Fixing structure for electronic device and chip package

Abstract

The utility model discloses an electronic device and a fixing structure for chip packaging. The electronic device comprises a printed circuit board, a semiconductor element, a packaging connecting material and at least one fixing piece, the semiconductor element is arranged on the printed circuit board. The package connection material attaches the semiconductor element to the printed circuit board. The fixing piece is provided with a first end, a second end opposite to the first end and a middle section connected between the first end and the second end, and the fixing piece spans an upper surface of the semiconductor element from a first side of the semiconductor element to a second side of the semiconductor element; the first end and the second end are respectively fixed on the printed circuit board, and the middle section limits the movement of the semiconductor element relative to the direction of the printed circuit board.

Description

TECHNICAL FIELD

[0001] The utility model relates to a packaging of electronic device, especially to a wafer packaging and fixing structure which can avoid the falling of semiconductor elements in the electronic device. BACKGROUND

[0002] In the common packaging technology, the tin ball is used as the material which is bonded between the integrated circuit (IC) semiconductor element and the printed circuit board (PCB), so that the semiconductor element can be connected with the circuit of the circuit board to transmit power or signal. However, when the printed circuit board with the semiconductor element is deformed or falls and hits due to external force, the pulling force in the opposite direction between the semiconductor element and the printed circuit board can be generated, which causes the tin ball bonded between the semiconductor element and the printed circuit board to fall off, thereby affecting the signal transmission and the quality of the packaging. SUMMARY

[0003] The main purpose of the utility model is to solve the problem that the bonding part of the conventional integrated circuit packaging falls off due to external force.

[0004] To achieve the above purpose, the utility model discloses an electronic device, which comprises a printed circuit board, a semiconductor element, a packaging connection material and at least one fixing member. The semiconductor element is arranged on the printed circuit board. The packaging connection material attaches the semiconductor element to the printed circuit board. The fixing member has a first end, a second end opposite to the first end and a middle section connected between the first end and the second end. The fixing member spans from a first side of the semiconductor element to a second side of the semiconductor element through an upper surface of the semiconductor element, and the first end and the second end are fixed to the printed circuit board respectively, and the middle section limits the movement of the semiconductor element relative to the printed circuit board.

[0005] In an embodiment, the fixing member fixes the printed circuit board by spanning opposite edges of the semiconductor element.

[0006] In an embodiment, the fixing member comprises a first fixing member and a second fixing member, and the first fixing member and the second fixing member are parallel to each other and are fixed to the printed circuit board by spanning opposite edges of the semiconductor element respectively.

[0007] In an embodiment, the fixing member comprises a first fixing member and a second fixing member, and the first fixing member and the second fixing member are parallel to each other and are fixed to the printed circuit board by spanning adjacent edges of the semiconductor element respectively.

[0008] In an embodiment, the first fixing member and the second fixing member are symmetrically arranged based on an axis of the semiconductor element.

[0009] In one embodiment, the fixing members include a first fixing member, a second fixing member, a third fixing member, and a fourth fixing member, which are respectively fixed to the printed circuit board across two adjacent edges of the semiconductor element.

[0010] In one embodiment, the first fixing member, the second fixing member, the third fixing member, and the fourth fixing member are symmetrically arranged with reference to an axis of the semiconductor element.

[0011] In one embodiment, the first fixing member, the second fixing member, the third fixing member, and the fourth fixing member do not overlap with each other.

[0012] To achieve the above object, the utility model also discloses a fixing structure of wafer package, which is used for fixing a wafer package on a carrier plate, and the fixing structure includes at least one fixing member, which has a first end, a second end opposite to the first end, and a middle section connected between the first end and the second end and adhered to an upper surface of the wafer package, wherein the first end and the second end are fixed to the carrier plate, and the middle section limits the movement of the wafer package relative to the printed circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a three-dimensional schematic view of one embodiment of the utility model;

[0014] Figure 2 It is a side view schematic view of one embodiment of the utility model;

[0015] Figure 3A It is a top view schematic view of the first embodiment of the utility model;

[0016] Figure 3B It is a top view schematic view of the second embodiment of the utility model;

[0017] Figure 3C It is a top view schematic view of the third embodiment of the utility model;

[0018] Figure 3D It is a top view schematic view of the fourth embodiment of the utility model.

[0019] SYMBOL DESCRIPTION

[0020] 1: electronic device

[0021] 10: carrier plate

[0022] 11: printed circuit board

[0023] 111: upper surface

[0024] 12: first solder pad

[0025] 20: semiconductor element module

[0026] 21: semiconductor element

[0027] 21a: first edge

[0028] 21b: second edge

[0029] 21c: third edge

[0030] 21d: fourth edge

[0031] 211: lower surface

[0032] 212: upper surface

[0033] 22: second pad

[0034] 30: encapsulation connecting material

[0035] 40: fixing structure

[0036] 41: fixing member

[0037] 41a: first fixing member

[0038] 41b: second fixing member

[0039] 41c: third fixing member

[0040] 41d: fourth fixing member

[0041] 411: first end

[0042] 412: second end

[0043] 413: intermediate section DETAILED DESCRIPTION

[0044] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0045] As used herein, directional terms such as "upper", "lower", "left", "right", "front", "back", and derivatives thereof or similar terms are in reference to the orientation of the elements in the drawings and are not limiting of the present application, unless the context clearly indicates otherwise.

[0046] The utility model discloses a kind of fixed structures of wafer packaging, especially a kind of structure of the fixedness between auxiliary wafer and carrier plate, the carrier plate can be printed circuit board, and between the wafer and the carrier plate, it can be connected on the carrier plate by including but not limited to lead frame (Leadframe), ball grid array (Ball Grid Array, BGA), plug-in package (Through-Hole Package), surface adhesion technology (Surface-Mount Technology, SMT), system-level packaging (System-in-Package, SiP), flip-chip technology (Flip-Chip Technology), cohesion welding (Cohesion Welding) etc.But the fixed structure of the utility model is another additional structure outside the connecting structure, for preventing and avoiding when the wafer or the carrier plate is impacted or external force and easily occurs the problem of falling or structure being destroyed.

[0047] Figure 1 、 Figure 2 Display the electronic device 1 of an example of the utility model, the electronic device 1 includes a carrier plate 10, one or more semiconductor element modules 20, one or more packaging connection materials 30 and one or more fixed structures 40, the semiconductor element module 20 is connected in the carrier plate 10 by the packaging connection material 30, and the fixed structure 40 can limit the stress between the carrier plate 10 and the semiconductor element module 20 to avoid the semiconductor element module 20 and the packaging connection material 30 fall off, the following example is with ball grid array as example, and the packaging connection material 30 is ball grid array.

[0048] The carrier plate 10 includes a printed circuit board 11 and one or more first solder pads 12, the printed circuit board 11 extends along a plane direction and has an upper surface 111, the first solder pad 12 is arranged on the upper surface 111, and the configuration of the first solder pad 12 on the upper surface 111 is based on the design of integrated circuit package as a whole, and the utility model is not intended to limit the drawings shown.

[0049] The semiconductor element module 20 includes a semiconductor element 21 and a second solder pad 22, the second solder pad 22 is arranged on a lower surface 211 of the semiconductor element 21, the electronic device 1 connects the second solder pad 22 of the semiconductor element module 20 to the first solder pad 12 of the carrier plate 10 by the packaging connection material 30, so that the semiconductor element 21 and the printed circuit board 11 transmit signals or power between them.In the embodiment, the packaging connection material 30 is coupled between the first solder pad 12 and the second solder pad 22 by a plurality of solder balls, and in other examples, the packaging connection material 30 can be in the form of pin to couple the printed circuit board 11 and the semiconductor element 21.

[0050] The first solder pad 12 and the second solder pad 22 are intended to be a lead area provided on the surface of a semiconductor device or a substrate for soldering, which can be, but is not limited to, a solder mask defined (SMD) pad, a non-solder mask defined (NSMD) pad.

[0051] The fixing structure 40 includes at least one fixing member 41 connected to the carrier plate 10 and the semiconductor element module 20, so as to fix the semiconductor element module 20 on the carrier plate 10. The fixing structure 40 can be provided with different numbers and forms of the fixing member 41 according to different sizes of the semiconductor element 21 or based on the arrangement of the semiconductor element 21 on the printed circuit board 11, which will be described in different embodiments.

[0052] The fixing member 41 has a first end 411, a second end 412 and an intermediate section 413. The first end 411 and the second end 412 are located at opposite ends of the fixing member 41, and the intermediate section 413 is connected between the first end 411 and the second end 412. When the fixing member 41 is installed on the printed circuit board 11 and the semiconductor element 21, the intermediate section 413 is attached to an upper surface 212 of the semiconductor element 21, and the first end 411 and the second end 412 are fixed on the printed circuit board 11 across a first side and a second side of the semiconductor element 21, respectively. The first end 411 and the second end 412 can be fixed by gluing or welding without penetrating or penetrating the printed circuit board 11 in a vertical direction (Z direction), so as to limit the movement of the intermediate section 413 in the vertical direction, thereby limiting the stress of the semiconductor element 21 and the packaging connecting material 30 away from the printed circuit board 11, and avoiding the semiconductor element 21 and the packaging connecting material 30 from falling off.

[0053] Referring to Figures 3A to 3D The semiconductor element module 20 is commonly designed in the shape of a parallelogram, and the embodiments disclosed by the present application take a quadrilateral as an example, but this is not a limitation. The semiconductor element 21 includes, in the clockwise direction shown in the figure, a first edge 21a, a second edge 21b, a third edge 21c and a fourth edge 21d.

[0054] The first embodiment of the present application is as follows Figure 3AAs shown, the fixing structure 40 includes a fixing member 41 which fixes the printed circuit board 11 across opposite edges of the semiconductor element 21. In this example, the fixing member 41 is across the first edge 21a and the third edge 21c in the Y direction. In other examples, the fixing member 41 can be across the second edge 21b and the fourth edge 21d in the X direction. The fixing member 41 can be, but is not limited to, disposed on the central axis of the semiconductor element 21 in the X axis or Y axis direction.

[0055] Referring to Figure 3B For the second embodiment of the present application, the fixing structure 40 includes a first fixing member 41a and a second fixing member 41b which fix the printed circuit board 11 across opposite edges of the semiconductor element 21. In this example, the first fixing member 41a and the second fixing member 41b are across the first edge 21a and the third edge 21c in the Y direction. In other examples, the first fixing member 41a and the second fixing member 41b can be across the second edge 21b and the fourth edge 21d in the X direction. In one example, the first fixing member 41a and the second fixing member 41b can be, but are not limited to, disposed symmetrically on both sides of the central axis of the semiconductor element 21 in the X axis or Y axis direction.

[0056] Referring to Figure 3C The first fixing member 41a and the second fixing member 41b fix the printed circuit board 11 across adjacent edges of the semiconductor element 21. The first fixing member 41a and the second fixing member 41b can be across the first edge 21a and the second edge 21b; across the third edge 21c and the fourth edge 21d; across the fourth edge 21d and the first edge 21a; or across the second edge 21b and the third edge 21c. In one example, the first fixing member 41a and the second fixing member 41b can be disposed symmetrically on an axis of the semiconductor element 21.

[0057] For the fourth embodiment of the present application, Figure 3DAs shown, the fixing structure 40 includes a first fixing member 41a, a second fixing member 41b, a third fixing member 41c, and a fourth fixing member 41d. The first fixing member 41a, the second fixing member 41b, the third fixing member 41c, and the fourth fixing member 41d are arranged to cross the opposite edges of the semiconductor element 21 to fix the printed circuit board 11. In this embodiment, the first fixing member 41a crosses the first edge 21a and the second edge 21b, the second fixing member 41b crosses the second edge 21b and the third edge 21c, the third fixing member 41c crosses the third edge 21c and the fourth edge 21d, and the fourth fixing member 41d crosses the fourth edge 21d and the first edge 21a. The first fixing member 41a, the second fixing member 41b, the third fixing member 41c, and the fourth fixing member 41d are arranged symmetrically with respect to the central axis of the semiconductor element 21 in the X-axis or Y-axis direction.

[0058] In summary, the fixing member is fixed to the semiconductor element and the printed circuit board to limit the pulling force of the semiconductor element and the packaging connection material away from the printed circuit board, avoid the semiconductor element and the packaging connection material from falling off to affect the packaging quality, and the fixing structure is arranged with different numbers of fixing members in different embodiments, and the fixing members cross the semiconductor element in different modes, which can be configured for semiconductor elements of different sizes or based on the design of the electronic device.

Claims

1. An electronic device, characterized in that, include: A printed circuit board; A semiconductor device is disposed on the printed circuit board; A packaging and bonding material is used to attach the semiconductor component to the printed circuit board; as well as At least one fixing member has a first end, a second end opposite to the first end, and an intermediate section connecting the first end and the second end. The fixing member extends from a first side of the semiconductor element across an upper surface of the semiconductor element to a second side of the semiconductor element, and the first end and the second end are respectively fixed to the printed circuit board. The intermediate section restricts the movement of the semiconductor element relative to the printed circuit board.

2. The electronic device according to claim 1, characterized in that, The fastener spans across the two opposite edges of the semiconductor element to secure the printed circuit board.

3. The electronic device according to claim 1, characterized in that, The fastener includes a first fastener and a second fastener, which are parallel to each other and span across the two opposite edges of the semiconductor element body to fix it to the printed circuit board.

4. The electronic device according to claim 1, characterized in that, The fastener includes a first fastener and a second fastener, which are parallel to each other and span across the two adjacent edges of the semiconductor element to fix it to the printed circuit board.

5. The electronic device according to claim 3 or 4, characterized in that, The first fixing member and the second fixing member are symmetrically arranged with respect to one axis of the semiconductor element.

6. The electronic device according to claim 1, characterized in that, The fastener includes a first fastener, a second fastener, a third fastener, and a fourth fastener, which are respectively positioned across two adjacent edges of the semiconductor element and fixed to the printed circuit board.

7. The electronic device according to claim 6, characterized in that, The first fixing member, the second fixing member, the third fixing member, and the fourth fixing member are symmetrically arranged with respect to one axis of the semiconductor element.

8. The electronic device according to claim 6, characterized in that, The first fastener, the second fastener, the third fastener, and the fourth fastener do not overlap with each other.

9. A wafer package fixing structure for fixing a wafer package onto a carrier board, characterized in that, The fixing structure includes at least one fixing member having a first end, a second end opposite to the first end, and an intermediate section connected between the first end and the second end and attached to an upper surface of the wafer package, wherein the first end and the second end are fixed to the carrier plate, and the intermediate section restricts the movement of the wafer package relative to the carrier plate.

Images