High-frequency signal circuit board and antenna and electronic equipment comprising same

Abstract

The utility model discloses a high-frequency signal circuit board and an antenna and an electronic device comprising the same, the high-frequency signal circuit board comprises a first copper-clad plate, a first core plate and a second core plate which are attached in sequence, the first core plate comprises at least one cavity, the cavity is obtained by windowing the first core plate, and the second core plate comprises a second copper-clad plate. A plurality of air holes penetrate through the area, corresponding to the cavity, of the first copper-clad plate, and signal circuit patterns are arranged in other areas of the first copper-clad plate. According to the utility model, the circuit board structure is optimized, and the cavity is constructed, so that the insertion loss of high-frequency signals is reduced, and the high-frequency signal performance is improved; and a plurality of through air holes are formed in the first copper-clad plate, so that the overall flatness of the circuit board is ensured, warping caused by thermal expansion of the circuit board is prevented, and the stability of the circuit board is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of circuit board preparation, and particularly relates to a high-frequency signal circuit board and an antenna and electronic equipment comprising the same. BACKGROUND

[0002] With the development of the communication electronic field in the direction of high frequency and high speed of signals, higher requirements are put forward for the low-loss transmission and impedance continuity of high-frequency and high-speed signals of signal lines in PCB. At present, the insertion loss of signal lines such as microstrip lines and strip lines in PCB is affected by the dielectric loss Df of PCB materials, the dielectric loss Df directly affects the transmission quality of high-frequency signals, and with the increase of the working frequency of signal lines, the influence of the dielectric loss Df is more obvious. UTILITARY MODEL

[0003] In order to overcome one or more of the above technical defects, the utility model provides a kind of high-frequency signal circuit board, the structure of circuit board is optimized, cavity is structured, to reduce the insertion loss of high-frequency signal, improve high-frequency signal performance.

[0004] In order to solve the above problems, the utility model is realized according to the following technical scheme:

[0005] A kind of high-frequency signal circuit board, it is characterized by, including the first copper-clad plate, first core plate and second core plate that are sequentially attached, first core plate includes at least one cavity, cavity is obtained by windowing on first core plate,

[0006] The region corresponding to cavity on first copper-clad plate is penetrated by several air holes, and signal line pattern is arranged on other regions of first copper-clad plate.

[0007] Further, the upper and lower surfaces of the second core plate are respectively pressed with the second copper-clad plate and the third copper-clad plate, the signal line pattern is etched on the second copper-clad plate, and the gap between the signal line patterns is connected with the cavity to form a large cavity.

[0008] Further, the first copper-clad plate is connected with the first core plate through the adhesive layer, the first core plate is connected with the second copper-clad plate through the adhesive layer, and the thickness of the adhesive layer is greater than or equal to the thickness of the copper-clad plate.

[0009] Further, the adhesive layer is high-frequency pure glue or epoxy glue.

[0010] Further, the materials of the first core plate and the second core plate are high molecular materials, glass or ceramic.

[0011] Further, the second core plate is connected with a via hole, which is connected with a feed point on the third copper-clad plate, for connecting with external circuit.

[0012] Further, the hole spacing of air holes on the first copper-clad plate is 1 / 2 of the line width of signal line.

[0013] The utility model also provides an antenna, including above-mentioned circuit board.

[0014] The utility model also provides an electronic equipment, including equipment body, above-mentioned circuit board or above-mentioned antenna.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] The utility model discloses a high frequency signal circuit board, including first copper-clad plate, first core plate and second core plate that stick in proper order, including at least one cavity on the first core plate, and the cavity is obtained using the slotting process or the windowing process on the first core plate, and a plurality of air holes are penetrated in the region corresponding to the cavity on the first copper-clad plate, and signal line pattern is arranged in other regions of the first copper-clad plate. Since the dielectric loss Df of air is 0, the utility model optimizes the circuit board structure, constructs the cavity to reduce the insertion loss of high frequency signal and improve the high frequency signal performance. And a plurality of air holes are arranged on the first copper-clad plate, the overall flatness of the circuit board is guaranteed, the warping caused by thermal expansion is prevented, and the stability of the circuit board is improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] The specific embodiments of the utility model will be further described in detail below in combination with the drawings, wherein:

[0018] Figure 1 It is the structure schematic view of the high frequency signal circuit board of example 1;

[0019] Figure 2 It is the structure schematic view of the high frequency signal circuit board of example 2;

[0020] Marking description: 100, cavity;101, the gap between signal line patterns on the second copper-clad plate;110, large cavity;200, air hole;300, via. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantage of the utility model embodiment more clear, the technical scheme in the utility model embodiment will be clearly and completely described below in combination with the drawings in the utility model embodiment, obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiment. The components of the utility model embodiment described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the application claimed, but merely represents the selected embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the application.

[0023] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. Meanwhile, in the description of the application, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0024] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. Meanwhile, in the description of the application, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0025] In the description of the application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0026] Embodiment 1

[0027] The embodiment discloses a high-frequency signal circuit board, like Figure 1, including a first copper-clad plate L1, a first core plate C1 and a second core plate C2 attached in sequence, the first core plate C1 includes at least one cavity 100, the cavity 100 is obtained by adopting a slotting process or a windowing process on the first core plate C1, and the specific shape and size of the cavity are selected according to actual requirements. A plurality of air holes 200 are penetrated through the region of the first copper-clad plate L1 corresponding to the cavity 100, and a signal line pattern is arranged on other regions of the first copper-clad plate L1. The upper and lower surfaces of the second core plate C2 are respectively pressed with a second copper-clad plate L2 and a third copper-clad plate L3. Specifically, the materials of the first core plate C1 and the second core plate C2 can be high polymer materials, glass or ceramics, or other materials that meet the high-frequency characteristics and have strong stability and reliability according to actual requirements.

[0028] By penetrating a plurality of air holes 200 through the region of the first copper-clad plate C1 corresponding to the cavity 100, the flatness of the circuit board is maintained, and the warping of the circuit board caused by thermal expansion is prevented. Specifically, the hole spacing of the air holes 200 can be 1 / 2 of the signal line width, which can increase the number of air holes and ensure the maximum heat dissipation effect without affecting the high-frequency performance of the signal line.

[0029] In the embodiment, the first copper-clad plate L1 is connected with the first core plate C1 through a glue layer A1, the first core plate C1 is connected with the second copper-clad plate L2 through a glue layer C2, and the thickness of the glue layer is greater than or equal to the thickness of the copper-clad plate, so that the overall height of the cavity region is consistent after the first copper-clad plate L1, the first core plate C1 and the second copper-clad plate L2 are attached. The size of the cavity region of the glue layer is slightly smaller than the size of the first through hole on the first core plate, so that the through hole opening of the first core plate is aligned with the through hole opening of the first core plate after the glue layer is pressed and does not overflow. Specifically, the glue layer is high-frequency pure glue or epoxy glue, or other attachment glue can be selected according to actual requirements.

[0030] In the embodiment, the second core plate C2 is connected with a via hole 300, the via hole 300 is connected with a feeding point on the third copper-clad plate, and the feeding point is used to connect with an external circuit.

[0031] Embodiment 2

[0032] The embodiment discloses a high-frequency signal circuit board, which comprises a first copper-clad plate L1, a first core plate C1 and a second core plate C2 attached in sequence. Figure 2 , including a first copper-clad plate L1, a first core plate C1 and a second core plate C2 attached in sequence, the first core plate C1 includes at least one cavity 100, the cavity 100 is obtained by adopting a slotting process or a windowing process on the first core plate C1, and the specific shape and size of the cavity are selected according to actual requirements. A plurality of air holes 200 are penetrated through the region of the first copper-clad plate L1 corresponding to the cavity 100, and a signal line pattern is arranged on other regions of the first copper-clad plate L1.

[0033] In the embodiment, the upper and lower surfaces of the second core plate C2 are respectively laminated with the second copper-clad plate L2 and the third copper-clad plate L3, the second copper-clad plate L2 is etched with a signal line pattern, and the gaps 101 between the signal line patterns are connected with the cavities to form a large cavity 110. The signal line pattern part on the second copper-clad plate L2 corresponding to the large cavity area is subjected to gold plating or silver plating treatment to achieve corrosion resistance and oxidation resistance. Specifically, the same method or other existing technologies can also be used to manufacture a signal line pattern on the third copper-clad plate according to actual needs.

[0034] Other implementation details please refer to embodiment 1, here will not repeat them.

[0035] Since the dielectric loss Df of air is 0, the circuit board structure is optimized, the cavity is constructed, the insertion loss of high-frequency signals is reduced, and the performance of high-frequency signals is improved. A plurality of air holes are arranged on the first copper-clad plate for heat dissipation, the overall flatness of the circuit board is ensured, the warping caused by thermal expansion is prevented, and the stability of the circuit board is improved. The high-frequency signal circuit board disclosed by the utility model not only meets the low loss requirement, but also has strong reliability and stability, and can be applied to products with high-frequency signal requirements in many fields (such as wireless communication, microwave radar, etc.), can effectively improve the performance of high-frequency signals, and ensure the signal integrity of the product.

[0036] Embodiment 3

[0037] The embodiment discloses an antenna comprising the circuit board described in embodiment 1 or embodiment 2, so it also has the technical effects brought by the technical solutions of the high-frequency signal circuit board described in embodiment 1 or embodiment 2, which will not be repeated here.

[0038] Embodiment 4

[0039] The embodiment discloses an electronic device further comprising a device body, the circuit board described in embodiment 1 or embodiment 2, or the antenna described in embodiment 3, so it also has the technical effects brought by the technical solutions of the high-frequency signal circuit board described in embodiment 1 or embodiment 2, which will not be repeated here.

[0040] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form, so any modification, equivalent change and modification made to the above embodiment according to the technical essence of the utility model, without departing from the technical solution of the utility model, still belongs to the scope of the technical solution of the utility model.

Claims

1. A high frequency signal circuit board, characterized by, The circuit board comprises a first copper-clad plate, a first core plate and a second core plate which are sequentially attached, the first core plate comprises at least one cavity which is obtained by windowing on the first core plate, The first copper-clad plate is provided with a plurality of air holes in the area corresponding to the cavity, and the other areas of the first copper-clad plate are provided with signal line patterns.

2. The high-frequency signal circuit board according to claim 1, characterized by The upper and lower surfaces of the second core plate are respectively provided with a second copper-clad plate and a third copper-clad plate, the second copper-clad plate is etched with signal line patterns, and the gaps between the signal line patterns are connected with the cavity to form a large cavity.

3. The high-frequency signal circuit board according to claim 2, characterized by The first copper-clad plate is connected with the first core plate through a glue layer, the first core plate is connected with the second copper-clad plate through a glue layer, and the thickness of the glue layer is greater than or equal to the thickness of the copper-clad plate.

4. The high-frequency signal circuit board according to claim 3, characterized by The glue layer is high-frequency pure glue or epoxy glue.

5. The high-frequency signal circuit board according to claim 1, wherein The materials of the first core plate and the second core plate are high-molecular materials, glass or ceramic.

6. The high-frequency signal circuit board according to claim 2, characterized by The second core plate is connected with a via hole which is connected with a feeding point on the third copper-clad plate, and the feeding point is used for connecting with an external circuit.

7. The high-frequency signal circuit board according to claim 1, wherein The hole spacing of the air holes on the first copper-clad plate is 1 / 2 of the line width of the signal line.

8. An antenna, characterized by The circuit board comprises any one of claims 1-7.

9. An electronic device, comprising: The device comprises a device body, the circuit board of any one of claims 1-7 or the antenna of claim 8.

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