 100 in the vertical direction. In an optional implementation, to ensure good contact between the detection body 103 and the base 100, the flatness of the surface of the detection body 103 needs to be within a predetermined error range.
[0038] Further, referring to Figure 2 An exemplary top view of the edge ring flatness detection device is shown in Figure 2 The projection of the detection body in the vertical direction is circular. The contact indication structure 1031 covers an area a predetermined distance inward from the edge of the detection body 103. The predetermined distance is in the range of 2mm-5mm, for example, it can be 2mm, 3mm or 4mm, etc.
[0039] The thickness of the contact indication structure cannot be too thin, otherwise it cannot provide sufficient friction and wear resistance. In addition, the thickness of the contact indication structure cannot be too thick, otherwise it will hinder the direct contact between the detection body and the base, thereby affecting the detection. Therefore, in the embodiment of the application, the thickness of the contact indication structure can be in the range of 0.08mm to 0.25mm.
[0040] In a specific implementation, the contact indication structure 1031 can be sandpaper. As a common abrasive material, sandpaper has a rough surface and is easy to produce obvious wear marks when in contact with other objects. In addition, sandpaper is low in cost, and the use of sandpaper as a contact indication structure can reduce the detection cost.
[0041] It should be noted that the material selection of the contact indication structure is only an optional material, i.e., sandpaper. In practice, the material of the contact indication structure is not limited to sandpaper, but can be selected according to specific needs. When selecting, the sensitivity, stability, visualization, and durability of the material should be considered to ensure that the contact indication structure can accurately indicate the contact between the detection body and the edge ring.
[0042] The positioning and rotating device 104 is located on the detection body 103, and is used to position the detection body 103 to a preset position on the side of the base 100 away from the heater 102, at which the outer edge of the detection body 103 matches the outer edge of the base 100, and rotate the detection body 103 at the preset position. If the edge ring 101 is deformed, when the detection body 103 rotates on the base 100, its edge will contact the edge ring 101. When the edge of the detection body 103 contacts the edge ring 101, due to friction or pressure, the contact indication structure 1031 will change significantly. Therefore, by observing the wear of the contact indication structure 1031, the unevenness of the edge ring can be found in time, so that measures can be taken to correct it, so as to ensure that the subsequent substrate will not contact the edge ring, thereby improving the deposition effect of the substrate film deposition.
[0043] In an optional implementation, the edge ring flatness detection device can further include a sensor for detecting the pressure between the base and the detection body. By monitoring the pressure between the base and the detection body in real time, it can be ensured that the pressure between the base and the detection body will not be too small or too large.
[0044] When the pressure between the base and the detection body is too small, the detection body may fly out during rotation due to centrifugal force. The sensor can monitor the pressure value in real time, and once the pressure is below the minimum safety threshold, the rotation can be stopped immediately and an alarm can be issued, so as to avoid the detection body from flying out during rotation.
[0045] When the pressure between the base and the detection body is too large, it may cause the detection body to receive too much resistance during rotation, or even unable to rotate. The sensor can monitor the pressure value in real time, and issue an alarm when the pressure exceeds the maximum safety threshold, so as to avoid the detection body from receiving too much resistance during rotation, causing it to be unable to rotate.
[0046] It can be seen that the edge ring flatness detection device provided by the embodiment of the present application can rotate the detection body at a preset position, so that the contact indication structure around the edge of the detection body can indicate the contact condition of the detection body and the edge ring, and then the flatness of the edge ring can be intuitively identified. Therefore, the present application can timely find the uneven problem of the edge ring, so that measures can be taken to correct it, so as to ensure that the subsequent substrate will not contact the edge ring, and then improve the deposition effect of the substrate film deposition.
[0047] The above describes the multiple embodiment schemes provided by the embodiment of the present application, and each optional mode introduced by each embodiment scheme can be combined, cross-referenced in the case of no conflict, thereby extending multiple possible embodiment schemes, which can be considered as the embodiment schemes disclosed and disclosed by the embodiment of the present application.
[0048] Although the above is disclosed by the embodiment of the present application, the present application is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, therefore the protection scope of the present application should be limited by the scope defined by the claims.
Claims
1. An edge ring flatness detection apparatus, characterized by, The application is applied to a vapor deposition chamber, which comprises a base and an edge ring located at the edge of the base, a heater is arranged in the base for heating the base, and the edge ring flatness detection device comprises: a detection body and a contact indication structure around the edge of the detection body; wherein the projection of the detection body in the vertical direction coincides with the projection of the base in the vertical direction; a positioning rotating device located on the detection body, which is used for positioning the detection body to a preset position on the side of the base away from the heater, at which the outer edge of the detection body matches the outer edge of the base; and rotating the detection body at the preset position.
2. The edge ring flatness detection apparatus of claim 1, wherein The contact indication structure covers an area inward from the edge of the detection body by a preset distance.
3. The edge ring flatness detection apparatus of claim 2, wherein The preset distance ranges from 2mm to 5mm.
4. The edge ring flatness detection apparatus of claim 1, wherein The thickness of the contact indication structure ranges from 0.08mm to 0.25mm.
5. The edge ring flatness detection apparatus of claim 1, wherein The contact indication structure is sandpaper.
6. The edge ring flatness detection apparatus of claim 1, wherein The surface of the edge ring is treated by sandblasting process.
7. The edge ring flatness detection apparatus of claim 1, wherein The edge ring is composed of multiple ring bodies by screwing.
8. The edge ring flatness detection apparatus of claim 1, wherein The projection of the detection body in the vertical direction is circular.
9. The edge ring flatness detection apparatus of claim 1, wherein Further comprising: a sensor for detecting the pressure between the base and the detection body.
10. The edge ring flatness detection apparatus of claim 1, wherein The flatness of the surface of the detection body is within a preset error range.