Rotary table tool for semiconductor polishing

Abstract

The rotary table tool for semiconductor polishing comprises a device body, the device body comprises a base, an installation cabinet, a fixing device and a polishing device, the installation cabinet is installed at the top of the base, and the fixing device and the polishing device are both installed at the top of the installation cabinet; the fixing device comprises a fixing disc, an adsorption disc and an adsorption pump body, a plurality of small pipelines annularly distributed at equal intervals are arranged at the top of the fixing disc, a main pipeline is arranged at the bottom of the fixing disc, the small pipelines are connected with the main pipeline, the bottom end of the main pipeline is connected with the adsorption pump body, and a lower connecting pipe is arranged at the bottom of the adsorption disc. The bottom of the adsorption disc is installed on the top of the small pipeline through a lower connecting pipe, a damping cover is arranged on the top of the adsorption disc, and an attaching ring is arranged on the top of the damping cover. According to the device, the semiconductor wafer can be effectively adsorbed and fixed, so that the stability of the semiconductor wafer during processing is improved, and the wafer is prevented from shifting and flying out during processing.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor polishing technology, specifically a turntable fixture for semiconductor polishing. Background Technology

[0002] Semiconductor materials are a class of electronic materials that possess semiconductor properties (conductivity between conductors and insulators, resistivity in the range of approximately 1 mΩ·cm to 1 GΩ·cm) and can be used to fabricate semiconductor devices and integrated circuits.

[0003] Existing semiconductor polishing methods have the following drawbacks:

[0004] 1. Existing semiconductor polishing equipment cannot effectively improve the firmness of semiconductor fixation, and semiconductors are prone to flying out during rotation, affecting semiconductor processing.

[0005] 2. Existing semiconductor polishing equipment cannot effectively seal and store semiconductors, thus affecting the storage of processed semiconductors.

[0006] Therefore, a solution is needed. Utility Model Content

[0007] (a) Technical problems to be solved

[0008] To address the shortcomings of existing technologies, this invention provides a turntable fixture for semiconductor polishing, thereby solving the problems mentioned in the background section.

[0009] (II) Technical Solution

[0010] To achieve the above objectives, this utility model provides the following technical solution: a turntable fixture for semiconductor polishing, comprising a device body, the device body including a base, a mounting cabinet, a fixing device, and a polishing device, the mounting cabinet mounting the top of the base, the fixing device and the polishing device both mounted on the top of the mounting cabinet, the fixing device being located above the polishing device; the fixing device including a fixing plate, an adsorption plate, and an adsorption pump body, the top of the fixing plate having several groups of small pipes distributed in a ring-shaped equidistant manner, the bottom of the fixing plate having a main pipe, the several groups of small pipes being connected to the main pipe respectively, the bottom end of the main pipe being connected to the adsorption pump body, the adsorption plate having a funnel-shaped structure, the bottom of the adsorption plate having a lower connecting pipe, the bottom of the adsorption plate being mounted on the top of the small pipes through the lower connecting pipe, the top of the adsorption plate having a shock-absorbing cover, and the top of the shock-absorbing cover having a fitting ring.

[0011] Preferably, the polishing device includes hydraulic rods, a mounting frame, and a polishing assembly. The hydraulic rods are arranged in a set, and the set of hydraulic rods are symmetrically installed at the bottom of the mounting frame. The polishing assembly is installed on the mounting frame.

[0012] Preferably, the polishing assembly includes a motor, a mounting plate, and a polishing plate. The motor is located at the top of the mounting frame, the mounting plate is located below the mounting frame, the bottom drive end of the motor is connected to the top of the mounting plate, and the polishing plate is mounted on the bottom of the mounting plate.

[0013] Preferably, the front side of the installation cabinet is fitted with a cabinet door via a hinge, the cabinet door is fitted with a handle, the interior of the installation cabinet is fitted with a partition, the upper part of the partition is divided into a first storage space, and the lower part of the partition is divided into a second storage space.

[0014] (III) Beneficial Effects

[0015] This utility model provides a turntable fixture for semiconductor polishing. It has the following advantages:

[0016] The turntable fixture for semiconductor polishing in this solution can effectively adsorb and fix semiconductor wafers, thereby improving the stability of semiconductor wafers during processing and preventing wafers from shifting or flying out during processing. This greatly facilitates the polishing equipment to process wafers accurately. This device can also facilitate the storage of processed semiconductor wafers. Simply place the processed semiconductor wafers into a storage cabinet for sealed storage. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the fixing device of this utility model;

[0019] Figure 3 This is a schematic diagram of the polishing device of this utility model.

[0020] In the diagram, 1. Device body; 2. Base; 3. Mounting cabinet; 4. Fixing device; 5. Polishing device; 6. Fixing plate; 7. Adsorption plate; 8. Adsorption pump body; 9. Main pipe; 10. Small pipe; 11. Lower connecting pipe; 12. Shock absorber; 13. Fitting ring; 14. Hydraulic rod; 15. Mounting frame; 16. Polishing assembly; 17. Motor; 18. Mounting plate; 19. Polishing plate; 20. Cabinet door; 21. Handle; 22. Partition; 23. First storage space; 24. Second storage space. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-3 This utility model provides a technical solution:

[0023] Example 1

[0024] Regarding the problem 1 that needs to be solved above: existing semiconductor polishing equipment cannot effectively improve the firmness of semiconductor fixation, and semiconductors are prone to flying out during rotation, which affects the semiconductor processing.

[0025] The solution is as follows: A turntable fixture for semiconductor polishing includes a device body 1. The device body 1 includes a base 2, a mounting cabinet 3, a fixing device 4, and a polishing device 5. The mounting cabinet 3 is mounted on the top of the base 2. The fixing device 4 and the polishing device 5 are both mounted on the top of the mounting cabinet 3, with the fixing device 4 located above the polishing device 5. The fixing device 4 includes a fixing plate 6, an adsorption plate 7, and an adsorption pump body 8. The top of the fixing plate 6 is provided with several groups of small pipes 10 distributed in a ring-shaped equidistant manner. The bottom of the fixing plate 6 is provided with a main pipe 9. The several groups of small pipes 10 are respectively connected to the main pipe 9. The bottom end of the main pipe 9 is connected to the adsorption pump body 8. The adsorption plate 7 has a funnel-shaped structure. The bottom of the adsorption plate 7 is provided with a lower connecting pipe 11. The bottom of the adsorption plate 7 is mounted on the top of the small pipes 10 through the lower connecting pipe 11. The top of the adsorption plate 7 is provided with a shock-absorbing cover 12, and the top of the shock-absorbing cover 12 is provided with a fitting ring 13. During operation, the operator places the wafer disk on top of several sets of adsorption plates 7. The bonding ring 13 on the top of the adsorption plate 7 can effectively adhere to the wafer surface, while the shock-absorbing cover 12 can expand and contract after being subjected to force, thereby protecting the wafer. After the wafer is placed, the adsorption pump body 8 draws air through the main pipe 9 to several sets of small pipes 10, and then generates negative pressure, which can be used to adsorb and fix the bottom of the wafer through several sets of funnel-shaped adsorption plates 7, thereby improving stability.

[0026] The polishing device 5 includes hydraulic rods 14, a mounting frame 15, and a polishing assembly 16. A set of hydraulic rods 14 are symmetrically mounted at the bottom of the mounting frame 15. The polishing assembly 16 is mounted on the mounting frame 15. In use, the set of hydraulic rods 14 descends, which in turn drives the mounting frame 15 and the polishing assembly 16 on the mounting frame 15 to descend to the wafer position for operation.

[0027] The polishing assembly 16 includes a motor 17, a mounting plate 18, and a polishing disc 19. The motor 17 is located at the top of the mounting frame 15, and the mounting plate 18 is located below the mounting frame 15. The bottom drive end of the motor 17 is connected to the top of the mounting plate 18, and the polishing disc 19 is mounted on the bottom of the mounting plate 18. When polishing the semiconductor wafer fixed below, the drive end of the motor 17 drives the mounting plate 18 to rotate, and the polishing disc 19 at the bottom of the mounting plate 18 can rotate, thereby polishing the semiconductor wafer.

[0028] Example 2

[0029] Regarding the second problem to be solved above: existing semiconductor polishing equipment cannot effectively seal and store semiconductors, thus affecting the storage of processed semiconductors.

[0030] The solution is as follows: The front side of the mounting cabinet 3 is fitted with a cabinet door 20 via a hinge, and a handle 21 is installed on the cabinet door 20. The interior of the mounting cabinet 3 is fitted with a partition 22, with a first storage space 23 above the partition 22 and a second storage space 24 below the partition 22. The first storage space 23 inside the mounting cabinet 3 is for installing and storing the adsorption pump body 8, while the second storage space 24 facilitates the storage of wafers, thereby improving the convenience of wafer storage.

[0031] Working principle: During operation, the operator places the wafer disk on top of several sets of adsorption trays 7. The fitting ring 13 on the top of the adsorption tray 7 can effectively adhere to the wafer surface, while the shock-absorbing cover 12 can expand and contract under force, thereby protecting the wafer. After the wafer is placed, the adsorption pump body 8 evacuates air through the main pipe 9 to several sets of small pipes 10, generating negative pressure. This negative pressure allows the wafer bottom to be adsorbed and fixed by the several sets of funnel-shaped adsorption trays 7, improving stability. Then, a set of hydraulic rods 14 descends, driving the mounting frame 15 and the polishing assembly 16 on the mounting frame 15 to descend to the wafer position for operation. When polishing the semiconductor wafer fixed below, the motor 17 drives the mounting plate 18 to rotate, and the polishing plate 19 at the bottom of the mounting plate 18 can also rotate, thereby polishing the semiconductor wafer disk.

[0032] The present invention comprises: 1. Device body; 2. Bottom shock absorber; 3. Main shock absorber; 4. Mounting frame; 5. Marine engine set; 6. Bottom shock absorber plate; 7. Top shock absorber plate; 8. Pneumatic shock absorber column; 9. Spring shock absorber column; 10. Pneumatic chamber; 11. Guide column; 12. Load-bearing block; 13. Stabilizing frame; 14. Adjusting plate; 15. Movable groove; 16. Movable ball; 17. Lateral shock absorber spring. All components are general standard parts or parts known to those skilled in the art. Their structure and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods. The problem solved by this invention is that existing semiconductor polishing equipment cannot effectively improve the firmness of semiconductor fixation, and semiconductors are prone to flying out during rotation, affecting semiconductor processing. This invention, through the combination of the above components, can effectively adsorb and fix semiconductor wafers, thereby improving the stability of semiconductor wafers during processing and preventing wafer displacement or flying out during processing.

[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and thus all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0034] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A turntable fixture for semiconductor polishing, characterized in that: The device includes a main body (1), which includes a base (2), a mounting cabinet (3), a fixing device (4) and a polishing device (5). The mounting cabinet (3) is mounted on the top of the base (2), and the fixing device (4) and the polishing device (5) are both mounted on the top of the mounting cabinet (3). The fixing device (4) is located above the polishing device (5). The fixing device (4) includes a fixing plate (6), an adsorption plate (7), and an adsorption pump body (8). The top of the fixing plate (6) is provided with several groups of small pipes (10) distributed in a ring-shaped equidistant manner. The bottom of the fixing plate (6) is provided with a main pipe (9). The several groups of small pipes (10) are respectively connected to the main pipe (9). The bottom end of the main pipe (9) is connected to the adsorption pump body (8). The adsorption plate (7) has a funnel-shaped structure. The bottom of the adsorption plate (7) is provided with a lower connecting pipe (11). The bottom of the adsorption plate (7) is installed on the top of the small pipes (10) through the lower connecting pipe (11). The top of the adsorption plate (7) is provided with a shock-absorbing cover (12). The top of the shock-absorbing cover (12) is provided with a fitting ring (13).

2. The turntable fixture for semiconductor polishing according to claim 1, characterized in that: The polishing device (5) includes a hydraulic rod (14), a mounting frame (15), and a polishing assembly (16). The hydraulic rod (14) is provided in a set, and the set of hydraulic rods (14) is symmetrically installed at the bottom of the mounting frame (15). The polishing assembly (16) is installed on the mounting frame (15).

3. The semiconductor polishing turntable fixture according to claim 2, characterized in that: The polishing assembly (16) includes a motor (17), a mounting plate (18), and a polishing plate (19). The motor (17) is located on top of the mounting frame (15), the mounting plate (18) is located below the mounting frame (15), the bottom drive end of the motor (17) is connected to the top of the mounting plate (18), and the polishing plate (19) is mounted on the bottom of the mounting plate (18).

4. The turntable fixture for semiconductor polishing according to claim 1, characterized in that: The front side of the installation cabinet (3) is fitted with a cabinet door (20) via a hinge. The cabinet door (20) is fitted with a handle (21). The interior of the installation cabinet (3) is fitted with a partition (22). A first storage space (23) is separated above the partition (22), and a second storage space (24) is separated below the partition (22).

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