High-temperature test probe jig and detection device

Abstract

The utility model discloses a high-temperature test probe jig and a detection device. The high-temperature test probe jig comprises a base frame, a test module, a heating module, a heat dissipation module, a temperature sensor and a controller. The base frame comprises an installation part and a heat dissipation part located on at least one side of the installation part, the installation part is provided with a through groove in the vertical direction, the test module is connected to the installation part by penetrating through the through groove, the test module is provided with a station suitable for placing a probe to be tested, the heating module is installed on the installation part, and the heating module is located on the same side of the heat dissipation part. The heat dissipation module is arranged on the heat dissipation part, the temperature sensor is close to the station and is suitable for detecting the test temperature, and the test module, the heating module and the heat dissipation module are electrically connected with the controller. Different temperature environments can be simulated to test the performance condition of the to-be-tested probe.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor's test probe detection, especially a high temperature test probe fixture and detection device. BACKGROUND

[0002] With the development of semiconductor technology, the size and complexity of electronic components are constantly improving, and the working power is getting bigger and bigger, and the heat generated during work is also getting more and more, so when testing semiconductor components, whether the test probe can normally and stably run in a high temperature environment is particularly important. The existing technology lacks a test device for the working capacity of the test probe in a high temperature environment. SUMMARY

[0003] The utility model aims at at least one of the technical problems existing in the prior art. To this end, the utility model provides a high temperature test probe fixture, which can adjust the test environment temperature to test the failure of the probe in a high temperature environment.

[0004] The utility model further provides a detection device with the high temperature test probe fixture.

[0005] According to the high temperature test probe fixture of the first aspect of the utility model, the base frame includes a mounting portion and a heat dissipation portion on at least one side of the mounting portion, and the mounting portion is provided with a through slot in the up-down direction.

[0006] The test module is connected to the mounting portion by penetrating the through slot, and the test module is provided with a work station suitable for placing the probe to be tested.

[0007] The heating module is installed on the mounting portion, and the heating module is located on the same side of the heat dissipation portion.

[0008] The heat dissipation module is arranged on the heat dissipation portion.

[0009] The temperature sensor is close to the work station and is suitable for detecting the test temperature.

[0010] The test module, the heating module and the heat dissipation module are electrically connected to the controller.

[0011] According to the high temperature test probe fixture of the utility model, the test module can carry the probe to be tested, the heating module and the heat dissipation module can monitor the temperature and control the temperature accurately in real time, and the state of the probe to be tested can be detected by the test module, so that the failure of the probe to be tested in a high temperature environment can be detected.

[0012] According to some embodiments of the present application, the test module comprises a probe fixing member detachably arranged in the through groove, a first circuit board and a second circuit board arranged on the upper and lower sides of the probe fixing member, a first mounting plate arranged on the upper end of the first circuit board, and a second mounting plate arranged on the lower end of the second circuit board, a plurality of the probes to be tested are arranged on the probe fixing member and are electrically connected with the first circuit board and the second circuit board to realize series connection, and the first circuit board and the second circuit board are electrically connected with the controller.

[0013] According to some embodiments of the present application, the probe fixing member comprises a cover plate and a base plate, the upper end surface of the cover plate is connected with the lower end surface of the first circuit board, the lower end surface of the cover plate is connected with the upper end surface of the base plate, the lower end surface of the base plate is connected with the upper end surface of the second circuit board, the temperature sensor is arranged on the upper end surface of the cover plate, a plurality of first through holes are arranged on the cover plate, a plurality of second through holes are arranged on the base plate, the plurality of first through holes are matched with the plurality of second through holes and form the workstations.

[0014] According to some embodiments of the present application, the mounting part comprises a first vertical mounting member, a second vertical mounting member, and a horizontal mounting member arranged between the first vertical mounting member and the second vertical mounting member, the first vertical mounting member, the second vertical mounting member, and the horizontal mounting member enclose a first groove and a second groove with the notches facing upward and downward, a third groove is arranged at the bottom of the first groove, the through groove penetrates the first groove, the second groove, and the third groove, the cover plate is arranged in the third groove, the base plate is arranged in the through groove, the first circuit board and the first mounting plate are arranged in the first groove, and the second circuit board and the second mounting plate are arranged in the second groove.

[0015] According to some embodiments of the present application, the test module further comprises a plurality of first positioning members, a plurality of second positioning members, and a plurality of third positioning members, the plurality of first positioning members are sequentially arranged through the first mounting plate, the first circuit board, the horizontal mounting member, the second circuit board, and the second mounting plate, the plurality of second positioning members are sequentially arranged through the cover plate and the horizontal mounting member, and the plurality of third positioning members are sequentially arranged through the cover plate and the base plate.

[0016] According to some embodiments of the present application, the heating module comprises a plurality of heating rods, a plurality of mounting holes are arranged on the first vertical mounting member and the second vertical mounting member, and the heating rods are arranged in the mounting holes.

[0017] According to some embodiments of the present application, the heating module comprises a plurality of heating rods, the heat dissipation part and the heating module are both two, two heat dissipation parts and two heating modules are arranged on the outer side of the first vertical mounting and the second vertical mounting.

[0018] According to some embodiments of the present application, the temperature sensor comprises two, two temperature sensors are respectively close to two sides of the heating module.

[0019] According to some embodiments of the present application, a plurality of through grooves are formed on the heat dissipation part, the heat dissipation module comprises a fan, and the fan is arranged in the groove of the plurality of through grooves.

[0020] The detection device according to the second aspect of the present application comprises the device according to the first aspect of the present application.

[0021] The detection device has at least the following beneficial effects: the test module can carry the probe to be tested, the temperature sensor can monitor the temperature and accurately control the temperature in real time through the heating function of the heating module and the cooling function of the heat dissipation module, and the state of the probe to be tested is detected by the test module, so that the failure of the probe to be tested in a high temperature environment is detected.

[0022] Additional aspects and advantages of the present application will be given in part in the following description, and will become apparent from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0023] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, with reference to the following drawings, in which:

[0024] Figure 1 is an assembly drawing of the high-temperature test probe jig according to the embodiments of the present application;

[0025] Figure 2 is a top view assembly structure schematic diagram of the high-temperature test probe jig according to the embodiments of the present application;

[0026] Figure 3 is Figure 2 A-A section view in the figure;

[0027] Figure 4 is Figure 1 The structure schematic diagram of the base frame of the high-temperature test probe jig is shown.

[0028] REFERENCE NUMERALS:

[0029] Base frame 100, mounting portion 110, through slot 111, first vertical mounting member 112, mounting hole 1121, second vertical mounting member 113, horizontal mounting member 114, first recess 115, second recess 116, third recess 1151, heat dissipation portion 120, through slot 121,

[0030] Test module 200, probe fixing member 210, cover plate 211, first through hole 2111, base plate 212, second through hole 2121, first circuit board 220, second circuit board 230, first mounting plate 240, second mounting plate 250, first positioning member 260, second positioning member 270, third positioning member 280,

[0031] Heating module 300,

[0032] Heat dissipation module 400,

[0033] Temperature sensor 500. DETAILED DESCRIPTION

[0034] The embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary only, and are used only for explaining the present application, and cannot be understood as a limitation of the present application.

[0035] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "vertical", "horizontal", "bottom", "inner", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application. In addition, the features limited as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "several" is two or more.

[0036] In the description of the present application, unless otherwise explicitly limited, the words "set", "mount", "connect", "connected" and the like should be broadly understood, and the skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0037] The following refers to Figures 1 to 4 A high-temperature test probe jig according to an embodiment of the present application is described.

[0038] Reference is made to Figure 1As shown, according to the high-temperature test probe jig of the utility model embodiment, the high-temperature test probe jig comprises a base frame 100, a test module 200, a heating module 300, a heat dissipation module 400, a temperature sensor 500 and a controller. The base frame 100 comprises a mounting portion 110 and a heat dissipation portion 120 located on at least one side of the mounting portion 110, the mounting portion 110 is provided with a through groove 111 in the up-down direction, the test module 200 is connected to the mounting portion 110 by penetrating the through groove 111, the test module 200 is provided with a work station suitable for placing a probe to be tested, the heating module 300 is installed on the mounting portion 110, the heating module 300 is located on the same side of the heat dissipation portion 120, the heat dissipation module 400 is arranged on the heat dissipation portion 120, the temperature sensor 500 is close to the work station and is suitable for detecting the test temperature, and the test module 200, the heating module 300 and the heat dissipation module 400 are electrically connected to the controller.

[0039] When the jig is used, the controller can control the test module 200, the heating module 300 and the heat dissipation module 400, the probe to be tested is placed at the work station formed by the test module 200, the test module 200 can detect the state of the probe to be tested in real time, the heating module 300 can heat the test module 200, so that the temperature at the work station is increased, the temperature sensor 500 can read the temperature at the work station in real time, record the data and feed back in real time, and the heat dissipation module 400 can perform overall cooling, so that the heating module 300 and the temperature sensor 500 can precisely control the temperature at the work station, thereby realizing temperature regulation of the work station on the test module 200 and detecting the failure of the probe to be tested in a high-temperature environment.

[0040] It can be understood that the base frame 100 is made of aluminum alloy, which is a material having good heat conduction function, so that the temperature of the work station can be quickly increased or decreased, the test time is reduced, and the base frame 100 can also be made of copper alloy, silver alloy, carbon fiber composite material and other materials having good heat conduction function.

[0041] In some specific embodiments of the utility model, test module 200 includes probe fixing piece 210 detachably installed in through groove 111, first circuit board 220 and second circuit board 230 arranged on the upper and lower sides of probe fixing piece 210, first mounting plate 240 arranged on the upper end of first circuit board 220 and second mounting plate 250 arranged on the lower end of second circuit board 230, a plurality of probes to be tested are installed on probe fixing piece 210 and are electrically connected with first circuit board 220 and second circuit board 230 to realize series connection, and first circuit board 220 and second circuit board 230 are electrically connected with the controller. Probe fixing piece 210 includes cover plate 211 and base plate 212, the upper end surface of cover plate 211 is connected with the lower end surface of first circuit board 220, the lower end surface of cover plate 211 is connected with the upper end surface of base plate 212, the lower end surface of base plate 212 is connected with the upper end surface of second circuit board 230, temperature sensor 500 is arranged on the upper end surface of cover plate 211, a plurality of first through holes 2111 are arranged on cover plate 211, a plurality of second through holes 2121 are arranged on base plate 212, a plurality of first through holes 2111 are matched with a plurality of second through holes 2121 and form a work station.

[0042] Reference Figure 1 , Figure 2 and Figure 3 In the embodiment, first mounting plate 240, first circuit board 220, cover plate 211, base plate 212, second circuit board 230 and second mounting plate 250 are connected in turn from top to bottom, the design of first mounting plate 240 facilitates the installation of first circuit board 220, the design of second mounting plate 250 facilitates the installation of second circuit board 230, and the pressure generated during installation and connection can be shared by first mounting plate 240 and second mounting plate 250, thereby playing a certain protection role.

[0043] It can be understood that the wiring points on first circuit board 220 and second circuit board 230 can be matched with the probes to be tested, thereby realizing the connection test of the probes to be tested.

[0044] It can be understood that first circuit board 220 and second circuit board 230 have the same structure size, and first mounting plate 240 and second mounting plate 250 have the same structure size, thereby improving the interchangeability of the device and facilitating maintenance and assembly.

[0045] It can be understood that the split structure design of test module 200 can realize the detection of different types of test probes by replacing cover plate 211, base plate 212, first circuit board 220 and second circuit board 230 of different specifications, thereby improving the applicability of the jig.

[0046] In some specific embodiments of the utility model, the installation part 110 includes first vertical installation piece 112, second vertical installation piece 113 and horizontal installation piece 114 arranged between first vertical installation piece 112 and second vertical installation piece 113, and first vertical installation piece 112, second vertical installation piece 113 and horizontal installation piece 114 enclose first recess 115 and second recess 116 with the notched upward and downward direction, the bottom of first recess 115 is provided with third recess 1151, through groove 111 passes through first recess 115, second recess 116 and third recess 1151, cover plate 211 is installed in third recess 1151, substrate 212 is located in through groove 111, first circuit board 220 and first mounting plate 240 are installed in first recess 115, and second circuit board 230 and second mounting plate 250 are installed in second recess 116.

[0047] Reference Figure 4 As shown in the utility model, in the embodiment, the design of first recess 115, second recess 116 and third recess 1151 can further reduce the space occupation of the jig, and make the device connection more compact, facilitate the bearing test module 200.

[0048] It can be understood that the upper end face of cover plate 211 can be flush with the bottom face of first recess 115, and the bottom face of substrate 212 can be flush with the groove bottom of second recess 116, which can make the overall structure of the device more compact and improve the stability.

[0049] In some specific embodiments of the utility model, the test module 200 further includes a plurality of first positioning members 260, a plurality of second positioning members 270 and a plurality of third positioning members 280, the plurality of first positioning members 260 are sequentially arranged through first mounting plate 240, first circuit board 220, horizontal installation piece 114, second circuit board 230 and second mounting plate 250, the plurality of second positioning members 270 are sequentially arranged through cover plate 211 and horizontal installation piece 114, and the plurality of third positioning members 280 are sequentially arranged through cover plate 211 and substrate 212.

[0050] Reference Figure 3 As shown in the utility model, in the embodiment, the plurality of first positioning members 260, the plurality of second positioning members 270 and the plurality of third positioning members 280 are different in size Pin structure, the number of the plurality of first positioning members 260, the plurality of second positioning members 270 and the plurality of third positioning members 280 is two, and the design of first positioning member 260, second positioning member 270 and third positioning member 280 can accurately position first mounting plate 240, first circuit board 220, cover plate 211, installation part 110, second circuit board 230 and second mounting plate 250 in the vertical direction, and ensure the placement accuracy of the probe to be tested.

[0051] In some embodiments of the utility model, heating module 300 includes several heating rods, first vertical mounting piece 112 and second vertical mounting piece 113 are provided with several mounting holes 1121, and the heating rods are installed in the mounting holes 1121.

[0052] Reference Figure 1 As shown in the figure, in the embodiment, heating module 300 is two heating rods horizontally installed in two mounting holes 1121, and presents central symmetry distribution, and can uniformly heat the work station. It can be understood that the setting of heating module 300 aims to uniformly heat the work station at measurement module 200, and the number can also be four, six and eight etc., and the mounting hole 1121 can also be vertically provided on the first vertical mounting piece 112 and the second vertical mounting piece 113, so that the heating module 300 can also be vertically installed near the work station, and the function of heating and warming up the work station is met.

[0053] In some embodiments of the utility model, the heat dissipation part 120 and the heating module 300 are uniformly two, and the two heat dissipation parts 120 and the two heating modules 300 are separately arranged on the outer side of the first vertical mounting piece 112 and the second vertical mounting piece 113.

[0054] Reference Figure 1 As shown in the figure, the design that two heat dissipation parts 120 and two heating modules 300 are separately arranged on the outer side of the first vertical mounting piece 112 and the second vertical mounting piece 113 can better heat and dissipate heat to the work station.

[0055] It can be understood that the jig presents a central symmetric structure in the overall structure, the middle is the test module 200, the heating module 300 surrounds the test module 200, the heat dissipation module 400 surrounds the heating module 300, and the temperature sensor 500 can effectively simulate the high-temperature environment to detect the probe to be detected.

[0056] In some embodiments of the utility model, the temperature sensor 500 includes two, and the two temperature sensors 500 are respectively close to two side heating modules 300. It can be understood that the design that the two temperature sensors 500 are respectively close to two side heating modules 300 can accurately read the temperature data of the work station, and the data feedback is good.

[0057] In some embodiments of the utility model, the heat dissipation part 120 is provided with several through grooves 121, the heat dissipation module 400 includes a fan, and the fan is arranged in the groove of the several through grooves 121.

[0058] Reference Figure 1As shown, in the embodiment, the heat dissipation part 120 is provided with a fin structure by opening a plurality of through grooves 121, can quickly export heat during the test, improves the heat dissipation temperature control capability, and effectively ensures the normal test. The heat dissipation module 400 is provided with a plurality of through grooves 121, and the heat dissipation module 400 uses the design of the fan. It can be understood that the number of fans is three, four or five, etc.

[0059] It can be understood that the jig is based on the base frame 100, and the "H" mounting part 110 is composed of the first vertical mounting part 112, the second vertical mounting part 113 and the horizontal mounting part 114. The first mounting plate 240, the first circuit board 220, the cover plate 211, the substrate 212, the second circuit board 230 and the second mounting plate 250 are mounted from top to bottom in the middle mounting part 110. The mounting hole 1121 is opened on the first vertical mounting part 112 and the second vertical mounting part 113 to place the heating module 300, which can be closest to the work station for heating. The heat dissipation part 120 provided with a fin structure on both sides of the mounting part 110 can facilitate the heat dissipation of the heating module 300, and the heat dissipation module 400 provided above the heat dissipation part can accelerate the speed of heat dissipation. The overall structure is centrally symmetric, and the arrangement is reasonable and compact, which can effectively reduce the space occupation.

[0060] The utility model embodiment further discloses a detection device, comprising the high temperature test probe jig.

[0061] When the device is used, the controller can control the test module 200, the heating module 300 and the heat dissipation module 400. The probe to be tested is placed at the work station formed by the test module 200. The test module 200 can detect the state of the probe to be tested in real time. The heating module 300 can heat the test module 200, so that the temperature of the work station is increased. The temperature sensor 500 can read the temperature of the work station in real time, record the data, and feedback in real time. The heat dissipation module 400 can cool the whole device. The heating module 300 and the temperature sensor 500 can accurately control the temperature of the work station, so as to realize temperature regulation of the work station on the test module 200, and detect the failure of the probe to be tested in the high temperature environment.

[0062] The embodiments of the utility model are described in detail above in combination with the drawings, but the utility model is not limited to the above-mentioned embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the purpose of the utility model.

Claims

1. A high temperature test probe jig, comprising: The utility model relates to a test device for probe, which comprises: a base frame (100) comprising a mounting part (110) and a heat dissipation part (120) on at least one side of the mounting part (110), the mounting part (110) being provided with a through slot (111) in the up-down direction; a test module (200) connected to the mounting part (110) by passing through the through slot (111), the test module (200) being provided with a work station suitable for placing a probe to be tested; a heating module (300) installed on the mounting part (110), the heating module (300) being located on the same side of the heat dissipation part (120); a heat dissipation module (400) provided on the heat dissipation part (120); a temperature sensor (500) close to the work station, suitable for detecting the test temperature; a controller, the test module (200), the heating module (300) and the heat dissipation module (400) being electrically connected to the controller.

2. The high temperature test probe handler of claim 1, wherein, The test module (200) comprises a probe fixing member (210) detachably installed in the through slot (111), a first circuit board (220) and a second circuit board (230) separately provided on the upper and lower sides of the probe fixing member (210), a first mounting plate (240) provided on the upper end of the first circuit board (220) and a second mounting plate (250) provided on the lower end of the second circuit board (230), a plurality of probes to be tested being installed on the probe fixing member (210) and electrically connected to the first circuit board (220) and the second circuit board (230) to realize series connection, the first circuit board (220) and the second circuit board (230) being electrically connected to the controller.

3. The high temperature test probe handler of claim 2, wherein, The probe fixing member (210) comprises a cover plate (211) and a base plate (212), the upper end surface of the cover plate (211) being connected to the lower end surface of the first circuit board (220), the lower end surface of the cover plate (211) being connected to the upper end surface of the base plate (212), the lower end surface of the base plate (212) being connected to the upper end surface of the second circuit board (230), the temperature sensor (500) being provided on the upper end surface of the cover plate (211), a plurality of first through holes (2111) being provided on the cover plate (211), a plurality of second through holes (2121) being provided on the base plate (212), the plurality of first through holes (2111) being matched with the plurality of second through holes (2121) and forming the work station.

4. The high temperature test probe handler of claim 3, wherein, The mounting part (110) comprises a first vertical mounting piece (112), a second vertical mounting piece (113) and a horizontal mounting piece (114) arranged between the first vertical mounting piece (112) and the second vertical mounting piece (113), the first vertical mounting piece (112), the second vertical mounting piece (113) and the horizontal mounting piece (114) enclose a first recess (115) and a second recess (116) with a notch facing upward and downward, a third recess (1151) is arranged at the bottom of the first recess (115), the through groove (111) penetrates the first recess (115), the second recess (116) and the third recess (1151), the cover plate (211) is arranged in the third recess (1151), the substrate (212) is arranged in the through groove (111), the first circuit board (220) and the first mounting plate (240) are arranged in the first recess (115), and the second circuit board (230) and the second mounting plate (250) are arranged in the second recess (116).

5. The high temperature test probe handler of claim 4, wherein, The test module (200) further comprises a plurality of first positioning pieces (260), a plurality of second positioning pieces (270) and a plurality of third positioning pieces (280), the plurality of first positioning pieces (260) are sequentially arranged through the first mounting plate (240), the first circuit board (220), the horizontal mounting piece (114), the second circuit board (230) and the second mounting plate (250), the plurality of second positioning pieces (270) are sequentially arranged through the cover plate (211) and the horizontal mounting piece (114), and the plurality of third positioning pieces (280) are sequentially arranged through the cover plate (211) and the substrate (212).

6. The high temperature test probe handler of claim 4, wherein, The heating module (300) comprises a plurality of heating rods, a plurality of mounting holes (1121) are arranged on the first vertical mounting piece (112) and the second vertical mounting piece (113), and the heating rods are arranged in the mounting holes (1121).

7. The high temperature test probe handler of claim 6, wherein The heat dissipation part (120) and the heating module (300) are uniformly arranged on the outer side of the first vertical mounting piece (112) and the second vertical mounting piece (113).

8. The high temperature test probe handler of claim 7, wherein, The temperature sensor (500) comprises two temperature sensors, and the two temperature sensors are arranged close to the two heating modules (300) respectively.

9. The high temperature test probe handler of claim 1, wherein, A plurality of through grooves (121) are arranged on the heat dissipation part (120), the heat dissipation module (400) comprises a fan, and the fan is arranged in the groove of the plurality of through grooves (121).

10. A detection device, characterized in that The high-temperature test probe jig comprises the high-temperature test probe jig according to any one of claims 1 to 9.

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