Semiconductor conductivity measuring instrument

Abstract

The utility model relates to the technical field of measuring instruments, in particular to a semiconductor conductivity measuring instrument which comprises a shell, a thermal field measuring module, a force field measuring module, a magnetic field measuring module, a sample conveying module and an operation panel module, a door plate is arranged on one side of the shell, and the sample conveying module is arranged on the side, close to the door plate, in the shell. The force field measurement module is vertically arranged and has a degree of freedom of up-down movement; the magnetic field measurement module is arranged around the force field measurement module; the thermal field measurement module is arranged on the inner wall of the shell; the operation panel module is used for controlling the measuring instrument to be arranged on the outer wall of the shell. According to the semiconductor conductivity measuring instrument, the thermal field measuring module, the force field measuring module and the magnetic field measuring module are integrated, so that the influence of a thermal field, a force field and a magnetic field on the conductivity of a semiconductor can be measured at the same time, and a comprehensive measuring result is provided. The device has the advantages of multi-physical field measurement capability, automatic operation, portable design, wide applicability and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of measuring instrument, concretely to a semiconductor conductivity measuring instrument. BACKGROUND

[0002] As a basic functional material, the pros and cons of the conductivity of the material are usually evaluated by the core index of conductivity, which is a key parameter representing the physical properties of the material.

[0003] The mainstream experimental determination methods at the present stage include direct current four-electrode method, classical four-probe technology and three-terminal electrical measurement method. These verified measurement schemes have built a complete experimental framework for quantitative analysis of the conductivity performance, and each method has a specific application range and measurement advantage. The common measuring instrument on the market generally uses the four-probe method for measurement. For small size or thin samples, the edge effect and probe spacing may interfere with the measurement results, and the contact resistance between the probe and the sample will introduce errors, which is more obvious in high resistivity materials. Compared with other methods, the four-probe method is slower in measurement speed, not suitable for rapid detection, and needs to be calibrated regularly. The calibration process is complex, which increases the operation difficulty and the cost of the device. Secondly, although the three-terminal electrical measurement method overcomes the problem of contact resistance to some extent, its measurement accuracy and stability are still insufficient in complex physical field environment. In addition, the devices and test methods on the market can only measure single physical field, and cannot fully reflect the real situation of the sample in actual application. It cannot well reflect the real situation of the sample, especially in many physical fields or extreme environmental conditions, which is more obvious.

[0004] In summary, a semiconductor conductivity measuring instrument is needed, which can not only measure the conductivity of the semiconductor in a single physical field, but also measure in the case of coupling multiple physical fields, so as to more comprehensively evaluate the conductivity performance of the material. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a conductivity measuring instrument that can measure in three common physical fields of heat, force and magnetism, so as to solve the problems of large measurement error in complex physical field and single measurement physical field of the existing measuring instrument.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme, a semiconductor conductivity measuring instrument, characterized by comprising: a shell, a thermal field measurement module, a force field measurement module, a magnetic field measurement module, a sample feeding module and an operation panel module.

[0007] The side of the shell is provided with a door plate, and the sample feeding module is used for feeding test materials to the force field measuring module; the sample feeding module is arranged inside the shell and close to one side of the door plate; the force field measuring module is vertically arranged and has the freedom of moving up and down; the magnetic field measuring module is arranged around the force field measuring module; the thermal field measuring module is arranged on the inner wall of the shell; and the operation panel module for controlling the measuring instrument is arranged on the outer wall of the shell.

[0008] Further, the shell comprises a top plate, a wall plate, a door plate, a handle and support feet, the top plate of the shell has two, the two top plates are placed up and down, respectively as the top wall and the bottom wall of the shell, the front end is recessed for mounting the door plate; the wall plate is arranged on the left and right sides and the rear side of the measuring instrument; the door plate is embedded in the recess of the top plate on the upper and lower sides, placed left and right, forming a sliding door structure; the handle is fixed on the door plate and placed symmetrically; the support feet are distributed at the four corners of the lower part of the shell.

[0009] Further, the thermal field measuring module comprises heat insulation cotton, a heat dissipation fan, a ceramic heating sheet and a thermocouple;

[0010] The heat insulation cotton of the thermal field measuring module is filled in the shell of the measuring instrument; the heat dissipation fan is fixed on the shell by bolts; the ceramic heating sheet is fixed on the wall plate by bolts; and the thermocouple for measuring the temperature of the sample is placed on the lower electrode sheet.

[0011] Further, the force field measuring module comprises a push rod, a fixed sheet, a pressing container, a spring, a pressing flange, a pressing sheet, a fixed table, a power supply, a support rod and a flexible pressure sensor;

[0012] The push rod of the force field measuring module is powered to perform telescopic movement, and the push rod is connected with the pressing container through the fixed sheet; the pressing container is a hollow structure composed of two parts, connected through the pressing flange, and the spring and the pressing sheet are placed in the pressing container; the two ends of the spring are respectively abutted against the top wall of the pressing container and the upper end of the pressing sheet; the pressing sheet is a I-shaped structure and is clamped at the bottom of the pressing container; used for contacting the sample and applying pressure; and the flexible pressure sensor is in the form of a film and is placed on the fixed table.

[0013] Further, the magnetic field measuring module comprises a y-axis Helmholtz coil, an x-axis Helmholtz coil, a z-axis Helmholtz coil, a first flange, a second flange, a third flange, a z-axis coil support, a second profile, a support table and a linear Hall element;

[0014] The y-axis Helmholtz coil, the x-axis Helmholtz coil and the z-axis Helmholtz coil of the magnetic field measuring module are all annular structures, wherein the y-axis Helmholtz coil and the x-axis Helmholtz coil are fixed on the support table through a first flange and a second flange respectively; the z-axis Helmholtz coil is fixed to the inner wall of the shell through a third flange; a second profile is further arranged below the x-axis Helmholtz coil; the linear Hall element is used for measuring the magnetic field intensity and is placed on the thermocouple.

[0015] Further, the sample feeding module comprises a support seat, a screw sliding table, a first profile, a feeding table, a lower electrode sheet and an upper electrode sheet.

[0016] The support seat of the sample feeding module is a columnar structure and is connected with the first profile through welding; the screw sliding table is connected with the first profile through bolts; the first profile is connected with the support seat through welding; the feeding table is a flat plate and is connected with the screw sliding table through bolts; the lower electrode sheet is welded on the feeding table and is used for contacting the sample; the upper electrode sheet is welded on the pressing sheet and is used for contacting the sample.

[0017] Further, the operation panel module comprises a circuit board, an LCD display screen and a key.

[0018] The circuit board is connected with each module through wires; the LCD display screen is used for displaying the measurement results and is connected with the circuit board through wires; the key is connected with the circuit board through wires.

[0019] Beneficial effects

[0020] The semiconductor conductivity measuring instrument can simultaneously measure the influence of the thermal field, the force field and the magnetic field on the semiconductor conductivity, and provides comprehensive measurement results.

[0021] The measuring instrument has the advantages of multi-physical field measurement capability, automatic operation, portable design and wide applicability, and can meet the needs of modern scientific and technological development.

[0022] The semiconductor conductivity measuring instrument is suitable for various types of semiconductor materials and has wide applicability. DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments or the prior art, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0024] Figure 1 is the internal structure front view of the conductivity measuring instrument disclosed by the present application;

[0025] Figure 2 is the internal structure of the conductivity measuring instrument of the utility model disclosed in the utility model discloses a conductivity measuring instrument's internal structure plan view;

[0026] Figure 3 is the internal structure of the conductivity measuring instrument of the utility model disclosed in the utility model discloses a conductivity measuring instrument's internal structure side view;

[0027] Figure 4 is the force field measurement module of the conductivity measuring instrument of the utility model disclosed in the utility model discloses a conductivity measuring instrument's force field measurement module structure diagram;

[0028] Figure 5 is the operation panel module of the conductivity measuring instrument of the utility model disclosed in the utility model discloses a conductivity measuring instrument's operation panel module schematic view;

[0029] Figure 6 is the external structure of the conductivity measuring instrument of the utility model disclosed in the utility model discloses a conductivity measuring instrument's external structure diagram.

[0030] In the drawing,

[0031] 1-thermal insulation cotton;2-wallboard;3-radiating fan;4-y-axis helmholtz coil;5-top plate;6-door plate;7-handle;8-screw slide;9-first section bar;10-supporting seat;11-first flange.

[0032] 12-second flange;13-x-axis helmholtz coil;14-z-axis coil support;15-acrylic plate;16-ceramic heating sheet;17-supporting base;18-lower electrode sheet;19-feeding table.

[0033] 20-third flange;21-z-axis helmholtz coil;22-supporting leg;23-second section bar.

[0034] 24-power supply;25-push rod;26-fixing sheet;27-pressing container;28-spring;29-pressing flange;30-pressing sheet;31-thermocouple;32-upper electrode sheet;33-fixing base;34-supporting rod;35-linear hall element;36-flexible pressure sensor.37-circuit board;38-LCD display screen;39-key; DETAILED DESCRIPTION

[0035] The technical scheme in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model, and apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the range of protection of the utility model.

[0036] To achieve the above object, the utility model provides the following technical scheme, such as Figures 1-6As shown, a semiconductor conductivity measuring instrument, characterized in that: comprising: a shell, a thermal field measuring module, a force field measuring module, a magnetic field measuring module, a sample feeding module and an operation panel module;

[0037] One side of the shell is provided with a door plate 6, and the sample feeding module is used for feeding the test material to the force field measuring module; the sample feeding module is arranged inside the shell close to one side of the door plate 6; the force field measuring module is vertically arranged and has the freedom of moving up and down; the magnetic field measuring module is arranged around the force field measuring module; the thermal field measuring module is arranged on the inner wall of the shell; and the operation panel module is used for controlling the measuring instrument and is arranged on the outer wall of the shell.

[0038] Further, the shell includes a top plate 5, a wall plate 2, a door plate 6, a handle 7 and a support foot 22, which are used to provide structural support and protect internal components; the top plate 5 of the shell has two, which are placed above and below, respectively, as the top wall and the bottom wall of the shell, and the front end has a groove for mounting the door plate 6; the wall plate 2 is arranged on the left and right sides and the rear side of the measuring instrument, providing structural support and protecting internal components; the door plate 6 is embedded in the groove of the top plate 5 on the upper and lower sides, and is placed left and right, forming a sliding door structure, which is convenient for users to observe and operate; the handle 7 is fixed on the door plate 6 and is placed symmetrically, which is convenient for users to pull the door plate; and the support foot 22 is distributed at the four corners of the lower part of the shell, providing stable support.

[0039] Further, the thermal field measuring module includes heat insulation cotton 1, a heat dissipation fan 3, a ceramic heating sheet 16 and a thermocouple 31, which are used to control the temperature of the measuring environment;

[0040] The heat insulation cotton 1 of the thermal field measuring module is a soft fiber material, which is used to fill in the inside of the shell around the measuring instrument to reduce heat loss; the heat dissipation fan 3 is a cylindrical structure, which is fixed on the shell by bolts and is used to regulate the temperature inside the measuring instrument; the ceramic heating sheet 16 is flat, has high heating efficiency and uniformity, and is fixed on the wall plate 2 by bolts; and the thermocouple 31 is elongated, and the thermocouple 31 is placed on the lower electrode sheet 18 for measuring the temperature of the sample.

[0041] Further, the force field measuring module includes a push rod 25, a fixed sheet 26, a lower pressing container 27, a spring 28, a lower pressing flange 29, a pressing sheet 30, a fixed table 33, a power supply 24, a support rod 34 and a flexible pressure sensor 36, which are used to apply pressure and measure the pressure suffered by the sample;

[0042] The push rod 25 of the force field measurement module is cylindrical, and is driven to extend and retract by the power supply 24, and is connected with the lower pressing container 27 through the fixing sheet 26; the fixing sheet 26 is flat, and is used for fixing the push rod 25 and the lower pressing container 27; the lower pressing container 27 is a hollow structure composed of two parts, and is connected through the lower pressing flange 29; the spring 28 and the pressing sheet 30 are placed in the lower pressing container 27; the spring 28 is helical, and is used for buffering pressure change, and the two ends are respectively abutted against the top wall of the lower pressing container 27 and the upper end of the pressing sheet 30; the lower pressing flange 29 is circular and plate-shaped, and is used for connecting the upper and lower two parts of the lower pressing container 27; the pressing sheet 30 is an I-shaped structure, and is used for contacting and applying pressure to the sample, and is clamped at the bottom of the lower pressing container 27; the flexible pressure sensor 36 is thin film-shaped, and is used for detecting the pressure suffered by the sample, and is placed on the fixed table 33.

[0043] Further, the magnetic field measurement module includes a y-axis Helmholtz coil 4, an x-axis Helmholtz coil 13, a z-axis Helmholtz coil 21, a first flange 11, a second flange 12, a third flange 20, a z-axis coil support 14, a second profile 23, a support table 17 and a linear Hall element 35, which are used for generating and measuring a magnetic field;

[0044] The y-axis Helmholtz coil 4, the x-axis Helmholtz coil 13 and the z-axis Helmholtz coil 21 of the magnetic field measurement module are all annular structures, which are used for generating a uniform magnetic field, wherein the y-axis Helmholtz coil 4 and the x-axis Helmholtz coil 13 are respectively fixed on the support table 17 through the first flange 11 and the second flange 12; the z-axis Helmholtz coil 21 is fixed to the inner wall of the shell through the third flange 20; the x-axis Helmholtz coil 13 is further provided with the second profile 23 below; the second profile 23 is fixed on the support table 17; the linear Hall element 35 is used for measuring the magnetic field strength and is placed on the thermocouple 31.

[0045] Further, the sample feeding module includes a support seat 10, a lead screw sliding table 8, a first profile 9, a feeding table 19, a lower electrode sheet 18 and an upper electrode sheet 32, which are used for placing and feeding the sample;

[0046] The support seat 10 of the sample feeding module is a columnar structure, which is used for adjusting the height of the sample feeding device and is connected with the first profile 9 through welding; the lead screw sliding table 8 is a long strip-shaped structure, which is used for controlling the movement of the feeding table 19 and is connected with the first profile 9 through bolts; the first profile 9 is a long strip-shaped metal structure, which is used for supporting the lead screw sliding table 8 and is connected with the support seat 10 through welding; the feeding table 19 is flat, which is used for placing the sample and is connected with the lead screw sliding table 8 through bolts; the lower electrode sheet 18 is flat, which is used for contacting the sample and is welded on the feeding table 19; the upper electrode sheet 32 is flat, which is used for contacting the sample and is welded on the pressing sheet 30.

[0047] Further, the operation panel module comprises a circuit board 37, an LCD display screen 38 and a button 39 for controlling the use of the instrument.

[0048] The circuit board 37 of the operation panel module is in a rectangular plate shape for controlling the use of the instrument and is connected with each module through wires; the LCD display screen 38 is in a rectangular plate shape for displaying the measurement results and is connected with the circuit board 37 through wires; and the button 39 is a circular or square button for controlling the operation of the instrument and is connected with the circuit board 37 through wires.

[0049] Working principle:

[0050] The semiconductor conductivity measuring instrument integrates the thermal field, force field and magnetic field measurement modules to realize the conductivity measurement of semiconductor materials under various physical fields.

[0051] Firstly, the heating and cooling process: the ceramic heating sheet 16 generates heat after being electrified, and the heat loss is reduced through the heat insulation cotton 1 to maintain the temperature stability of the measurement environment. When the temperature is too high, the cooling fan 3 starts to discharge the heat through forced convection to prevent the temperature from being too high. The thermocouple 31 monitors the temperature of the sample in real time and feeds back to the control system to ensure that the sample is measured at a constant temperature.

[0052] Then, the pressurizing process: the push rod 25 is powered by the power supply 24 to push the lower pressing container 27 to move downward, and the spring 28 buffers to uniformly apply pressure to the sample on the pressing sheet 30. The flexible pressure sensor 36 monitors the pressure on the sample in real time and feeds back to the control system to ensure accurate control of the pressure.

[0053] The magnetic field generation process: by adjusting the current size of the y-axis Helmholtz coil 4, the x-axis Helmholtz coil 13 and the z-axis Helmholtz coil 21, a uniform magnetic field is generated. The linear Hall element 35 measures the magnetic field strength of the sample in real time and feeds back to the control system to ensure accurate control of the magnetic field strength.

[0054] Use process

[0055] When the conductivity measurement is performed, the door plate 6 of the measuring instrument is opened, the sample is placed on the feeding table 19, and the door plate 6 is closed to ensure the sealing of the measurement environment.

[0056] The required temperature, pressure and magnetic field strength are set through the button 39 on the operation panel, and the measuring instrument is started. The measuring instrument automatically adjusts the power of the ceramic heating sheet 16 and the rotating speed of the cooling fan 3 according to the set temperature to ensure that the measurement environment reaches the set temperature.

[0057] The push rod 25 pushes the lower pressing container 27 to move downward, and the tablet 30 is uniformly pressed on the sample through the buffering effect of the spring 28. The flexible pressure sensor monitors the pressure in real time and feeds back to the control system.

[0058] The current size through the Helmholtz coil is adjusted to generate the required uniform magnetic field.

[0059] The upper and lower electrode sheets are in contact with the sample to form a closed loop. The measurement circuit measures the conductivity of the sample and displays the result on the LCD display. The user records the measurement result according to the data on the LCD display.

[0060] After the measurement is completed, the measuring instrument is turned off, the sample is taken out, and the next measurement is prepared.

[0061] The embodiments of the present application are given for the purpose of illustration and description, and are not exhaustive or limit the present application to the disclosed form. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present application, and to enable those of ordinary skill in the art to understand the present application so as to design various embodiments with various modifications suitable for specific purposes.

Claims

1. A semiconductor conductivity meter, characterized by: The application relates to a thermal field measurement module, a force field measurement module, a magnetic field measurement module, a sample feeding module and an operation panel module. The side of the shell is provided with a door plate (6), the sample feeding module is used for feeding test materials to the force field measurement module; the sample feeding module is arranged on one side of the shell close to the door plate (6) in the shell; the force field measurement module is vertically arranged and has the freedom of moving up and down; the magnetic field measurement module is arranged around the force field measurement module; the thermal field measurement module is arranged on the inner wall of the shell; and the operation panel module for controlling the measuring instrument is arranged on the outer wall of the shell. The shell comprises top plates (5), wall plates (2), door plates (6), handles (7) and supporting feet (22), the top plates (5) of the shell are two, the two top plates (5) are placed up and down and serve as the top wall and the bottom wall of the shell respectively, recesses are left at the front ends of the top plates (5) and are used for mounting the door plates (6); the wall plates (2) are arranged on the left and right sides and the rear side of the measuring instrument; the door plates (6) are embedded in the recesses of the top plates (5) on the upper and lower sides and are placed left and right to form a sliding door structure; the handles (7) are fixed on the door plates (6) and are placed symmetrically; and the supporting feet (22) are distributed at the four corners of the lower part of the shell.

2. The semiconductor conductivity meter according to claim 1, characterized in that The thermal field measurement module comprises heat insulation cotton (1), heat dissipation fans (3), ceramic heating sheets (16) and thermocouples (31).

3. The semiconductor conductivity meter of claim 1, wherein, The heat insulation cotton (1) of the thermal field measurement module is filled in the shell of the measuring instrument; the heat dissipation fans (3) are fixed on the shell through bolts; the ceramic heating sheets (16) are fixed on the wall plates (2) through bolts; and the thermocouples (31) for measuring sample temperature are placed on the lower electrode sheets (18). The force field measurement module comprises a push rod (25), a fixing sheet (26), a pressing container (27), a spring (28), a pressing flange (29), a pressing sheet (30), a fixing table (33), a power supply (24), a supporting rod (34) and a flexible pressure sensor (36).

4. The semiconductor conductivity gauge of claim 1, wherein, The push rod (25) of the force field measurement module is powered by the power supply (24) to perform telescopic movement, the push rod (25) is connected with the pressing container (27) through the fixing sheet (26); the pressing container (27) is a hollow structure composed of two parts and is connected through the pressing flange (29), the spring (28) and the pressing sheet (30) are placed in the pressing container (27); the spring (28) is abutted against the top wall of the pressing container (27) and the upper end of the pressing sheet (30) respectively; the pressing sheet (30) is in an I-shaped structure and is clamped at the bottom of the pressing container (27) and is used for contacting the sample and applying pressure; and the flexible pressure sensor (36) is in a film shape and is placed on the fixing table (33). The magnetic field measurement module comprises a y-axis Helmholtz coil (4), an x-axis Helmholtz coil (13), a z-axis Helmholtz coil (21), a first flange (11), a second flange (12), a third flange (20), a z-axis coil support (14), a second profile (23), a support table (17) and a linear Hall element (35).

5. The semiconductor conductivity gauge of claim 1, wherein, ​ The y-axis Helmholtz coil (4), the x-axis Helmholtz coil (13) and the z-axis Helmholtz coil (21) of the magnetic field measuring module are all annular structures, wherein the y-axis Helmholtz coil (4) and the x-axis Helmholtz coil (13) are fixed on the support table (17) through the first flange (11) and the second flange (12) respectively; the z-axis Helmholtz coil (21) is fixed to the inner wall of the shell through the third flange (20); the x-axis Helmholtz coil (13) is further provided with a second profile (23) below; the linear Hall element (35) is used for measuring the magnetic field intensity and is placed on the thermocouple (31).

6. The semiconductor conductivity gauge of claim 1, wherein, The sample feeding module comprises a support seat (10), a lead screw sliding table (8), a first profile (9), a feeding table (19), a lower electrode sheet (18) and an upper electrode sheet (32); The support seat (10) of the sample feeding module is a columnar structure and is connected with the first profile (9) by welding; the lead screw sliding table (8) is connected with the first profile (9) by bolts; the first profile (9) is connected with the support seat (10) by welding; the feeding table (19) is a flat plate and is connected with the lead screw sliding table (8) by bolts; the lower electrode sheet (18) is in contact with the sample and is welded on the feeding table (19); the upper electrode sheet (32) is used for contacting with the sample and is welded on the tablet press (30).

7. The semiconductor conductivity gauge of claim 1, wherein, The operation panel module comprises a circuit board (37), an LCD display screen (38) and a button (39); The circuit board (37) is connected with each module through wires; the LCD display screen (38) is used for displaying the measurement results and is connected with the circuit board (37) through wires; the button (39) is connected with the circuit board (37) through wires.

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