Energy storage power supply

Abstract

The utility model discloses an energy storage power supply. The energy storage power supply comprises a shell, a battery module, an inverter and a fan. The shell is provided with a mounting cavity, and a heat dissipation structure is formed on the shell; the battery module is mounted in the mounting cavity; the inverter is mounted in the mounting cavity, is thermally coupled with the heat dissipation structure and is electrically connected with the battery module; the fan is installed on the outer side of the shell, and the fan forms a structure that flowing air flows through the heat dissipation structure. According to the energy storage power supply, the heat dissipation structure is formed on the shell, the inverter is thermally coupled with the heat dissipation structure, the fan is installed on the outer side of the shell, the fan forms the structure that flowing air flows through the heat dissipation structure, and compared with a natural heat dissipation mode, the inverter is better in heat dissipation effect and lighter in weight. The heat dissipation efficiency is improved by introducing the fan, and the shell has a heat dissipation function and a supporting function, so that the internal space and the manufacturing cost of the energy storage power supply are saved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of energy storage, in particular to an energy storage power supply. BACKGROUND

[0002] With the improvement of living standards, users have higher and higher requirements for the protection level and high power of portable power supplies.

[0003] After the current portable energy storage protection level is improved, the corresponding problem is that the heat dissipation volume of the energy storage power supply is large, which cannot effectively cool down, resulting in poor heat dissipation capacity. CONTENT OF THE UTILITY MODEL

[0004] Therefore, the present application aims to at least solve one of the problems in the related art. To this end, the purpose of the present application is to provide an energy storage power supply.

[0005] The present application provides an energy storage power supply. The energy storage power supply comprises a shell, a battery module, an inverter and a fan. The shell has a mounting cavity, and the shell is formed with a heat dissipation structure; the battery module is installed in the mounting cavity; the inverter is installed in the mounting cavity and is thermally coupled with the heat dissipation structure and electrically connected with the battery module; the fan is installed on the outside of the shell, and the fan forms an air flow that flows through the heat dissipation structure.

[0006] In some embodiments, the heat dissipation structure comprises a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged on the bottom, sides and / or top of the shell.

[0007] In some embodiments, the plurality of heat dissipation fins are arranged radially and form a mounting space in the middle, and the fan is installed in the mounting space.

[0008] In some embodiments, the arrangement density of the heat dissipation fins gradually changes from dense to sparse from the center to the periphery, and the arrangement height of the heat dissipation fins gradually changes from low to high from the center to the periphery.

[0009] In some embodiments, the fan is a centrifugal fan or an axial flow fan.

[0010] In some embodiments, the heat dissipation structure further comprises a protrusion, the protrusion is located in the mounting cavity and is fixedly arranged on the shell, and the protrusion is thermally coupled with a power element of the inverter.

[0011] In some embodiments, a thermally conductive layer is arranged between the protrusion and the power element, and the protrusion is thermally coupled with the power element of the inverter through the thermally conductive layer.

[0012] In some embodiments, the heat-conducting layer has a thickness less than 1 mm and a thermal conductivity greater than 3 W / M / K.

[0013] In some embodiments, the energy storage power supply further comprises a foot pad, the bottom of the shell is provided with a foot pad, the foot pad is used to contact with an external support surface, so that the bottom of the shell is spaced apart from the external support surface.

[0014] In some embodiments, the energy storage power supply further comprises a first cover plate, the first cover plate is fixedly installed on the outer side of the shell and covers the fan arrangement, the first cover plate is provided with a ventilation hole.

[0015] In some embodiments, the first cover plate covers the heat dissipation structure, the first cover plate comprises a first bottom plate and a first side plate surrounding the first bottom plate, an air duct is formed between the heat dissipation structure and the first cover plate, the ventilation hole comprises a first ventilation hole and a second ventilation hole, the air duct is arranged between the first ventilation hole and the second ventilation hole, the first bottom plate is provided with the first ventilation hole, and the first side plate is provided with the second ventilation hole.

[0016] In some embodiments, the energy storage power supply further comprises a foot pad, the foot pad is arranged on the side of the first cover plate opposite to the fan, the foot pad is used to contact with an external support surface, so that the bottom of the first cover plate is spaced apart from the external support surface.

[0017] In some embodiments, the energy storage power supply further comprises a foot pad, the bottom plate of the cover plate is provided with a through hole corresponding to the foot pad, the foot pad is fixedly arranged on the bottom of the cover plate through the through hole, the foot pad is used to contact with an external support surface, so that the bottom of the cover plate is spaced apart from the external support surface.

[0018] In some embodiments, the shell comprises a first shell and a second shell, the first shell and the second shell are buckled to each other to form the mounting cavity; the inverter is fixed on the first shell, the first shell is provided with a heat dissipation structure, and the battery module is fixed on the second shell.

[0019] In some embodiments, the first shell is an aluminum alloy shell, the inner side of the first shell is thermally coupled with the inverter, and the outer side of the first shell is formed with the heat dissipation structure.

[0020] In some embodiments, the first shell is subjected to an anodizing treatment.

[0021] In some embodiments, the first shell is provided with a containing cavity, and the inverter is fixedly installed in the containing cavity.

[0022] In some embodiments, a panel is arranged on the second housing, and an electric energy output port is arranged on the panel.

[0023] In some embodiments, the first housing is snap-fitted with the second housing, and the first housing is arranged on the lower side of the second housing.

[0024] In some embodiments, a temperature sensor is arranged on the heat dissipation structure to detect the temperature of the heat dissipation structure, and the energy storage power supply controls the start-stop or rotation speed of the fan based on the temperature of the heat dissipation structure.

[0025] In some embodiments, the energy storage power supply further comprises a semiconductor refrigeration device, the semiconductor refrigeration device comprises a hot end and a cold end, the cold end is thermally coupled with the inverter, and the hot end is thermally coupled with the heat dissipation structure.

[0026] In some embodiments, one side of the heat dissipation structure towards the inverter has a mounting groove, and the semiconductor refrigeration device is arranged in the mounting groove.

[0027] In some embodiments, the outer wall of the mounting cavity has a heat dissipation port, and the heat dissipation structure is arranged on the heat dissipation port.

[0028] In some embodiments, the heat dissipation structure comprises a mounting portion and a fixed flange arranged around the mounting portion, the mounting portion extends into the heat dissipation port, the semiconductor refrigeration device is arranged on the mounting portion, and the fixed flange is fixed on the outer wall of the mounting cavity by a connecting piece to close the heat dissipation port by the heat dissipation structure.

[0029] In some embodiments, the energy storage power supply further comprises a heat dissipation support, the inverter comprises a circuit board, and the circuit board is provided with the power element; the heat dissipation support is arranged in the housing, the heat dissipation support fixes the circuit board and is thermally coupled with the power element, and the heat dissipation support is further thermally coupled with the heat dissipation structure.

[0030] In some embodiments, the heat dissipation support comprises a base and a second cover plate. The base comprises a second bottom plate and two second side plates, and the two second side plates are respectively connected to the two ends of the second bottom plate; a heat conduction pad is arranged between the second bottom plate and the power element; the second cover plate is connected with the two second side plates, and the second cover plate is provided with a limiting piece for limiting the battery module.

[0031] In some embodiments, the energy storage power supply further comprises a heat pipe, and the heat pipe is thermally coupled with the heat dissipation structure.

[0032] The energy storage power supply of the present application forms a heat dissipation structure in the part of the shell located in the mounting cavity, and the inverter is thermally coupled with the heat dissipation structure, and the fan is installed on the outside of the shell, and the fan forms an air flow flowing through the heat dissipation structure. Compared with the natural heat dissipation mode, the heat dissipation effect of the inverter of the present application is better, and the weight of the inverter is lighter. The introduction of the fan improves the heat dissipation efficiency, and the shell has heat dissipation effect and supporting effect, saving the internal space and manufacturing cost of the energy storage power supply.

[0033] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0034] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the accompanying drawings, wherein:

[0035] Figure 1 is a structural schematic diagram of the energy storage power supply of some embodiments of the present application;

[0036] Figure 2 is a disassembled structural schematic diagram of the energy storage power supply of some embodiments of the present application;

[0037] Figure 3 is a partial structural schematic diagram of the energy storage power supply of some embodiments of the present application;

[0038] Figure 4 is a partial structural schematic diagram of the energy storage power supply of some embodiments of the present application;

[0039] Figure 5 is a partial structural schematic diagram of the energy storage power supply of some embodiments of the present application;

[0040] Figure 6 is a partial structural schematic diagram of the energy storage power supply of some embodiments of the present application;

[0041] Figure 7 is a partial structural schematic diagram of the energy storage power supply of some embodiments of the present application;

[0042] Figure 8 is a partial structural schematic diagram of the energy storage power supply of some embodiments of the present application;

[0043] Figure 9 is a partial structural schematic diagram of the energy storage power supply of some embodiments of the present application;

[0044] Figure 10 is a partial structural schematic diagram of the energy storage power supply of some embodiments of the present application.

[0045] MAIN MARKS OF THE DRAWINGS:

[0046] The energy storage power supply 100;

[0047] The housing 10, the bottom 101, the side 102, the top 103, the mounting cavity 11, the heat dissipation structure 12, the heat dissipation fin 121, the second clamping piece 1211, the first connecting column 1212, the mounting space 1201, the protrusion 122, the heat conduction layer 123, the semiconductor refrigeration piece 124, the heat preservation piece 125, the mounting groove 126, the mounting part 127, the fixed convex edge 128, the sealing piece 129, the first housing 13, the first clamping piece 131, the containing cavity 132, the second housing 14, the second clamping piece 141; The battery module 20, the protection plate 21; The inverter 30, the circuit board 31, the power element 311, the heat conduction pad 312, the transformer 3111, the inductor 3112, the heat dissipation support 32, the base 321, the second bottom plate 3211, the containing groove 32111, the second side plate 3212, the heat dissipation fin 32121, the second cover plate 322, the limiting piece 3221, the insulating plate 33; The fan 40, the first clamping piece 41; The foot pad 50; The first cover plate 60, the vent hole 61, the first vent hole 611, the second vent hole 612, the first bottom plate 62, the first side plate 63, the perforated hole 64. DETAILED DESCRIPTION

[0048] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.

[0049] In the description of the present application, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance, or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly defined.

[0050] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting" should be understood in a broad sense, which can mean fixed connection, or detachable connection, or integrally connected; can be mechanical connection, or electrical connection or can communicate with each other; can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0051] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples, and such repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0052] The embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary, only for explaining the present application, and cannot be understood as limiting the present application.

[0053] Please refer to Figures 1 to 4 The present application discloses a kind of energy storage power supply 100.Energy storage power supply 100 includes shell 10, battery module 20, inverter 30 and fan 40.Shell 10 has installation cavity 11, shell 10 is formed with heat dissipation structure 12.Battery module 20 is installed in installation cavity 11.Inverter 30 is installed in installation cavity 11, is thermally coupled with heat dissipation structure 12, and is electrically connected with battery module 20.Fan 40 is installed on the outside of shell 10, fan 40 forms flowing air and passes through heat dissipation structure 12.

[0054] It can be understood that, since battery module 20 has larger heat capacity and relatively smaller heat generation, battery module 20 can realize cooling by using natural heat dissipation, while inverter 30 has larger heat generation, and needs heat dissipation structure 12 formed on shell 10 to cooperate with fan 40 to cool down.The heat generated during the operation of inverter 30 is transferred to heat dissipation structure 12, and the heat is transferred to the outside through fan 40, reducing the temperature of inverter 30, thereby ensuring the cooling effect of energy storage power supply.

[0055] That is, the energy storage power supply 100 of the present application can use shell 10 as a support frame while using it as a heat sink, without the need for an additional heat sink, reducing the overall height and volume of energy storage power supply 100, achieving high protection of inverter 30.

[0056] The shell 10 of the present application can be made of metal material, so that the energy storage power supply 100 made of the shell 10 is more durable.

[0057] The heat coupling mode of inverter 30 and heat dissipation structure 12 can be that inverter 30 is directly thermally connected with heat dissipation structure 12, or indirectly thermally connected through an intermediate connecting component.

[0058] The inverter 30 and the battery module 20 can be directly or indirectly electrically connected. For example, the battery module 20 can be indirectly electrically connected to the inverter 30 through a battery protection plate. The battery protection plate can realize overvoltage, overtemperature, overcurrent protection, and can open or close the electrical connection between the battery and the outside.

[0059] Therefore, the shell 10 of the energy storage power supply 100 is formed with the heat dissipation structure 12, the inverter 30 is thermally coupled with the heat dissipation structure 12, and the fan 40 is installed on the outside of the shell 10. The fan 40 forms an air flow that flows through the heat dissipation structure 12. Compared with the natural heat dissipation mode, the heat dissipation effect of the inverter 30 is better, and the weight of the inverter 30 is lighter. The introduction of the fan 40 improves the heat dissipation efficiency, and the shell 10 has heat dissipation and supporting effects, saving the internal space and manufacturing cost of the energy storage power supply 100.

[0060] Please refer to Figure 4 In some embodiments, the heat dissipation structure 12 includes a plurality of heat dissipation fins 121. The plurality of heat dissipation fins 121 are arranged on the bottom 101, the side 102 and / or the top 103 of the shell 10.

[0061] Specifically, the plurality of heat dissipation fins 121 arranged on the bottom 101, the side 102 and / or the top 103 of the shell 10 include the following cases: (1) the plurality of heat dissipation fins 121 are arranged at any one of the bottom 101, the side 102 or the top 103 of the shell 10; (2) the plurality of heat dissipation fins 121 are arranged at any two of the bottom 101, the side 102 or the top 103 of the shell 10; (3) the plurality of heat dissipation fins 121 are arranged on the bottom 101, the side 102 and the top 103 of the shell 10.

[0062] Please refer to Figure 4 When the plurality of heat dissipation fins 121 are arranged on the bottom 101 of the shell 10 of the energy storage power supply 100, the overall appearance of the energy storage power supply 100 is more beautiful. In addition, since the heat dissipation fins 121 are arranged on the bottom 101 of the shell 10 of the energy storage power supply 100, the user is less likely to touch the heat dissipation fins 121 when holding the energy storage power supply 100, which can prevent the user from being scalded.

[0063] In addition, the plurality of heat dissipation fins 121 arranged on the bottom 101 of the shell 10 of the energy storage power supply 100 can also prevent rainwater from entering the installation cavity 11, and has better waterproof effect. Therefore, when the energy storage power supply 100 is used in an outdoor environment, the problem of short circuit and damage of the circuit board 31 in the inverter 30 caused by water in the air entering the installation cavity 11 in rainy or humid weather can be avoided.

[0064] When the plurality of heat dissipation fins 121 are arranged on the side surface 102 or the top surface 103, the electronic components inside the mounting cavity 11 can dissipate heat from the side surface 102 and the top surface 103 of the shell 10, and the heat dissipation mode and the heat dissipation channel are more diversified.

[0065] In some embodiments, the plurality of heat dissipation fins 121 are arranged radially, and the middle part forms a mounting space 1201, and the fan 40 is mounted in the mounting space 1201.

[0066] Specifically, as shown in Figure 4 The fan 40 can be provided with a first clamping piece 41, and the heat dissipation fin 121 can be provided with a second clamping piece 1211 matched with the first clamping piece 41. The first clamping piece 41 and the second clamping piece 1211 are clamped and connected to mount the fan 40 at the center of the heat dissipation fin 121. The first clamping piece 41 can be a clamping column, and the second clamping piece 1211 can be a clamping hole, or the first clamping piece 41 can be a clamping hole, and the second clamping piece 1211 can be a clamping column, which is not limited here.

[0067] Since the fan 40 is mounted on the outside of the shell 10, the fan 40 forms a flowing air flow through the heat dissipation structure 12 to form a heat dissipation channel, thereby achieving the heat dissipation effect of the inverter 30 in the mounting cavity 11. Or, since one end of the plurality of heat dissipation fins 121 encloses the mounting space 1201, and the fan 40 is mounted in the mounting space 1201, during the rotation of the fan 40, the heat dissipation airflow can contact the heat dissipation fin 121 from all directions, thereby more conducive to improving the heat dissipation effect of the heat dissipation fin 121.

[0068] At this time, no matter where the heat dissipation fin 121 is arranged on the bottom 101, the side surface 102 or the top surface 103 of the shell 10, the fan 40 can be arranged at the center of the outside of the shell 10, and the heat dissipation fin 121 can be arranged around the fan 40 in an interval, thereby forming a shorter and more direct heat dissipation channel, forming a larger heat dissipation area, and achieving a better heat dissipation effect.

[0069] Please refer to Figure 4 In some embodiments, the arrangement density of the heat dissipation fin 121 gradually changes from dense to sparse from the center to the periphery, and the arrangement height of the heat dissipation fin 121 gradually changes from low to high from the center to the periphery.

[0070] Specifically, from the center inner region of the heat dissipation fins 121, since this part is close to the heat source and has a large heat generation power, the heat dissipation fins 121 are designed to be relatively dense. The layout of such dense heat dissipation fins 121 can increase the heat dissipation area in a limited space, thereby more efficiently absorbing and conducting heat. Although the heat dissipation fins 121 are relatively dense, the height of the heat dissipation fins 121 is relatively low, which on the one hand can ensure reasonable layout in a limited internal space, avoid occupying too much space due to the heat dissipation fins 121 being too high, and affect the installation and layout of other components. On the other hand, the relatively low height of the heat dissipation fins 121 also helps to conduct heat to the outside more quickly, avoiding the accumulation of heat in the center inner region of the heat dissipation fins 121, and facilitating the diffusion of heat to the periphery outside the shell 10, thereby achieving better heat dissipation effect.

[0071] In the outer region of the heat dissipation fins 121 relative to the center inner region, the height of the heat dissipation fins 121 is relatively high. This is because the space outside the heat dissipation fins 121 is relatively spacious, and the relatively high heat dissipation fins 121 can better exchange heat with the surrounding air, thereby improving the heat dissipation efficiency. At the same time, the outer heat dissipation fins 121 are relatively sparse, which can reduce the weight of the overall heat sink while ensuring the heat dissipation effect. The layout of the sparse heat dissipation fins 121 can reduce the use of materials, thereby reducing costs, and also makes the heat sink more lightweight, facilitating installation and carrying.

[0072] The range interval of the gradual change angle of the heat dissipation fins 121 from the inner side to the outer side can be (10°, 15°).

[0073] In this way, the energy storage power supply 100 can effectively achieve the heat equalization effect through the gradual change design of the heat dissipation fins 121, which are dense and low in the inner region, and high and sparse in the outer region. After the heat is generated from the heat source such as the inverter 30, it is first quickly absorbed and conducted by the heat dissipation fins 121 in the center inner region of the shell 10, and then gradually diffuses to the outside. Since the heat dissipation fins 121 in the outer region are relatively high and sparse, they can better exchange heat with the air, thereby uniformly dissipating heat to the surrounding environment and avoiding local overheating.

[0074] At the same time, the gradual change design of the heat dissipation fins 121, which are dense and low in the inner region, and high and sparse in the outer region, can also achieve the purpose of weight reduction while ensuring the heat dissipation performance, and is conducive to the overall lightweight design of the portable power supply high-protection inverter.

[0075] In some embodiments, the fan 40 is a centrifugal fan or an axial flow fan.

[0076] Specifically, the axial fan pushes air to flow in the same direction as the shaft, i.e., the inlet direction is parallel to the outlet direction, when in operation. The axial fan is generally capable of providing a large air volume, which helps to quickly remove the heat from the inside of the energy storage power supply and achieve effective heat dissipation. The structure of the axial fan is relatively simple, and the manufacturing cost is relatively low, so it has a high cost performance in use. The axial fan is suitable for most heat dissipation needs of the energy storage power supply, especially in situations where a large air volume is needed to quickly dissipate heat.

[0077] The centrifugal fan pushes air to flow in a direction perpendicular to the shaft, i.e., the radial direction, when in operation. The centrifugal fan is capable of generating a high air pressure, which helps to remove heat from the inside of the energy storage power supply, and is particularly suitable for situations where the heat dissipation channel is long or the heat dissipation resistance is large. The centrifugal fan can change the flow direction of the air flow to be perpendicular to the axial direction, which is very useful in some specific heat dissipation designs. Under the same size and other comparable performance, the noise of the centrifugal fan is generally lower than that of the axial fan, which helps to improve the overall user experience of the energy storage power supply. The centrifugal fan is suitable for heat dissipation situations that require air flow to rotate 90 degrees or require a large air pressure.

[0078] When the fan 40 is a centrifugal fan, since the inlet direction of the centrifugal fan is perpendicular to the outlet direction, the centrifugal fan can achieve effective air flow in a smaller space. This means that in the design of the energy storage power supply 100, the position and direction of the centrifugal fan can be more flexible to adapt to the space layout inside the energy storage power supply 100. Therefore, by optimizing the layout and direction of the fan, the limited space inside the energy storage power supply can be used more effectively. For example, the centrifugal fan can be installed on the side or top of the power supply, thereby avoiding occupying too much space in front of or behind the energy storage power supply 100. This layout not only reduces the overall volume of the energy storage power supply 100, but also helps to reduce the height of the energy storage power supply 100, making the structure of the energy storage power supply 100 more compact and portable.

[0079] That is, due to the characteristic that the inlet direction of the centrifugal fan is perpendicular to the outlet direction, the space can be more flexibly utilized in the design of the energy storage power supply 100, thereby effectively reducing the overall volume and height of the energy storage power supply 100. This design not only improves the compactness and portability of the energy storage power supply 100, but also helps to improve the heat dissipation efficiency of the energy storage power supply 100 and prolong the service life.

[0080] In addition, the fan 40 can achieve an IP68 protection level through a glue filling process and vacuum plating of the printed circuit board assembly inside the fan 40, so that the fan 40 has extremely high dust and water resistance, can adapt to various harsh working environments, and ensure the normal heat dissipation and operation of the energy storage power supply 100.

[0081] Please refer toFigure 5 In some embodiments, the heat dissipation structure 12 further comprises a protrusion 122. The protrusion 122 is located in the installation cavity 11 and is fixedly arranged on the shell 10. The protrusion 122 is thermally coupled with the power element of the inverter 30.

[0082] It can be understood that when two solid surfaces are in contact, the heat transfer between the two solids will be hindered due to the presence of surface roughness, gaps and other factors. This hindrance is the contact thermal resistance.

[0083] Since the contact area between the protrusion 122 and the power element 311 of the inverter 30 is relatively large, and the design of the protrusion 122 can help reduce the presence of gaps and air, the contact thermal resistance between the inverter 30 and the shell 10 can be reduced. This means that the heat transfer between the inverter 30 and the shell 10 will be hindered, thereby improving the heat dissipation efficiency of the power element 311 of the inverter 30.

[0084] In detail, please refer to Figure 3 The power element 311 of the inverter 30 includes elements such as transformers 3111 and inductors 3112. The power element 311 such as transformers 3111 and inductors 3112 can be arranged as close as possible to the position of the protrusion 122 on the shell 10, so as to fully utilize the effect of the protrusion 122 in reducing the contact thermal resistance between the inverter 30 and the shell 10.

[0085] Therefore, the protrusion 122 arranged at the bottom of the installation cavity 11 can be in thermal coupling contact with the power element 311 of the inverter 30, thereby reducing the contact thermal resistance between the inverter 30 and the shell 10 and improving the heat dissipation efficiency of the power element 311 of the inverter 30.

[0086] Please refer to Figure 6 In some embodiments, a thermally conductive layer 123 is arranged between the protrusion 122 and the power element 311. The protrusion 122 is thermally coupled with the power element 311 of the inverter 30 through the thermally conductive layer 123.

[0087] Specifically, the thermally conductive layer 123 can be a thermally conductive pad, a thermally conductive gel or a thermally conductive structure formed by other high thermal conductive materials, which is not limited herein.

[0088] In this way, the energy storage power supply 100 of the present application can be arranged with a thermally conductive layer between the protrusion 122 on the inside of the shell 10 and the power element 311. The thermally conductive layer is made of flexible material, which can make the power element 311 of the inverter 30 more closely fit the protrusion 122, accelerate the heat conduction process between the inverter 30 and the protrusion 122, and thus accelerate the heat conduction of the inverter 30 to the shell 10 for heat dissipation.

[0089] In some embodiments, the thickness of the heat-conducting layer 123 is less than 1mm, and the heat-conducting coefficient of the heat-conducting layer 123 is greater than 3W / M / K.

[0090] It can be understood that, due to the high height of the heat-conducting layer 123, the heat conduction efficiency between the inverter 30 and the protrusion 122 is reduced.

[0091] Therefore, the thickness of the heat-conducting layer 123 of the present application can be set to be less than 1mm, and the heat-conducting coefficient of the heat-conducting layer 123 is greater than 3W / M / K, which can ensure the heat conduction efficiency between the inverter 30 and the protrusion 122, so as to ensure that the heat can be quickly conducted from the power elements such as the circuit board device of the inverter 30 to the shell 10.

[0092] In other words, the protrusion 122 is arranged on the inner side of the shell 10 inside the mounting cavity 11, which can reduce the setting height of the heat-conducting layer 123, so that the heat conduction efficiency between the inverter 30 and the shell 10 is optimal.

[0093] Please refer to Figure 1 In some embodiments, the energy storage power supply 100 further comprises a foot pad 50. The bottom 101 of the shell 10 is provided with the foot pad 50, and the foot pad 50 is used to contact with an external supporting surface, so that the bottom 101 of the shell 10 is spaced apart from the external supporting surface.

[0094] Specifically, the foot pad 50 is arranged on the bottom 101 of the shell 10, on the one hand, the heat dissipation structure 12 cannot be seen from the outside of the energy storage power supply 100, and the appearance is beautiful, and on the other hand, the driving airflow between the fan 40 and the heat dissipation structure 12 can flow in a relatively sufficient space, so as to ensure the heat dissipation efficiency of the heat dissipation structure 12 on the shell 10.

[0095] In addition, the energy storage power supply 100 of the present application is supported by the foot pad 50, and the human body is not easy to touch the fan 40, thereby improving the use safety of the energy storage power supply 100.

[0096] Optionally, the foot pad 50 is four, and the four foot pads 50 are respectively located at four corners of the shell 10. In this way, the stability of the energy storage power supply 100 on the external supporting surface can be ensured. Of course, in other embodiments of the present application, the number of foot pads 50 can also be adjusted according to actual needs, and is not limited to four.

[0097] Please refer to Figure 2 In some embodiments, the energy storage power supply 100 further comprises a first cover plate 60. The first cover plate 60 is fixedly installed on the outer side of the shell 10 and covers the fan 40, and the first cover plate 60 is provided with a ventilation hole 61.

[0098] That is to say, the setting position of the first cover plate 60 corresponds to the setting position of the fan 40. When the fan 40 is installed on the bottom 101 of the shell 10, the first cover plate 60 is also covered on the bottom 101 of the shell 10. When the fan 40 is installed on the side 102 of the shell 10, the first cover plate 60 is also covered on the side 102 of the shell 10. When the fan 40 is installed on the top 103 of the shell 10, the first cover plate 60 is also covered on the top 103 of the shell 10.

[0099] In the present application, the first cover plate 60 is fixedly installed outside the shell 10 and covers the fan 40 and the heat dissipation fins 121, so that the fan 40 and the heat dissipation fins 121 are prevented from being exposed, the fan 40 is protected, and the user is prevented from being scalded by touching the heat dissipation fins 121 when taking the energy storage power supply 100, and the first cover plate 60 also has a certain aesthetic effect. The first cover plate 60 can be fixedly installed outside the shell 10 by screws or other parts, which is not limited herein.

[0100] The first cover plate 60 of the present application is provided with a ventilation hole 61, and heat generated by the inverter 30 can be dissipated to the outside through the ventilation hole 61 of the first cover plate 60 by the action of the fan 40, so as to realize the heat dissipation effect of the heat conducted from the inverter 30 to the shell 10.

[0101] In some embodiments, the first cover plate 60 includes a first bottom plate 62 and a first side plate 63 surrounding the first bottom plate 62. A wind channel is formed between the heat dissipation structure 12 and the first cover plate 60, the ventilation hole 61 includes a first ventilation hole 611 and a second ventilation hole 612, the wind channel is arranged between the first ventilation hole 611 and the second ventilation hole 612, the first bottom plate 62 is provided with the first ventilation hole 611, and the first side plate 63 is provided with the second ventilation hole 612.

[0102] Specifically, the first cover plate 60 is provided with the first ventilation hole 611 and the second ventilation hole 612 at the same time, that is, the first cover plate 60 is provided with ventilation holes in two directions, so that an independent wind channel can be formed between the first cover plate 60 and the shell 10, and the energy storage power supply 100 of the present application can be quickly cooled.

[0103] As shown in Figure 4 The number of the first ventilation holes 611 can be multiple, and the multiple first ventilation holes 611 are arranged in an array. The number of the second ventilation holes 612 can also be multiple, and the multiple second ventilation holes 612 can also be arranged in an array. It can be understood that the more the number of the first ventilation holes 611 and the second ventilation holes 612 or the larger the aperture, the better the ventilation effect, so that the final heat dissipation effect is better.

[0104] Thus, the energy storage power supply 100 of this application can form an independent air duct between the first cover plate 60 and the housing 10 through the first ventilation hole 611 and the second ventilation hole 612 on the first cover plate 60, so that the heat dissipation structure 12 on the housing 10 has a better heat dissipation effect.

[0105] In some embodiments, the first ventilation hole 611 is an air inlet and the second ventilation hole 612 is an air outlet; or, the second ventilation hole 612 is an air inlet and the first ventilation hole 611 is an air outlet.

[0106] That is, the first ventilation hole 611 of this application can serve as either an air inlet or an air outlet. When serving as an air inlet, it is responsible for introducing external cold air into the power supply, or when serving as an air outlet, it is responsible for expelling internal hot air. Similarly, the second ventilation hole 612 can also serve as either an air inlet or an air outlet. When serving as an air inlet, it is responsible for introducing external cold air into the power supply, or when serving as an air outlet, it is responsible for expelling internal hot air, depending on the heat dissipation requirements of the energy storage power supply 100 and the airflow path inside the energy storage power supply 100.

[0107] In this application, the direction of the fan 40 can be controlled to determine whether the two ventilation holes are used as air inlets or air outlets.

[0108] Furthermore, a grille may be provided on the first ventilation hole 611 or the second ventilation hole 612. This can serve to dissipate heat from the energy storage power supply 100 and also prevent foreign objects from entering the first cover plate 60 of the energy storage power supply 100.

[0109] In some embodiments, the energy storage power supply 100 includes feet. The feet are disposed on the side of the first cover 60 opposite to the fan 40. The feet are designed to contact an external support surface such that the bottom of the first cover 60 is spaced apart from the external support surface.

[0110] That is, the present application can directly provide foot pads at the bottom of the first cover plate 60. On the one hand, the heat dissipation structure 12 is not visible from the outside of the energy storage power supply 100, which is aesthetically pleasing. On the other hand, it can allow the driving airflow between the fan 40 and the heat dissipation structure 12 to circulate in a relatively sufficient space, thereby ensuring the heat dissipation efficiency of the heat dissipation structure 12 on the housing 10.

[0111] Optionally, there are four foot pads 50, located at the four corners of the first cover plate 60. This ensures the stability of the energy storage power supply 100 on the external support surface. Of course, in other embodiments of this invention, the number of foot pads 50 can be adjusted according to actual needs and is not limited to four.

[0112] Please see Figure 2 and Figure 4In some embodiments, the energy storage power supply 100 comprises a foot pad 50. The first bottom plate 62 of the first cover plate 60 is provided with a through hole 64 corresponding to the foot pad 50. The foot pad 50 is fixedly arranged at the bottom of the first cover plate 60 through the through hole 64, and the foot pad 50 is used to contact with an external supporting surface, so that the bottom of the first cover plate 60 is arranged in a spaced manner with the external supporting surface.

[0113] In one embodiment, as shown in Figure 4 When the bottom of the shell 10 is provided with a heat dissipation fin 121, the heat dissipation fin 121 can be provided with a first connecting column 1212, and the foot pad 50 can be provided with a first connecting hole corresponding to the first connecting column 1212. The foot pad 50 can be fixed to the bottom of the shell 10 by cooperating with the first connecting column 1212 through the first connecting hole, so that the pressure received by the foot pad 50 can be directly conducted to the shell 10 and will not be borne by the first cover plate 60, which can effectively further avoid the first cover plate 60 from being crushed.

[0114] In another embodiment, when the bottom of the shell 10 is provided with a heat dissipation fin 121, the heat dissipation fin 121 can also be provided with a second connecting hole, and the foot pad 50 can be provided with a second connecting column 52 corresponding to the second connecting hole. The foot pad 50 can be fixed to the bottom of the shell 10 by cooperating with the second connecting hole through the second connecting column 52, so that the pressure received by the foot pad 50 can be directly conducted to the shell 10 and will not be borne by the first cover plate 60, which can effectively further avoid the first cover plate 60 from being crushed.

[0115] In yet another embodiment, the foot pad 50 can be provided with a first clamping column corresponding to the through hole 64, and the shell 10 can be provided with a second clamping column with a clamping hole corresponding to the clamping column. The first clamping column can be clamped with the second clamping column through the through hole 64, so that the foot pad 50 can be stably installed with the shell 10 through the first cover plate 60, so that the pressure received by the foot pad 50 can be directly conducted to the shell 10 and will not be borne by the first cover plate 60, which can effectively further avoid the first cover plate 60 from being crushed.

[0116] Similarly, the foot pad 50 is arranged at the bottom of the first cover plate 60, on the one hand, the heat dissipation structure 12 cannot be seen from the outside of the energy storage power supply, and the appearance is beautiful, and on the other hand, the driving airflow between the fan 40 and the heat dissipation structure 12 can flow in a relatively sufficient space, thereby ensuring the heat dissipation efficiency of the heat dissipation structure 12 on the shell 10.

[0117] Optionally, the foot pad 50 is four, and the four foot pads 50 are respectively located at four corners of the first cover plate 60. In this way, the stability of the energy storage power supply 100 on the external supporting surface can be ensured. Of course, in other embodiments of the present application, the number of foot pads 50 can also be adjusted according to actual needs, and is not limited to four.

[0118] Please refer to Figure 2 In some embodiments, the shell 10 comprises a first shell 13 and a second shell 14, the first shell 13 and the second shell 14 are buckled to each other to form the mounting cavity 11. The inverter 30 is fixed on the first shell 13, the first shell 13 is provided with the heat dissipation structure 12, and the battery module 20 is fixed on the second shell 14.

[0119] Specifically, the first shell 13 is a lower shell, and the second shell 14 is an upper shell. The first shell 13 can be provided with a first clamping member 131, and the second shell 14 can be provided with a second clamping member 141 clamped with the first clamping member 131. The first clamping member 131 can be a hollow first clamping column as shown in the figure, and the second clamping member 141 can be a solid second clamping column corresponding to the first clamping column as shown in the figure. Figure 3 Figure 2

[0120] The first shell 13 and the second shell 14 of the present application can be pressure die cast, which is simple in structure and convenient to manufacture.

[0121] The shell 10 of the present application is designed as a splicing structure formed by splicing the first shell 13 and the second shell 14, which facilitates the assembly of the energy storage power supply 100.

[0122] It can be understood that when the shell 10 is designed as a splicing structure, the corresponding heat dissipation structure 12 on the shell 10 can be a splicing structure or not, which is not limited here.

[0123] Please refer to Figure 4 In some embodiments, the first shell 13 is an aluminum alloy shell, the inner side of the first shell 13 is thermally coupled with the inverter 30, and the outer side of the first shell 13 is formed with the heat dissipation structure 12.

[0124] It can be understood that the first shell 13 is an aluminum alloy shell, and the aluminum alloy has good heat conduction performance, so the heat dissipation performance of the first shell 13 made of aluminum alloy material is also good. Since the outer side of the first shell 13 is formed with the heat dissipation structure 12, the heat dissipation structure 12 is also made of aluminum alloy material, and the heat dissipation performance of the corresponding heat dissipation structure 12 of the present application is also good.

[0125] In addition, since the aluminum alloy has a lower density and a higher strength compared with traditional metal materials such as steel and copper, the strength of the first shell 13 made of aluminum alloy material is good and is not easy to be damaged.

[0126] In some embodiments, the first shell 13 is subjected to anodic oxidation treatment.

[0127] ​​Specifically, the first shell 13 is subjected to an anodization treatment, which can improve the corrosion resistance of the first shell 13 while improving the surface emissivity, thereby improving the radiation capacity of the first shell 13.

[0128] Referring to Figure 3 and Figure 5 In some embodiments, the first shell 13 is provided with a receiving cavity 132, and the inverter 30 is fixedly installed in the receiving cavity 132.

[0129] Specifically, the inverter 30 can be fixedly installed in the receiving cavity 132 by screws or bolts, or can be fixedly installed in the receiving cavity 132 by other means, which is not limited herein.

[0130] In this way, the inverter 30 of the present application can be fixedly installed in the receiving cavity 132, so that it can be cooled by the heat dissipation structure 12 formed on the outside of the first shell 13, achieving a better cooling effect.

[0131] Referring to Figure 1 and Figure 2 In some embodiments, the second shell 14 is provided with a panel 142, and the panel 142 is provided with an electric energy output port 1421.

[0132] That is, the energy storage power supply 100 of the present application can output electric energy through the electric energy output port 1421 provided on the panel 142 of the second shell 14.

[0133] In some embodiments, the first shell 13 and the second shell 14 are upper and lower buckles, and the first shell 13 is arranged on the lower side of the second shell 14.

[0134] That is, the shell 10 of the present application can be composed of two half shells buckled up and down, which has a simple structure and is easy to mass-produce the shell 10.

[0135] In addition, since the heat dissipation structure 12 is arranged on the outside of the first shell 13 and the first shell 13 is arranged on the lower side of the second shell 14, the energy storage power supply 100 of the present application is equivalent to arranging the heat dissipation structure 12 below the shell 10, so that the heat dissipation structure 12 is not easy to be mistakenly contacted, and the heat dissipation structure 12 can be protected from being damaged.

[0136] In some embodiments, a temperature sensor is installed on the heat dissipation structure 12 to detect the temperature of the heat dissipation structure 12. The energy storage power supply 100 controls the start-stop or rotation speed of the fan 40 based on the temperature of the heat dissipation structure 12.

[0137] That is, the energy storage power supply 100 can also be installed with a temperature sensor on the shell 10. When the temperature sensor detects that the temperature of the heat dissipation structure 12 is greater than or equal to the first threshold value, the energy storage power supply 100 can automatically control the fan 40 to start, so as to ensure that the temperature of the heat dissipation structure 12 does not become too high, and facilitate timely heat dissipation of the energy storage power supply 100.

[0138] When the temperature sensor detects that the temperature of the heat dissipation structure 12 is less than or equal to the second threshold value, the energy storage power supply 100 can automatically control the fan 40 to stop working, so as to improve the heat dissipation efficiency of the fan 40 and save energy consumption.

[0139] The first threshold value may be, for example, 38°, 39°, 40°, 43°, 45°, 48°, 50°, 51°, 55°, or 60°, without limitation.

[0140] The second threshold value may be, for example, 28°, 29°, 29.5°, 30°, 31°, 34°, 35°, 36°, 37°, or 38°, without limitation.

[0141] In this way, the application can timely sense the temperature of the heat dissipation structure 12 by setting a temperature sensor on the heat dissipation structure 12, so that the energy storage power supply 100 can timely control the fan 40 to start to start heat dissipation, and timely control the fan 40 to stop working to stop heat dissipation.

[0142] Please refer to Figure 7 In some embodiments, the energy storage power supply 100 further includes a semiconductor refrigeration device 124. The semiconductor refrigeration device 124 includes a hot end and a cold end. The cold end is thermally coupled to the inverter 30, and the hot end is thermally coupled to the heat dissipation structure 12.

[0143] It can be understood that the heat dissipation structure 12 can include a semiconductor refrigeration device 124. The semiconductor refrigeration technology is a high-efficiency refrigeration and heat pump technology. It uses semiconductor materials as refrigerants and generates refrigeration effect through electric current. This technology has the advantages of energy saving, environmental protection, small size, and good refrigeration effect, and has been widely used in various fields. The principle of semiconductor refrigeration technology is to realize refrigeration through electric current transmission and thermoelectric effect of semiconductor materials. When electric current passes through semiconductor materials, one side of the semiconductor materials becomes hot and the other side becomes cold. This is because the carriers of the semiconductor materials produce energy transfer under the action of the thermoelectric field. By using this effect, heat can be transferred from the cold side to the hot side, thereby achieving the effect of refrigeration.

[0144] In the embodiment, the cold end of the semiconductor refrigeration device 124 is in thermal connection with the inverter 30, the hot end is in thermal connection with the heat dissipation structure 12, and the air at the hot end of the semiconductor refrigeration device 124 is transmitted to the outside through the heat dissipation structure 12 and the fan 40, so that the purpose of refrigeration at the cold end is achieved, the temperature of the inverter 30 is reduced, and thus the cooling effect of the energy storage power supply 100 is ensured.

[0145] At the same time, since the semiconductor refrigeration device 124 can accurately control the temperature, the temperature of the shell 10 can be adjusted according to the power consumption parameters of the semiconductor refrigeration device 124 according to the user demand, the temperature of the shell 10 is intelligently adjusted, and the user experience is improved.

[0146] Reference Figure 7 As shown in the figure, the heat dissipation structure 12 further comprises a heat preservation member 125 surrounding the semiconductor refrigeration device 124. It can be understood that, since the semiconductor refrigeration device 124 refrigerates at one end and heats at the other end during operation, the heat preservation member 125 is needed to prevent the use performance of the semiconductor refrigeration device 124 from being affected by the outside, and the heat preservation member 125 needs to be made of an insulating material with low thermal conductivity and good compression performance, such as pearl wool, foam and the like. Of course, in other embodiments of the utility model, the material of the heat preservation member 125 can also be adjusted according to actual needs, and is not limited to the above-mentioned limitation.

[0147] Optionally, the thickness of the heat preservation member 125 is determined according to the compression performance of the heat preservation material, and is generally 1.5-2 times the thickness of the semiconductor refrigeration device 124, and is filled between the inverter 30 and the heat dissipation structure 12. The compression filling is locked by the compression force of the heat dissipation structure 12 from bottom to top, so as to ensure good heat preservation performance.

[0148] Please refer to Figure 8 In some embodiments, the side of the heat dissipation structure 12 facing the inverter 30 has a mounting groove 126, and the semiconductor refrigeration device 124 is mounted in the mounting groove 126.

[0149] It can be understood that, as the support of the semiconductor refrigeration device 124 and the fan 40, the heat dissipation structure 12 can make the heat dissipation structure 12, the semiconductor refrigeration device 124 and the fan 40 form a heat dissipation whole, which is convenient for assembly. Mounting the semiconductor refrigeration device 124 in the mounting groove 126 can improve the contact area between the hot end of the semiconductor refrigeration device 124 and the heat dissipation structure 12, so as to facilitate the heat dissipation effect of the heat dissipation structure 12 on the hot end of the semiconductor refrigeration device 124.

[0150] Optionally, the size of the mounting groove 126 is slightly larger than the size of the semiconductor refrigeration device 124, and the depth of the mounting groove 126 is between 0.1mm-0.2mm, mainly for positioning the semiconductor refrigeration device 124, and at the same time, a heat conduction material is applied at the position where the mounting groove 126 contacts the semiconductor refrigeration device 124, so as to eliminate the heat conduction thermal resistance. The heat conduction material is generally a heat conduction material with fluidity, such as silicone grease.

[0151] Referring to Figure 4 In some embodiments, the outer wall of the mounting cavity 11 has a heat dissipation opening 15, and the heat dissipation structure 12 is mounted on the heat dissipation opening 15.

[0152] Specifically, the heat dissipation structure 12 can be fixedly mounted on the heat dissipation opening 15 by screws or bolts.

[0153] In this way, the heat dissipation structure 12 of the present application can be mounted on the heat dissipation opening 15 of the outer wall of the mounting cavity 11, facilitating heat dissipation of the inverter 30 through the heat dissipation opening 15.

[0154] Referring to Figure 4 and Figure 8 In some embodiments, the heat dissipation structure 12 can include a mounting portion 127 and a fixed flange 128 arranged around the mounting portion 127. The mounting portion 127 extends into the heat dissipation opening 15, and the semiconductor refrigeration element 124 is mounted on the mounting portion 127. The fixed flange 128 is fixed on the outer wall of the mounting cavity 11 by a connecting member to close the heat dissipation opening 15 by the heat dissipation structure 12.

[0155] It can be understood that the heat dissipation structure 12 is an independent module attached to the outer wall of the mounting cavity by the connecting member. On the one hand, the heat dissipation structure 12 cannot be seen from the outside of the energy storage power supply, and the appearance is beautiful. On the other hand, the cold end of the semiconductor refrigeration element 124 can be tightly attached to the inverter 30, thereby improving the cooling effect of the inverter 30.

[0156] Optionally, as shown in Figure 9 The outer wall of the sealing member 129 abuts against the inner wall of the heat dissipation opening 15 of the housing 10. Thus, the connection sealing performance of the heat dissipation structure 12 and the housing 10 can be improved, thereby avoiding external dirt or liquid from entering the energy storage power supply 100 and reducing the failure rate of the energy storage power supply 100.

[0157] Optionally, the heat dissipation structure 12 is an integrated die casting. Thus, the heat dissipation fins 121, the mounting portion 127, and the fixed flange 128 can be formed at one time, facilitating the manufacturing of the heat dissipation structure 12 and being conducive to reducing the weight of the heat dissipation structure 12, thereby being conducive to the lightweight design of the energy storage power supply.

[0158] Referring to Figure 9 In some embodiments, the energy storage power supply 100 further includes a heat dissipation bracket 32. The inverter 30 includes a circuit board 31, and the circuit board 31 is provided with a power element 311. The heat dissipation bracket 32 is mounted on the housing 10, and the heat dissipation bracket 32 fixes the circuit board 31 and is thermally coupled with the power element 311. The heat dissipation bracket 32 is also thermally coupled with the heat dissipation structure 12.

[0159] It can be understood that the circuit board 31 is fixed on the heat dissipation support 32, which can play a role in protecting the power element 311. The heat dissipation support 32 is in thermal connection with the circuit board 31, and the heat dissipation support 32 is in thermal connection with the heat dissipation structure 12. In actual working process, the heat generated by the power element 311 on the circuit board 31 can be transmitted from the circuit board 31 to the heat dissipation support 32, and then dissipated to the outside by the heat dissipation structure 12 and the fan 40, which can improve the cooling effect of the inverter 30, thereby ensuring the heat dissipation effect of the energy storage power supply 100.

[0160] Optionally, the heat dissipation support 32 is provided with heat dissipation fins 32121. The heat dissipation fins 32121 arranged on the heat dissipation support 32 can play a role in heat dissipation, and the cooperation of the heat dissipation fins 32121 and the heat dissipation structure 12 can ensure the cooling effect of the inverter 30, thereby ensuring that the energy storage power supply 100 has good heat dissipation function. In the embodiment of the utility model, the number and area of the heat dissipation fins 32121 can be selected according to actual needs, so that the heat dissipation effect is ensured while the area is relatively small, thereby facilitating the lightweight design of the energy storage power supply.

[0161] Please refer to Figure 10 In some embodiments, the heat dissipation support 32 includes a base 321 and a second cover plate 322. The base 321 includes a second bottom plate 3211 and two second side plates 3212 connected to the two ends of the second bottom plate 3211. A heat-conducting pad 312 is arranged between the second bottom plate 3211 and the power element 311, and the second cover plate 322 is connected to the two second side plates 3212, and the second cover plate 322 is provided with a limiting piece 3221 for limiting the battery module 20.

[0162] It can be understood that, as shown in Figure 9 The base 321 is formed as a U-shaped plate, and the heat-conducting pad 312 is arranged between the second bottom plate 3211 and the circuit board 31. The heat dissipation fins 32121 are arranged on the second side plates 3212, and the heat generated by the power element 311 on the circuit board 31 can be quickly conducted to the heat dissipation support 32 through the heat-conducting pad 312, and then quickly dissipated through the heat dissipation fins 32121, thereby ensuring the heat dissipation effect of the circuit board 31.

[0163] The second cover plate 322 is provided with a limiting piece 3221 for limiting the battery module 20. On the one hand, the limiting piece 3221 can avoid the inverter 30 from shaking relative to the battery module 20, and on the other hand, the limiting piece 3221 can provide positioning for the installation of the inverter 30, thereby facilitating assembly and improving the reliability of the energy storage power supply.

[0164] Optionally, as shown in Figure 10As shown, the second bottom plate 3211 is provided with a receiving groove 32111 for accommodating the semiconductor refrigeration piece 124. The receiving groove 32111 has a size slightly larger than that of the semiconductor refrigeration piece 124, and has a depth of 0.1-0.2 mm. The main purpose is to position the semiconductor refrigeration piece 124, and at the same time, to smear a heat-conducting material at the position where the receiving groove 32111 contacts the semiconductor refrigeration piece 124, so as to eliminate the heat-conducting thermal resistance. Generally, the heat-conducting material is a flowable heat-conducting material such as silicone grease. In this way, the positioning effect of the semiconductor refrigeration piece 124 on the heat-dissipating support 32 can be improved, and the heat-dissipating effect of the semiconductor refrigeration piece 124 on the heat-dissipating support 32 can be improved.

[0165] Optionally, referring to Figure 10 As shown, the inverter 30 further comprises an insulating plate 33. The insulating plate 33 is clamped between the second bottom plate 3211 and the circuit board 31, and the insulating plate 33 is provided with an avoiding hole 331 corresponding to the heat-conducting pad 312. It can be understood that the added insulating plate 33 can ensure the insulation between the circuit board 31 and the second bottom plate 3211, avoid the short-circuit phenomenon caused by the electrification of the heat-dissipating support 32, and thus improve the working reliability of the energy storage power supply. The avoiding hole 331 provided on the insulating plate 33 can ensure that the heat-conducting pad 312 directly abuts against the second bottom plate 3211, and ensure that the heat on the circuit board 31 can be quickly conducted to the heat-dissipating support 32, thereby facilitating the improvement of the heat-dissipating efficiency of the inverter 30.

[0166] In some embodiments, the energy storage power supply 100 further comprises a heat pipe, which is thermally coupled with the heat-dissipating structure 12.

[0167] Specifically, the heat pipe is generally a closed copper pipe with a phase-change medium, and has very strong heat conductivity. The heat pipe is arranged in the receiving cavity 132 and is attached to the heat-dissipating structure 12. The heat is mainly generated from the inverter 30, and different power elements 311 of the inverter 30 generate different amounts of heat, which causes different temperatures in different regions of the heat-dissipating structure 12, and an extremely high temperature region can occur.

[0168] Therefore, the heat pipe can guide the heat in the high-temperature region to the low-temperature region, so as to achieve uniform heat dissipation of the heat-dissipating structure 12, and better heat dissipation and better heat-dissipating effect can be achieved.

[0169] Please refer to Figure 2 In some embodiments, the battery module 20 can be arranged above the inverter 30, and a protective plate 21 can be arranged on the side of the battery module 20 opposite to the inverter 30, and the protective plate 21 is used for protecting the battery module 20.

[0170] In detail, the protection plate 21 can prevent the inverter 30 or other external objects from directly contacting the battery module 20, thereby avoiding physical damage that may be caused by friction, collision or extrusion. This is crucial for maintaining the structural integrity of the battery module 20 and prolonging its service life.

[0171] In addition, in some cases, the inverter 30 may generate electromagnetic interference or electrical noise. The protection plate 21 can serve as an electrical barrier to reduce the impact of these disturbances on the battery module 20, ensuring that the battery module 20 can work stably and safely.

[0172] In addition, the battery module 20 will generate heat during operation, and the inverter 30 may also be a heat source. The protection plate 21 can to some extent act as a heat shield, reducing heat exchange between the battery module 20 and the inverter 30, and helping to maintain the battery module within the appropriate operating temperature range.

[0173] If the inverter 30 fails or produces abnormalities such as short circuit, overheating, etc., the protection plate 21 can serve as an additional safety barrier to prevent these failures from directly damaging the battery module 20. It can also reduce the risk of fire, explosion and other safety hazards to some extent.

[0174] The above embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it cannot be interpreted as a limitation on the scope of the patent of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application should be subject to the appended claims.

Claims

1. An energy storage power supply, characterized by, The energy storage power supply comprises: a shell having a mounting cavity, the shell being formed with a heat dissipation structure comprising a plurality of heat dissipation fins arranged on the bottom, side and / or top of the shell, the heat dissipation fins being arranged radially and the middle part forming a mounting space; a battery module mounted in the mounting cavity; an inverter mounted in the mounting cavity, thermally coupled with the heat dissipation structure and electrically connected with the battery module; and a fan mounted in the mounting space outside the shell, the fan forming an air flow through the heat dissipation structure. The arrangement density of the heat dissipation fins gradually changes from the center to the periphery, and the arrangement height of the heat dissipation fins gradually changes from the center to the periphery.

2. The energy storage power supply of claim 1, wherein, The fan is a centrifugal fan or an axial flow fan.

3. The energy storage power supply of claim 1, wherein, The heat dissipation structure further comprises a protrusion arranged in the mounting cavity and fixedly arranged on the shell, the protrusion being thermally coupled with a power element of the inverter.

4. The energy storage power supply of claim 1, wherein, A thermally conductive layer is arranged between the protrusion and the power element, and the protrusion is thermally coupled with the power element of the inverter through the thermally conductive layer.

5. The energy storage power supply of claim 4, wherein, The thickness of the thermally conductive layer is less than 1 mm, and the thermal conductivity coefficient of the thermally conductive layer is greater than 3 W / M / K.

6. The energy storage power supply of claim 5, wherein, The energy storage power supply further comprises a foot pad, the bottom of the shell is provided with a foot pad, the foot pad is used to contact with an external supporting surface, so that the bottom of the shell is arranged spaced apart from the external supporting surface.

7. The energy storage power supply of claim 1, wherein, The energy storage power supply further comprises a first cover plate, the first cover plate is fixedly mounted on the outside of the shell and covers the fan, and the first cover plate is provided with a ventilation hole.

8. The energy storage power supply of claim 1, wherein, The first cover plate covers the heat dissipation structure, the first cover plate comprises a first bottom plate and a first side plate arranged around the first bottom plate, an air duct is formed between the heat dissipation structure and the first cover plate, the ventilation hole comprises a first ventilation hole and a second ventilation hole, the air duct is arranged between the first ventilation hole and the second ventilation hole, the first bottom plate is provided with the first ventilation hole, and the first side plate is provided with the second ventilation hole.

9. The energy storage power supply of claim 8, wherein, The energy storage power supply further comprises a foot pad, the foot pad is arranged on the side of the first cover plate opposite to the fan, the foot pad is used to contact with an external supporting surface, so that the bottom of the first cover plate is arranged spaced apart from the external supporting surface.

10. The energy storage power supply of claim 8, wherein, The energy storage power supply further comprises a foot pad, the bottom plate of the cover plate is provided with a through hole corresponding to the foot pad, the foot pad is fixedly arranged on the bottom of the cover plate through the through hole, the foot pad is used to contact with an external supporting surface, so that the bottom of the cover plate is arranged spaced apart from the external supporting surface.

11. The energy storage power supply of claim 8, wherein, The shell comprises a first shell and a second shell, the first shell and the second shell are buckled to each other to form the mounting cavity, the inverter is fixed on the first shell, the heat dissipation structure is arranged on the first shell, and the battery module is fixed on the second shell.

12. The energy storage power source of claim 1, wherein, The first shell is an aluminum alloy shell, the inside of the first shell is thermally coupled with the inverter, and the outside of the first shell is formed with the heat dissipation structure.

13. The energy storage power supply of claim 12, wherein, The first shell is subjected to an anodization treatment.

14. The energy storage power supply of claim 13, wherein, ​ 15. The energy storage power supply of claim 12, wherein, The first shell is provided with a containing cavity, and the inverter is fixedly installed in the containing cavity.

16. The energy storage power source of claim 12, wherein, The second shell is provided with a panel, and the panel is provided with an electric energy output port.

17. The energy storage power source of claim 12, wherein, The first shell is buckled with the second shell in an up-down mode, and the first shell is arranged on the lower side of the second shell.

18. The energy storage power source of claim 1, wherein, A temperature sensor is installed on the heat dissipation structure to detect the temperature of the heat dissipation structure, and the energy storage power supply controls the start-stop or rotating speed of the fan based on the temperature of the heat dissipation structure.

19. The energy storage power source of claim 1, wherein, The energy storage power supply further comprises a semiconductor refrigeration device, the semiconductor refrigeration device comprises a hot end and a cold end, the cold end is thermally coupled with the inverter, and the hot end is thermally coupled with the heat dissipation structure.

20. The energy storage power source of claim 19, wherein, The side of the heat dissipation structure facing the inverter is provided with a mounting groove, and the semiconductor refrigeration device is installed in the mounting groove.

21. The energy storage power source of claim 19, wherein, The outer wall of the mounting cavity is provided with a heat dissipation port, and the heat dissipation structure is installed on the heat dissipation port.

22. The energy storage power source of claim 21, wherein, The heat dissipation structure comprises a mounting portion and a fixed flange arranged around the mounting portion, the mounting portion extends into the heat dissipation port, the semiconductor refrigeration device is installed on the mounting portion, and the fixed flange is fixed on the outer wall of the mounting cavity by a connecting piece to close the heat dissipation port by the heat dissipation structure.

23. The energy storage power source of any one of claims 1-22, wherein, The energy storage power supply further comprises a heat dissipation support, The inverter comprises a circuit board and a power element, and the circuit board is provided with the power element; The heat dissipation support is installed on the shell, the heat dissipation support fixes the circuit board and is thermally coupled with the power element, and the heat dissipation support is further thermally coupled with the heat dissipation structure.

24. The energy storage power source of claim 23, wherein, The heat dissipation support comprises: A base, the base comprises a second bottom plate and two second side plates, and the two second side plates are respectively connected to two ends of the second bottom plate; a heat conduction pad is arranged between the second bottom plate and the power element; and A second cover plate, the second cover plate is connected with the two second side plates, and the second cover plate is provided with a limiting piece for limiting the battery module.

25. The energy storage power source of claim 1, wherein, The energy storage power supply further comprises a heat pipe, and the heat pipe is thermally coupled with the heat dissipation structure.

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