Thermocompression bonding equipment

Abstract

The utility model relates to the technical field of bonding equipment, and provides a thermocompression bonding head, which comprises a thermocompression bonding head and a bonding platform, the thermocompression bonding head is arranged above the bonding platform, and a thermocompression head of the thermocompression bonding head penetrates through a bonding window of the bonding platform to bond a workpiece in a bonding cavity of the bonding platform; the thermocompression bonding head further comprises a connecting mechanism, an upper cavity, a recycling mechanism, a guide mechanism, a bearing plate and a moving mechanism. One end of the connecting mechanism is connected with the bearing plate, the other end of the connecting mechanism is connected with the hot-pressing head, the guide mechanism is arranged on the side of the bearing plate, the hot-pressing head is arranged in the upper cavity, the moving mechanism is arranged on the outer side of the upper cavity, and the moving mechanism is used for driving the upper cavity. The recycling mechanism is arranged on the periphery of the upper cavity. The reducibility of the thermocompression bonding equipment is improved, and the oxidation of the chip is prevented.

Description

Technical Field

[0001] This utility model relates to the field of bonding equipment technology, and in particular to a hot-press bonding device. Background Technology

[0002] Hot-press bonding is a solid-state bonding process that combines heat and force to cause plastic deformation between two thin sheets, forming a clean surface in close contact.

[0003] In existing technologies, dozens or even more chips are accurately placed on an intermediate carrier such as a substrate, where solder is applied to the corresponding chip placement positions. All chips are then packaged together and placed in a reflow oven, heated to a temperature that melts the solder to complete bonding, and then subsequent steps are performed, such as removing flux residue and underfilling.

[0004] Existing thermocompression bonding equipment requires improved reducibility and prevention of chip oxidation. Summary of the Invention

[0005] This invention provides a thermosetting bonding head to solve the problems in the prior art where thermosetting bonding equipment needs to improve its reducibility and prevent chip oxidation.

[0006] A hot-press bonding apparatus includes a hot-press bonding head and a bonding platform; the hot-press bonding head is disposed above the bonding platform, and the hot-press head of the hot-press bonding head passes through the bonding window of the bonding platform to bond a workpiece inside the bonding cavity of the bonding platform;

[0007] The hot-press bonding head further includes a connecting mechanism, an upper cavity, a recycling mechanism, a guiding mechanism, a support plate, and a moving mechanism; one end of the connecting mechanism is connected to the support plate, and the other end of the connecting mechanism is connected to the hot-press head; the guiding mechanism is provided on the side of the support plate; the hot-press head is disposed inside the upper cavity; the moving mechanism is provided on the outside of the upper cavity and is used to drive the upper cavity; and the recycling mechanism is provided around the upper cavity.

[0008] According to the hot-press bonding device of this utility model, the recycling mechanism includes a drawout, a recycling cavity, and multiple recycling holes; the recycling cavity is fixedly disposed around the upper cavity, the drawout is disposed above the recycling cavity, and the recycling holes are disposed below the recycling cavity.

[0009] According to the hot pressing bonding apparatus of this utility model, the bonding platform further includes a cooling plate and a top cover; the top cover is disposed above the bonding cavity, and the cooling plate is disposed below the bonding cavity.

[0010] According to the hot-press bonding apparatus of this utility model, the upper cover includes an upper cover plate, a baffle, and a gas pipe; the baffle is disposed in the upper center of the upper cover plate, the bonding window is disposed in the center of the upper cover plate, the baffle is disposed around the upper part of the bonding window, and the gas pipe is disposed around the lower part of the bonding window.

[0011] The hot-press bonding device according to this utility model further includes a rotary drive mechanism, which is disposed above the support plate.

[0012] According to the hot-press bonding device of this utility model, the...

[0013] The hot press head includes a hot press plate and a first pipeline; the hot press plate is fixedly connected to the connecting mechanism; a heater is provided on the inner surface / or outer surface of the hot press plate, and an air hole is opened on the hot press plate, which is connected to the first pipeline.

[0014] The hot-press bonding device according to this utility model further includes a lifting guide mechanism, which is connected to the rotary drive mechanism.

[0015] According to the hot-press bonding device of this utility model, there are multiple hot-press bonding heads, and the lifting guide mechanism is arranged corresponding to the hot-press bonding heads.

[0016] This invention alters the flow direction of the formic acid mixture by using a baffle, preventing its diffusion and reducing the risk of spread. Multiple recovery holes increase the extraction contact area, resulting in more efficient and uniform extraction, avoiding excessively rapid local extraction or gas blockage. It also improves the reducibility of the thermosetting bonding equipment, preventing chip oxidation. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A three-dimensional structural diagram of a thermo-press bonding head. Figure 1 ;

[0019] Figure 2 A three-dimensional structural diagram of a thermo-press bonding head. Figure 2 ;

[0020] Figure 3 A 3D structural diagram of the recycling facility Figure 1 ;

[0021] Figure 4 A 3D structural diagram of the recycling facility Figure 2 ;

[0022] Figure 5 A three-dimensional structural diagram of the bonding platform;

[0023] Figure 6 This is a three-dimensional structural diagram of the top cover;

[0024] Reference numerals: 1. Hot-press bonding head; 11. Pressure sensor; 12. Support plate; 13. Guide mechanism; 14. Moving mechanism; 15. Upper cavity; 16. Connecting mechanism; 17. Hot-press head; 18. Recycling mechanism; 19. Bellows; 181. Pull-out port; 182. Recycling cavity; 183. Recycling hole; 2. Bonding platform; 21. Bonding cavity; 22. Cooling plate; 23. Top cover; 211. Heating tube; 231. Baffle; 232. Gas tube; 233. Top cover plate; 234. Bonding window. Detailed Implementation

[0025] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0026] In the description of the embodiments of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0028] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0029] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0030] The following is combined Figure 1-6 A hot-press bonding apparatus according to an embodiment of the present invention includes a hot-press bonding head 1 and a bonding platform 2; the hot-press bonding head 1 is disposed above the bonding platform 2, and the hot-press head 17 of the hot-press bonding head 1 passes through the bonding window 234 of the bonding platform 2 to bond the workpiece in the bonding cavity 21 of the bonding platform 2;

[0031] The hot-press bonding head 1 also includes a connecting mechanism 16, an upper cavity 15, a recycling mechanism 18, a guiding mechanism 13, a support plate 12, and a moving mechanism 14. One end of the connecting mechanism 15 is connected to the support plate 12, and the other end of the connecting mechanism 15 is connected to the hot-press head 17. The support plate 12 is provided with a guiding mechanism 13 on its side. The hot-press head 17 is located inside the upper cavity 15. The moving mechanism 14 is provided on the outside of the upper cavity 15. The moving mechanism 14 is used to drive the upper cavity 15. The recycling mechanism 18 is provided around the upper cavity 15.

[0032] In some embodiments, the recovery mechanism 18 includes an extraction port 181, a recovery chamber 182, and a plurality of recovery holes 183. The recovery chamber 182 is fixedly disposed around the upper chamber 15, the extraction port 181 is provided above the recovery chamber 182, and the recovery holes 183 are provided below the recovery chamber 182. The formic acid mixed gas enters the recovery chamber 182 through the recovery holes 183 and is extracted by the extraction port 181.

[0033] In some embodiments, the bonding platform 2 further includes a cooling plate 22 and an upper cover 23; the upper cover 23 is disposed above the bonding cavity 21, and the cooling plate 22 is disposed below the bonding cavity 21. Cooling pipes are disposed inside the cooling plate 22.

[0034] In some embodiments, the upper cover 23 includes an upper cover plate 233, a baffle 231, and a gas pipe 232. The baffle 231 is disposed at the upper center of the upper cover plate 233, the bonding window 234 is disposed at the center of the upper cover plate 233, the baffle 231 is disposed around the upper part of the bonding window 234, and the gas pipe 232 is disposed around the lower part of the bonding window 234. The gas pipe 232 is preferentially filled with formic acid mixed gas to achieve the purpose of locally filling with formic acid mixed gas to improve the reducing power.

[0035] In some embodiments, a rotary drive mechanism is also included, which is disposed above the support plate 12.

[0036] In some embodiments,

[0037] The hot press head 17 includes a hot press plate and a first pipeline; the hot press plate is fixedly connected to the connecting mechanism; a heater is provided on the inner surface / or outer surface of the hot press plate, and air holes are opened on the hot press plate, which are connected to the first pipeline.

[0038] In some embodiments, a lifting guide mechanism is also included, which is connected to a rotary drive mechanism.

[0039] In some embodiments, multiple hot-press bonding heads 1 are provided, and lifting guide mechanisms are provided corresponding to the hot-press bonding heads.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A hot-press bonding device, characterized in that, It includes a hot-press bonding head and a bonding platform; the hot-press bonding head is disposed above the bonding platform, and the hot-press head of the hot-press bonding head passes through the bonding window of the bonding platform to bond the workpiece in the bonding cavity of the bonding platform; The hot-press bonding head further includes a connecting mechanism, an upper cavity, a recycling mechanism, a guiding mechanism, a support plate, and a moving mechanism; one end of the connecting mechanism is connected to the support plate, and the other end of the connecting mechanism is connected to the hot-press head; the guiding mechanism is provided on the side of the support plate; the hot-press head is disposed inside the upper cavity; the moving mechanism is provided on the outside of the upper cavity and is used to drive the upper cavity; and the recycling mechanism is provided around the upper cavity.

2. The hot-press bonding apparatus according to claim 1, characterized in that, The recycling mechanism includes a drawer, a recycling chamber, and multiple recycling holes; the recycling chamber is fixedly arranged around the upper chamber, the drawer is arranged above the recycling chamber, and the recycling holes are arranged below the recycling chamber.

3. The hot-press bonding apparatus according to claim 1, characterized in that, The bonding platform also includes a cooling plate and a top cover; the top cover is disposed above the bonding cavity, and the cooling plate is disposed below the bonding cavity.

4. The hot-press bonding apparatus according to claim 3, characterized in that, The upper cover includes an upper cover plate, a baffle, and a gas pipe; the baffle is disposed in the upper center of the upper cover plate, the bonding window is disposed in the center of the upper cover plate, the baffle is disposed around the upper part of the bonding window, and the gas pipe is disposed around the lower part of the bonding window.

5. The hot-press bonding apparatus according to claim 1, characterized in that, It also includes a rotary drive mechanism, which is disposed above the support plate.

6. The hot-press bonding apparatus according to claim 5, characterized in that, It also includes a lifting guide mechanism, which is connected to the rotary drive mechanism.

7. The hot-press bonding apparatus according to claim 6, characterized in that, The hot-press bonding head is provided in multiple ways, and the lifting guide mechanism is provided in correspondence with the hot-press bonding head.

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