Final wafer cleaning device

Abstract

The utility model discloses a final wafer cleaning device which comprises a cleaning table, a machine table and a cleaning mechanism. The cleaning table is circular and is rotationally arranged, and a plurality of placing positions are sequentially arranged at the upper end of the cleaning table along the edge of the cleaning table; the plurality of placing positions are independently arranged through separation of partition plates; a feeding station, at least two cleaning stations and a discharging station are sequentially arranged on the outer side of the cleaning table in a circle, and the cleaning stations are provided with machine tables. The cleaning mechanism capable of extending to the cleaning position for cleaning is arranged on the machine table, the wafer is placed on the cleaning table, the wafer is sequentially moved to different cleaning mechanisms of different machine tables for cleaning through rotation of the cleaning table, the wafer does not need to be transferred through independent equipment, and the risk that the wafer is polluted again is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cleaning technical field, concretely relate to a wafer final cleaning device. BACKGROUND

[0002] When completing final polishing, the wafer needs to be cleaned to remove organic matter, particles and metal and other impurities.

[0003] In the invention patent with the publication number "CN109326501A", a kind of semiconductor wafer final polishing after cleaning method is disclosed, using the cleaning fluid including oxidizing reagent to clean the wafer;Using acidic cleaning fluid to clean the wafer;Using the cleaning fluid including oxidizing reagent to clean the wafer again.

[0004] The above-mentioned patent needs to use different cleaning agents to clean the wafer respectively, but in the single wafer cleaning machine in the prior art, only one cleaning agent can be used for cleaning in turn, if different cleaning agents are used for multiple cleaning, multiple cleaning equipment is needed, when the wafer is transferred between multiple equipment, the wafer is easy to be polluted again. UTILITY MODEL CONTENTS

[0005] In order to solve the above-mentioned deficiencies in the prior art, the utility model provides a kind of wafer final cleaning device.

[0006] In order to realize the above-mentioned technical effect, the utility model adopts the following scheme:

[0007] A kind of wafer final cleaning device, including cleaning table, machine table and cleaning mechanism;

[0008] The cleaning table is circular and rotationally arranged, and a plurality of placing positions are sequentially arranged on the upper end of the cleaning table along the edge thereof;Multiple placing positions are independently arranged by partition.

[0009] The outer side of the cleaning table is sequentially provided with a feeding position, at least two cleaning positions and a discharging position, and the cleaning position is provided with a machine table.

[0010] The machine table is provided with a cleaning mechanism that can extend to the cleaning position for cleaning, the cleaning mechanism includes a first connecting rod, a second connecting rod, a cleaning roller and a water jet pipe, one end of the first connecting rod is rotatably mounted on the machine table by a first rotating shaft, one end of the second connecting rod is rotatably connected to the other end of the first connecting rod by a second rotating shaft, the cleaning roller is rotatably mounted on the other end of the second connecting rod by a third rotating shaft, the first connecting rod, the second connecting rod and the cleaning roller are driven to rotate by a first driving mechanism, a second driving mechanism and a third driving mechanism respectively, and the water jet pipe is arranged on the second connecting rod and faces the cleaning roller.

[0011] Preferably, the number of the partitions is several, the partitions are vertically arranged, one side of the several partitions is sealingly connected to the center of the cleaning table, the other side of the several partitions respectively extends to the edge of the cleaning table along the radial direction of the cleaning table, a placing position is arranged between two adjacent partitions, and the several partitions are distributed at equal angles.

[0012] Preferably, the first driving mechanism comprises a first motor arranged on the machine table, the output end of the first motor is provided with a first gear, the first rotating shaft is fixedly connected with a first connecting rod, and the first connecting rod is fixedly provided with a second gear which is meshingly connected with the first gear.

[0013] Preferably, the second driving mechanism comprises a second motor arranged on the machine table, the output end of the second motor is provided with a first sprocket, the first rotating shaft is rotatably provided with a double sprocket, the second rotating shaft is fixedly connected with a second connecting rod, the second connecting rod is fixedly provided with a second sprocket, and the first sprocket, the double sprocket and the second sprocket are sequentially transmissionally connected through a first chain and a second chain.

[0014] Preferably, the third driving mechanism comprises a third motor arranged on the machine table, the output end of the third motor is provided with a first synchronous wheel, the first rotating shaft is rotatably provided with a first double synchronous wheel, the second rotating shaft is rotatably provided with a second double synchronous wheel, the third rotating shaft is fixedly connected with the cleaning roller, the third rotating shaft is rotatably provided with a second synchronous wheel, and the first synchronous wheel, the first double synchronous wheel, the second double synchronous wheel and the second synchronous wheel are sequentially transmissionally connected through a first synchronous belt, a second synchronous belt and a third synchronous belt.

[0015] Preferably, the lower end of the cleaning table is provided with a supporting column, and the cleaning table is rotatably arranged on the supporting column and driven to rotate by a fourth motor.

[0016] Compared with the prior art, the beneficial effects are:

[0017] The wafer is placed on the cleaning table, and is sequentially moved to different cleaning mechanisms of different machine tables through rotation of the cleaning table, so that the wafer does not need to be transferred through independent equipment, and the risk of wafer recontamination is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a top view schematic diagram of the utility model.

[0019] Figure 2 is a top view schematic diagram of the cleaning mechanism in the utility model.

[0020] Figure 3 is a side view schematic diagram of the cleaning mechanism in the utility model.

[0021] 1, cleaning table; 2, placing position; 3, partition; 4, machine table; 5, first connecting rod; 6, second connecting rod; 7, cleaning roller; 8, water spraying pipe; 9, first rotating shaft; 10, second rotating shaft; 11, third rotating shaft; 12, second gear; 13, first gear; 14, first motor; 15, second motor; 16, first sprocket; 17, double sprocket; 18, second sprocket; 19, third motor; 20, first synchronous wheel; 21, first double synchronous wheel; 22, second double synchronous wheel; 23, second synchronous wheel. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments.

[0023] A wafer final cleaning device comprises a cleaning table 1, a machine table 4 and a cleaning mechanism.

[0024] The cleaning table 1 is circular and rotationally arranged, and a plurality of placing positions 2 are sequentially arranged on the upper end of the cleaning table 1 along the edge thereof; the plurality of placing positions 2 are independently arranged by being separated by partitions 3.

[0025] A loading position, at least two cleaning positions and a discharging position are sequentially arranged on the outer side of the cleaning table 1, and the cleaning positions are provided with the machine table 4.

[0026] The machine table 4 is provided with a cleaning mechanism capable of extending to the cleaning positions for cleaning, and the cleaning mechanism comprises a first connecting rod 5, a second connecting rod 6, a cleaning roller 7 and a water spraying pipe 8; one end of the first connecting rod 5 is rotatably mounted on the machine table 4 by a first rotating shaft 9; one end of the second connecting rod 6 is rotatably connected to the other end of the first connecting rod 5 by a second rotating shaft 10; the cleaning roller 7 is rotatably mounted on the other end of the second connecting rod 6 by a third rotating shaft 11; the first connecting rod 5, the second connecting rod 6 and the cleaning roller 7 are respectively driven to rotate by a first driving mechanism, a second driving mechanism and a third driving mechanism; and the water spraying pipe 8 is arranged on the second connecting rod 6 and faces the cleaning roller 7.

[0027] The wafer is placed in the placing position 2 on the cleaning table 1 at the loading position, and then the wafer is intermittently sequentially rotated to different cleaning positions by the rotation of the cleaning table 1; the wafer is cleaned by corresponding cleaning at the cleaning position; and the cleaning agents sprayed by the water spraying pipes 8 of different cleaning mechanisms are different.

[0028] Since the wafer is sequentially moved to different cleaning mechanisms of different machine tables 4 by the rotation of the cleaning table 1 for cleaning, the wafer does not need to be transferred by independent equipment, thereby reducing the risk of recontamination of the wafer.

[0029] By rotating the first connecting rod 5 and the second connecting rod 6, the cleaning roller 7 can be moved to the wafer surface for rotating cleaning.

[0030] Preferably, the number of the partition plates 3 is several, the partition plates 3 are vertically arranged, one side of the several partition plates 3 is sealingly connected to the center of the cleaning table 1, the other side of the several partition plates 3 respectively extends to the edge of the cleaning table 1 along the radial direction of the cleaning table 1, the placing positions 2 are arranged between the adjacent two partition plates 3, and the partition plates 3 are distributed at equal angles.

[0031] The different placing positions 2 are independently separated by the partition plates 3, so that cross contamination between different cleaning agents during cleaning can be avoided, and the cleaned cleaning agent can not flow to the wafer after cleaning, thereby avoiding pollution.

[0032] Preferably, the first driving mechanism comprises a first motor 14 arranged on the machine table 4, the output end of the first motor 14 is provided with a first gear 13, the first rotating shaft 9 is fixedly connected with the first connecting rod 5, and the first connecting rod 5 is fixedly provided with a second gear 12 which is meshingly connected with the first gear 13.

[0033] The first motor 14 drives one end of the first connecting rod 5 to rotate on the machine table 4 through the first gear 13 and the second gear 12.

[0034] Preferably, the second driving mechanism comprises a second motor 15 arranged on the machine table 4, the output end of the second motor 15 is provided with a first sprocket 16, the first rotating shaft 9 is rotatably provided with a double sprocket 17, the second rotating shaft 10 is fixedly connected with the second connecting rod 6, the second connecting rod 6 is fixedly provided with a second sprocket 18, and the first sprocket 16, the double sprocket 17 and the second sprocket 18 are sequentially connected through a first chain and a second chain.

[0035] The second motor 15 drives one end of the second connecting rod 6 to rotate on the first connecting rod 5 through the first chain and the second chain.

[0036] Preferably, the third driving mechanism comprises a third motor 19 arranged on the machine table 4, the output end of the third motor 19 is provided with a first synchronous wheel 20, the first rotating shaft 9 is rotatably provided with a first double synchronous wheel 21, the second rotating shaft 10 is rotatably provided with a second double synchronous wheel 22, the third rotating shaft 11 is fixedly connected with the cleaning roller 7, the third rotating shaft 11 is provided with a rotating second synchronous wheel 23, and the first synchronous wheel 20, the first double synchronous wheel 21, the second double synchronous wheel 22 and the second synchronous wheel 23 are sequentially connected through a first synchronous belt, a second synchronous belt and a third synchronous belt.

[0037] The third motor 19 drives the cleaning roller 7 to rotate through the first synchronous belt, the second synchronous belt and the third synchronous belt.

[0038] Preferably, the lower end of the cleaning table 1 is provided with a support column, and the cleaning table 1 is rotatably installed on the support column and driven to rotate by a fourth motor.

[0039] In the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0040] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0041] Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

Claims

1. A wafer final cleaning apparatus, characterized by, The utility model relates to a cleaning device, including cleaning platform (1), machine table (4) and cleaning mechanism, The cleaning platform (1) is circular and rotationally arranged, and a plurality of placing positions (2) are sequentially arranged along the edge of the upper end of the cleaning platform (1); the plurality of placing positions (2) are independently arranged by the partition plates (3). The outer side of the cleaning platform (1) is sequentially provided with a feeding position, at least two cleaning positions and a discharging position, and the cleaning positions are provided with the machine table (4). The machine table (4) is provided with a cleaning mechanism capable of extending to the cleaning position for cleaning, the cleaning mechanism comprises a first connecting rod (5), a second connecting rod (6), a cleaning roller (7) and a water spraying pipe (8), one end of the first connecting rod (5) is rotatably mounted on the machine table (4) through a first rotating shaft (9), one end of the second connecting rod (6) is rotatably connected to the other end of the first connecting rod (5) through a second rotating shaft (10), the cleaning roller (7) is rotatably mounted on the other end of the second connecting rod (6) through a third rotating shaft (11), the first connecting rod (5), the second connecting rod (6) and the cleaning roller (7) are driven to rotate by a first driving mechanism, a second driving mechanism and a third driving mechanism respectively, and the water spraying pipe (8) is arranged on the second connecting rod (6) and faces the cleaning roller (7).

2. The wafer final cleaning apparatus of claim 1, wherein The partition plates (3) are arranged on the side, and one side of the plurality of partition plates (3) is sealingly connected to the center of the cleaning platform (1), the other side of the plurality of partition plates (3) extends to the edge of the cleaning platform (1) along the radial direction of the cleaning platform (1), and the adjacent two partition plates (3) are used for arranging the placing positions (2), and the plurality of partition plates (3) are distributed at equal angles.

3. The wafer final cleaning apparatus of claim 1, wherein The first driving mechanism comprises a first motor (14) arranged on the machine table (4), the output end of the first motor (14) is provided with a first gear (13), the first rotating shaft (9) is fixedly connected with the first connecting rod (5), and the first connecting rod (5) is fixedly provided with a second gear (12) meshedly connected with the first gear (13).

4. The wafer final cleaning apparatus of claim 1, wherein The second driving mechanism comprises a second motor (15) arranged on the machine table (4), the output end of the second motor (15) is provided with a first sprocket (16), the first rotating shaft (9) is rotatably provided with a double sprocket (17), the second rotating shaft (10) is fixedly connected with the second connecting rod (6), the second connecting rod (6) is fixedly provided with a second sprocket (18), and the first sprocket (16), the double sprocket (17) and the second sprocket (18) are sequentially connected through a first chain and a second chain.

5. The wafer final cleaning apparatus of claim 1, wherein The third driving mechanism comprises a third motor (19) arranged on the machine table (4), the output end of the third motor (19) is provided with a first synchronous wheel (20), the first rotating shaft (9) is rotatably provided with a first double synchronous wheel (21), the second rotating shaft (10) is rotatably provided with a second double synchronous wheel (22), the third rotating shaft (11) is fixedly connected with the cleaning roller (7), the third rotating shaft (11) is rotatably provided with a second synchronous wheel (23), and the first synchronous wheel (20), the first double synchronous wheel (21), the second double synchronous wheel (22) and the second synchronous wheel (23) are sequentially connected through a first synchronous belt, a second synchronous belt and a third synchronous belt.

6. The wafer final cleaning apparatus of claim 1, wherein The lower end of the cleaning table (1) is provided with a supporting column, the cleaning table (1) is rotatably arranged on the supporting column and is driven to rotate through a fourth motor.

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