Active oscillator

Abstract

The utility model discloses an active oscillator, comprising a substrate main body which is provided with a groove body, the bottom of the groove body is provided with a pin, the top surface of the groove body is provided with a boss part, and one opposite side of the boss part is provided with a recessed part; the IC chip is connected with the pins through gold threads; the quartz wafer is arranged on the upper side of the IC chip, and a silver-plated electrode is arranged on the quartz wafer; and the upper cover is clamped on the boss part, and the upper cover and the boss part are bonded and fixed. Compared with the prior art, the active crystal oscillator solves the problem that the cover plate and the substrate main body of the existing active crystal oscillator are easy to collide and damage in the splicing process, so that the sealing is not tight.

Description

TECHNICAL FIELD

[0001] The utility model relates to active crystal vibration technology field especially relates to a kind of active oscillators. BACKGROUND

[0002] Quartz crystal resonator is the piezoelectric effect of quartz crystal, to produce high-precision oscillation frequency electronic component. Crystal vibration is divided into active crystal vibration and passive crystal vibration, wherein passive crystal vibration needs external circuit series connection work, and active crystal vibration can vibrate itself.

[0003] In the process of assembling the existing active oscillator, the cover plate and the substrate body of the active oscillator are prone to collision damage during splicing, resulting in poor sealing effect of the cover plate and the substrate body. UTILITY MODEL CONTENT

[0004] The utility model aims at: provide a kind of active oscillator, to solve the problem of not being sealed strictly caused by the cover plate, substrate body splicing process of existing active crystal vibration easy to appear collision damage.

[0005] To achieve the above object, the utility model adopts the following technical scheme: a kind of active oscillator, comprising:

[0006] The substrate body is provided with a groove body, the groove body bottom is provided with a pin, the groove body top surface is provided with a boss portion, and the opposite side of the boss portion is provided with a recess portion;

[0007] IC chip is connected to pin by gold wire;

[0008] Quartz wafer is set on the upside of IC chip, and silver electrode is set on quartz wafer;

[0009] Upper cover is clamped on boss portion, and upper cover is adhesively fixed with boss portion.

[0010] As a further description of the above technical scheme:

[0011] The opposite side of the boss portion is provided with a guide slope.

[0012] As a further description of the above technical scheme:

[0013] The bottom of the opposite side wall of upper cover is provided with a guide arc surface, and the position of guide arc surface corresponds to guide slope.

[0014] As a further description of the above technical scheme:

[0015] The top wall of upper cover is provided with prefabricated glue layer, and the position of prefabricated glue layer corresponds to the top surface of boss portion.

[0016] As a further description of the above technical scheme:

[0017] The prefabricated glue layer is a resin sealant layer.

[0018] In summary, due to the adoption of the technical scheme, the utility model has the beneficial effects that:

[0019] 1、In the utility model, the upper cover is combined with the boss part on the substrate main body and is fixed by adhesion, one opposite side of the boss part is provided with a recess, one opposite side of the upper cover is provided with a shape-matched inner bending part, so that the upper cover can be clamped and positioned by the inner bending part, the combination is facilitated, the deformation resistance of the side wall of the upper cover is improved, the combination quality is further improved, and the sealing effect is ensured.

[0020] 2、In the utility model, one opposite side of the boss part is provided with a guide slope, which guides during the combination of the upper cover, avoids collision damage, and further facilitates the combination of the substrate main body and the upper cover. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments, and it should be understood that the following drawings only show some embodiments of the utility model, and should not be regarded as a limitation to the scope, and for those skilled in the art, other related drawings can be obtained without creative labor on the basis of the drawings.

[0022] Fig. 1 It is a structural schematic diagram of an active oscillator.

[0023] Fig. 2 It is a structural split schematic diagram of an active oscillator.

[0024] Fig. 3 It is a structural schematic diagram of the upper cover of an active oscillator.

[0025] LEGEND:

[0026] 1, substrate main body;11, pin;12, groove;13, boss part;131, recess;132, guide slope;2, IC chip;21, gold wire;3, quartz wafer;31, silver-plated electrode;4, upper cover;41, guide arc surface;42, prefabricated glue layer. DETAILED DESCRIPTION

[0027] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only some of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0028] Embodiment 1

[0029] Please refer to Figs. 1-3 The utility model provides a technical scheme: an active oscillator, comprising:

[0030] The base plate main body 1 is provided with a groove 12, the groove 12 is provided with a pin 11 at the bottom, the top surface of the groove 12 is provided with a boss part 13, and the opposite side of the boss part 13 is provided with a recess 131;

[0031] The IC chip 2 is connected with the pin 11 through the gold wire 21;

[0032] The quartz wafer 3 is arranged on the upside of the IC chip 2, and the quartz wafer 3 is provided with a silver-plated electrode 31;

[0033] The upper cover 4 is clamped on the boss part 13, and the upper cover 4 is adhesively fixed with the boss part 13.

[0034] Specifically, the upper cover 4 is an aluminum shell, which is light in weight and not easy to deform.

[0035] Working principle: the boss part 13 on the base plate main body 1 is spliced with the upper cover 4 and is fixed by adhesion, and since the opposite side of the boss part 13 is provided with the recess 131 and the opposite side of the upper cover 4 is provided with the shape-matched inner bending part, the upper cover 4 can be clamped and positioned by using the inner bending part, so that the splicing is facilitated, the deformation resistance of the side wall of the upper cover 4 is improved, the splicing quality is further improved, and the sealing effect is ensured.

[0036] Embodiment 2

[0037] In the embodiment, the opposite side of the boss part 13 is provided with a guide slope 132. In the process of splicing the upper cover 4 downward, the guide slope 132 can guide the upper cover 4 to avoid collision and damage, and further facilitate the splicing of the base plate main body 1 and the upper cover 4.

[0038] In addition, the opposite side wall of the upper cover 4 is provided with a guide arc surface 41 at the bottom, and the position of the guide arc surface 41 corresponds to the guide slope 132. In the process of splicing the upper cover 4 downward, the guide arc surface 41 can further avoid collision and damage, and improve the splicing quality.

[0039] Embodiment 3

[0040] In the embodiment, the top wall of the upper cover 4 is provided with a prefabricated glue layer 42, and the position of the prefabricated glue layer 42 corresponds to the top surface of the boss part 13.

[0041] The prefabricated glue layer 42 is made on the top wall of the upper cover 4 in advance, which improves the adhesion quality of the base plate main body 1 and the upper cover 4, prevents the upper cover 4 from being loose, and further ensures the sealing effect.

[0042] Specifically, the prefabricated glue layer 42 is a resin sealant layer to ensure the bonding quality.

[0043] The above merely describes a preferred embodiment of the present application, but the scope of protection of the present application is not limited thereto, and any skilled person in the art can make equivalent replacements or changes to the technical scheme and the inventive concept of the present application within the technical scope disclosed by the present application, which shall be covered within the scope of protection of the present application.

Claims

1. An active oscillator characterized by, The application relates to a substrate body provided with a groove body, the bottom of the groove body is provided with a pin, the top surface of the groove body is provided with a boss part, one opposite side of the boss part is provided with a recess part, an IC chip is connected with the pin through gold wires, a quartz wafer is arranged on the upside of the IC chip, the quartz wafer is provided with a silver-plated electrode, an upper cover is clamped on the boss part, and the upper cover is adhesively fixed with the boss part. One opposite side of the boss part is provided with a guide inclined surface. The bottom of one opposite side wall of the upper cover is provided with a guide arc surface, and the position of the guide arc surface corresponds to the guide inclined surface. The upper cover is an aluminum shell. The top wall of the upper cover is provided with a prefabricated glue layer, and the position of the prefabricated glue layer corresponds to the top surface of the boss part.

2. An active oscillator as claimed in claim 1, characterized in that The prefabricated glue layer is a resin sealing glue layer.

3. An active oscillator as claimed in claim 2, characterized in that ​ 4. An active oscillator as claimed in claim 1, characterized in that ​ 5. An active oscillator as claimed in claim 1, characterized in that ​ 6. An active oscillator as claimed in claim 5, characterized in that ​

Images