Lightweight fin type laser heat dissipation module
By combining a lightweight finned heat dissipation module with a cooling fan and a cooling module, the overheating problem of the laser module during high-power operation is solved, achieving rapid heat dissipation and cooling, and improving the stability and lifespan of the equipment.
Patent Information
- Application Number
- CN202423164592.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-21
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2034-12-21
AI Technical Summary
Existing laser modules are prone to overheating when operating at high power, leading to equipment damage, and existing finned heat dissipation components are not effective in heat dissipation.
It adopts a lightweight finned heat dissipation module design, combined with a heat dissipation fan and a cooling module. It achieves rapid heat conduction and cooling through finned heat sinks and semiconductor cooling plates, and is equipped with a filter layer to prevent impurities from entering.
It achieves rapid heat dissipation and cooling during high-power operation, improving the stability and service life of the equipment.
Smart Images
Figure CN223957072U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to laser heat dissipation module, concretely light weight finned laser heat dissipation module. BACKGROUND
[0002] The core of the existing laser module for generating laser is a laser diode, and the laser diode will generate a large amount of heat while emitting light. How to effectively dissipate the heat generated by the laser diode is an important indicator for measuring the service life and performance of the laser diode.
[0003] The laser heat dissipation module in the prior art only simply arranges a light weight finned metal heat dissipation operation outside, but the single finned component will still cause overheating of the laser module and a probability of equipment damage when the laser module is operated at high power. UTILITY MODEL CONTENT
[0004] The utility model solves the technical problem in the above background technology, and provides a light weight finned laser heat dissipation module with good heat dissipation effect.
[0005] To solve the above technical problems, the utility model provides a technical scheme of a light weight finned laser heat dissipation module, which comprises an outer shell body, a heat dissipation middle cylinder is connected in the outer shell body, a laser device is connected in the heat dissipation middle cylinder, a plurality of finned heat dissipation fins are connected between the outer side of the heat dissipation middle cylinder and the inner side of the outer shell body, and the finned heat dissipation fins are arranged in a wave shape.
[0006] An upper heat dissipation module is connected to the top plate of the outer shell body, an inner sleeve in interference fit with the inside of the heat dissipation middle cylinder is connected to the bottom of the upper heat dissipation module, a wind collecting cover is connected to the top of the upper heat dissipation module, a heat dissipation exhaust fan is connected to the top of the wind collecting cover, and an air inlet hole matched with the heat dissipation exhaust fan is arranged at the bottom of the outer shell body.
[0007] Further, a plurality of fixed support plates are connected to the top plate on the outer side of the upper heat dissipation module, and the fixed support plates are jointly connected with a top cover.
[0008] Further, a first filter screen layer is connected to the outer side of the fixed support plates, and a second filter screen layer is connected to the top of the heat dissipation exhaust fan.
[0009] Further, a refrigeration module is connected to one side of the outer shell body, a refrigeration channel is arranged in the refrigeration module, a semiconductor refrigeration plate is connected in the refrigeration channel, a gas conveying pipe in communication with the refrigeration channel is connected to the bottom of the refrigeration module, a gas distribution ring plate is connected to the end of the gas conveying pipe, and a plurality of gas guide pipes in communication with the air inlet hole are connected to the gas distribution ring plate.
[0010] Further, the outside of the refrigeration module is provided with a heat dissipation cavity, the semiconductor refrigeration plate extends into the heat dissipation cavity and is connected with a heat dissipation metal piece, and the outside of the refrigeration module is connected with a heat dissipation fan matched with the heat dissipation cavity.
[0011] Further, the inside top plate of the refrigeration channel is connected with a third filter screen layer.
[0012] Compared with the prior art, the light-weight fin type laser heat dissipation module has the following advantages: the light-weight fin type fin can quickly conduct heat to the laser equipment, the heat dissipation exhaust fan can quickly dissipate heat at high efficiency, and the refrigeration module on one side can quickly refrigerate and dissipate heat at high efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 is a first structural schematic view of the light-weight fin type laser heat dissipation module.
[0014] Figure 2 is a second structural schematic view of the light-weight fin type laser heat dissipation module.
[0015] Figure 3 is a sectional view of the light-weight fin type laser heat dissipation module.
[0016] Figure 4 is a top view of the shell body of the light-weight fin type laser heat dissipation module.
[0017] As shown in the drawings: 1, shell body; 2, heat dissipation middle cylinder; 3, laser equipment; 4, upper heat dissipation module; 5, inner sleeve; 6, air collecting cover; 7, heat dissipation exhaust fan; 8, first filter screen layer; 9, fixed support plate; 10, top cover; 11, second filter screen layer; 12, fin type heat dissipation fin; 13, refrigeration module; 14, refrigeration channel; 15, semiconductor refrigeration plate; 16, heat dissipation cavity; 17, heat dissipation metal piece; 18, heat dissipation fan; 19, gas conveying pipe; 20, gas distribution ring plate; 21, air inlet hole; 22, gas guide pipe; 23, third filter screen layer. DETAILED DESCRIPTION
[0018] The utility model makes further detailed description in combination with the drawings.
[0019] In combination with the drawings Figures 1-4A light finned laser heat dissipation module, comprising an outer shell 1, a heat dissipation middle cylinder 2 is connected in the outer shell 1, a laser device 3 is connected in the heat dissipation middle cylinder 2, a plurality of finned heat dissipation fins 12 are connected between the outer side of the heat dissipation middle cylinder 2 and the inner side of the outer shell 1, the finned heat dissipation fins 12 are arranged in a wave shape, that is, the laser device 3 is arranged close to the inner side of the heat dissipation middle cylinder 2 during installation, if it is necessary to accelerate heat dissipation, silicon gel can be applied between the laser device 3 and the heat dissipation middle cylinder 2, then the heat dissipation middle cylinder 2 is contacted with the plurality of finned heat dissipation fins 12 to accelerate heat conduction, and the wave-shaped arrangement of the finned heat dissipation fins 12 can further accelerate heat conduction.
[0020] The outer shell 1 is provided with an upper heat dissipation module 4 on the top plate, the upper heat dissipation module 4 is provided with an inner sleeve 5 which is in interference fit with the inside of the heat dissipation middle cylinder 2 at the bottom, the upper heat dissipation module 4 is provided with a wind collecting cover 6 at the top, the wind collecting cover 6 is provided with a heat dissipation exhaust fan 7 at the top, the plurality of finned heat dissipation fins 12 at the bottom are used for rapid heat conduction, the heat dissipation exhaust fan 7 in the upper heat dissipation module 4 at the top is used for accelerating heat discharge, so that the device can be stably operated at high power, the outer shell 1 is provided with an air inlet hole 21 which is matched with the heat dissipation exhaust fan 7 at the bottom, the outer side of the top plate of the upper heat dissipation module 4 is provided with a plurality of fixed support plates 9, the plurality of fixed support plates 9 are jointly provided with a top cover 10, the internal structure can be protected by the plurality of fixed support plates 9 matched with the top cover 10, the outer side of the plurality of fixed support plates 9 is provided with a first filter screen layer 8, the top of the heat dissipation exhaust fan 7 is provided with a second filter screen layer 11, the first filter screen layer 8 and the second filter screen layer 11 can prevent too many garbage particles from entering.
[0021] The outer shell 1 is connected with a refrigeration module 13 on one side, the refrigeration module 13 is internally provided with a refrigeration channel 14, the refrigeration channel 14 is internally connected with a semiconductor refrigeration plate 15, the bottom of the refrigeration module 13 is connected with a gas conveying pipe 19 which is in communication with the refrigeration channel 14, the end of the gas conveying pipe 19 is connected with a gas distribution ring plate 20, the gas distribution ring plate 20 is connected with a plurality of gas guide pipes 22 which are in communication with air inlet holes 21, that is, a refrigeration module is further provided, the semiconductor refrigeration plate 15 can be used to cool the refrigeration channel 14, so that the gas conveying pipe 19, the gas distribution ring plate 20 and the gas guide pipe 22 are arranged, when the heat dissipation exhaust fan 7 is started, cold air can be introduced from below, so that the heat dissipation can be further accelerated during high-power operation, the stability of the equipment operation is further ensured and the service life is increased, the outer side of the refrigeration module 13 is provided with a heat dissipation cavity 16, the semiconductor refrigeration plate 15 extends into the heat dissipation cavity 16 and is connected with a heat dissipation metal piece 17, the outer side of the refrigeration module 13 is connected with a heat dissipation fan 18 which matches the heat dissipation cavity 16, the heat dissipation metal piece 17 matches the heat dissipation fan 18, so that the rapid heat dissipation of the semiconductor refrigeration plate 15 can be accelerated, the top of the refrigeration channel 14 is connected with a third filter screen layer 23, the third filter screen layer 23 can prevent foreign matters and garbage from entering the refrigeration channel 14.
[0022] The above description of the present application and its embodiments is not restrictive, and the embodiments shown in the drawings are only one of the embodiments of the present application, and the actual structure is not limited thereto. In summary, if a person skilled in the art is inspired by the above description, without departing from the spirit of the present application, similar structural modes and embodiments can be designed without creative design, which should belong to the protection scope of the present application.
Claims
1. A lightweight finned laser heat dissipation module comprising an outer housing (1), characterized in that: The outer shell (1) is internally connected with a heat dissipation middle cylinder (2), the heat dissipation middle cylinder (2) is internally connected with a laser device (3), a plurality of finned heat dissipation fins (12) are connected between the outer side of the heat dissipation middle cylinder (2) and the inner side of the outer shell (1), and the finned heat dissipation fins (12) are arranged in a wave shape. The outer shell (1) is connected with an upper heat dissipation module (4) on the top plate, the upper heat dissipation module (4) is connected with an inner sleeve (5) that is in interference fit with the inner part of the heat dissipation middle cylinder (2) at the bottom, the upper heat dissipation module (4) is connected with a wind collecting cover (6) at the top, the wind collecting cover (6) is connected with a heat dissipation exhaust fan (7) at the top, and the outer shell (1) is provided with an air inlet hole (21) that matches the heat dissipation exhaust fan (7) at the bottom.
2. The light-weight finned laser heat sink module of claim 1, wherein: The outer side of the upper heat dissipation module (4) is connected with a plurality of fixed support plates (9) on the top plate, and the plurality of fixed support plates (9) are jointly connected with a top cover (10).
3. The light-weight finned laser heat sink module of claim 2, wherein: The outer side of the plurality of fixed support plates (9) is connected with a first filter screen layer (8), and the heat dissipation exhaust fan (7) is connected with a second filter screen layer (11) at the top.
4. The light-weight finned laser heat sink module of claim 1, wherein: One side of the outer shell (1) is connected with a refrigeration module (13), the refrigeration module (13) is internally provided with a refrigeration channel (14), the refrigeration channel (14) is internally connected with a semiconductor refrigeration plate (15), the refrigeration module (13) is connected with a gas conveying pipe (19) that is in communication with the refrigeration channel (14) at the bottom, the gas conveying pipe (19) is connected with a gas distribution ring plate (20) at the end, and the gas distribution ring plate (20) is connected with a plurality of gas guide pipes (22) that are in communication with the air inlet hole (21).
5. The light-weight finned laser heat sink module of claim 4, wherein: The refrigeration module (13) is provided with a heat dissipation cavity (16) on the outer side, the semiconductor refrigeration plate (15) extends into the heat dissipation cavity (16) and is connected with a heat dissipation metal piece (17), and the refrigeration module (13) is connected with a heat dissipation fan (18) that matches the heat dissipation cavity (16) on the outer side.
6. The light-weight finned laser heat sink module of claim 4, wherein: The refrigeration channel (14) is connected with a third filter screen layer (23) on the top plate.