Cooling plate for multi-chip heat dissipation
By designing wavy or strip-shaped cooling grooves and aluminum or copper substrates on the multi-chip heat dissipation cooling plate, the problems of uneven heat dissipation and increased energy consumption of multi-chips are solved, achieving efficient and uniform heat dissipation and cost reduction.
Patent Information
- Application Number
- CN202520581161.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-03-31
AI Technical Summary
During multi-chip heat dissipation, the temperature of some chips becomes too high, leading to an increase in coolant temperature and energy consumption, as well as uneven heat dissipation.
Design a cooling plate for multi-chip heat dissipation. Multiple sets of cooling grooves are formed on the substrate surface. The cooling grooves are divided into upstream and downstream, with more downstream grooves than upstream grooves. The grooves are wavy or strip-shaped to increase the contact area between the coolant and the chip. Aluminum or copper materials are used to improve heat dissipation efficiency.
It improves the heat dissipation uniformity of each chip, reduces energy consumption caused by the rise in coolant temperature, avoids leakage, achieves efficient and uniform heat dissipation, and reduces costs.
Smart Images
Figure CN223957962U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of chip heat dissipation, especially a cooling plate for multi-chip heat dissipation. BACKGROUND
[0002] The cooling liquid flows in the cooling plate, thereby being capable of efficiently dissipating heat of the chips on the surface of the cooling plate.
[0003] However, in the process of dissipating heat of the multiple chips, the heat dissipation of some chips is insufficient, which leads to excessively high temperature of some chips and reduces the temperature of the cooling liquid, thereby increasing the energy consumption of the refrigeration of the cooling liquid. SUMMARY
[0004] In view of the above problems of the prior art, the utility model aims to provide a cooling plate for multi-chip heat dissipation, which can improve the uniformity of heat dissipation of each chip and reduce the cost.
[0005] In order to solve the above problems, the utility model provides a cooling plate for multi-chip heat dissipation, which comprises:
[0006] A substrate is formed with a first surface and a second surface opposite to each other, the first surface of the substrate is used for connecting chips, the second surface of the substrate is formed with a plurality of groups of cooling grooves, one group of cooling grooves corresponds to one chip, the substrate is formed with liquid inlet holes and liquid outlet holes for the entry and exit of cooling liquid, each group of cooling grooves comprises a plurality of cooling grooves which are spaced apart along the transverse direction and extend along the longitudinal direction, the cooling grooves are formed into first cooling grooves located upstream and second cooling grooves located downstream based on the flow direction of the cooling liquid, the number of the first cooling grooves in each group of the first cooling grooves is less than the number of the second cooling grooves in each group of the second cooling grooves;
[0007] A sealing plate is connected to the second surface of the substrate to seal the cooling grooves.
[0008] Further, the cooling grooves are formed in a wave shape or a strip shape.
[0009] Further, the cooling grooves are formed in a wave shape and comprise a plurality of continuous curved groove groups.
[0010] Further, the curved grooves are formed in an arc shape, a triangular shape or a "U" shape.
[0011] Further, the widths of the curved grooves constituting a single cooling groove are equal.
[0012] Further, along the flow direction of the cooling liquid, the widths of the openings of the curved grooves gradually decrease in a single cooling groove.
[0013] Further, the top end and the bottom end of the opening of each of the curved grooves constituting the single cooling groove are flush.
[0014] Further, the substrate comprises:
[0015] The first connecting groove is transversely arranged, and one end of the transverse direction of the first connecting groove is communicated with the liquid inlet hole;
[0016] The plurality of groups of first cooling grooves are longitudinally connected to one side of the middle part of the substrate of the longitudinal direction of the first connecting groove;
[0017] The plurality of groups of second cooling grooves are longitudinally connected to the second end of the longitudinal direction of the plurality of groups of first cooling grooves;
[0018] The second connecting groove is transversely arranged, and one end of the transverse direction of the second connecting groove is communicated with the liquid outlet hole, and one side of the middle part of the substrate of the longitudinal direction of the second connecting groove is connected to the second end of the longitudinal direction of the plurality of groups of second cooling grooves.
[0019] Further, the second end of the longitudinal direction of each of the first cooling grooves is connected to the first end of the longitudinal direction of two groups of the second cooling grooves.
[0020] Further, the substrate and the sealing plate are formed into an aluminum plate or a copper plate.
[0021] Due to the above technical scheme, the utility model has the following beneficial effects:
[0022] According to the cooling plate for multi-chip heat dissipation, the first surface of the substrate is connected with the plurality of chips, so that the plurality of chips can be synchronously cooled. The second surface of the substrate forms a plurality of groups of cooling grooves corresponding to the plurality of chips one by one. Based on the flow direction of the cooling liquid, the cooling grooves are divided into first cooling grooves located at the upstream and second cooling grooves located at the downstream. The number of the first cooling grooves in each group of the first cooling grooves located at the upstream is less than the number of the second cooling grooves in each group of the second cooling grooves located at the downstream. Thus, the contact area of the second cooling grooves of the downstream group with the cooling liquid is increased, the heat dissipation efficiency is improved, the situation that the cooling efficiency decreases due to the temperature rise of the cooling liquid during the process of flowing from the upstream to the downstream is compensated, the uniformity of heat dissipation for each chip is improved, the situation that the temperature of the cooling liquid is reduced and the energy consumption is increased is avoided, and the cost can be reduced. The sealing plate covers the second surface of the substrate, and liquid leakage can be avoided. BRIEF DESCRIPTION OF DRAWINGS
[0023] In order to make the technical scheme of the present application clearer, the following will briefly introduce the drawings needed in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.
[0024] Figure 1 is a structural diagram of a substrate according to an embodiment of the present application;
[0025] Figure 2 is Figure 1 a top view of the substrate of the embodiment;
[0026] Figure 3 is Figure 2 an enlarged view of the A area in the above;
[0027] Figure 4 is a structural diagram of a cooling plate according to an embodiment of the present application.
[0028] Reference signs:
[0029] 100, substrate; 111, first connecting groove; 112, second connecting groove; 121, first cooling groove; 122, second cooling groove; 131, liquid inlet hole; 132, liquid outlet hole; 200, sealing plate; 300, chip. DETAILED DESCRIPTION
[0030] In order to make the technical scheme of the present application clearer, the following will briefly introduce the drawings needed in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.
[0031] It should be noted that the terms "first", "second", and the like in the description and claims of the present application and the above drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion.
[0032] Next, the cooling plate for multi-chip heat dissipation of the embodiment of the present application is described.
[0033] AsFigures 1 to 4 The cooling plate for multi-chip heat dissipation includes a substrate 100 and a sealing plate 200.
[0034] Firstly, the substrate 100 is described. The substrate 100 is formed with a first surface and a second surface opposite to each other, the first surface of the substrate 100 is used for connecting chips 300, the second surface of the substrate 100 is formed with a plurality of groups of cooling grooves, one group of cooling grooves corresponds to one chip 300, the substrate 100 is formed with a liquid inlet hole 131 and a liquid outlet hole 132 for the cooling liquid to flow in and out, each group of cooling grooves includes a plurality of cooling grooves which are spaced apart along the transverse direction and extend along the longitudinal direction, the cooling grooves are formed into first cooling grooves 121 located upstream and second cooling grooves 122 located downstream based on the flow direction of the cooling liquid, and the number of the first cooling grooves 121 in each group of the first cooling grooves 121 is less than the number of the second cooling grooves 122 in each group of the second cooling grooves 122.
[0035] As shown in Figure 1 and Figure 4 The first surface of the substrate 100 is connected with six chips 300, and the second surface of the substrate 100 is correspondingly formed with six groups of cooling grooves. Based on the flow direction of the cooling liquid (from the liquid inlet hole 131 to the liquid outlet hole 132), there are two groups of the first cooling grooves 121 located upstream and four groups of the second cooling grooves 122 located downstream.
[0036] The number of the first cooling grooves 121 in each group of the first cooling grooves 121 located upstream is less than the number of the second cooling grooves 122 in each group of the second cooling grooves 122 located downstream, so as to increase the contact area of the second cooling grooves 122 of the downstream group with the cooling liquid, improve the heat dissipation efficiency, compensate for the situation that the cooling efficiency decreases due to the temperature rise of the cooling liquid during the process that the cooling liquid flows from upstream to downstream, and thus improve the uniformity of heat dissipation for each chip 300.
[0037] The cooling grooves are formed in a wave shape or a strip shape.
[0038] Then, the sealing plate 200 is described. The sealing plate 200 connects the second surface of the substrate 100 to seal the cooling grooves.
[0039] The sealing plate 200 covers the second surface of the substrate 100, which can avoid liquid leakage. The sealing plate 200 can be connected with the substrate 100 by brazing.
[0040] The first surface of the substrate 100 is connected with the plurality of chips 300, so that the plurality of chips 300 can be synchronously cooled.
[0041] In some embodiments of the utility model, the cooling groove is formed in a wavy shape and comprises a plurality of continuous curved grooves.
[0042] As shown in Figure 1 and Figure 2 , the cooling groove can increase the lateral swing of the cooling liquid, increase the lateral heat dissipation while the longitudinal heat dissipation, and increase the uniformity of heat dissipation.
[0043] Further, the curved groove is formed in an arc shape, a triangular shape or a "U" shape.
[0044] As shown in Figure 1 , the curved groove is formed in an arc shape, a triangular shape or a "U" shape.
[0045] As shown in Figure 3 , the curved groove is formed in an arc shape. The opening of the curved groove in the arc shape, the "U" shape or the triangular shape is regular, so that the flow of the cooling liquid is smoother.
[0046] Further, the width of each curved groove constituting a single cooling groove is equal.
[0047] The width of the curved groove is consistent, the flow of the curved groove is smoother, the flow resistance is relatively low, and the heat dissipation is more uniform.
[0048] Further, along the flow direction of the cooling liquid, the width of the opening of the curved groove gradually decreases in a single cooling groove.
[0049] As shown in Figure 3As shown, along the flow direction of the coolant (from bottom to top), the coolant sequentially passes through curved grooves a, b, c, d, and e, with the opening width of the curved grooves gradually decreasing (a>b>c>d>e). During the flow of the coolant through these grooves, the temperature gradually increases, and the cooling efficiency gradually decreases. In this application, the lower the opening width of the curved grooves, the more numerous the curved grooves become along the coolant flow direction, resulting in a gradually increasing contact area with the coolant and improved cooling efficiency. Based on the gradual temperature increase of the coolant during the cooling process of chip 300, increasing the contact area of the coolant offsets the decrease in cooling efficiency caused by the temperature rise, thereby improving the uniformity of heat dissipation for each chip 300.
[0050] Furthermore, the top and bottom ends of the openings of the individual curved grooves that make up a single cooling groove are flush.
[0051] The top and bottom of the openings of the curved grooves that make up a single cooling groove are flush, which makes the lateral oscillation of the coolant consistent and increases the uniformity of heat dissipation.
[0052] In some embodiments of this utility model, the substrate 100 includes a first connecting groove 111, multiple sets of first cooling grooves 121, multiple sets of second cooling grooves 122, and a second connecting groove 112. The first connecting groove 111 is arranged laterally, and one of its lateral ends communicates with a liquid inlet hole 131. The first longitudinal ends of the multiple sets of first cooling grooves 121 are all connected to the longitudinal side of the first connecting groove 111 near the middle of the substrate 100. The first longitudinal ends of the multiple sets of second cooling grooves 122 are connected to the longitudinal second ends of the multiple sets of first cooling grooves 121. The second connecting groove 112 is arranged laterally, and one of its lateral ends communicates with a liquid outlet hole 132. The longitudinal side of the second connecting groove 112 near the middle of the substrate 100 is connected to the longitudinal second ends of the multiple sets of second cooling grooves 122.
[0053] like Figure 1 As shown, the coolant enters the horizontally shaped first connecting groove 111 through the inlet hole 131, then enters multiple sets of first cooling grooves 121 from the first connecting groove 111, then enters multiple sets of second cooling grooves 122 from the first cooling grooves 121, and finally flows out to the outlet hole 132 from the second cooling grooves 122. This allows for the formation of more cooling grooves on the substrate 100, thereby enabling heat dissipation for more chips 300.
[0054] Furthermore, the second longitudinal end of each set of first cooling grooves 121 is connected to the first longitudinal end of two sets of second cooling grooves 122.
[0055] like Figure 1 and Figure 2As shown, the second end of the longitudinal direction of each group of first cooling grooves 121 is connected to the first end of the longitudinal direction of two groups of second cooling grooves 122.
[0056] In some embodiments of the present application, the base plate 100 and the sealing plate 200 are formed as aluminum plates or copper plates.
[0057] Copper and aluminum have lower thermal conductivity, thereby enabling efficient heat dissipation of the chips 300.
[0058] The above is only a preferred embodiment of the present application, and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A cooling plate for multi-chip heat dissipation, characterized by, The cooling plate comprises: a substrate formed with a first surface and a second surface opposite to each other, the first surface of the substrate being used for connecting chips, the second surface of the substrate being formed with a plurality of groups of cooling grooves, one group of cooling grooves corresponding to one chip, the substrate being formed with liquid inlet holes and liquid outlet holes for the cooling liquid to flow in and out, each group of cooling grooves comprising a plurality of cooling grooves spaced apart along a transverse direction and extending along a longitudinal direction, the cooling grooves being formed into first cooling grooves located upstream and second cooling grooves located downstream based on the flow direction of the cooling liquid, the number of the first cooling grooves in each group of the first cooling grooves being less than the number of the second cooling grooves in each group of the second cooling grooves; a cover plate connected to the second surface of the substrate to enclose the cooling grooves.
2. The cooling plate for multi-chip heat dissipation according to claim 1, wherein, The cooling grooves are formed in a wave shape or a strip shape.
3. The cooling plate for multi-chip heat dissipation according to claim 2, wherein, The cooling grooves are formed in a wave shape, and the cooling grooves comprise a plurality of continuous curved grooves.
4. The cooling plate for multi-chip heat dissipation according to claim 3, wherein, The curved grooves are formed in an arc shape, a triangular shape or a "U" shape.
5. The cooling plate for multi-chip heat dissipation according to claim 4, wherein, The widths of the curved grooves constituting a single cooling groove are equal.
6. The cooling plate for multi-chip heat dissipation according to claim 5, wherein, Along the flow direction of the cooling liquid, the widths of the openings of the curved grooves gradually decrease in a single cooling groove.
7. The cooling plate for multi-chip heat dissipation according to claim 6, wherein The top end and the bottom end of the openings of the curved grooves constituting a single cooling groove are flush.
8. The cooling plate for multi-chip heat dissipation according to claim 1, wherein, The substrate comprises: a first connecting groove transversely arranged, and one end of the first connecting groove in the transverse direction being communicated with the liquid inlet hole; a plurality of groups of first cooling grooves, the first ends in the longitudinal direction of the plurality of groups of first cooling grooves being connected to one side in the longitudinal direction of the first connecting groove close to the middle of the substrate; a plurality of groups of second cooling grooves, the first ends in the longitudinal direction of the plurality of groups of second cooling grooves being connected to the second ends in the longitudinal direction of the plurality of groups of first cooling grooves; a second connecting groove transversely arranged, and one end of the second connecting groove in the transverse direction being communicated with the liquid outlet hole, and one side in the longitudinal direction of the second connecting groove close to the middle of the substrate being connected to the second ends in the longitudinal direction of the plurality of groups of second cooling grooves.
9. The cooling plate for multi-chip heat dissipation according to claim 8, wherein, The second ends in the longitudinal direction of each group of first cooling grooves are connected to the first ends in the longitudinal direction of two groups of second cooling grooves.
10. The cooling plate for multi-chip heat dissipation according to claim 1, wherein, The substrate and the cover plate are both formed into aluminum plates or copper plates.