LED patch type packaging structure easy to dissipate heat

Abstract

The utility model relates to an LED paster type packaging structure easy to dissipate heat, comprising a substrate, the bottom end of the substrate is provided with a heat dissipation groove, the top end of the substrate is recessed downwards to form a sinking part, the upper end of the sinking part is provided with a positioning groove, the groove bottom wall of the positioning groove is provided with a mounting groove, and the interior of the mounting groove is provided with a chip fixing plate. A light-emitting chip is attached to the top end of the chip fixing plate through heat-conducting glue. The utility model relates to the technical field of LED surface-mounted packaging. According to the LED surface-mounted packaging structure easy to dissipate heat, when the light-emitting chip emits heat, heat of the light-emitting chip is transmitted to the chip fixing plate and passes through the chip fixing plate and the heat dissipation supporting feet, heat dissipation is conducted on the chip fixing plate through the heat dissipation supporting feet, the heat dissipation structure and the substrate are assisted to make contact with each other, and therefore the contact area of the substrate and air is increased; the heat dissipation efficiency of the substrate is improved, and the purpose of effectively improving the heat dissipation efficiency is achieved through multiple heat dissipation of the heat dissipation supporting feet, the substrate and the auxiliary heat dissipation structure.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED patch type packaging technical field especially is easy to heat dissipation's LED patch type packaging structure. BACKGROUND

[0002] As a new generation of light source, LED has many advantages, such as small size, large luminous flux, full solid state operation, compact structure, green pollution-free, high efficiency, energy saving and so on.

[0003] Chinese patent publication No. CN206516658U patch type LED packaging structure, it includes LED support and flip chip, the LED support includes support cup and the first electrode, second electrode of support cup bottom, the first electrode, second electrode are respectively the positive pole, negative pole of LED support, the first electrode, second electrode surface respectively coated with tin paste, the positive pole, negative pole of flip chip is fixed on two electrodes respectively set on the tin paste upper surface and the position corresponding with the first electrode, second electrode, fluorescent colloid is filled in the support cup and covers the flip chip, the upper end of the fluorescent colloid is formed through mold solidification one specific shape's transparent colloid. The utility model is an integral type lens, and the combination is good, and does not fall off without layering;Automation production, lens modularization, higher efficiency;Shape and size can be controlled, and diversified schemes can be provided;Luminous angle is big, and consistency is good.

[0004] In the above patent, although the combination of the LED packaging structure can be improved by the setting of the integral lens, the heat dissipation efficiency of the chip itself is reduced, which is easily affected by the outdoor environment temperature, so that the heat of the LED packaging structure is difficult to dissipate, and the circuit board is burned out when the temperature is too high. UTILITY MODEL CONTENTS

[0005] According to the deficiencies existing in the prior art, the purpose of the utility model is to provide an easy heat dissipation LED patch type packaging structure, so as to solve the technical problems mentioned in the background art.

[0006] The above technical purpose of the utility model is realized by the following technical scheme:

[0007] An easy heat dissipation LED patch type packaging structure, comprising a substrate, a heat dissipation groove is arranged at the bottom end of the substrate, a sunken part is formed by concave downward at the top end of the substrate, a positioning groove is arranged at the upper end of the sunken part;

[0008] A mounting groove is arranged at the groove bottom wall of the positioning groove, a chip fixing plate is arranged inside the mounting groove, a light emitting chip is attached to the top end of the chip fixing plate through heat conductive glue, a heat dissipation leg is arranged at the bottom end of the chip fixing plate, a protective lens is arranged on the top surface of the substrate, and an auxiliary heat dissipation structure is arranged inside the heat dissipation groove.

[0009] Further, the heat dissipation structure comprises a forming plate fixedly installed on the top wall of the heat dissipation groove, and the bottom end of the forming plate is provided with a plurality of heat dissipation frames which are hollow.

[0010] Further, the inner side groove wall of the positioning groove is provided in a slope, and the depth of the positioning groove is greater than the height of the light emitting chip.

[0011] Further, the cavity formed by the positioning groove and the bottom surface of the protection lens is filled with heat dissipation silica gel, and the heat dissipation silica gel is transparent silica gel material.

[0012] Further, the heat dissipation leg is inserted between two adjacent heat dissipation frames.

[0013] Further, the chip fixing plate and the heat dissipation leg are integrally formed and are made of metal copper.

[0014] The utility model discloses at least one beneficial technical effect as follows:

[0015] 1. The LED patch type packaging structure of easy heat dissipation, when the heat of the light emitting chip is transmitted to the chip fixing plate and is passed through the chip fixing plate and the heat dissipation leg, the heat dissipation leg is used for heat dissipation to the chip fixing plate, the auxiliary heat dissipation structure and the substrate are in contact with each other, so as to increase the contact area of the substrate and air, improve the heat dissipation efficiency of the substrate, and then the multiple heat dissipation of the heat dissipation leg, the substrate and the auxiliary heat dissipation structure is used for effectively improving the heat dissipation efficiency.

[0016] 2. The LED patch type packaging structure of easy heat dissipation, the positioning groove provided in the slope can effectively reduce the reflection of the light emitted by the light emitting chip, so as to improve the illumination area when the light emitting chip emits light, improve the luminous flux of the LED lamp, and reduce the light loss caused by light refraction and reflection.

[0017] 3. The LED patch type packaging structure of easy heat dissipation, the heat dissipation leg is used for transmitting the heat to the external air, so as to achieve the effect of rapid heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description, obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0019] Figure 1 It is a structure schematic view of the LED patch type packaging structure easy to dissipate heat of the present application.

[0020] Figure 2 It is an exploded view of the LED patch type packaging structure easy to dissipate heat of the present application.

[0021] Figure 3 It is a structure schematic view of the substrate, the heat dissipation leg and the auxiliary heat dissipation structure of the LED patch type packaging structure easy to dissipate heat of the present application.

[0022] Figure 4 It is an internal structure schematic view of the substrate of the LED patch type packaging structure easy to dissipate heat of the present application.

[0023] In the figure, 1, substrate; 2, heat dissipation groove; 3, sunken part; 4, positioning groove; 5, mounting groove; 6, chip fixing plate; 7, light emitting chip; 8, heat dissipation leg; 801, heat conduction plate; 802, heat dissipation leg; 9, protective lens; 10, auxiliary heat dissipation structure; 1001, forming plate; 1002, heat dissipation frame; 11, heat dissipation silica gel. DETAILED DESCRIPTION

[0024] The present application will be further described in detail below in combination with the drawings.

[0025] Embodiment:

[0026] Reference Figure 1 - Figure 4 The present application discloses an LED patch type packaging structure easy to dissipate heat, which comprises a substrate 1, the bottom end of the substrate 1 is provided with a heat dissipation groove 2, the top end of the substrate 1 is recessed downward to form a sunken part 3, the upper end of the sunken part 3 is provided with a positioning groove 4;

[0027] The groove bottom wall of the positioning groove 4 is provided with a mounting groove 5, the inside of the mounting groove 5 is provided with a chip fixing plate 6, the top end of the chip fixing plate 6 is attached with a light emitting chip 7 through heat conduction glue, the bottom end of the chip fixing plate 6 is provided with a heat dissipation leg 8, the top surface of the substrate 1 is provided with a protective lens 9, the inside of the heat dissipation groove 2 is provided with an auxiliary heat dissipation structure 10.

[0028] In this embodiment, the substrate 1, the sinking part 3 and the mounting groove 5 are used for mounting the chip fixing plate 6, and the chip fixing plate 6 is fixedly connected with the substrate 1 through the packaging glue, and the light emitting chip 7 is fixed on the top end of the chip fixing plate 6 through the heat-conducting glue;

[0029] When the light emitting chip 7 generates heat, the heat of the light emitting chip 7 is transmitted to the chip fixing plate 6 and then to the heat dissipation leg 8 through the chip fixing plate 6, the heat dissipation leg 8 is used for dissipating heat of the chip fixing plate 6, the auxiliary heat dissipation structure 10 is in contact with the substrate 1, so that the contact area of the substrate 1 and air is increased, the heat dissipation efficiency of the substrate 1 is improved, and the multiple heat dissipation of the heat dissipation leg 8, the substrate 1 and the auxiliary heat dissipation structure 10 is used for effectively improving the heat dissipation efficiency.

[0030] In a further preferable embodiment of the present application, as shown in Figures 1-4 The heat dissipation structure comprises a forming plate 1001, the forming plate 1001 is fixedly installed on the groove top wall of the heat dissipation groove 2, and the bottom end of the forming plate 1001 is provided with a plurality of heat dissipation frames 1002, and the heat dissipation frames 1002 are hollow.

[0031] In this embodiment, the contact area of the forming plate 1001 and the substrate 1 is increased through the forming plate 1001, and the contact area of the forming plate 1001 and the external air is increased through the heat dissipation frames 1002, so that the heat dissipation efficiency of the substrate 1 is further improved.

[0032] In a further preferable embodiment of the present application, as shown in Figures 1-4 The inner side groove wall of the positioning groove 4 is inclinedly arranged, and the depth of the positioning groove 4 is greater than the height of the light emitting chip 7.

[0033] In this embodiment, the positioning groove 4 arranged in an inclined manner can effectively reduce the reflection of the light emitted by the light emitting chip 7, so that the illumination area of the light emitting chip 7 during light emission is increased, the light flux of the LED lamp is increased, and the light loss caused by light refraction and reflection is reduced.

[0034] In a further preferable embodiment of the present application, as shown in Figures 1-4 The cavity formed by the positioning groove 4 and the bottom surface of the protection lens 9 is filled with heat dissipation silica gel 11, and the heat dissipation silica gel 11 is transparent silica gel material.

[0035] In this embodiment, the heat dissipation silica gel 11 can not only improve the stability of the light emitting chip 7, but also absorb the heat emitted by the light emitting chip 7 and transmit the heat to the substrate 1, so that the heat dissipation efficiency is further improved.

[0036] In a further preferable embodiment of the present application, as shown in Figures 1-4As shown, the heat dissipation leg 8 comprises a heat conduction plate 801 fixedly connected with the bottom surface of the chip fixing plate 6, and the outer peripheral wall of the heat conduction plate 801 is provided with a plurality of heat dissipation legs 802 inserted between two adjacent heat dissipation frames 1002.

[0037] In the embodiment, the heat conduction plate 801 is connected with the chip fixing plate 6, so that the heat conduction plate 801 can effectively absorb the heat in the chip fixing plate 6, thereby improving the heat dissipation efficiency of the chip fixing plate 6, and the heat is transmitted to the external air through the heat dissipation legs 802, so that the effect of rapid heat dissipation is achieved.

[0038] In the further preferable embodiment of the utility model, as shown in the figure, Figures 1-4 The chip fixing plate 6 and the heat dissipation leg 8 are integrally formed and made of copper.

[0039] In the embodiment, since the chip fixing plate 6 and the heat dissipation leg 8 are integrally formed and both are made of copper, the heat dissipation efficiency can be further improved due to the good heat dissipation property of copper.

[0040] The embodiments of the specific embodiment are preferable embodiments of the utility model, and are not limited to the protection scope of the utility model, so that: equivalent changes made according to the structure, shape and principle of the utility model should be covered in the protection scope of the utility model.

Claims

1. A heat-dissipating LED surface-mount package structure, characterized in that, Includes a substrate (1), a heat dissipation groove (2) is provided at the bottom end of the substrate (1), a recessed part (3) is formed at the top end of the substrate (1), and a positioning groove (4) is provided at the upper end of the recessed part (3). The bottom wall of the positioning groove (4) is provided with an installation groove (5). A chip fixing plate (6) is provided inside the installation groove (5). A light-emitting chip (7) is attached to the top of the chip fixing plate (6) by thermally conductive adhesive. A heat dissipation support foot (8) is provided at the bottom of the chip fixing plate (6). A protective lens (9) is provided on the top surface of the substrate (1). An auxiliary heat dissipation structure (10) is provided inside the heat dissipation groove (2).

2. The heat-dissipating LED surface-mount packaging structure according to claim 1, characterized in that, The heat dissipation structure includes a molding plate (1001), which is fixedly installed on the top wall of the heat dissipation groove (2). Several heat dissipation frames (1002) are provided at the bottom of the molding plate (1001), and the heat dissipation frames (1002) are hollow.

3. The heat-dissipating LED surface-mount packaging structure according to claim 2, characterized in that, The inner side wall of the positioning groove (4) is set with an inclined surface, and the depth of the positioning groove (4) is greater than the height of the light-emitting chip (7).

4. The heat-dissipating LED surface-mount packaging structure according to claim 3, characterized in that, The cavity formed by the positioning groove (4) and the bottom surface of the protective lens (9) is filled with heat-dissipating silicone (11), and the heat-dissipating silicone (11) is made of transparent silicone.

5. The heat-dissipating LED surface-mount packaging structure according to claim 4, characterized in that, The heat dissipation support (8) includes a heat-conducting plate (801), which is fixedly connected to the bottom surface of the chip fixing plate (6). The outer peripheral wall of the heat-conducting plate (801) is provided with a plurality of heat dissipation legs (802), and the heat dissipation legs (802) are inserted between two adjacent heat dissipation frames (1002).

6. The heat-dissipating LED surface-mount packaging structure according to claim 5, characterized in that, The chip mounting plate and heat dissipation support (8) are integrally formed and made of copper.

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