Circuit system for intelligent bed

Abstract

The utility model relates to a circuit system for an intelligent bed. The circuit system comprises a main control board; the main control board comprises a single-chip microcomputer MCU, a DC-DC circuit and an AD / DC switching power supply. The MCU is electrically connected with an AD / DC switching power supply through a DC-DC circuit; the single-chip microcomputer MCU is also electrically connected with the driver and the built-in H-bridge chip circuit. The driver adopts a built-in MOS tube to drive a chip circuit; the pulse width modulation driver is electrically connected with the fan assembly; the built-in H-bridge chip circuit is electrically connected with the Peltier assembly; the device is reasonable in design, compact in structure and convenient to use.

Description

TECHNICAL FIELD

[0001] The utility model relates to intelligent bed circuit system. BACKGROUND

[0002] Nowadays, more and more people pay attention to sleep experience. It is found through investigation that the temperature of the mattress is one of the important indicators of people's sleep experience. The mattress itself cannot adjust the temperature.

[0003] It is found that when the above temperature difference requirements are met, the air-cooled and heated main machine is only a single-channel structure, and when the rated air volume is reached, the working noise of the fan and the turbofan is too large, which affects the sleep quality of the user. The double-air-duct structure can meet the requirements under the condition of reducing the noise and keeping the rated air volume unchanged.

[0004] In view of the above technical problems, in order to realize double air duct, control cold and warm air, improve the safety of the mattress, reduce the circuit loss and failure, the present application develops an air-cooled and heated main machine, which delivers hot air and cold air to the mattress to cool or heat the mattress from inside to outside. When the mattress cover and the quilt hole inside and outside the quilt hole are heated, a temperature difference of about 6 DEG C is generated, and when the mattress is cooled, a temperature difference of about 2 DEG C is generated. UTILITY MODEL CONTENTS

[0005] The technical problem to be solved by the utility model is to provide an intelligent bed circuit system, thereby improving the poor safety, large loss and other technical problems of the existing circuit, and effectively supporting the hardware work.

[0006] To solve the above problems, the technical scheme adopted by the utility model is:

[0007] An intelligent bed circuit system, comprising a main control panel; the main control panel comprises a single-chip microcomputer MCU, a DC-DC circuit and an AD / DC switching power supply;

[0008] The single-chip microcomputer MCU is electrically connected with the AD / DC switching power supply through the DC-DC circuit;

[0009] The single-chip microcomputer MCU is further electrically connected with a driver and a built-in H-bridge chip circuit;

[0010] The driver adopts a built-in MOS tube driving chip circuit;

[0011] The pulse width modulation driver is electrically connected with a fan assembly; and the built-in H-bridge chip circuit is electrically connected with a Peltier assembly.

[0012] As a further improvement of the above technical scheme:

[0013] The single-chip microcomputer MCU is connected with a wireless remote controller through a wireless receiving module and / or an RF module;

[0014] The single-chip microcomputer MCU is further electrically connected with the buzzer.

[0015] The MCU is electrically connected with the driving chip pin 2; the built-in MOS tube driving chip U2 is electrically connected with the fan assembly through pin 7;

[0016] A current and temperature rise acquisition circuit is arranged between the built-in H-bridge chip circuit and the MCU.

[0017] The current and temperature rise acquisition circuit comprises a chip U5 and a chip U8;

[0018] In the chip U5, the current channel of the Peltier assembly is accessed through pin 1 and pin 6; pin 3 is grounded through a resistor R28;

[0019] The current signal acquired by the resistor R28 is connected to the other end of a resistor R4 electrically connected with pin 3 of the chip U8, the current OCP signal of the Peltier assembly is amplified by the chip U8, and pin 1 of the chip U8 is electrically connected with pin 21 of the MCU.

[0020] As a temperature rise acquisition channel, pin 5 of the chip U8 is electrically connected with an NTC temperature acquisition circuit, the chip U8 amplifies the signal, and pin 7 of the U8 chip is output electrically connected to pin 22 of the MCU.

[0021] A kind of intelligent bed circuit system control method, by means of above-mentioned host computer;

[0022] First, the fan blade of turbofan A is powered on to rotate, so that air pressure is generated in air duct A, and flowing air enters the air duct A of the host computer;Then, in the air duct A, the module in the refrigeration state or in the heating state carries out temperature treatment on the air flowing through the air duct A, and then outputs from the air outlet into the mattress interior.

[0023] As a further improvement of the above technical solution:

[0024] When carrying out the heating strategy, first, when the control system inputs direct current, the positive pole of the Peltier wire contacts the positive pole of the circuit, and the negative pole of the Peltier wire contacts the negative pole of the circuit;Then, the front surface of the Peltier wire generates heat and transmits the heat to the small aluminum evaporation shell through silicone grease to evaporate the heat energy, and the cold energy is gathered in the air duct A, and the back surface of the Peltier A generates cold energy, which is transmitted to the large aluminum evaporation sheet shell outside the channel through silicone grease to evaporate the cold energy;Secondly, the square fan works to speed up the air flow speed on the surface of the large aluminum evaporation sheet shell, thereby improving the evaporation efficiency of the large aluminum evaporation sheet shell.

[0025] When the refrigeration strategy is carried out, when input direct current power, the positive pole of the Peltier wire contacts the negative pole of the circuit, and the negative pole of the Peltier wire contacts the positive pole of the circuit, the front surface of the Peltier A generates cold energy, which is transmitted to the small aluminum evaporation shell through the silicone grease to evaporate the cold energy, and is gathered in the air duct A; the back surface of the Peltier A generates heat energy, which is transmitted to the large aluminum evaporation sheet shell through the silicone grease to evaporate the heat energy, and the square fan accelerates the air flow speed on the surface of the large aluminum evaporation sheet shell when working, thereby improving the evaporation efficiency of the large aluminum evaporation sheet shell;

[0026] Working principle: after the system is connected to AC power, the external switching power supply supplies power 29V to the main control panel, and the DC-DC circuit on the main control panel reduces 29V to 3.3V to supply power to the single-chip microcomputer MCU and the RF module;

[0027] When the mattress is supplied with warm air, the keys on the wired hand controller send instructions to the main control panel, and the hand controller interface circuit on the main control panel receives the key instruction of the wired hand controller and converts it into a level or instruction data recognized by the single-chip microcomputer MCU and transmits it to the single-chip microcomputer MCU for processing; when the single-chip microcomputer MCU receives the key instruction of the hand controller, the operation is executed;

[0028] The operation includes starting the Peltier A heating; when the heating temperature of the Peltier A rises to the user-set temperature, the fan assembly is started to deliver the heat of the Peltier A heating to the mattress to supply warm air, and in addition, air is blown to the other side of the Peltier A to balance the temperatures of the front and back surfaces of the Peltier A.

[0029] The utility model discloses the design is reasonable, low in cost, solid durable, safe and reliable, easy operation, save time and effort, save money, compact structure and convenient to use, solve the requirement of people when falling asleep to temperature, improve falling asleep experience, reduce circuit loss, guarantee electrical safety, optimize existing circuit, specific combination embodiment is explained. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 It is the air-cooled heating main machine system connection diagram of the utility model.

[0031] Figure 2 It is the electric control system module diagram of the utility model.

[0032] Figure 3 It is the control box system single-chip microcomputer circuit schematic diagram of the utility model.

[0033] Figure 4 It is the wireless transceiver circuit schematic diagram of the utility model.

[0034] Figure 5 It is the wired hand controller circuit schematic diagram of the utility model.

[0035] Figure 6Is the control box power circuit schematic diagram of the utility model.

[0036] Figure 7 Is the utility model's built-in MOS tube fan drive circuit schematic diagram.

[0037] Figure 8 Is the utility model's peltier drive circuit schematic diagram.

[0038] Figure 9 Is the utility model's current and temperature rise acquisition circuit schematic diagram.

[0039] Figure 10 Is the utility model's wired hand controller circuit schematic diagram.

[0040] Among them: 1, mattress;2, bellows;3, main machine. CONCRETE IMPLEMENTATION

[0041] As Figures 1-10 , as an embodiment, as Figure 1 shown, as the air-cooled and heated main machine of the embodiment is connected to the mattress, as an introduction, the embodiment includes a mattress 1;The inner cavity of the mattress 1 is connected to the bellows 2;The bellows 2 are connected to the main machine 3;The main machine 3 is an air-cooled and heated main machine and an air duct;A peltier assembly is arranged in the air duct;

[0042] When the air-cooled and heated main machine 3 is powered on and starts working, the refrigeration or heating air output by the main machine is connected to the mattress through the bellows 2, and the cold air or hot air is delivered to the inside of the mattress 1.

[0043] It is the application scenario introduction of the circuit.

[0044] In order to match the above components, as Figure 2 shown, the mattress 1 has an electric control system;The electric control system includes a main control board;The main control board circuit is respectively electrically connected to the AD / DC switching power supply, the fan assembly and the peltier assembly;

[0045] The fan assembly can include a square fan and a turbofan;

[0046] The peltier assembly includes a peltier and a heat sink arranged on both sides of the peltier;

[0047] The controller includes a wired hand controller or a wireless remote controller;

[0048] The controller is electrically connected to the single-chip microcomputer MCU;

[0049] The main control board includes a single-chip microcomputer MCU;The single-chip microcomputer MCU is electrically connected to the AD / DC switching power supply through the DC-DC circuit;

[0050] The single-chip microcomputer MCU accesses a wireless remote controller through a wireless receiving module and / or an RF module; the single-chip microcomputer MCU is also electrically connected with a buzzer, a driver and a built-in H-bridge chip circuit;

[0051] The pulse width modulation driver is electrically connected with the fan assembly; the built-in H-bridge chip circuit is electrically connected with the Peltier assembly; the driver adopts a built-in MOS tube driving chip circuit;

[0052] Working principle: after the system is connected to AC power, the external switching power supply supplies 29V power to the main control panel, the DC-DC circuit on the main control panel reduces the voltage from 29V to 3.3V to supply power to the single-chip microcomputer MCU and the RF module circuit, and the main power 29V supplies power to the fan driver and the H-bridge circuit; when the user needs to supply warm air to the mattress, the user sends instructions to the main control panel by operating the keys on the wired remote controller; after the wired remote controller key instruction is received by the remote controller interface circuit on the main control panel, it is converted into a level or instruction data that can be recognized by the single-chip microcomputer and is transmitted to the single-chip microcomputer for processing; after the single-chip microcomputer receives the key instruction of the remote controller, it performs related operations, such as starting Peltier heating; when the temperature of the Peltier heating rises to the user's set temperature, the fan is started to supply warm air to the mattress through the ventilation pipe; at the same time, another set of fan is also started to blow air to the other side of the Peltier, so that the temperature of the front and back of the Peltier is balanced. Similarly, the user can also operate other functions through the wired remote controller, such as turning off the Peltier heating, adjusting the increase or decrease of the Peltier temperature rise, adjusting the Peltier refrigeration, etc.

[0053] In addition, the user can also send instructions to the wireless receiving module on the main control panel by operating the keys on the wireless remote controller; after the wireless receiving module receives the key instruction of the wireless remote controller, it is converted into a level or instruction data that can be recognized by the single-chip microcomputer and is transmitted to the single-chip microcomputer for processing; after the single-chip microcomputer receives the key instruction of the wireless remote controller, it performs related operations, such as starting Peltier heating, turning off Peltier heating, adjusting the increase or decrease of the Peltier temperature rise, adjusting the Peltier refrigeration, etc.

[0054] As Figure 4 , the control box system, the single-chip microcomputer is used to process the wired or wireless remote controller instructions, control the Peltier refrigeration or heating, and monitor the working current of the Peltier and the Peltier temperature rise at the same time. Collect the current and temperature rise data of the Peltier; then control the Peltier refrigeration or heating temperature. The single-chip microcomputer also controls the fan to deliver cold or warm air to the mattress and controls the fan to dissipate heat from the Peltier. When the electric control system encounters an abnormal situation, the single-chip microcomputer controls the buzzer to alarm. The wireless transceiver circuit includes chip U7; chip U7 is electrically connected with stat and interface J1 through channel TX.

[0055] As Figure 5, the user operates the keys on the remote controller, when the remote controller's upper wireless module receives the key instruction, the key signal is converted into a radio frequency signal and sent to the wireless receiving module of the control box, the wireless module circuit of the control box receives the wireless radio frequency signal sent by the remote controller, and then converts the wireless radio frequency signal into a level or instruction data that can be recognized by the single-chip microcomputer. Then the single-chip microcomputer receives the key instruction of the wireless remote controller and executes the related operation. Such as starting the peltier heating, turning off the peltier heating, adjusting the increase and decrease of the peltier temperature rise, adjusting the peltier refrigeration, etc.

[0056] The wired hand controller interface circuit converts the wired hand controller key signal into a level or instruction data that can be recognized by the single-chip microcomputer and transmits it to the single-chip microcomputer for processing, and then the single-chip microcomputer controls the fan and the peltier to run.

[0057] The interface RJ1 realizes the signal input to the base of the corresponding triode, thereby realizing the level change of the collector R-SIG of the triode.

[0058] In Figure 6 , the power supply circuit is used to power the single-chip microcomputer, the hand controller circuit, and the MOS tube driving circuit, and the voltage stabilizer is the chip U3.

[0059] As Figure 7 , the fan is controlled by the switching action of the built-in MOS tube chip driving circuit, and the fan is started and stopped. The MOS tube chip is U2, the signal input to the single-chip microcomputer MCU is output to the corresponding fan through the foot 7 signal output interface XS3.

[0060] In Figure 8 , the built-in H-bridge chip circuit is used to change the current direction of the peltier to realize peltier refrigeration or heating. The H-bridge circuit uses chip U5.

[0061] The feet 11 and 12 of the chip U5 are connected to the single-chip microcomputer MCU, and the feet 1 and 6 are electrically connected to the peltier to realize the change of the current direction setting.

[0062] In Figure 9 , the current and temperature rise acquisition circuit is used to collect the current and temperature rise data of the peltier refrigeration and heating process and feed back to the single-chip microcomputer for PID accurate control of the temperature of the peltier refrigeration or heating.

[0063] In Figure 10 , the hand controller circuit is connected to the control box for operating the fan and the peltier to run.

[0064] The current and temperature rise acquisition circuit is arranged between the H-bridge circuit and the MCU;

[0065] The current and temperature rise acquisition circuit includes chip U5;

[0066] In the chip U5, the current channel of the Peltier component is accessed by the pins 1 and 6; the pin 3 is grounded through the resistor R28, and the current signal collected by the resistor R28 is connected to the other end of the resistor R4 connected to the pin 3 of the U8, and the current OCP signal of the Peltier component is transmitted to the pin 21 of the MCU through the pin 1 after being amplified by the U8 chip; the temperature rise acquisition channel is electrically connected to the NTC temperature acquisition circuit through the pin 5 of the U8, and the signal is amplified by the chip U8 and output to the pin 22 of the MCU through the pin 7 of the U8 chip.

[0067] The small aluminum evaporation shell and the large aluminum evaporation piece shell are respectively small and large heat dissipation fins.

[0068] As a specific application, the heating principle of the embodiment. When the control system inputs direct current energy in the following way: the positive pole of the Peltier wire contacts the positive pole of the circuit, and the negative pole of the Peltier wire contacts the negative pole of the circuit, the positive side of the Peltier wire will generate heat and transfer to the small aluminum evaporation shell on one side through silicone grease to evaporate heat energy, and gather in the air duct. The reverse side of the Peltier wire will generate cold energy, which is also transferred to the large aluminum evaporation piece shell on the other side of the channel through silicone grease to evaporate cold energy. The large aluminum evaporation piece shell is provided with square fans which only work side by side, and the square fans speed up the air flow speed on the surface of the large aluminum evaporation piece shell when working, thereby improving the evaporation efficiency of the large aluminum evaporation piece shell. While improving the evaporation efficiency of the large aluminum evaporation piece shell outside the air duct, the evaporation efficiency of the small aluminum evaporation shell inside the air duct is also improved.

[0069] The cooling principle is that when the control system inputs direct current energy in the following way: the positive pole of the Peltier wire contacts the negative pole of the circuit, and the negative pole of the Peltier wire contacts the positive pole of the circuit, the positive side of the Peltier wire will generate cold energy, which is transferred to the small aluminum evaporation shell on one side through silicone grease to evaporate cold energy. And gather in the channel. The reverse side of the Peltier wire will generate heat energy, which is also transferred to the large aluminum evaporation piece shell on the other side of the channel through silicone grease to evaporate heat energy. The large aluminum evaporation piece shell is provided with square fans which only work side by side, and the square fans speed up the air flow speed on the surface of the large aluminum evaporation piece shell when working, thereby improving the evaporation efficiency of the large aluminum evaporation piece shell. While improving the evaporation efficiency of the large aluminum evaporation piece shell outside the air duct, the evaporation efficiency of the small aluminum evaporation shell inside the air duct is also improved.

[0070] As a specific application, the working principle of the double-channel module: the double-channel air duct is divided into a left air duct and a right air duct by a partition plate, and is assembled together by screws to form a double-channel module. The double-channel module forms a sealed treatment around the channel, and at this time, air can only be input from the air inlet of the double-channel module and output from the air outlet of the double-channel module.

[0071] The utility model fully describes in order to disclose more clearly, and for prior art no longer enumerate one by one.

[0072] Finally, it should be noted that: the above examples are used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; as a person skilled in the art, it is obvious to combine the technical solutions of the present application. These modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application. The technical content not described in detail in the present application is known technology.

Claims

1. An intelligent bed circuit system, characterized by: The main control board comprises a single-chip microcomputer (MCU), a DC-DC circuit, and an AD / DC switching power supply. The single-chip microcomputer (MCU) is electrically connected to the AD / DC switching power supply through the DC-DC circuit. The single-chip microcomputer (MCU) is also electrically connected to a driver and a built-in H-bridge chip circuit. The driver adopts a built-in MOS tube driving chip circuit. The pulse width modulation driver is electrically connected to a fan assembly; and the built-in H-bridge chip circuit is electrically connected to a Peltier assembly.

2. The smart bed circuitry of claim 1, wherein: The single-chip microcomputer (MCU) is connected to a wireless remote controller through a wireless receiving module and / or an RF module. The single-chip microcomputer (MCU) is also electrically connected to a buzzer.

3. The smart bed circuitry of claim 1, wherein: The MCU is electrically connected to a driving chip pin 2; and a built-in MOS tube driving chip U2 is electrically connected to a fan assembly through a pin 7. A current and temperature rise acquisition circuit is arranged between the built-in H-bridge chip circuit and the MCU.

4. The smart bed circuitry of claim 3, wherein: The current and temperature rise acquisition circuit comprises a chip U5 and a chip U8. In the chip U5, a pin 1 and a pin 6 are connected to a current channel of the Peltier assembly. A pin 3 is connected to the ground through a resistor R28. A current signal acquired by the resistor R28 is connected to the other end of a resistor R4 electrically connected to a pin 3 of the chip U8; a current OCP signal of the Peltier assembly is amplified by the chip U8; and a pin 1 of the chip U8 is electrically connected to a pin 21 of the MCU. As a temperature rise acquisition channel, a pin 5 of the chip U8 is electrically connected to an NTC temperature acquisition circuit; the chip U8 amplifies a signal; and a pin 7 of the chip U8 is output to a pin 22 of the MCU.

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