Peripheral symmetry clamp for panel and circuit board

Abstract

The utility model provides a panel and circuit board periphery symmetry fixture, including the mounting frame and the positioning frame that are arranged separately, the inner side of the periphery of mounting frame is evenly distributed with a plurality of L-shaped cushion blocks, the inner side of the upper end of the periphery of positioning frame is evenly distributed with a plurality of elastic clamping pieces, and the L-shaped cushion blocks are connected with the elastic clamping pieces. A V-shaped jacking structure is arranged at the tail end of the elastic clamping piece, and the V-shaped jacking structure and the L-shaped cushion block form clamping fit which is adaptive to the thickness of the panel or the circuit board; extension structures are arranged at the four corners of the mounting frame, a mounting convex column is arranged at the bottom end of each extension structure, and positioning convex columns are arranged on the inner sides of the four corners of the upper end of the mounting frame; positioning grooves matched with the positioning protruding columns in an inserted mode are formed in the inner sides of the four corners of the positioning frame, and clamping pins are arranged at the upper ends of the four corners of the positioning frame. The utility model relates to the technical field of TGV spraying and clamping.

Description

Technical Field

[0001] This utility model relates to the technical field of TGV spray clamping, and in particular to a peripherally symmetrical clamp for a panel and a circuit board. Background Technology

[0002] In the semiconductor and advanced packaging fields, through-glass via (TGV) technology has become a key process for 3D integrated packaging due to its excellent electrical properties and dimensional accuracy. TGV substrates need to be fixed with fixtures during spray cleaning, electroplating, and etching processes to ensure uniform treatment of the inner walls of the vias. However, traditional fixtures mostly adopt integral frames and rigid clamping structures, which are difficult to adapt to the high-precision requirements of TGV processes.

[0003] Existing fixtures require complete disassembly and assembly when loading and unloading TGV substrates, which is incompatible with the continuous operation mode of automated spraying production lines. Frequent manual intervention leads to low production efficiency and increases the risk of substrate scratches. In addition, spraying solution residues can easily seep into the contact area between the fixture and the substrate, and the integral structure makes thorough cleaning difficult. After long-term use, residue accumulation will hinder the uniform distribution of the spray flow field, affecting the cleaning of the inner wall of the through-hole and the metallization effect.

[0004] Given the ultra-thin and fragile nature of TGV substrates, traditional rigid clamping mechanisms are prone to causing micro-cracks or breakage due to localized stress concentration, and cannot compensate for minor warping caused by thermal expansion or process deformation. In the electrostatic spraying process, the asymmetrical layout of the contact points between the clamp and the substrate can also lead to distortion of the electric field distribution, resulting in uneven metal plating thickness within the vias, and in severe cases, even causing short circuits or open circuits within the vias.

[0005] Therefore, the inventors designed a peripherally symmetrical clamp for the panel and circuit board to solve the above problems. Utility Model Content

[0006] To address the shortcomings of the prior art, this utility model provides a peripheral symmetrical clamp for panels and circuit boards, aiming to solve the problems of incompatibility between the existing TGV substrate clamp and the automated spraying production line during loading and unloading, easy damage to the substrate, and uneven electric field distribution leading to inconsistent metal plating thickness.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a peripherally symmetrical clamp for a panel and a circuit board, comprising a separately configured mounting frame and a positioning frame. The mounting frame has several L-shaped pads evenly distributed around its inner perimeter, and the positioning frame has several elastic clips evenly distributed around its upper inner perimeter. Each elastic clip has a V-shaped pressing structure at its end, which, together with the L-shaped pads, forms a clamping fit that adapts to the thickness of the panel or circuit board. The mounting frame has extended structures at its four corners, each extended structure having a mounting protrusion at its bottom end. The mounting frame also has positioning protrusions at its upper inner corners. The positioning frame has positioning grooves at its four inner corners that engage with the positioning protrusions, and clamping pins at its upper corners.

[0008] Based on the above, the beneficial effects of a peripherally symmetrical clamp for panels and circuit boards are that it solves the problems of incompatibility between TGV substrate clamps and automated spray production lines during loading and unloading, easy damage to substrates, and uneven electric field distribution leading to inconsistent metal plating thickness; mainly reflected in:

[0009] 1. This utility model, through its split design, namely the independent setting of the mounting frame and the positioning frame, enables the rapid assembly and disassembly of the TGV substrate in the automated spray production line, which greatly improves production efficiency and reduces the need for manual intervention. This allows the fixture to better adapt to continuous operation mode and improves the smoothness and efficiency of the overall production line.

[0010] 2. This utility model adopts a combination of a V-shaped top pressing structure at the end of the elastic clamping piece and an L-shaped pad to form a clamping fit that is adaptive to the thickness of the panel or circuit board. This not only effectively compensates for the concave deformation of the substrate, but also avoids micro-cracks or breakage caused by local stress concentration. It is especially suitable for ultra-thin and fragile TGV substrate materials.

[0011] 3. This utility model takes into account the electric field distribution requirements during the live machining process through the design of the elastic clamp. Its elastic deformation configuration can improve the uniformity of the electric field distribution and ensure the consistency of the metal plating thickness in the through hole, thereby effectively preventing short circuit or open circuit defects in the hole caused by uneven electric field distribution.

[0012] Furthermore, the insertion and engagement of the positioning protrusion and the positioning groove restricts the rotation and translation of the split frame.

[0013] Based on the above, the beneficial effect of the positioning protrusion and positioning groove is to constrain the relative motion freedom of the mounting frame and the positioning frame, ensure that the split frame does not undergo micro-displacement during high-speed spraying operations, effectively avoid the substrate tilting problem caused by frame misalignment, and keep the TGV through hole in the ideal position perpendicular to the spray flow field, thereby improving process stability.

[0014] Furthermore, the axis of the mounting protrusion is perpendicular to the bottom surface of the extension structure, and is used to lock it coaxially with the air clamp of the spray device.

[0015] Based on the above, the beneficial effect of installing the convex column is to match the radial expansion locking of the air clamp, realize the rapid and accurate positioning of the clamp and the spray station, and while ensuring the clamping rigidity, the frictionless contact characteristics of the air clamp avoid the frame torsion and deformation caused by traditional bolt locking, which is especially suitable for high-frequency automated loading and unloading scenarios.

[0016] Furthermore, the outer circumferential surface of the clamping pin is provided with anti-slip texture, and its axis is perpendicular to the upper plane of the positioning frame.

[0017] Based on the above, the beneficial effects of anti-slip texture are to significantly increase the contact friction between the clamping pin and the robotic arm gripper, resist accidental slippage caused by the impact of spray liquid flow during automated handling, and ensure that the vertical axis layout of the clamping pin ensures symmetrical force when the robotic arm grasps, avoids frame deformation caused by lateral torque, and ensures the posture stability of the substrate during the transmission process.

[0018] Furthermore, the elastic deformation of the elastic clip is configured to compensate for the concave deformation of the panel or circuit board.

[0019] Based on the above, the beneficial effects of the elastic clip are that it maintains a constant contact pressure within a certain deformation range, which can absorb the warping deformation of the substrate caused by thermal stress, and reduce the dispersion of contact resistance through the point contact method of the V-shaped top pressure structure. In the electroplating process, this structure forms an equipotentially distributed contact network, which reduces the standard deviation of the current density distribution on the inner wall of the through hole and significantly improves the uniformity of the metal coating.

[0020] To more clearly illustrate the above-mentioned features of this utility model and the objectives it aims to achieve, the present utility model will be further described below in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0021] Figure 1 This is an exploded view of the present invention.

[0022] Figure 2 :for Figure 1 An enlarged schematic diagram of part A;

[0023] Figure 3 :for Figure 1 An enlarged schematic diagram of part B;

[0024] Figure 4 : This is a perspective view of the present invention.

[0025] The reference numerals in the attached diagram are as follows: 1-Mounting frame, 11-Extended structure, 111-Mounting protrusion, 12-Positioning protrusion, 13-L-shaped pad, 2-Positioning frame, 21-Positioning groove, 22-Clamping pin, 23-Elastic clamping piece, 231-V-shaped top pressing structure. Detailed Implementation

[0026] like Figures 1-4 As shown, a peripherally symmetrical clamp for a panel and circuit board includes a separately configured mounting frame 1 and a positioning frame 2. The mounting frame 1 has several L-shaped pads 13 evenly distributed around its inner perimeter. The positioning frame 2 has several elastic clamping pieces 23 evenly distributed around its upper inner perimeter. Each elastic clamping piece 23 has a V-shaped pressing structure 231 at its end, which, together with the L-shaped pads 13, forms a clamping fit that adapts to the thickness of the panel or circuit board. The mounting frame 1 has extension structures 11 at its four corners, each extension structure 11 having a mounting protrusion 111 at its bottom. The mounting frame 1 also has positioning protrusions 12 at its upper inner corners. The positioning frame 2 has positioning grooves 21 at its four inner corners that engage with the positioning protrusions 12, and clamping pins 22 at its upper corners.

[0027] The insertion and engagement of the positioning protrusion 12 and the positioning groove 21 restricts the rotation and translation of the split frame.

[0028] The axis of the mounting protrusion 111 is perpendicular to the bottom surface of the extension structure 11, and is used to lock it coaxially with the air clamp of the spray device.

[0029] The outer circumferential surface of the clamping pin 22 is provided with anti-slip texture, and its axis is perpendicular to the upper plane of the positioning frame 2.

[0030] The elastic deformation of the elastic clip 23 is configured to compensate for the concave deformation of the panel or circuit board, while improving the uniformity of the electric field distribution during live machining.

[0031] In summary, the specific embodiments of this utility model are as follows:

[0032] First, the mounting frame 1 is coaxially locked with the air clamp of the spraying device through the mounting protrusions 111 at the four corners. The axis of the mounting protrusions 111 is perpendicular to the bottom surface of the extension structure 11, ensuring that the mounting frame 1 is precisely aligned with the spraying station. The radial expansion force of the air clamp is fixed without twisting through the mounting protrusions 111, providing rigid support for subsequent processes.

[0033] Next, the TGV substrate is laid flat on the L-shaped pad 13 inside the mounting frame 1. The L-shaped pad 13 is evenly distributed around the inner side of the mounting frame 1. Its stepped support surface automatically corrects the flatness of the substrate and avoids local stress concentration by distributing the load.

[0034] Next, after aligning the positioning grooves 21 at the four corners of the positioning frame 2 with the positioning protrusions 12 of the mounting frame 1, press down. The insertion and engagement of the positioning protrusions 12 and the positioning grooves 21 restricts the rotation and translation of the split frame, ensuring the symmetry of the clamping system.

[0035] During the process of the robotic arm gripping the positioning frame 2 and pressing it down by the clamping pins 22 at the four corners, the V-shaped top pressing structure 231 at the end of the elastic clamping piece 23 on the inner side of the frame 2 forms a clamp with the L-shaped pad 13. The elastic deformation of the elastic clamping piece 23 is configured to compensate for the thickness tolerance or concave deformation of the substrate. At the same time, the uniformity of the electric field distribution during the electrified spraying is optimized by the equipotential contact point of the V-shaped top pressing structure 231.

[0036] After the spraying is completed, the air clamp releases the locking of the mounting frame 1, and the robotic arm lifts the positioning frame 2 through the clamping pin 22, and then removes the substrate to prepare for the next round of spraying.

[0037] The above description is only the optimal solution embodiment of this utility model and is not intended to limit this utility model. Various modifications or substitutions made by those skilled in the art to this utility model without departing from the essence and protection scope of this utility model should also be within the protection scope of this utility model.

Claims

1. A peripherally symmetrical clamp for a panel and a circuit board, characterized in that: The system includes a separate mounting frame (1) and a positioning frame (2). The mounting frame (1) has several L-shaped pads (13) evenly distributed on its inner perimeter. The positioning frame (2) has several elastic clips (23) evenly distributed on its upper inner perimeter. The elastic clips (23) have V-shaped pressing structures (231) at their ends. The V-shaped pressing structures (231) and the L-shaped pads (13) form a clamping fit that adapts to the thickness of the panel or circuit board. The mounting frame (1) has extension structures (11) at its four corners. Each extension structure (11) has a mounting protrusion (111) at its bottom end. The mounting frame (1) has positioning protrusions (12) at its upper inner corners. The positioning frame (2) has positioning grooves (21) at its four inner corners that engage with the positioning protrusions (12). The positioning frame (2) has clamping pins (22) at its upper corners.

2. The peripheral symmetrical clamp for a panel and a circuit board according to claim 1, characterized in that: The insertion and engagement of the positioning protrusion (12) and the positioning groove (21) restricts the rotation and translation of the split frame.

3. The peripheral symmetrical clamp for a panel and a circuit board according to claim 1, characterized in that: The axis of the mounting protrusion (111) is perpendicular to the bottom surface of the extension structure (11) and is used to lock coaxially with the air clamp of the spray device.

4. The peripheral symmetrical clamp for a panel and a circuit board according to claim 1, characterized in that: The outer circumferential surface of the clamping pin (22) is provided with anti-slip texture, and its axis is perpendicular to the upper plane of the positioning frame (2).

5. The peripheral symmetrical clamp for a panel and a circuit board according to claim 1, characterized in that: The elastic deformation of the elastic clip (23) is configured to compensate for the concave deformation of the panel or circuit board.

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