Novel ceramic heating destressing device

Abstract

The utility model discloses a novel ceramic heating destressing device which comprises two heating assemblies, a die, an embossing assembly, a cooling assembly and a control module, the two heating assemblies are oppositely arranged between the die and the embossing assembly left and right, and the cooling assembly is located on one side of the embossing assembly; the heating assembly comprises a frame and a plurality of ceramic heating plates capable of automatically measuring temperature, a plurality of ceramic heating plate mounting areas which are distributed from top to bottom in an array mode are arranged in the frame, a plurality of ceramic heating plate mounting grooves which are distributed from left to right in an array mode are formed in the ceramic heating plate mounting areas, and ceramic heating plates are arranged in the ceramic heating plate mounting grooves; the frame is connected with the mold or the embossing assembly; the ceramic heating plate is detachably connected with the ceramic heating plate mounting groove; the mold is used for extruding plastic films. Different temperatures can be set for different areas, and the temperatures of the corresponding areas can be stably and flexibly controlled, so that the stress in the plastic film is effectively released; and independent replacement can be achieved, dismounting and mounting are convenient, and the maintenance cost is effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of plastic film processing technology, and in particular to a novel ceramic heating stress relief device. Background Technology

[0002] With the rapid development of the plastic film industry and the continuous rise in labor costs, the industry's requirements for equipment are becoming increasingly stringent. Cooling and forming of plastic film is a crucial process in film production. Stable temperature and humidity during the cooling and forming process have a significant impact on the final properties of the plastic film.

[0003] However, existing heating devices use a single heating method and cannot achieve zoned temperature control, resulting in the inability to effectively release the internal stress of the film product, which affects the cooling and molding of subsequent film processes; moreover, maintenance and disassembly are cumbersome and costly.

[0004] Therefore, in order to solve the above problems, it is urgent to design a new type of ceramic heating stress relief device that can set different temperatures for different areas, can stably and flexibly control the temperature of the corresponding areas, and effectively release the stress inside the plastic film; moreover, it can be replaced individually, is easy to disassemble and assemble, and effectively reduces maintenance costs. Utility Model Content

[0005] To solve the above problems, the technical solution adopted by this utility model is as follows:

[0006] A novel ceramic heating stress relief device includes a heating component, a mold, an embossing component, and a cooling component, characterized in that:

[0007] There are two heating components, which are arranged opposite each other between the mold and the embossing component, and the cooling component is located on one side of the embossing component;

[0008] The heating assembly includes a frame and multiple ceramic heating plates that can automatically measure temperature. The frame is provided with multiple ceramic heating plate mounting areas arranged in an array from top to bottom. Multiple ceramic heating plate mounting slots are arranged in an array from left to right on the ceramic heating plate mounting areas. Each ceramic heating plate is installed in a ceramic heating plate mounting slot.

[0009] The frame is connected to the mold or embossing assembly;

[0010] The ceramic heating plate is detachably connected to the ceramic heating plate mounting groove.

[0011] The mold is used to extrude a plastic film. The plastic film passes through the heating assembly for heating and then passes through the embossing assembly and the cooling assembly for embossing and cooling in sequence.

[0012] It also includes a control module, which is electrically connected to the heating component.

[0013] Preferably, the embossing assembly includes a frame, a rubber roller, and an embossing roller;

[0014] The rubber roller and the embossing roller are rotatably connected to the frame, and an embossing channel is formed between the rubber roller and the embossing roller;

[0015] A rubber roller drive assembly is provided between the rubber roller and the frame. The rubber roller drive assembly is used to drive the rubber roller to move closer to or away from the embossing roller. The rubber roller drive assembly is electrically connected to the control module.

[0016] One of the frames is connected to the rubber roller drive assembly.

[0017] Preferably, the rubber roller drive assembly includes a driver, a rubber roller connecting seat, and a guide rail pair;

[0018] The rubber roller connecting seat is connected to the frame via a guide rail pair, and both ends of the rubber roller are connected to the rubber roller connecting seat via bearings. The driver is connected to the frame, and the driver end is provided with a lead screw that is threadedly connected to the rubber roller connecting seat.

[0019] One of the frames is connected to the rubber roller connector.

[0020] Preferably, the cooling assembly includes a plurality of cooling rollers rotatably connected to a frame, and the plastic film is wound on the plurality of cooling rollers.

[0021] Preferably, the driver is a servo motor.

[0022] Preferably, the frame is arranged parallel to or at an angle to the plastic film.

[0023] Preferably, the surface of the frame facing the plastic film is coated with a silicon carbide-based coating.

[0024] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0025] This utility model allows for setting different temperatures for different areas, providing stable and flexible temperature control for the corresponding areas; moreover, it can be replaced individually, making disassembly and assembly convenient and effectively reducing maintenance costs. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of this utility model;

[0027] Figure 2 This is a schematic diagram of the heating component in this utility model;

[0028] The components include: heating assembly 1, mold 2, frame 3, rubber roller 4, embossing roller 5, rubber roller drive assembly 6, cooling roller 7, frame 11, ceramic heating plate 12, driver 61, rubber roller connecting seat 62, guide rail pair 63, lead screw 64, ceramic heating plate mounting area 111, and ceramic heating plate mounting groove 111a. Detailed Implementation

[0029] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0030] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," "up," "down," "front," "back," and similar expressions used in this document are for illustrative purposes only.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0032] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments:

[0033] like Figure 1-2 As shown, a novel ceramic heating stress relief device includes a heating component 1, a mold 2, an embossing component, and a cooling component. There are two heating components 1, which are arranged opposite each other between the mold 2 and the embossing component. The cooling component is located on one side of the embossing component.

[0034] The heating assembly 1 includes a frame 11 and multiple ceramic heating plates 12 that can automatically measure temperature. The frame 11 is provided with multiple ceramic heating plate mounting areas 111 arranged in an array from top to bottom. Multiple ceramic heating plate mounting slots 111a are arranged in an array from left to right on the ceramic heating plate mounting areas 111. Each ceramic heating plate 12 is provided in a ceramic heating plate mounting slot 111a.

[0035] The frame 11 is connected to the mold 2 or the embossing assembly;

[0036] The ceramic heating plate 12 is detachably connected to the ceramic heating plate mounting groove 111a;

[0037] The mold 2 is used to extrude a plastic film 100. The plastic film 100 passes through the heating component 1 for heating and then passes through the embossing component and the cooling component in sequence for embossing and cooling.

[0038] It also includes a control module (not shown in the figure), which is electrically connected to the heating component 1.

[0039] In this embodiment, during production, when the molten plastic film 100 is extruded from the mold 2 and passes through the heating component 1, the heating component 1 generates heat to heat the plastic film 100. This process is to release the internal stress of the plastic film 100. Then, the plastic film 100 first passes through the embossing component to press out patterns, and then passes through the subsequent cooling component to be shaped and cooled. Since the heating component 1 is composed of ceramic heating plates 12 and a frame 11, multiple ceramic heating plates 12 with automatic temperature measurement functions are detachably installed in the ceramic heating plate mounting groove 111a. Compared with the lamp-type heating structure of the prior art, different temperatures can be set for different areas of the plastic film 100. Under the action of the control module, the ceramic heating plates 12 in each area can maintain the temperature stability of the corresponding area according to the set temperature, so that the internal stress of the plastic film 100 can be effectively released. Moreover, they can be replaced individually, which is convenient for disassembly and assembly, and effectively reduces maintenance costs.

[0040] Furthermore, such as Figure 1 , 2 As shown, the embossing assembly includes a frame 3, a rubber roller 4, and an embossing roller 5;

[0041] The rubber roller 4 and the embossing roller 5 are rotatably connected to the frame 3, and an embossing channel is formed between the rubber roller 4 and the embossing roller 5;

[0042] A rubber roller drive assembly 6 is provided between the rubber roller 4 and the frame 3. The rubber roller drive assembly 6 is used to drive the rubber roller 4 to move closer to or away from the embossing roller 5. The rubber roller drive assembly 6 is electrically connected to the control module.

[0043] One of the frames 11 is connected to the rubber roller drive assembly 6.

[0044] In this embodiment, the size of the embossing channel is controlled by driving the rubber roller 4 closer to or further away from the embossing roller 5 through the rubber roller drive assembly 6. This allows the plastic film 100 extruded from the mold 2 to pass through the embossing channel before the equipment is started. Then, the rubber roller drive assembly 6 drives the rubber roller 4 closer to the embossing roller 5 until it reaches the set position.

[0045] In this embodiment, the position control of the rubber roller 4 simultaneously drives the heating component 1 on one side to move closer to or away from the plastic film 100, thereby reducing the adjustment control steps and ensuring synchronous and stable adjustment.

[0046] In this embodiment, the structure described above can control the distance between the two sides of the plastic film 100 and the heating component 1, and can control the distance between the two sides to be equal or unequal, so as to suit different processing requirements.

[0047] Furthermore, such as Figure 1 , 2 As shown, the rubber roller drive assembly 6 includes a driver 61, a rubber roller connecting seat 62, and a guide rail pair 63;

[0048] The rubber roller connecting seat 62 is connected to the frame 3 via the guide rail pair 63. Both ends of the rubber roller 4 are connected to the rubber roller connecting seat 62 via bearings. The driver 61 is connected to the frame 3, and the driving end is provided with a lead screw 64 that is threadedly connected to the rubber roller connecting seat 62.

[0049] One of the frames 11 is connected to the rubber roller connecting seat 62.

[0050] In this embodiment, the embossing channel can be stably and precisely controlled by the drive structure consisting of lead screw 64, guide rail pair 63 and driver 61.

[0051] Furthermore, such as Figure 1 As shown, in order to improve the cooling and forming effect of the plastic film 100, the cooling assembly includes a plurality of cooling rollers 7 rotatably connected to the frame 3, and the plastic film 100 is wound on the plurality of cooling rollers 7.

[0052] Furthermore, such as Figure 1 , 2 As shown, in order to improve the moving drive accuracy of the rubber roller 4 and the stability against extrusion pressure, the driver 61 is a servo motor.

[0053] Furthermore, such as Figure 1 As shown, in order to meet the processing requirements of different plastic films 100, the frame 11 is arranged parallel or inclined to the plastic film 100.

[0054] Furthermore, in order to improve the high temperature resistance and heat radiation effect of the frame 11 and achieve energy-saving and efficient heating, a silicon carbide-based coating is provided on the surface of the frame 11 facing the plastic film 100.

[0055] For those skilled in the art, various other corresponding changes and modifications can be made based on the technical solutions and concepts described above, and all such changes and modifications should fall within the protection scope of the claims of this utility model patent.

Claims

1. A novel ceramic heating stress relief device, comprising a heating assembly, a mold, an embossing assembly and a cooling assembly, characterized in that: the heating assembly is provided with two frames arranged oppositely on the left and right between the mold and the embossing assembly, and the cooling assembly is arranged on one side of the embossing assembly; the heating assembly comprises a frame and a plurality of ceramic heating plates capable of automatic temperature measurement, a plurality of ceramic heating plate mounting areas are arranged in an array from top to bottom in the frame, a plurality of ceramic heating plate mounting grooves are arranged in an array from left to right on the ceramic heating plate mounting areas, and a ceramic heating plate is arranged in each ceramic heating plate mounting groove; the frame is connected with the mold or the embossing assembly; the ceramic heating plate is detachably connected with the ceramic heating plate mounting groove; the mold is used for extruding a plastic film, and the plastic film is heated by passing through the heating assembly, and then sequentially passes through the embossing assembly and the cooling assembly for embossing and cooling; a control module is further included, and the control module is electrically connected with the heating assembly.

2. A novel ceramic heating stress relieving device as claimed in claim 1, wherein, the embossing assembly comprises a rack, a rubber roller and an embossing roller; the rubber roller and the embossing roller are rotatably connected with the rack, and an embossing channel is formed between the rubber roller and the embossing roller; a rubber roller driving assembly is arranged between the rubber roller and the rack, the rubber roller driving assembly is used for driving the rubber roller to approach or move away from the embossing roller, and the rubber roller driving assembly is electrically connected with the control module; one of the frames is connected with the rubber roller driving assembly.

3. A novel ceramic heating stress relieving device as claimed in claim 2, wherein, the rubber roller driving assembly comprises a driver, a rubber roller connecting seat and a guide rail pair; the rubber roller connecting seat is connected with the rack through the guide rail pair, both ends of the rubber roller are connected with the rubber roller connecting seat through bearings, the driver is connected with the rack, and a driving end is provided with a screw rod which is threadedly connected with the rubber roller connecting seat; one of the frames is connected with the rubber roller connecting seat.

4. A novel ceramic heating stress relieving device as claimed in claim 1, wherein, the cooling assembly comprises a plurality of cooling rollers rotatably connected with the rack, and the plastic film is wound around the plurality of cooling rollers.

5. A novel ceramic heating stress relieving device as claimed in claim 3, wherein, the driver is a servo motor.

6. A novel ceramic heating stress relieving device as claimed in claim 1, wherein, the frame is arranged in parallel or inclined to the plastic film.

7. A new ceramic heating stress relief device as claimed in claim 1, wherein, a silicon carbide-based coating is arranged on the surface of the side of the frame facing the plastic film.

Images