Vapor chamber and electronic equipment

Abstract

The utility model provides a vapor chamber and electronic equipment, and the vapor chamber comprises a first cover body and a second cover body, the first cover body and the second cover body are enclosed to form an accommodating space, and the peripheral side of the first cover body wraps the peripheral side of the second cover body.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronic devices, and in particular, to a vapor chamber and an electronic device. BACKGROUND

[0002] Electronic devices often use a vapor chamber as a heat dissipation device for heat dissipation. For some portable electronic devices, such as mobile phones, tablet computers, and notebook computers, the internal space is limited, and it is necessary to ensure performance while reducing the space occupied by the vapor chamber in the electronic device.

[0003] The vapor chamber is enclosed by an upper cover and a lower cover. The upper cover and the lower cover are attached to each other by the sealing plane of the peripheral sealing area to realize the connection of the two. In order to ensure the stability of the connection of the upper cover and the lower cover, the area of the sealing plane needs to be increased. However, increasing the area of the sealing plane will result in a large invalid area of the vapor chamber and a large volume of the vapor chamber occupying the internal space of the electronic device. UTILITY MODEL CONTENT

[0004] The first aspect of the present disclosure provides a vapor chamber, comprising: a first cover body and a second cover body, the first cover body and the second cover body enclosing a containing space, and the first cover body wrapping the peripheral side of the second cover body.

[0005] Further, the peripheral side of the first cover body has a first structure;

[0006] The peripheral side of the second cover body has a second structure, the first structure is attached to at least part of the second structure, and the first structure wraps the second structure.

[0007] Further, the second structure is located on the side of the second cover body close to the first cover body, the second structure extends along the extension direction of the second cover body, and the first structure and the second structure can wrap each other.

[0008] Further, the second structure further comprises:

[0009] A first sub-structure, the first sub-structure is connected to the second cover body, and the first sub-structure extends along the extension direction of the second cover body;

[0010] A second sub-structure, the second sub-structure is arranged on the side of the first sub-structure close to the first cover body and extends in the opposite direction of the extension direction of the second cover body, and the second sub-structure and the first sub-structure are connected at the end part away from the containing space.

[0011] Further, the first structure is connected to the end part of the first cover body in the extension direction;

[0012] The second structure is connected to the end part of the second cover body in the extension direction, and the first structure and the second structure are connected to form a nested structure, and the nested structure is located in the containing space.

[0013] Further, the vapor chamber further comprises:

[0014] a first sub-space, the first sub-space is arranged between the first cover and the second cover, and the nesting structure is arranged around the first sub-space;

[0015] a second sub-space, the second sub-space is arranged between the first cover and the nesting structure, and the second sub-space is in communication with the first sub-space;

[0016] a third sub-space, the third sub-space is arranged between the second cover and the nesting structure, and the third sub-space is in communication with the first sub-space.

[0017] Further, the first structure forms a first connecting groove, the depth direction of the first connecting groove is opposite to the extension direction of the first cover, and part of the second structure is arranged in the first connecting groove to form the nesting structure.

[0018] Alternatively, the second structure forms a second connecting groove, the depth direction of the second connecting groove is opposite to the extension direction of the second cover, and part of the first structure is arranged in the second connecting groove to form the nesting structure.

[0019] Further, the vapor chamber further comprises:

[0020] a metal mesh, the metal mesh is arranged inside the accommodation space to divide the accommodation space into a plurality of flow channel structures;

[0021] a heat dissipation fluid, the heat dissipation fluid is arranged in the plurality of flow channel structures to circulate.

[0022] Further, the vapor chamber further comprises:

[0023] an edge sealing structure, the edge sealing structure is arranged on the side of the accommodation space to increase the sealing performance of the accommodation space;

[0024] The thickness of the region where the side of the first cover wraps the side of the second cover is equal to or less than the thickness of the region where the side of the first cover does not wrap the side of the second cover.

[0025] The second aspect of the present disclosure provides an electronic device, comprising:

[0026] an electronic device body;

[0027] a vapor chamber, the vapor chamber is arranged inside the electronic device, and the vapor chamber comprises:

[0028] a first cover and a second cover, the first cover and the second cover enclose an accommodation space, and the side of the first cover wraps the side of the second cover. BRIEF DESCRIPTION OF DRAWINGS

[0029] The above and other objects, features and advantages of the presently disclosed example embodiments will become more apparent from the following detailed description read in conjunction with the accompanying drawings. In the drawings, several embodiments of the disclosure are shown by way of example, not limitation, in which like or corresponding reference numerals indicate the same or corresponding parts, wherein:

[0030] Figure 1 A first type of vapor chamber structure schematic diagram is shown schematically;

[0031] Figure 2 A second type of vapor chamber structure schematic diagram is shown schematically;

[0032] Figure 3 A third type of vapor chamber structure schematic diagram is shown schematically;

[0033] Figure 4 A fourth type of vapor chamber structure schematic diagram is shown schematically;

[0034] Figure 5 A fifth type of vapor chamber structure schematic diagram is shown schematically;

[0035] Figure 6 A sixth type of vapor chamber structure schematic diagram is shown schematically;

[0036] BRIEF DESCRIPTION OF DRAWINGS

[0037] 1, first cover; 2, second cover;

[0038] 3, first structure;

[0039] 4, second structure; 41, first substructure; 42, second substructure;

[0040] 5, accommodation space; 51, first sub-space; 52, second sub-space; 53, third sub-space;

[0041] 6, metal mesh; 7, edge sealing structure. DETAILED DESCRIPTION

[0042] The embodiments of the disclosure will be described in further detail below with reference to the drawings and examples. The detailed description and drawings of the following examples are used to illustrate the principles of the disclosure by way of example, but cannot be used to limit the scope of the disclosure, and the disclosure can be implemented in many different forms, not limited to the specific examples disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0043] The present disclosure provides these embodiments to make the present disclosure thorough and complete, and fully convey the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the components of materials, numerical expressions and numerical values set forth in these embodiments should be interpreted as merely exemplary, not as a limitation.

[0044] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the purpose of facilitating the description of the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation to the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0045] In addition, "first", "second" and similar words used in the present disclosure do not mean any order, number or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0046] Embodiment one

[0047] As shown in Figures 1-4 The first aspect of the first embodiment of the present disclosure provides a first kind of vapor chamber, which comprises: a first cover 1 and a second cover 2, the first cover 1 and the second cover 2 enclose a containing space 5, and the first cover 1 wraps the periphery of the second cover 2.

[0048] Specifically, the first cover body 1 and the second cover body 2 can be circular cover bodies or rectangular cover bodies, and are not specifically limited, and can be selected according to actual needs. The first cover body 1 and the second cover body 2 enclose to form a containing space 5, and the containing space 5 is used for storing a heat dissipation fluid. The heat dissipation fluid can be water, ethanol, acetone or the like, and can be selected according to actual needs. The first cover body 1 wraps the periphery of the second cover body 2, which can be understood as that, after the first cover body 1 and the second cover body 2 are buckled, the periphery of the first cover body 1 extends from a position close to the inner surface of the second cover body 2 to a position of the outer surface of the second cover body 2 and is attached, or the periphery of the first cover body 1 and the periphery of the second cover body 2 are embedded in each other, that is, after the peripheries are attached, they are bent together at least once, and are not specifically limited. The connection mode of the first cover body 1 and the second cover body 2 can be laser welding or connecting through a connecting piece. It should be noted that the connection between the first cover body 1 and the second cover body 2 needs to be sealed to prevent the heat dissipation fluid in the containing space 5 from flowing out of the containing space 5.

[0049] The first aspect of the present disclosure provides a vapor chamber, which comprises: a first cover body 1 and a second cover body 2, the first cover body 1 and the second cover body 2 enclose to form a containing space 5, and the periphery of the first cover body 1 wraps the periphery of the second cover body 2. Due to the wrapping of the periphery of the first cover body 1 on the periphery of the second cover body 2, the periphery of the first cover body 1 is attached to at least the inner surface, the outer surface and the side surface of the second cover body 2, which can effectively provide sufficient contact surface for the first cover body 1 and the second cover body 2 to ensure the stability of the connection between the two. At the same time, compared with the single surface attachment of the first cover body 1 and the second cover body 2, the periphery of the first cover body 1 wrapping the periphery of the second cover body 2 does not need to set a large area of edge plane, which effectively reduces the overall volume of the vapor chamber.

[0050] As shown in Figures 1-4 In some embodiments, the periphery of the first cover body 1 has a first structure 3, and the periphery of the second cover body 2 has a second structure 4. The first structure 3 is attached to at least part of the second structure 4, and the first structure 3 wraps the second structure 4.

[0051] Specifically, the first structure 3 and the second structure 4 can be two connecting pieces on the first cover body 1 and the second cover body 2, respectively, or can be part structures of the first cover body 1 and the second cover body 2, and are not specifically limited. The first structure 3 is attached to at least part of the second structure 4, that is, the first structure 3 and the second structure have an attachment surface that can contact each other. It should be noted that the attachment surface of the two needs to have sufficient area to prevent unstable connection.

[0052] As shown in Figure 1As shown, in some embodiments, the second structure 4 is located on the side of the second cover 2 close to the first cover 1, the second structure 4 extends along the extension direction of the second cover 2, and the first structure 3 and the second structure 4 can cover each other.

[0053] Specifically, the second structure 4 is located inside the second cover 2, and the second structure 4 can be connected to the second cover 2 via a connector. In this embodiment, the first structure 3 can cover the second structure 4, and the second cover 2 and the second structure 4 are integrally formed. The second cover 2 can be provided with a protrusion extending in a direction close to the first cover 1, and the second structure 4 is connected to the protrusion. The second structure 4 can be a sheet-like structure. The extension of the second structure 4 along the extension direction of the second cover 2 can be understood as the second structure 4 extending away from the accommodating space 5. The first structure 3 covers the second structure 4 to achieve contact with multiple surfaces of the second structure 4, providing sufficient contact area to achieve a stable connection between the two.

[0054] like Figure 5 As shown, the mutual covering of the first structure 3 and the second structure 4 is not specifically limited. The first structure 3 and the second structure 4 can be two grooves, which are connected by insertion to achieve mutual covering. Alternatively, the first structure 3 and the second structure 4 can be two sheet-like structures respectively disposed on the first cover 1 and the second cover 2. After the two sheet-like structures are attached, they are bent multiple times to achieve mutual covering of the first structure 3 and the second structure 4. This arrangement can further increase the connection stability between the first cover 1 and the second cover 2.

[0055] like Figure 2 As shown, in some embodiments, the second structure 4 further includes: a first substructure 41 and a second substructure 42; the first substructure 41 is connected to the second cover 2 and extends along the extension direction of the second cover 2; the second substructure 42 is disposed on the side of the first substructure 41 close to the first cover 1 and extends in the opposite direction to the extension direction of the second cover 2, and the ends of the second substructure 42 and the first substructure 41 that are away from the accommodating space 5 are connected.

[0056] Specifically, the first substructure 41 can be understood as being connected to the inner surface of the second cover 2 and extending in a direction away from the accommodation space 5. The second substructure 42 can be connected to the first substructure 41 by a connecting member such as a rivet or a clamping member, opposite to the extension direction of the second cover 2. It can be understood as being in a direction close to the accommodation space 5. In the present embodiment, the second substructure 42 can be integrally formed with the first substructure 41. In the present embodiment, the first substructure 41 and the second substructure 42 can be two integrally formed sheet structures that are folded to form the second structure 4. The first structure 3 covers the second structure 4 to achieve stable connection between the first cover 1 and the second cover 2. In this way, since the second structure 4 is formed by the first substructure 41 and the second substructure 42, the first structure 3 covering the second structure 4 can effectively increase the connection stiffness of the first cover 1 and the second cover 2 and increase the contact area of the first structure 3 and the second structure 4, thereby increasing the connection stability between the first cover 1 and the second cover 2.

[0057] As shown in Figure 2 , in some embodiments, the heat plate further comprises: a metal mesh 6 and a heat dissipation fluid; the metal mesh 6 is arranged inside the accommodation space 5 to divide the accommodation space 5 into a plurality of flow channel structures; and the heat dissipation fluid circulates in the plurality of flow channel structures.

[0058] Specifically, the metal mesh 6 is not specifically limited, and the metal mesh 6 divides the accommodation space 5 into a plurality of flow channel structures, which is beneficial to make the heat dissipation fluid flow along a specific path, ensure uniform distribution of the heat dissipation fluid in the heat plate, and avoid local overheating or overcooling. At the same time, the metal mesh 6 plays a certain regularizing role in the flow of the heat dissipation fluid, making the flow of the heat dissipation fluid more stable and reducing the generation of turbulence. Turbulence can cause an increase in flow resistance of the heat dissipation fluid, an increase in energy loss, and even affect the normal circulation of the heat dissipation fluid, while the division of the flow channel structure helps to maintain the smooth flow of the heat dissipation fluid and ensure the heat dissipation performance of the heat plate. The connection mode of the metal mesh 6 with the first cover 1 and the second cover 2 can be welding or clamping by a clamping groove, which is not specifically limited. The metal mesh 6 divides the accommodation space 5 into a plurality of flow channel structures by the metal members constituting a mesh structure inside the metal mesh 6.

[0059] As shown in Figure 2 , 3 , in some embodiments, the heat plate further comprises: an edge sealing structure 7 arranged on the periphery of the accommodation space 5 to increase the sealing performance of the accommodation space 5; and the thickness of the region where the periphery of the first cover 1 covers the periphery of the second cover 2 is equal to or less than the thickness of the region where the periphery of the first cover 1 does not cover the periphery of the second cover 2.

[0060] Specifically, the edge sealing structure 7 can be a sealing member connected to the side of the accommodation space 5, which can be elastically deformed, and the first cover 1 and the second cover 2 press the sealing member to increase the sealing performance of the accommodation space 5, which is not specifically limited.

[0061] The thickness of the region where the side of the first cover 1 covers the side of the second cover 2 is equal to or less than the thickness of the region where the side of the first cover 1 does not cover the side of the second cover 2. It can be understood that the first cover 1 has two regions, one is the region for covering the side of the second cover 2, and the other is the region for constituting the accommodation space 5, and the thickness of the region for covering the side of the second cover 2 is equal to or less than the thickness of the region for constituting the accommodation space 5. As shown in Figure 1 When the connection strength of the first cover 1 and the second cover 2 is required to be high, the thickness of the region where the side of the first cover 1 covers the side of the second cover 2 can be equal to the thickness of the region where the side of the first cover 1 does not cover the side of the second cover 2. As shown in Figure 6 When the connection strength of the first cover 1 and the second cover 2 is sufficient, the thickness of the region where the side of the first cover 1 covers the side of the second cover 2 is less than the thickness of the region where the side of the first cover 1 does not cover the side of the second cover 2. In this way, the overall volume of the vapor chamber can be further reduced.

[0062] As shown in Figure 3 The edge sealing structure 7 can also be arranged on the outer side of the first structure 3 and the second structure 4 away from the accommodation space 5 to seal the connection gap of the first structure 3 and the second structure 4, thereby increasing the sealing performance.

[0063] Embodiment Two

[0064] As shown in Figure 3 , 4 The second vapor chamber provided by the second embodiment of the first aspect of the present disclosure is shown in

[0065] Specifically, the first structure 3 and the second structure 4 are respectively connected to the end portions of the first cover 1 and the second cover 2 in the extension direction can be understood as that the first structure 3 is connected to the side wall of the first cover 1 where the outer surface and the inner surface intersect. Similarly, the second structure 4 is also connected to the side wall of the second cover 2 where the outer surface and the inner surface intersect. The mutual nesting of the first structure 3 and the second structure 4 can be understood as that the first structure 3 encloses the second structure 4 to form a nested structure, or the second structure 4 encloses the first structure 3 to form a nested structure, which is not specifically limited. The nested structure is located inside the accommodation space 5, which can further reduce the external size of the vapor chamber. At the same time, when the accommodation space 5 is deformed due to external impact, the nested structure provides certain support to the first cover 1 and the second cover 2 inside the accommodation space 5, so as to prevent the leakage of the heat dissipation fluid due to excessive deformation of the accommodation space 5.

[0066] As shown in Figure 3 , 4 In some embodiments, the vapor chamber further comprises: the accommodation space 5 comprises at least one of the following combinations:

[0067] The first sub-space 51 is arranged between the first cover 1 and the second cover 2, and the nested structure is arranged around the first sub-space 51;

[0068] The second sub-space 52 is located between the first cover 1 and the nested structure, and the second sub-space 52 is in communication with the first sub-space 51;

[0069] The third sub-space 53 is located between the second cover 2 and the nested structure, and the third sub-space 53 is in communication with the first sub-space 51.

[0070] Specifically, since the nested structure is located inside the accommodation space 5, the position of the accommodation space 5 where the nested structure is arranged cannot accommodate the heat dissipation fluid, thereby causing a large invalid area of the vapor chamber. The second sub-space 52 arranged between the first cover 1 and the nested structure and the third sub-space 53 arranged between the second cover 2 and the nested structure can make the heat dissipation fluid flow through the two sides of the first cover and the second cover where the nested structure is arranged, thereby reducing the invalid area of the vapor chamber. In this embodiment, it can be understood that the thickness of the first sub-space 51 is greater than the thickness of the nested structure, so that the nested structure forms the first sub-space 51 and the second sub-space 52 on the two sides close to the first cover 1 and the second cover 2, respectively.

[0071] As shown in Figure 3 , 4As shown, in some embodiments, the first structure 3 constitutes a first connecting groove, the depth direction of the first connecting groove is opposite to the extension direction of the first cover 1, and part of the second structure 4 is located in the first connecting groove to constitute a nested structure; or, the second structure 4 constitutes a second connecting groove, the depth direction of the second connecting groove is opposite to the extension direction of the second cover 2, and part of the first structure 3 is located in the second connecting groove to constitute a nested structure.

[0072] Specifically, the first connecting groove constituted by the first structure 3 can be a sheet structure arranged on the side of the first cover 1 and bent to constitute, and the second structure 4 can also be a sheet structure, which is bent to extend into the first connecting groove. The sheet structure of the second structure 4 can be bent multiple times to increase the thickness of the part located in the first connecting groove, thereby increasing the connection stability of the first cover 1 and the second cover 2. The first connecting groove can also be directly formed by a mold, and is not specifically limited.

[0073] For the second connecting groove constituted by the second structure 4, it can be the same structure as the first connecting groove constituted by the first structure 3. When the second structure 4 is used as the second connecting groove, the connection direction with the first structure 3 can be the same as when the first structure 3 is used as the first connecting groove with the second structure 4. Here, it is not repeated. Such an arrangement can further increase the connection stability between the first cover 1 and the second cover 2, and can facilitate the formation of the second sub-space 52 and the third sub-space 53, and reduce the dead area of the vapor chamber.

[0074] Embodiment three

[0075] The second aspect embodiment three of the present disclosure provides an electronic device, which comprises: an electronic device body and a vapor chamber; the vapor chamber is arranged in the electronic device, and the vapor chamber comprises: a first cover 1 and a second cover 2, the first cover 1 and the second cover 2 enclose a containing space 5, and the side of the first cover 1 covers the side of the second cover 2.

[0076] Specifically, the vapor chamber can be attached to a heating element with a higher temperature in the electronic device, and the specific connection mode can be screw connection or clamping through a clamping groove, which is not specifically limited.

[0077] The electronic device provided by the second aspect embodiment three of the present disclosure adopts the vapor chamber, and the side of the first cover 1 of the vapor chamber covers the side of the second cover 2, without the need to set a large-area edge plane, effectively reducing the overall volume of the vapor chamber. Further, the overall space layout rationality in the electronic device is increased.

[0078] The above merely describes a specific implementation of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present disclosure, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

[0079] It should also be noted that in the description of the present disclosure, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between a first device and a second device, there can be or can not be an intermediate device between the specific device and the first device or the second device.

[0080] All the terms used in the present disclosure have the same meaning as understood by those skilled in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that the terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or excessively formalized sense, unless otherwise defined herein.

[0081] The technologies, methods and devices known to those skilled in the relevant art can not be discussed in detail, but in appropriate cases, the technologies, methods and devices should be considered as part of the specification.

Claims

1. A vapor chamber, characterized by, Comprising: a first cover and a second cover, the first cover and the second cover enclosing a receiving space, the first cover circumferentially covering the second cover.

2. The vapor chamber of claim 1, wherein: the first cover has a first structure; the second cover has a second structure, the first structure being fitted with at least part of the second structure, the first structure circumferentially covering the second structure.

3. The vapor chamber of claim 2, wherein: the second structure is located on a side of the second cover close to the first cover, the second structure extending along an extension direction of the second cover, the first structure and the second structure being capable of circumferentially covering each other.

4. The vapor chamber of claim 3, wherein the second structure further comprises: a first sub-structure connected to the second cover, the first sub-structure extending along the extension direction of the second cover; a second sub-structure located on a side of the first sub-structure close to the first cover and extending away from the extension direction of the second cover, the second sub-structure and the first sub-structure being connected at ends thereof away from the receiving space.

5. The vapor chamber of claim 2, wherein: the first structure is connected to an end of the first cover in the extension direction; the second structure is connected to an end of the second cover in the extension direction, the first structure and the second structure being connected to form a nested structure, the nested structure being located in the receiving space.

6. The vapor chamber of claim 5, wherein Further comprising: the receiving space comprises at least one of the following combinations: a first sub-space located between the first cover and the second cover, the nested structure being located around the first sub-space; a second sub-space located between the first cover and the nested structure, the second sub-space being in communication with the first sub-space; a third sub-space located between the second cover and the nested structure, the third sub-space being in communication with the first sub-space.

7. The vapor chamber of claim 5 or 6, wherein: the first structure forms a first connecting groove, the first connecting groove having a depth direction opposite to the extension direction of the first cover, part of the second structure being located in the first connecting groove to form the nested structure; or, the second structure forms a second connecting groove, the second connecting groove having a depth direction opposite to the extension direction of the second cover, part of the first structure being located in the second connecting groove to form the nested structure.

8. The vapor chamber of claim 1, wherein Further comprising: a metal mesh located inside the receiving space to divide the receiving space into a plurality of flow channel structures; a heat dissipation fluid circulating in the plurality of flow channel structures.

9. The vapor chamber of claim 1, wherein, Further comprising: an edge sealing structure located around the receiving space to increase the sealing property of the receiving space; the thickness of the region of the first cover circumferentially covering the second cover is equal to or less than the thickness of the region of the first cover not circumferentially covering the second cover.

10. An electronic device, comprising: Comprising: an electronic device body; A vapor chamber is arranged inside the electronic device, and the vapor chamber includes: A first cover and a second cover, which enclose a receiving space, and the first cover wraps around the periphery of the second cover.

Images