Thinning film pasting device of semiconductor wafer film pasting machine
By designing a detachable placement tray and carriage structure, the problem of poor compatibility of traditional wafer lamination devices with wafers of different diameters has been solved, enabling rapid adaptive adjustment and high-quality lamination.
Patent Information
- Application Number
- CN202423014090.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-07
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2034-12-07
AI Technical Summary
Traditional wafer mounting equipment uses fixed-size trays, resulting in extremely poor compatibility with wafers of different diameters and making it difficult to quickly adapt and adjust.
A detachable placement tray and carriage structure was designed. Combined with telescopic components, elastic components and pressure rollers, the placement tray can be quickly changed according to the wafer diameter through the cooperation of the drive component and the positioning slot. The uniform film application is achieved through the coordinated movement of the slide plate and carriage.
It improves the versatility and flexibility of the film application device, ensures the uniformity and stability of film application, reduces the risk of wafer damage, and improves the quality of film application.
Smart Images
Figure CN223957923U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the technical field of film pasting device, specifically point to semiconductor wafer film pasting machine thinning film pasting device. BACKGROUND
[0002] In the field of semiconductor manufacturing, wafer film pasting is a key process, with the continuous development of semiconductor technology, the precision, efficiency and protection requirements of wafer film pasting are increasing, in the processing flow of semiconductor wafer, the size specification of wafer is various.
[0003] The traditional wafer film pasting device often adopts fixed size placing disc, which leads to poor compatibility of the device when facing wafers of different diameters, and the equipment is difficult to quickly and conveniently adapt. UTILITY MODEL CONTENTS
[0004] The utility model solves the technical problem that the traditional wafer film pasting device often adopts fixed size placing disc, which leads to poor compatibility of the device when facing wafers of different diameters.
[0005] In order to realize the above function, the technical scheme adopted by the utility model is as follows: semiconductor wafer film pasting machine thinning film pasting device, including the supporting plate frame and the sliding frame, the supporting plate frame is detachably provided with a placing disc, the center of the placing disc is provided with a cutting groove, the sliding frame is slidably arranged on the two side walls of the supporting plate frame, the sliding frame is slidably provided with a sliding plate, the sliding plate and the sliding frame are provided with an extension piece, the bottom wall of the sliding plate is provided with an elastic piece, the bottom wall of the elastic piece is provided with a connecting seat, the connecting seat is rotatably provided with a film pressing roller.
[0006] Preferably, the bottom wall of the placing disc is provided with a groove, the side wall of the groove is provided with a clamping groove, the bottom wall of the supporting plate frame is provided with a driving piece, the driving piece is provided with a clamping plate, the top of the clamping plate is clamped into the clamping groove under the driving of the driving piece.
[0007] Preferably, the driving piece includes a double-headed screw rod and a limiting rod, the bottom wall of the supporting plate frame is provided with a supporting plate, the two ends of the double-headed screw rod are rotatably arranged on the supporting plate, the two ends of the limiting rod are arranged on the supporting plate, the clamping plate is slidably sleeved on the limiting rod, the clamping plate is threadedly connected with the screw rod, the side wall of the supporting plate is provided with a handle, the end of the handle is rotatably penetrated through the supporting plate and connected with the double-headed screw rod.
[0008] Preferably, the clamping plate is provided in an L-shaped structure.
[0009] Preferably, the elastic piece includes a telescopic rod and a spring, the two ends of the telescopic rod are respectively arranged between the bottom wall of the sliding plate and the top wall of the connecting seat, and the spring is sleeved on the telescopic rod.
[0010] Preferably, the two side walls of the support frame are provided with sliding grooves, sliding seats are arranged on the sliding grooves, and a screw rod and a sliding rod are arranged in the two sliding grooves respectively, both ends of the screw rod are rotatably arranged on the sliding grooves, one group of the sliding seats are threadedly connected with the screw rod, and the other group of the sliding seats are slidingly sleeved on the sliding rod, the bottom end of the sliding frame is fixedly arranged on the sliding seat, and the side wall of the support frame is provided with a driving motor, and an output end of the driving motor is rotatably arranged through the support frame and connected with the screw rod.
[0011] Preferably, the telescopic piece comprises an electric telescopic rod, a fixed end of the electric telescopic rod is arranged on the top wall of the sliding frame, and a movable end of the electric telescopic rod is slidingly arranged through the sliding frame and connected with the sliding plate.
[0012] The utility model discloses adopt above -mentioned structure and obtain beneficial effect as follows: through the coordination of sliding frame, sliding plate, telescopic piece and membrane roller, can be pasted on wafer with film, guarantee the uniformity and stability of pasting film, effectively improve the quality of pasting film, the setting of elastic part strengthens the buffer protection in pasting film process, reduces the damage risk to wafer, and the placing disc can be replaced according to the diameter of wafer, through the cooperation of driving part and clamping groove, the pasting film device is conveniently and quickly adjusted to adapt to wafers of different sizes, and the versatility and flexibility of the equipment are improved. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 It is the whole structure schematic of the utility model embodiment Figure 1 ;
[0014] Figure 2 It is the whole structure schematic of the utility model embodiment Figure 2 ;
[0015] Figure 3 It is the whole structure schematic of the utility model embodiment Figure 3 ;
[0016] Figure 4 It is the whole structure schematic of the utility model embodiment Figure 4 .
[0017] Among them, 1, support frame, 2, sliding frame, 3, placing disc, 4, cutting groove, 5, sliding plate, 6, telescopic piece, 7, elastic part, 8, connecting seat, 9, membrane roller, 10, recess, 11, clamping groove, 12, driving part, 13, clamping plate, 14, double head screw rod, 15, limiting rod, 16, support plate, 17, handle, 18, telescopic rod, 19, spring, 20, sliding groove, 21, sliding seat, 22, screw rod, 23, sliding rod, 24, driving motor. PREFERRED EMBODIMENT
[0018] The technical solutions of the present application will be described clearly and completely in connection with the drawings. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0019] In the description of the present application, it should be noted that the directions or position relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like are based on the directions or position relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as limiting the devices or elements indicated or implied to have a specific direction, structure and operation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. The present application will be further described in detail below in connection with the drawings.
[0020] As shown in Figures 1-4 The semiconductor wafer film laminating machine thinning film laminating device provided by the present application comprises a supporting plate frame 1 and a sliding frame 2, a placing disc 3 is detachably arranged on the supporting plate frame 1, a cutting groove 4 is arranged at the center of the placing disc 3, the sliding frame 2 is slidingly arranged on the two side walls of the supporting plate frame 1, a sliding plate 5 is slidingly arranged on the sliding frame 2, a telescopic piece 6 is arranged between the sliding plate 5 and the sliding frame 2, an elastic piece 7 is arranged on the bottom wall of the sliding plate 5, a connecting seat 8 is arranged on the bottom wall of the elastic piece 7, and a film pressing roller 9 is rotatably arranged between the connecting seats 8. The wafer is placed at the cutting center of the placing disc 3, the telescopic piece 6 is extended, the sliding plate 5 is driven to move downward, the film pressing roller 9 at the bottom of the sliding plate 5 is pressed on the placing disc 3, and the film is laminated on the wafer. At this time, the sliding frame 2 is slid, the film pressing roller 9 is rolled on the film on the wafer, and the elastic piece 7 is buffered to realize film lamination.
[0021] As shown in Figure 3 The bottom wall of the placing disc 3 is provided with a groove 10, the side wall of the groove 10 is provided with a clamping groove 11, the bottom wall of the supporting plate frame 1 is provided with a driving piece 12, the driving piece 12 is provided with a clamping plate 13, the clamping plate 13 is provided in an L-shaped structure, the top of the clamping plate 13 is clamped into the clamping groove 11 under the driving of the driving piece 12, the clamping plate 13 is clamped into or moved out of the clamping groove 11 by the driving piece 12, and at this time the placing disc 3 can be taken off from the supporting plate frame 1 to replace the placing disc 3 with the cutting groove 4 of the corresponding size according to the diameter of the wafer.
[0022] As shown in Figure 3As shown, the driving member 12 comprises a double-end screw rod 14 and a limiting rod 15, the bottom wall of the supporting plate frame 1 is provided with a supporting plate 16, the two ends of the double-end screw rod 14 are rotatably arranged on the supporting plate 16, the two ends of the limiting rod 15 are arranged on the supporting plate 16, the clamping plate 13 is slidably sleeved on the limiting rod 15, the clamping plate 13 is threadedly connected with the screw rod 22, the side wall of the supporting plate 16 is provided with a handle 17, the end of the handle 17 is rotatably penetrated through the supporting plate 16 and connected with the double-end screw rod 14, rotating the handle 17 drives the double-end screw rod 14 to rotate, and then the clamping plate 13 slides on the limiting rod 15 to drive the clamping plate 13 to move out of or enter the clamping slot 11.
[0023] As shown in Figure 4 , the elastic member 7 comprises a telescopic rod 18 and a spring 19, the two ends of the telescopic rod 18 are respectively arranged between the bottom wall of the sliding plate 5 and the top wall of the connecting seat 8, and the spring 19 is sleeved on the telescopic rod 18. By the spring 19 and the telescopic rod 18, the wafer is buffered and protected when the film pressing roller 9 presses the film.
[0024] As shown in Figure 1 and 4 , the two side walls of the supporting plate frame 1 are provided with sliding grooves 20, the sliding grooves 20 are slidably provided with sliding seats 21, and the two sliding grooves 20 are respectively provided with screw rods 22 and sliding rods 23, the two ends of the screw rod 22 are rotatably arranged on the sliding groove 20, one group of the sliding seats 21 is threadedly connected with the screw rod 22, and the other group of the sliding seats 21 is slidably sleeved on the sliding rod 23, the bottom end of the sliding frame 2 is fixedly arranged on the sliding seat 21, and the side wall of the supporting plate frame 1 is provided with a driving motor 24, the output end of the driving motor 24 is rotatably penetrated through the supporting plate frame 1 and connected with the screw rod 22.
[0025] As shown in Figure 1 and 4 , the telescopic member 6 comprises an electric telescopic rod 25, the fixed end of the electric telescopic rod 25 is arranged on the top wall of the sliding frame 2, the movable end of the electric telescopic rod 25 is slidably penetrated through the sliding frame 2 and connected with the sliding plate 5, and the electric telescopic rod 25 is extended, so that the sliding plate 5 is lowered, and the sliding plate 5 is lowered, so that the film pressing roller 9 is pressed and attached to the wafer.
[0026] In specific use, according to the diameter size of the wafer, the handle 17 is rotated, the handle 17 drives the double-end screw rod 14 to rotate, the clamping plate 13 slides on the limiting rod 15 and moves out of the clamping slot 11, so that the original placing disc 3 is taken off from the supporting plate frame 1, the placing disc 3 with the corresponding size cutting slot 4 is replaced, and the handle 17 is reversely rotated to make the clamping plate 13 enter the clamping slot 11 and fix the placing disc 3.
[0027] Then, the wafer is placed at the cutting center of the placing disc 3, the electric telescopic rod 25 is started, the electric telescopic rod 25 is extended, the slide plate 5 is driven to move downwards, the film pressing roller 9 at the bottom of the slide plate 5 is pressed on the placing disc 3, the film is covered on the wafer, then the driving motor 24 is started, the driving motor 24 drives the screw rod 22 to rotate, the slide block 21 is slid on the sliding groove 20, the slide block 2 is driven to move, the film pressing roller 9 on the slide block 2 is rolled on the film on the wafer, in the process, the elastic member 7 composed of the spring 19 and the telescopic rod 18 buffers, the film pasting operation is completed.
[0028] The above describes the utility model and its implementation mode, this kind of description has no limit, the embodiment of the utility model shown in the drawing is only one, the actual structure is not limited to this. In general, if the ordinary skilled person in the art is inspired, without departing from the utility model creation tenet, not creative design the structure mode and the embodiment similar to this technical scheme, all should belong to the protection scope of the utility model.
Claims
1. A semiconductor wafer film attaching and thinning device, characterized by comprising: a film attaching device; a film thinning device; and a wafer transfer device. The utility model provides a wafer placing device, including the tray frame (1) and the slide (2), the tray frame is detachably equipped with the placing disc (3) on, the center of placing disc (3) is equipped with cutting groove (4), according to the wafer of different size replacement has corresponding cutting groove (4) of placing disc, The slide (2) is slidably arranged on the two side walls of the tray frame (1), the slide (2) is slidably arranged with a slide plate (5), the slide plate (5) and the slide (2) are provided with a telescopic piece (6), the bottom wall of the slide plate (5) is provided with an elastic piece (7), the bottom wall of the elastic piece (7) is provided with a connecting seat (8), the connecting seat (8) is rotatably arranged with a film pressing roller (9).
2. The semiconductor wafer film laminating and thinning device of claim 1, wherein: The bottom wall of the placing disc (3) is provided with a groove (10), the side wall of the groove (10) is provided with a clamping groove (11), the bottom wall of the tray frame (1) is provided with a driving piece (12), the driving piece (12) is provided with a clamping plate (13), the top of the clamping plate (13) is clamped into the clamping groove (11) under the drive of the driving piece (12).
3. The semiconductor wafer film laminating and thinning device of claim 2, wherein: The driving piece (12) includes a double-end screw (14) and a limiting rod (15), the bottom wall of the tray frame (1) is provided with a support plate (16), the two ends of the double-end screw (14) are rotatably arranged on the support plate (16), the two ends of the limiting rod (15) are arranged on the support plate (16), the clamping plate (13) is slidably sleeved on the limiting rod (15), the clamping plate (13) is threadedly connected with the screw (22), the side wall of the support plate (16) is provided with a handle (17), the end of the handle (17) is rotatably penetrated through the support plate (16) and connected with the double-end screw (14).
4. The semiconductor wafer film laminating and thinning device of claim 2, wherein: The clamping plate (13) is provided in an L-shaped structure.
5. The semiconductor wafer dicing and film attaching apparatus of claim 1, wherein: The elastic piece (7) includes a telescopic rod (18) and a spring (19), the two ends of the telescopic rod (18) are respectively arranged between the bottom wall of the slide plate (5) and the top wall of the connecting seat (8), and the spring (19) is sleeved on the telescopic rod (18).
6. The semiconductor wafer dicing and film attaching apparatus of claim 1, wherein: The two side walls of the tray frame (1) are provided with a sliding groove (20), the sliding groove (20) is slidably provided with a sliding seat (21), and the two sliding grooves (20) are respectively provided with a screw (22) and a sliding rod (23), the two ends of the screw (22) are rotatably arranged on the sliding groove (20), one group of the sliding seat (21) is threadedly connected with the screw (22), the other group of the sliding seat (21) is slidably sleeved on the sliding rod (23), the bottom end of the slide (2) is fixedly arranged on the sliding seat (21), and the side wall of the tray frame (1) is provided with a driving motor (24), the output end of the driving motor (24) is rotatably penetrated through the tray frame (1) and connected with the screw (22).
7. The semiconductor wafer dicing and film attaching apparatus of claim 1, wherein: The telescopic piece (6) includes an electric telescopic rod (18), the fixed end of the electric telescopic rod (18) is arranged on the top wall of the slide (2), and the movable end of the electric telescopic rod (18) is slidably penetrated through the slide (2) and connected with the slide plate (5).