Semiconductor wafer boat with adjustable placing grooves

Abstract

The utility model relates to the technical field of crystal boats, and discloses a semiconductor crystal boat with an adjustable placing groove, which comprises a box body, the box body is provided with the placing groove, a plurality of mutually parallel first partition plates are fixed in the placing groove, the plurality of first partition plates are arranged in a row, and a boat groove is formed by two adjacent first partition plates and the box body; a second partition plate parallel to the first partition plate is arranged in each boat groove in a sliding mode, and each second partition plate divides the corresponding boat groove into a first boat groove and a second boat groove which are variable in groove width. A driving mechanism is mounted on the box body and is in transmission connection with all the second partition plates. According to the utility model, the second partition plate divides the boat groove into the first boat groove and the second boat groove with variable groove widths, and the driving mechanism drives the first boat groove and the second boat groove to place wafers with different thicknesses, so that the space of the boat groove is effectively utilized, the utilization rate of the effective space of semiconductor manufacturing equipment is improved, the number of wafers stored in the wafer boat is increased, and the production efficiency is improved. The capacity utilization of equipment is further improved, and the effects of reducing cost and increasing efficiency are achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of crystal boat technology, especially to a semiconductor crystal boat with adjustable placing groove. BACKGROUND

[0002] The semiconductor crystal boat is a tool commonly used in the process of manufacturing semiconductor integrated circuits, and is mainly used for carrying, conveying, cleaning and processing chips. The crystal boat functions like a transport tool, ensuring the smooth flow of chips in the complex manufacturing process.

[0003] The utility model discloses a crystal boat box, including two side plates, the two side plates are equipped with wafer clamping groove respectively, the rear end of wafer clamping groove is opposite and is curved and forms the retraction of the mouth, and the front end of two side plates is equipped with the ear plate respectively.

[0004] Based on the above technical features, the problem is that the current boat groove width is a fixed value, but when the chip is thin, a wider boat groove is not needed, which wastes the effective space of the semiconductor manufacturing equipment.

[0005] Therefore, it is necessary to solve the above problems by a semiconductor crystal boat with an adjustable placing groove. UTILITY MODEL CONTENTS

[0006] The utility model discloses a semiconductor crystal boat with an adjustable placing groove to solve the problems raised in the background art.

[0007] To achieve the above object, the utility model provides the following technical scheme: a semiconductor crystal boat with an adjustable placing groove, including the box body, the box body is set up and places the groove, places the groove and is fixedly set up a plurality of parallel first baffle, a plurality of first baffle form a row, and the common composition one boat groove is formed with the box body between two first baffles of adjacent two first baffles;Each boat groove is slidably provided with a second baffle parallel to the first baffle, and each second baffle divides the boat groove into a boat groove one and a boat groove two with variable groove width;The driving mechanism is installed on the box body, and the driving mechanism is drivingly connected to all second baffles.

[0008] Preferably, the driving mechanism includes a lead screw, the lead screw is located in the placing groove and the lead screw is rotatably connected to the box body;The lead screw penetrates all first baffles and second baffles in the direction perpendicular to the first baffle;The lead screw is threadedly connected with the second baffle, and each second baffle is limitingly and slidably connected with the box body.

[0009] Preferably, a circular through hole is formed in the first baffle, the lead screw penetrates the circular through hole coaxially, and the inner diameter of the circular through hole is greater than the diameter of the lead screw.

[0010] Preferably, a guide rod is fixedly arranged on the box body, and the guide rod penetrates all the first partitions and the second partitions; each first partition is fixedly connected with the guide rod, and each second partition is in limited sliding fit with the guide rod.

[0011] Preferably, one end of the lead screw penetrates the box body, and a knob is fixedly arranged on the end of the lead screw penetrating the box body.

[0012] Preferably, the placing groove on the box body is a V-shaped groove, and the lead screw is located at the groove bottom of the V-shaped groove, and the first partition and the second partition are matched with the V-shaped groove.

[0013] The technical effects and advantages of the utility model are as follows: the second partition divides the boat groove into the boat groove one and the boat groove two with variable groove width, the boat groove one and the boat groove two can place wafers with different thicknesses by the driving mechanism, the space of the boat groove is effectively utilized, the utilization rate of the effective space of the semiconductor manufacturing equipment is improved, the number of wafers stored in the boat is increased, the equipment capacity utilization is further improved, and the effect of reducing cost and increasing efficiency is achieved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0015] Figure 2 It is a driving mechanism schematic view of the utility model;

[0016] Figure 3 It is a box body partial schematic view of the utility model;

[0017] Figure 4 It is the A place of the utility model Figure 1 enlarged schematic view.

[0018] In the drawing: 1, box body; 2, lead screw; 3, knob; 4, first partition; 5, second partition; 6, guide rod; 7, boat groove. DETAILED DESCRIPTION

[0019] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments, based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the protection scope of the utility model.

[0020] The utility model provides a Figures 1 to 4The application discloses a semiconductor wafer boat with adjustable placing grooves.

[0021] The plurality of first partitions 4 are arranged in a row, and two adjacent first partitions 4 together with the box body 1 form a boat groove 7.

[0022] Each second partition 5 divides the boat groove 7 into a boat groove one and a boat groove two with variable groove widths, so that two wafers with different sizes can be placed in the boat groove 7.

[0023] The driving mechanism is located at the groove bottom of the placing groove, and the driving mechanism is in transmission connection with all the second partitions 5.

[0024] Each first partition 4 is provided with a circular perforation, and the screw rod 2 is coaxially penetrated through the circular perforation.

[0025] The box body 1 is fixedly provided with two parallel guide rods 6, and the two guide rods 6 are parallel to and symmetrically arranged about the screw rod 2.

[0026] One end of the screw rod 2 is penetrated out of the box body 1, and the end of the screw rod 2 penetrated out of the box body 1 is fixedly provided with a knob 3.

[0027] Working principle: when in use, the knob 3 is twisted according to the sizes of the two wafers, and the knob 3 drives all the second partitions 5 to synchronously slide.

[0028] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. A semiconductor boat with adjustable placement slots, comprising a box body (1), characterized in that: The box (1) is provided with a placing groove, a plurality of first partitions (4) are fixedly arranged in the placing groove and are parallel to each other, the plurality of first partitions (4) are arranged in a row, and two adjacent first partitions (4) and the box (1) together form a boat groove (7); a second partition (5) parallel to the first partition (4) is slidably arranged in each boat groove (7), and each second partition (5) divides the boat groove (7) into a boat groove one and a boat groove two with variable groove widths; a driving mechanism is installed on the box (1), and the driving mechanism is drivingly connected to all the second partitions (5).

2. The semiconductor boat of claim 1, wherein: The driving mechanism comprises a lead screw (2), the lead screw (2) is located in the placing groove and is rotationally connected to the box (1); the lead screw (2) penetrates all the first partitions (4) and the second partitions (5) in a direction perpendicular to the first partitions (4); the lead screw (2) is threadedly connected to the second partitions (5), and each second partition (5) is limitingly and slidably connected to the box (1).

3. The semiconductor boat of claim 2, wherein: A circular perforation is formed in the first partition (4), and the lead screw (2) coaxially penetrates the circular perforation; the inner diameter of the circular perforation is greater than the diameter of the lead screw (2).

4. The semiconductor boat of claim 2, wherein: A guide rod (6) is fixedly arranged on the box (1) and penetrates all the first partitions (4) and the second partitions (5); each first partition (4) is fixedly connected to the guide rod (6), and each second partition (5) is limitingly and slidably connected to the guide rod (6).

5. The adjustable placement slot semiconductor boat of claim 2, wherein: One end of the lead screw (2) penetrates the box (1), and a knob (3) is fixedly arranged on the end of the lead screw (2) penetrating the box (1).

6. The semiconductor boat of claim 2, wherein: The placing groove on the box (1) is a V-shaped groove, the lead screw (2) is located at the groove bottom of the V-shaped groove, and the first partitions (4) and the second partitions (5) are matched with the V-shaped groove.

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