Server

Abstract

The embodiment of the utility model provides a server which comprises a case, a first processor radiator, a second processor radiator and a temperature equalizing assembly, the temperature equalizing assembly comprises a first cold plate, a second cold plate and a circulating pipeline, and the circulating pipeline is filled with a cooling medium. In the temperature equalizing assembly of the server, the first cold plate and the second cold plate are communicated through the circulating pipeline, the cooling medium flows in the circulating pipeline, and the temperature of the cooling medium flowing through the first cold plate and the second cold plate is consistent, so that the temperature consistency of the first cold plate and the second cold plate is further ensured; due to the fact that the first cold plate and the second cold plate cover the first processor radiator and the second processor radiator respectively, the temperature equalizing effect on the first processor radiator and the second processor radiator is achieved through the cooling effect of the first cold plate and the second cold plate. The technical defects that the upstream and downstream temperature difference of a server provided with a plurality of CPUs is large, and the heat dissipation structure is complex are overcome.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, and in particular to a server. BACKGROUND

[0002] At present, the mainstream server on the market is configured with multiple CPUs to meet the practical demand of high performance of the server. After arranging multiple CPUs inside the server, the upstream and downstream CPUs will generate a large temperature difference. According to the calculation of the temperature difference between the upstream and downstream CPUs, the temperature difference can reach more than 9℃. The large temperature difference affects the use performance of the server.

[0003] Therefore, the technical defects of the server configured with multiple CPUs, such as large temperature difference between the upstream and downstream and complex heat dissipation structure, have become a problem to be solved by the technical personnel in the field. CONTENT OF THE INVENTION

[0004] The embodiment of the present application provides a server, which comprises a case, a first processor radiator, a second processor radiator and a uniform temperature assembly. The first processor radiator, the second processor radiator and the uniform temperature assembly are arranged inside the case. The uniform temperature assembly is connected between the first processor radiator and the second processor radiator. The uniform temperature assembly comprises a first cold plate, a second cold plate and a circulation pipeline. The first cold plate and the second cold plate are respectively arranged above the first processor radiator and the second processor radiator. The circulation pipeline is connected with the first cold plate and the second cold plate. The inside of the circulation pipeline is filled with a cooling medium, which is used for uniform temperature of the first processor radiator and the second processor radiator.

[0005] The first cold plate and the second cold plate are used for cooling the first processor radiator and the second processor radiator respectively, so that the uniform temperature of the first processor radiator and the second processor radiator is realized. Thus, the first processor cooled by the first processor radiator and the second processor cooled by the second processor are uniformly cooled.

[0006] In one embodiment, the case further comprises a box body and a cover plate arranged on the box body. The first processor radiator and the second processor radiator are arranged in the box body. The uniform temperature assembly is fixed to the surface of the cover plate facing the box body. When the cover plate is arranged on the box body, the first cold plate and the second cold plate are respectively arranged above the first processor radiator and the second processor radiator. Thus, the uniform temperature assembly can utilize the upper space of the box body, which is beneficial to improve the integration of the whole server. In one embodiment, the uniform temperature assembly further comprises a circulating pump, which is connected with the circulation pipeline.

[0007] The server further comprises a circuit board, the circuit board comprises a power supply interface, the circulating pump is connected with the power supply interface, and the circulating pump is powered through the circuit board. The circuit board supplies power to the circulating pump, and after the circulating pump is communicated with the circulating pipeline, the circulating speed of the cooling medium in the circulating pipeline is accelerated, and the cooling effect of the uniform temperature assembly is accelerated.

[0008] In one of the embodiments, the uniform temperature assembly further comprises: a heat dissipation fin, the heat dissipation fin is installed on the outer wall of the circulating pipeline and / or the upper cover plate of the cabinet. The heat dissipation fin can exchange heat with the cooling medium, quickly cool the cooling medium, and quickly conduct and release the heat absorbed by the first processor radiator and the second processor radiator.

[0009] In one of the embodiments, the uniform temperature assembly further comprises: a fan, the fan is arranged at the side of the heat dissipation fin. The fan can accelerate the air circulation speed around the heat dissipation fin, and optimize the heat dissipation effect of the heat dissipation fin.

[0010] In one of the embodiments, the first processor radiator is provided with a heat conduction pad on the surface facing the first cold plate, and the heat conduction pad is located between the first processor radiator and the first cold plate. The heat conduction pad can direct and efficiently transfer the heat emitted by the first processor radiator to the first cold plate, optimize the cooling effect of the first cold plate on the first processor radiator, and further optimize the heat dissipation effect on the first processor.

[0011] In one of the embodiments, the first processor radiator is provided with a sunken groove on the surface facing the first cold plate, the bottom surface of the sunken groove is provided with a heat conduction pad, the first cold plate is located in the sunken groove, and the heat conduction pad connects the first cold plate and the first processor radiator. The structure design of the sunken groove is beneficial to the miniaturization of the overall structure design of the server, and the fixed heat conduction pad is more conducive to the directional and efficient conduction of heat.

[0012] In one of the embodiments, the circulating pipeline is embedded in the surface of the cover plate facing the cabinet. The circulating pipeline is embedded in the cover plate, which can strengthen the structural stability of the circulating pipeline and prevent the cooling medium flowing in the circulating pipeline from affecting other structures of the server.

[0013] In one of the embodiments, the server further comprises a first processor and a second processor, the first processor is located on a side of the first processor heat sink opposite to the first cold plate, and the second processor is located on a side of the second processor heat sink opposite to the second cold plate. The heat of the first processor is dissipated through the first processor heat sink, and further, the heat of the first processor heat sink is further dissipated through the first cold plate. Similarly, the heat of the second processor is dissipated through the second processor heat sink, and further, the heat of the second processor heat sink is further dissipated through the second cold plate.

[0014] In one of the embodiments, the server further comprises a first processor, a second processor, a third cold plate and a fourth cold plate, the third cold plate is arranged on the first processor and connected with the first processor heat sink, and the fourth cold plate is arranged on the second processor and connected with the second processor heat sink. The third cold plate and the fourth cold plate cooperate with the first cold plate and the second cold plate respectively, and achieve better cooling effect on the first processor and the second processor respectively.

[0015] In the technical scheme provided by the embodiments of the present application, in the temperature equalizing assembly of the server, the first cold plate and the second cold plate are connected through the circulating pipeline, and the cooling medium flows in the circulating pipeline, the temperature of the cooling medium circulating through the first cold plate and the second cold plate is consistent, which further ensures the temperature consistency of the first cold plate and the second cold plate. Since the first cold plate and the second cold plate are respectively arranged above the first processor heat sink and the second processor heat sink, the heat of the first processor heat sink and the second processor heat sink is respectively absorbed by the first cold plate and the second cold plate through the cooling effect of the first cold plate and the second cold plate with consistent temperature, and the first processor heat sink and the second processor heat sink respectively cool the first processor and the second processor, thereby further achieving the same temperature equalizing effect on the first processor and the second processor. Meanwhile, the server provided by the embodiments of the present application has simple structure and does not introduce complex structural components, thereby solving the technical defects of large upstream and downstream temperature difference and complex heat dissipation structure of the server with multiple CPUs. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the provided drawings.

[0017] Figure 1 In the server provided by the embodiments of the present application, the top view of the temperature equalizing assembly;

[0018] Figure 2The side view of the server provided in the technical scheme of the embodiment of the application;

[0019] Figure 3 The top view of the server in which the uniform temperature assembly is integrated in the cover plate provided in the embodiment of the application;

[0020] Figure 4 The top view of the server without the cover plate provided in the technical scheme of the embodiment of the application;

[0021] Figure 5 The top view of the server with the cover plate provided in the technical scheme of the embodiment of the application;

[0022] The first cold plate 1, the circulating pipeline 2, the circulating pump 3, the fan 4, the heat dissipation fin 5, the first processor radiator 6, the first processor 7, the heat conduction pad 8, the second cold plate 9, the second processor radiator 10, the second processor 11, the cover plate 12, the third cold plate 13 and the fourth cold plate 14. DETAILED DESCRIPTION

[0023] The embodiment of the application provides a server, which is used for solving the technical defects of large upstream and downstream temperature difference and complex heat dissipation structure of the server configured with multiple CPUs.

[0024] In order to make the above-mentioned purposes, features and advantages of the embodiments of the application more obvious and easy to understand, the specific embodiments of the embodiments of the application are described in detail below. In the following description, a large number of specific details are set forth in order to facilitate a full understanding of the embodiments of the application. However, the embodiments of the application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the embodiments of the application, so the embodiments of the application are not limited by the specific embodiments disclosed below.

[0025] The server is a special dedicated computer that provides various services for the client in the network environment, undertakes the key tasks of data storage, forwarding and publishing, and is an important component indispensable in various client / server (C / S) mode or B / S mode networks. In the hardware composition of the server, the CPU is the core component of the server, responsible for executing various instructions and operation tasks, and the server usually adopts multiple high-performance CPUs to improve the processing capability.

[0026] Please refer to Figures 1 to 5The embodiment of the application provides a kind of server, including case, first processor radiator 6, second processor radiator 10 and uniform temperature component, first processor radiator 6, second processor radiator 10 and uniform temperature component are located in the inside of case, uniform temperature component is connected between first processor radiator 6 and second processor radiator 10;Uniform temperature component includes first cold plate 1, second cold plate 9 and circulation pipeline 2, first cold plate 1 and second cold plate 9 are covered above first processor radiator 6 and second processor radiator 10 respectively, circulation pipeline 2 is communicated first cold plate 1 and second cold plate 9;The inside of circulation pipeline 2 is filled with cooling medium, for first processor radiator 6 and second processor radiator 10 uniform temperature.

[0027] In the technical scheme provided by the embodiment of the application, in the uniform temperature component of the server, the circulation pipeline 2 is communicated with the first cold plate 1 and the second cold plate 9, the cooling medium flows in the circulation pipeline 2, the temperature of the cooling medium circulating through the first cold plate 1 and the second cold plate 9 is consistent, which further ensures the temperature consistency of the first cold plate 1 and the second cold plate 9. At this time, since the first cold plate 1 and the second cold plate 9 are respectively covered above the first processor radiator 6 and the second processor radiator 10, the uniform temperature effect of the first processor radiator 6 and the second processor radiator 10 is realized through the cooling effect of the first cold plate 1 and the second cold plate 9. Further, the first processor radiator 6 is used for cooling the first processor 7, and the second processor radiator 10 is used for cooling the second processor 11. Under the premise that the first cold plate 1 and the second cold plate 9 uniformly cool the first processor radiator 6 and the second processor radiator 10 respectively, the first processor 7 and the second processor 11 are uniformly cooled.

[0028] When multiple CPUs are arranged in the server, each CPU is cooled by the corresponding processor radiator. Since the cold plates for cooling each processor radiator are communicated by the circulation pipeline filled with cooling medium, the temperatures of the cold plates are the same, and the cooling effect of each processor radiator is the same. Correspondingly, the temperatures of the CPUs cooled by the processor radiators decrease uniformly, and there is no large difference in the temperatures of the CPUs due to the upstream and downstream differences.

[0029] Meanwhile, the server provided by the embodiment of the application has a simple structure, does not introduce complex structural components, and can realize the problem of large temperature difference between the first processor 7 and the second processor 11 through simple structural improvement, thereby solving the technical defects of large upstream and downstream temperature difference and complex cooling structure of the server with multiple CPUs.

[0030] Please refer to Figures 3-5In the server provided by the embodiments of the present application, the case further comprises a case body and a cover plate 12 arranged on the case body, the first processor radiator 6 and the second processor radiator 10 are arranged in the case body, the temperature equalizing assembly is fixed to the surface of the cover plate 12 facing the case body, and the first cold plate 1 and the second cold plate 9 respectively cover the first processor radiator 6 and the second processor radiator 10 when the cover plate 12 is arranged on the case body. In the process of heat dissipation of the first processor radiator 6 and the second processor radiator 10, the heat dissipated upwardly, at this time, when the cover plate 12 covers the case body, the first cold plate 1 and the second cold plate 9 are located in the main flow direction of the heat dissipated by the first processor radiator 6 and the second processor radiator 10, and can better absorb the heat dissipated by the first processor radiator 6 and the second processor radiator 10 respectively, thereby optimizing the cooling effect of the temperature equalizing assembly on the first processor radiator 6 and the second processor radiator 10.

[0031] In some embodiments, the cooling efficiency of the temperature equalizing assembly is improved, and the circulation speed of the cooling medium in the circulation pipeline 2 is accelerated. For details, please refer to Figure 3 In the server provided by the embodiments of the present application, the temperature equalizing assembly further comprises a circulating pump 3, and the circulating pump 3 is in communication with the circulation pipeline 2. The circulating pump 3 can overcome various resistances, such as friction and local resistance, which are suffered by the cooling medium in the process of flowing in the circulation pipeline 2, so as to ensure that the cooling medium can continuously flow in the circulation pipeline 2 and accelerate the circulation speed of the cooling medium in the circulation pipeline 2. The server further comprises a circuit board, and the circuit board comprises a power supply interface. The circulating pump 3 is connected with the power supply interface, and the circuit board supplies power to the circulating pump 3. In the working process of the circulating pump 3, the circuit board supplies power to the circulating pump 3 through the power supply interface. In the specific application process, different circuit boards can be selected according to actual needs, such as a mainboard, a fan 4 backboard or other backboards, and details are not described herein.

[0032] For details, please refer to Figure 1 In the server provided by some embodiments of the present application, the temperature equalizing assembly can further comprise a heat dissipation fin 5, and the heat dissipation fin 5 is arranged on the outer wall of the circulation pipeline 2 and / or the upper cover plate 12 of the case. In the process of circulation of the cooling medium in the circulation pipeline 2, the cooling medium in the first cold plate 1 and / or the second cold plate 9 exchanges heat with the first processor radiator 6 and / or the second processor radiator 10, at this time, the temperature of the cooling medium in the circulation pipeline 2 is increased, which may affect the cooling effect of the temperature equalizing assembly.

[0033] In the technical scheme provided by the embodiment of the application, the heat dissipation fins 5 are installed on the outer wall of the circulating pipeline 2 and / or the upper cover plate 12 of the case, when the cooling medium flows through the vicinity of the circulating pipeline 2 and / or the upper cover plate 12 of the case provided with the heat dissipation fins 5, the heat dissipation fins 5 exchange heat with the cooling medium, the cooling medium can be effectively cooled, and further, the heat dissipation fins 5 dissipate the heat absorbed when exchanging heat with the cooling medium. When the cooling medium cooled by the heat dissipation fins 5 flows through the first cold plate 1 and / or the second cold plate 9 again, the first processor radiator 6 and / or the second processor radiator 10 can be better cooled.

[0034] In some embodiments, please further refer to Figure 1 In the server provided by the embodiment of the application, the uniform temperature assembly can further include a fan 4 arranged at the side of the heat dissipation fins 5. The fan 4 can accelerate the air circulation speed around the heat dissipation fins 5, more efficiently dissipate the heat of the heat dissipation fins 5, and conduct the heat to the outside of the server, thereby effectively optimizing the heat dissipation effect of the heat dissipation fins 5.

[0035] In the process of dissipating heat of the first processor radiator 6 through the first cold plate 1, in order to ensure that the heat of the first processor radiator 6 can be conducted to the first cold plate 1 in a directional and efficient manner, in the technical scheme provided by the embodiment of the application, the surface of the first processor radiator 6 facing the first cold plate 1 is provided with a heat-conducting pad 8, and the heat-conducting pad 8 is located between the first processor radiator 6 and the first cold plate 1.

[0036] Similarly, it can be clearly understood by those skilled in the art that, in order to ensure that the heat of the second processor radiator 10 can be conducted to the second cold plate 9 in a directional and efficient manner, in the technical scheme provided by the embodiment of the application, the surface of the second processor radiator 10 facing the second cold plate 9 is provided with a heat-conducting pad 8, and the heat-conducting pad 8 is located between the second processor radiator 10 and the second cold plate 9.

[0037] In some embodiments, in the technical scheme provided by the embodiment of the application, the surface of the first processor radiator 6 facing the first cold plate 1 is provided with a sunken groove, the bottom surface of the sunken groove is provided with a heat-conducting pad 8, the first cold plate 1 is located in the sunken groove, and the heat-conducting pad 8 connects the first cold plate 1 and the first processor radiator 6. By means of the sunken groove, the first cold plate 1 is embedded or partially embedded in the first processor radiator 6, and further, by means of the connection of the heat-conducting pad 8, the first cold plate 1 can better absorb and conduct the heat dissipated by the first processor radiator 6, thereby optimizing the cooling effect of the first cold plate 1; at the same time, the embedded or partially embedded structure is simpler and more compact, and will not affect the structural arrangement of the server due to the addition of the uniform temperature assembly.

[0038] Similarly, it can be clearly understood by those skilled in the art that the same treatment can also be performed on the second processor radiator 10, which will not be described here.

[0039] In some embodiments, to strengthen the stability of the circulation pipeline 2 and prevent the cooling medium circulating in the circulation pipeline 2 from affecting other structures in the server, in the technical scheme provided by the embodiment of the application, the circulation pipeline 2 is embedded towards the surface of the cabinet.

[0040] Please refer to Figure 2 The server provided by the embodiment of the application further includes a first processor 7 and a second processor 11. The first processor 7 is located on the side of the first processor radiator 6 away from the first cold plate 1, and the second processor 11 is located on the side of the second processor radiator 10 away from the second cold plate 9. The heat of the first processor 7 is radiated through the first processor radiator 6, and then the first processor radiator 6 is radiated through the first cold plate 1. Similarly, the heat of the second processor 11 is radiated through the second processor radiator 10, and then the second processor radiator 10 is radiated through the second cold plate 9.

[0041] Please refer to Figure 5 The server provided by the embodiment of the application further includes a first processor, a second processor radiator 10, a third cold plate 13 and a fourth cold plate 14. The third cold plate 13 is arranged on the first processor and connected with the first processor radiator 6, and the fourth cold plate 14 is arranged on the second processor and connected with the second processor radiator 10. The third cold plate 13 and the fourth cold plate 14 are arranged below the first processor and the second processor radiator 10 respectively, and cooperate with the first cold plate 1 and the second cold plate 9 to absorb the heat from the first processor radiator 6 and the second processor radiator 10 respectively, thereby further optimizing the heat dissipation effect and efficiency of the first processor radiator 6 and the second processor radiator 10.

[0042] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the disclosure. Meanwhile, other embodiments can be derived from the above-described embodiments, so that the structure and logic can be replaced and changed without departing from the scope of the disclosure.

[0043] The above-described embodiments only express several implementation manners of the embodiments of the application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the embodiments of the application, several modifications and improvements can be made, which are within the protection scope of the embodiments of the application. Therefore, the protection scope of the patent of the embodiments of the application should be subject to the appended claims.

Claims

1. A server, characterized by The server comprises a cabinet, a first processor radiator, a second processor radiator and a uniform temperature assembly, the first processor radiator, the second processor radiator and the uniform temperature assembly are arranged in the cabinet, and the uniform temperature assembly is connected between the first processor radiator and the second processor radiator. The uniform temperature assembly comprises a first cold plate, a second cold plate and a circulation pipeline, the first cold plate and the second cold plate are arranged above the first processor radiator and the second processor radiator respectively, and the circulation pipeline is connected with the first cold plate and the second cold plate. The circulation pipeline is filled with cooling medium, and is used for uniform temperature of the first processor radiator and the second processor radiator.

2. The server of claim 1, wherein, The cabinet further comprises a cabinet body and a cover plate arranged on the cabinet body, the first processor radiator and the second processor radiator are arranged in the cabinet body, the uniform temperature assembly is fixed to the surface of the cover plate facing the cabinet body, and when the cover plate is arranged on the cabinet body, the first cold plate and the second cold plate are arranged above the first processor radiator and the second processor radiator respectively.

3. The server of claim 2, wherein, The uniform temperature assembly further comprises a circulation pump, and the circulation pump is connected with the circulation pipeline. The server further comprises a circuit board, the circuit board comprises a power supply interface, the circulation pump is connected with the power supply interface, and the circulation pump is powered by the circuit board.

4. The server of claim 3, wherein, The uniform temperature assembly further comprises heat dissipation fins, and the heat dissipation fins are arranged on the outer wall of the circulation pipeline and / or the upper cover plate of the cabinet.

5. The server of claim 4, wherein, The uniform temperature assembly further comprises a fan, and the fan is arranged on the side of the heat dissipation fins.

6. The server of any one of claims 2 to 5, characterized in that, The surface of the first processor radiator facing the first cold plate is provided with a heat conduction pad, and the heat conduction pad is arranged between the first processor radiator and the first cold plate.

7. The server of any of claims 2 to 5, wherein, The surface of the first processor radiator facing the first cold plate is provided with a sunken groove, the bottom surface of the sunken groove is provided with a heat conduction pad, the first cold plate is arranged in the sunken groove, and the heat conduction pad connects the first cold plate and the first processor radiator.

8. The server of any of claims 2 to 7, wherein, The circulation pipeline is embedded in the surface of the cover plate facing the cabinet body.

9. The server of any of claims 2 to 8, wherein, The server further comprises a first processor and a second processor, the first processor is arranged on the side of the first processor radiator away from the first cold plate, and the second processor is arranged on the side of the second processor radiator away from the second cold plate.

10. The server of any of claims 2 to 8, wherein, The server further comprises a first processor, a second processor, a third cold plate and a fourth cold plate, the third cold plate is arranged on the first processor and connected with the first processor radiator, and the fourth cold plate is arranged on the second processor and connected with the second processor radiator.

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