Heat dissipation structure, domain control device and vehicle
By designing a heat dissipation structure in the domain controller that directly contacts the coolant, the problems of large space occupation and low efficiency of the heat dissipation structure are solved, achieving efficient heat dissipation and stable operation.
Patent Information
- Application Number
- CN202520328719.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-02-26
AI Technical Summary
In the existing technology, the heat dissipation structure of the domain controller occupies a large space and has low heat dissipation efficiency, making it difficult to effectively remove the heat from the power devices and affecting the stable operation of electric vehicles.
Design a heat dissipation structure including an inlet, a heat dissipation cavity, a heat dissipation channel and an outlet inside the heat dissipation housing, a heat dissipation channel filled with coolant, and the power module in direct contact with the coolant in the heat dissipation cavity. Combine open and closed heat dissipation channels to dissipate heat from the power module, capacitor module and power supply module respectively.
It improves heat dissipation efficiency, reduces space occupation and lowers costs, and ensures stable operation of the domain controller.
Smart Images
Figure CN223957831U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of vehicles, in particular to a heat dissipation structure, a domain control device and a vehicle. BACKGROUND
[0002] In recent years, with the continuous development and innovation of new energy vehicle technology, the related technologies of electric vehicle industry are also experiencing rapid updating and iteration. This progress has significantly improved the overall performance of vehicles. At the same time of performance improvement, the power of core components has also increased significantly. However, the increase in power also brings an increase in heat, which poses a challenge to the stable operation of the domain controller. In order to ensure that the domain controller can work stably and continuously, the design of the heat dissipation structure becomes crucial. These heat dissipation structures can effectively take away the heat generated by the domain controller, so that it always maintains within the appropriate working temperature range, thereby ensuring the reliable operation of the electric vehicle. In the related art, most of the power devices are attached to the bottom of the box, and the waterway is laid on the bottom of the box. The heat is first transferred to the bottom surface of the box, and then to the cooling liquid, which causes problems such as large space occupation and low heat dissipation efficiency. CONTENT OF THE UTILITY MODEL
[0003] The present application provides an improved heat dissipation structure, a domain control device and a vehicle.
[0004] The present application provides a heat dissipation structure for dissipating heat for a domain controller, the domain controller at least comprising a power module; the heat dissipation structure comprising:
[0005] a heat dissipation shell, at least an inlet, a heat dissipation cavity, a heat dissipation channel and an outlet are formed in the heat dissipation shell, the inlet is in communication with the heat dissipation cavity, the heat dissipation channel and the outlet in turn, and a heat dissipation flow channel is formed, the heat dissipation flow channel is filled with cooling liquid; wherein when the power module is assembled with the heat dissipation shell, the power module is partially located in the heat dissipation cavity and in contact with the cooling liquid in the heat dissipation cavity.
[0006] Preferably, the heat dissipation shell comprises a first cavity, and the heat dissipation cavity is located in the first cavity; when the power module is installed in the first cavity, the power module is sealingly installed with the heat dissipation cavity.
[0007] Preferably, a boss is arranged in the first cavity, the boss is located on the side of the heat dissipation cavity, and a sealing member is arranged; when the power module is installed in the first cavity, the power module is installed corresponding to the boss, and the sealing member is sealingly installed with the heat dissipation cavity.
[0008] Preferably, the boss is further provided with a plurality of fixing holes located on the circumferential side of the sealing element; the heat dissipation shell further comprises a plurality of fixing elements corresponding to the plurality of fixing holes, and the power module is fixed with the fixing elements and the fixing holes and installed corresponding to the boss.
[0009] Preferably, the domain controller further comprises a capacitor module installed in the first cavity and installed side by side with the power module; the heat dissipation channel comprises at least a first heat dissipation channel in communication with the heat dissipation recess and the outlet, and the first heat dissipation channel is arranged staggered with the heat dissipation recess and located at a position corresponding to the installation of the capacitor module in the first cavity.
[0010] Preferably, the domain controller further comprises a power module; the heat dissipation shell comprises a second cavity in which the power module is installed; the heat dissipation channel further comprises a second heat dissipation channel in communication with the first heat dissipation channel and the outlet and located at a position corresponding to the installation of the power module in the second cavity.
[0011] Preferably, the domain controller further comprises a power module; the heat dissipation shell comprises a second cavity for installing the power module; the heat dissipation channel further comprises a second heat dissipation channel which is a heat dissipation groove in communication with the first heat dissipation channel and the outlet; one side surface of the power module is provided with a heat dissipation assembly, and when the power module is installed in the second cavity, the heat dissipation assembly is partially located in the heat dissipation groove and in contact with the cooling liquid in the heat dissipation groove, and the heat dissipation assembly is sealingly connected with the heat dissipation groove.
[0012] Preferably, the heat dissipation channel is provided with a plurality of flow guide ribs.
[0013] The application further provides a domain control device comprising:
[0014] a domain controller comprising at least a power module; and
[0015] The heat dissipation structure of any one of the above embodiments, wherein the power module is partially located in the heat dissipation recess of the heat dissipation structure and in contact with the cooling liquid in the heat dissipation recess.
[0016] The application further provides a vehicle comprising:
[0017] a battery pack; and
[0018] The domain control device of the above embodiments, wherein the domain control device is assembled in the battery pack.
[0019] The heat dissipation structure, domain control device and vehicle of the embodiment of the present application, the heat dissipation structure is used for at least dissipating heat for the power module of the domain controller; the heat dissipation structure comprises a heat dissipation shell, at least an inlet, a heat dissipation cavity, a heat dissipation channel and an outlet are formed in the heat dissipation shell, the inlet is communicated with the heat dissipation cavity, the heat dissipation channel and the outlet in sequence, and a heat dissipation flow channel is formed, and the heat dissipation flow channel is filled with cooling liquid. When the power module and the heat dissipation shell are assembled, the power module is partially located in the heat dissipation cavity, so that the power module is in contact with the cooling liquid in the heat dissipation cavity, so that the cooling liquid directly dissipates heat for the power module, so as to increase the heat dissipation area, improve the heat dissipation efficiency, and reduce the occupied space and cost. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 Fig. 1 shows a structural schematic diagram of one embodiment of the heat dissipation structure of the present application.
[0021] Figure 2 Fig. 2 shows a structural schematic diagram of another view of the heat dissipation structure. Figure 1 Fig. 3 shows a structural schematic diagram of one view of the heat dissipation structure.
[0022] Figure 3 Fig. 4 shows a structural schematic diagram of another view of the heat dissipation structure. Figure 1 Fig. 5 shows a structural schematic diagram of another view of the heat dissipation structure.
[0023] Figure 4 Fig. 6 shows a structural schematic diagram of another view of the heat dissipation structure. Figure 1 Fig. 7 shows a partial structural schematic diagram of the heat dissipation structure.
[0024] Figure 5 Fig. 8 shows a partial structural schematic diagram of the heat dissipation structure. Figure 1 Fig. 9 shows a partial structural schematic diagram of the heat dissipation structure.
[0025] Figure 6 Fig. 10 shows a partial structural schematic diagram of the heat dissipation structure. Figure 1 Fig. 11 shows a partial structural schematic diagram of the heat dissipation structure.
[0026] Reference signs:
[0027] Heat dissipation structure 1, heat dissipation shell 10, first cavity 101, second cavity 102, boss 103, sealing groove 104, sealing element 105, fixing hole 106, inlet 11, heat dissipation cavity 12, heat dissipation channel 13, first heat dissipation channel 131, first heat dissipation flow channel 132, first cover plate 133, second heat dissipation channel 134, second heat dissipation flow channel 135, second cover plate 136, via hole 137, flow guide rib 138, outlet 14, domain controller 2, power module 21, capacitor module 22, power supply module 23. DETAILED DESCRIPTION
[0028] The heat dissipation structure, domain control device and vehicle of the present application will be described in detail below in combination with the drawings. The features in the following embodiments and implementation manners can be combined with each other without conflict.
[0029] Figure 1 Fig. 1 is a structural schematic diagram of an embodiment of the heat dissipation structure 1 of the present application. Figure 2 Fig. 2 is a structural schematic diagram of another view of the heat dissipation structure 1. Figure 1 Fig. 3 is a structural schematic diagram of a view of the heat dissipation structure 1. Figure 3 Fig. 4 is a structural schematic diagram of another view of the heat dissipation structure 1. Figure 1 Fig. 5 is a structural schematic diagram of another view of the heat dissipation structure 1. Figures 1 to 3 Fig. 6 is a structural schematic diagram of the heat dissipation structure 1 used for dissipating heat for the domain controller 2. Figure 2 Fig. 7 is a structural schematic diagram of the domain controller 2.
[0030] In the embodiment shown in Fig. 1, the heat dissipation structure 1 includes a heat dissipation shell 10. The heat dissipation shell 10 is internally formed with an inlet 11, a heat dissipation cavity 12, a heat dissipation channel 13 and an outlet 14. The inlet 11 is in communication with the heat dissipation cavity 12, the heat dissipation channel 13 and the outlet 14 in sequence, and forms a heat dissipation flow channel, which is filled with cooling liquid. In the embodiment, the inlet 11 is used for connecting an inlet pipe (not shown), and the outlet 14 is used for connecting an outlet pipe (not shown). The inlet pipe and the outlet pipe are connected with the shell by press connection process. The inlet pipe is in communication with the heat dissipation flow channel through the inlet 11, the heat dissipation cavity 12, the heat dissipation channel 13, the outlet 14 and the outlet pipe in sequence. The heat dissipation flow channel is filled with cooling liquid, and the inlet pipe outside the heat dissipation flow channel can be connected with a driving assembly (not shown), which can drive the cooling liquid in the heat dissipation flow channel to circulate and dissipate heat. In the present application, when the power module is assembled with the heat dissipation shell 10, the power module is partially inserted into the heat dissipation cavity 12, so that the power module is in contact with the cooling liquid in the heat dissipation cavity 12, so that the cooling liquid directly dissipates heat for the power module, so as to increase the heat dissipation area, improve the heat dissipation efficiency, and reduce the occupied space and cost. Figures 1 to 3 In the embodiment shown in Fig. 1, the heat dissipation shell 10 includes two shells, which are fixed by a fixing member.
[0031] In Fig. 2, only one of the two shells is shown, and the other shell is not shown. The parts in the shell shown are integrated into the same pressure casting, which is a welded integrated structure, and has high integration degree. Figures 1 to 3 Figures 1 to 3 In the embodiment shown in Fig. 1, the heat dissipation shell 10 includes two shells, which are fixed by a fixing member.
[0032] In the embodiment shown in Fig. 1, the heat dissipation shell 10 includes two shells, which are fixed by a fixing member. Figures 1 to 3 The shown embodiment, the heat dissipation shell 10 is provided with a heat dissipation cavity, for accommodating power module 21, capacitor module 22 and power module 23. The heat dissipation cavity includes a first cavity 101 and a second cavity 102. The first cavity 101 is used to install power module 21 and capacitor module 22. Power module 21 and capacitor module 22 are assembled side by side in the first cavity 101. The second cavity 102 is used to install power module 23, which can be an integrated module of power conversion module and vehicle charging machine. The power module 23 is assembled in the second cavity 102. The capacitor module 22 is installed in the first cavity 101, and is installed side by side with the power module 21.
[0033] In Figures 1 to 3 The shown embodiment, the power module 21 is installed in the first cavity 101, and the power module 21 is sealed and installed with the heat dissipation recess 12. In this embodiment, the heat dissipation recess 12 is an open heat dissipation recess 12, the opening of which is arranged towards the first cavity 101, and the power module 21 can partially extend into or be located in the heat dissipation recess 12, so that the power module 21 is directly contacted with the cooling liquid in the heat dissipation recess 12, thus improving the heat dissipation efficiency. Since the power module 21 is partially directly contacted with the cooling liquid, the sealing requirement is relatively high. Therefore, in this embodiment, the power module 21 is sealed and installed with the heat dissipation recess 12, so as to improve the sealing.
[0034] Figure 4 The shown is Figure 1 The shown is a partial structure diagram of the heat dissipation structure 1. In combination with Figures 1 to 4 As shown, the first cavity 101 is provided with a boss 103, which is located on the side of the heat dissipation recess 12. The boss 103 is arranged along the side of the heat dissipation recess 12, and is protruded relative to the bottom surface of the heat dissipation recess 12. The boss 103 is provided with a sealing groove 104, and the sealing groove 104 is provided with a sealing element 105. When the power module 21 is installed in the first cavity 101, the power module 21 partially extends into the heat dissipation recess 12 and is installed corresponding to the boss 103. The power module 21 is sealed and installed with the heat dissipation recess 12 through the sealing element 105. Since the power module 21 is partially contacted with the cooling liquid, the sealing requirement is relatively high. Therefore, in this embodiment, the power module 21 is sealed and installed with the boss 103 through the sealing element 105, which is pressed tightly from top to bottom. By this arrangement, on the basis of improving the heat dissipation efficiency, the sealing requirement is achieved, and the sealing is good.
[0035] In Figures 1 to 4In the shown embodiment, the boss 103 is further provided with a plurality of fixing holes 106, which are located at the peripheral side of the sealing member 105. The plurality of fixing holes 106 are arranged at intervals. The heat dissipation shell further comprises a plurality of fixing members (not shown) corresponding to the plurality of fixing holes 106. When the power module 21 is fixed by the fixing members and the fixing holes 106, the fixing members and the fixing holes 106 are threadedly fixed to realize the corresponding installation of the power module 21 and the boss 103. Since the power module 21 is partially in contact with the cooling liquid, the fixing firmness is required to be relatively high. Therefore, in the present embodiment, the power module 21 is threadedly fixed with the boss 103 by the fixing members, and the fixing firmness is high.
[0036] Figure 5 As shown in Figure 1 A partial structure schematic view of the heat dissipation structure 1 is shown. Figure 6 As shown in Figure 1 A partial structure schematic view of the heat dissipation structure 1 is shown. In Figures 1 to 6 In the shown embodiment, the heat dissipation channel 13 at least comprises a first heat dissipation channel 131, which is in communication with the heat dissipation cavity 12 and the outlet 14. The first heat dissipation channel 131 is arranged staggered with the heat dissipation cavity 12 and is located at the position corresponding to the installation of the capacitor module 22 in the first cavity 101. In the present embodiment, the first heat dissipation channel 131 is enclosed by a first heat dissipation flow channel 132 and a first cover plate 133, which can be a closed heat dissipation channel. The first heat dissipation channel 131 is formed at the back of the first cavity 101. The first heat dissipation channel 131 is located inside the heat dissipation cavity, and the first heat dissipation flow channel 132 and the first cover plate 133 are both aluminum alloy die castings, which are connected with the shell by welding process. The capacitor module 22 is located at the front of the shell, and when the cooling liquid circulates, the heat on the shell can be taken away. Since the temperature of the capacitor module 22 is not too high compared with the power module 21, the capacitor module 22 can be cooled by the first heat dissipation channel 131, thereby improving the heat dissipation efficiency.
[0037] In Figures 1 to 6In the shown embodiment, the heat dissipation channel 13 further comprises a second heat dissipation channel 134, which is in communication with the first heat dissipation channel 131 and the outlet 14, and is located in the second cavity 102 at a position corresponding to the installation of the power module 23. In the embodiment, the second heat dissipation channel 134 is enclosed by a second heat dissipation flow channel 135 and a second cover plate 136, and can be a closed heat dissipation channel. The second heat dissipation channel 134 is formed in the bottom of the second cavity 102. The second heat dissipation channel 134 is located inside the heat dissipation cavity, and the second heat dissipation flow channel 135 and the second cover plate 136 are both aluminum alloy die castings, which are connected to the shell by welding process. The second heat dissipation channel 134 also dissipates heat for the power module 23. The power module 23 can transfer heat to the second cover plate 136 through heat-conducting silicone grease, and the cooling liquid can take away the heat of the second cover plate 136 by circulating in the second heat dissipation channel 134. Since the temperature of the power module 23 is not too high compared to the power module 21, the power module 23 can be cooled by the second heat dissipation channel 134, thereby improving the heat dissipation efficiency.
[0038] In Figures 1 to 6 In the shown embodiment, the first heat dissipation flow channel 132 and the second heat dissipation flow channel 135 are both provided with a plurality of through holes 137. The first heat dissipation flow channel 132 is in communication with the heat dissipation recess 12 and the second heat dissipation channel 134 through the through holes 137, respectively. The second heat dissipation flow channel 135 is in communication with the first heat dissipation flow channel 132 through the through holes 137. By communicating through the through holes 137, the structure is simple, easy to implement, and low in cost.
[0039] In other embodiments, the heat dissipation channel 13 further comprises a second heat dissipation channel 134, which is a heat dissipation groove in communication with the first heat dissipation channel 131 and the outlet 14. One side of the power module 23 is provided with a heat dissipation assembly. When the power module 23 is installed in the second cavity 102, the heat dissipation assembly is partially located in the heat dissipation groove and in contact with the cooling liquid in the heat dissipation groove, and the heat dissipation assembly is sealingly connected to the heat dissipation groove. In other embodiments, if the power module 23 is provided with a heat dissipation assembly (not shown), the heat dissipation assembly is inserted into the heat dissipation groove and directly contacts the cooling liquid in the heat dissipation groove to dissipate heat. In this way, the heat dissipation effect is better, and the cover plate of the second heat dissipation channel 134 can be omitted. Correspondingly, it is also a sealed installation, which can adopt the above description and will not be described here.
[0040] It should be noted that if the capacitor module 22 and the power module of the domain controller 2 are provided with heat dissipation assemblies, the first cover plate 133 and the second cover plate 136 can be removed, the first heat dissipation channel 131 and the second heat dissipation channel 134 can be changed to open heat dissipation channels, and the sealed assembly can be adapted, which is not limited in the present application and will not be described here.
[0041] In Figure 5 andFigure 6 In the shown embodiment, the heat dissipation channel 13 is provided with a plurality of flow guides 138. The flow guides 138 play a role of guiding flow, which is conducive to guiding the flow of the cooling liquid in the heat dissipation channel to accelerate circulation. Figure 5 In the shown embodiment, the first heat dissipation channel 131 is provided with flow guides 138, which is conducive to accelerating the circulation speed of the cooling liquid in the first heat dissipation channel 131, thereby improving the heat dissipation efficiency. Figure 6 In the shown embodiment, the second heat dissipation channel 134 is provided with flow guides 138, which is conducive to accelerating the circulation speed of the cooling liquid in the second heat dissipation channel 134, thereby improving the heat dissipation efficiency.
[0042] In the present embodiment, the flow guides 138 are curved flow guides and / or straight flow guides. Since the cooling liquid is a liquid, the liquid flow is mostly curved. The flow guides 138 are provided as curved flow guides 138 to accelerate the flow speed of the cooling liquid. In other embodiments, the flow guides 138 can also be provided as straight flow guides. In the present embodiment, the top surface of the flow guides 138 is lower than the top surface of the heat dissipation channel 13. Such arrangement is conducive to the cooling liquid in the heat dissipation channel 13 not being restricted by the flow guides 138, accelerating the flow speed of the cooling liquid, and improving the heat dissipation efficiency.
[0043] The present application also provides a domain control device, which comprises a domain controller 2 and the heat dissipation structure 1 shown in the above embodiments. Figures 1 to 6 The power module 21 of the domain controller 2 is partially located in the heat dissipation cavity 12 of the heat dissipation structure 1 and is in contact with the cooling liquid in the heat dissipation cavity 12. Such arrangement can make the cooling liquid directly dissipate heat for the power module 21 to increase the heat dissipation area, improve the heat dissipation efficiency, and reduce the occupied space and cost. Moreover, in the present embodiment, the capacitance module 22 of the domain controller 2 is cooled through the first heat dissipation channel 131. The power supply module 23 of the domain controller 2 is cooled through the second heat dissipation channel 134. The domain controller 2 is assembled in the heat dissipation structure 1, and the power module 21, the capacitance module 22, and the power supply module 23 are respectively cooled through the different heat dissipation channels provided in the heat dissipation structure 1, thereby improving the heat dissipation efficiency. The domain controller adopts the above heat dissipation structure 1, which combines the open heat dissipation channel and the closed heat dissipation channel, thereby realizing liquid cooling circulation heat dissipation, and having the advantages of high integration degree, compact layout, high heat dissipation efficiency, and low cost.
[0044] The present application also provides a vehicle, which comprises a battery pack and the domain control device of the above embodiments. The domain control device is assembled in the battery pack. The vehicle improves the heat dissipation efficiency by providing the domain control device with the heat dissipation structure 1 of the above embodiments. Figures 1 to 6
[0045] It is to be understood that the application is not limited to what has been described above and illustrated in the drawings. That which has been described above and illustrated in the drawings is merely the preferred embodiment of the application. Modifications and alterations will occur to others upon reading and understanding the preceding detailed description. It is intended to include all such modifications and alterations insofar as they come within the scope of the appended claims.
Claims
1. A heat dissipating structure, characterized by comprising: The heat dissipation structure is used for dissipating heat for a domain controller, and the domain controller at least comprises a power module; the heat dissipation structure comprises: A heat dissipation shell, at least an inlet, a heat dissipation cavity, a heat dissipation channel and an outlet are formed in the heat dissipation shell, the inlet is communicated with the heat dissipation cavity, the heat dissipation channel and the outlet in sequence, and a heat dissipation flow channel is formed, and the heat dissipation flow channel is filled with cooling liquid; wherein, when the power module is assembled with the heat dissipation shell, the power module is partially located in the heat dissipation cavity and contacts with the cooling liquid in the heat dissipation cavity.
2. The heat dissipating structure according to claim 1, wherein The heat dissipation shell comprises a first cavity, and the heat dissipation cavity is located in the first cavity; when the power module is installed in the first cavity, the power module is sealingly installed with the heat dissipation cavity.
3. The heat dissipating structure according to claim 2, wherein A boss is arranged in the first cavity, the boss is located at the periphery of the heat dissipation cavity, and a sealing member is arranged; when the power module is installed in the first cavity, the power module is correspondingly installed with the boss, and the sealing member is sealingly installed with the heat dissipation cavity.
4. The heat dissipating structure according to claim 3, wherein A plurality of fixing holes are further arranged on the boss, and the plurality of fixing holes are located at the periphery of the sealing member; the heat dissipation shell further comprises a plurality of fixing members corresponding to the plurality of fixing holes, and the power module is fixed with the fixing member and the fixing hole and correspondingly installed with the boss.
5. The heat dissipating structure according to claim 2, wherein The domain controller further comprises a capacitor module, the capacitor module is installed in the first cavity and installed side by side with the power module; the heat dissipation channel at least comprises a first heat dissipation channel, the first heat dissipation channel is communicated with the heat dissipation cavity and the outlet, the first heat dissipation channel is arranged staggered with the heat dissipation cavity, and is located at the position corresponding to the installation of the capacitor module in the first cavity.
6. The heat dissipating structure according to claim 5, wherein The domain controller further comprises a power supply module; the heat dissipation shell comprises a second cavity, and the power supply module is installed in the second cavity; the heat dissipation channel further comprises a second heat dissipation channel, the second heat dissipation channel is communicated with the first heat dissipation channel and the outlet, and is located at the position corresponding to the installation of the power supply module in the second cavity.
7. The heat dissipating structure according to claim 5, wherein The domain controller further comprises a power supply module; the heat dissipation shell comprises a second cavity, for installing the power supply module; the heat dissipation channel further comprises a second heat dissipation channel, the second heat dissipation channel is a heat dissipation groove, communicated with the first heat dissipation channel and the outlet; one side surface of the power supply module is provided with a heat dissipation assembly, when the power supply module is installed in the second cavity, the heat dissipation assembly is partially located in the heat dissipation groove and contacts with the cooling liquid in the heat dissipation groove, and the heat dissipation assembly is sealingly connected with the heat dissipation groove.
8. The heat dissipating structure according to claim 1, wherein A plurality of flow guide ribs are arranged in the heat dissipation channel.
9. A domain control device, characterized by Comprise: A domain controller, at least comprising a power module; And The heat dissipation structure according to any one of claims 1 to 8, the power module is partially located in the heat dissipation cavity of the heat dissipation structure, and contacts with the cooling liquid in the heat dissipation cavity.
10. A vehicle characterized by comprising: Comprise: A battery pack; And The domain control device according to claim 9, the domain control device is assembled in the battery pack.