Semiconductor part packaging box
By designing a semiconductor component packaging box with an adjustable limiting device and a pressing block structure, the problems of poor adaptability and high filler consumption of existing packaging boxes are solved, achieving efficient and stable component storage and protection, and adapting to the automated production of components of different sizes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2026-03-03
AI Technical Summary
Existing semiconductor component packaging box designs are fixed, have poor adaptability, require a large number of special molds, consume a lot of filling materials, are difficult to automate, and pose a risk of electrostatic friction.
It adopts an adjustable limit device and a pressure block structure, combined with a protective wall and multi-layer plate connection, to provide multi-level protection, adapt to parts of different sizes, reduce mold requirements and filler consumption, and realize automated production.
It improves the adaptability and protective performance of packaging boxes, reduces mold design and maintenance costs, reduces filler waste, avoids electrostatic friction damage, and achieves stable storage of parts.
Smart Images
Figure CN223962495U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a packaging box, and more particularly to a semiconductor component packaging box. Background Technology
[0002] Semiconductor components are highly valuable, highly sensitive, and have unique manufacturing processes. These special properties place extremely high demands on the transportation of semiconductor components, such as vibration values below 0.5G, temperature control of ±1℃, and humidity of <30%RH. Therefore, transport packaging boxes are usually used when transporting semiconductor components.
[0003] However, the size range of existing semiconductor components is extremely wide. Traditional semiconductor component packaging boxes adopt a fixed design, and the same model of packaging box can only accommodate components with a size error of ±5%. Manufacturers that produce semiconductor component packaging boxes usually need to design nearly a hundred special molds for semiconductor component packaging boxes, and the design and maintenance costs of the molds are extremely high.
[0004] To accommodate parts of different sizes, existing solutions generally use EPS foam / air column bags for filling, with the average filler material consumption per box accounting for nearly 35% of the total packaging weight, resulting in a huge consumption. Utility Model Content
[0005] To address the above problems, this utility model provides a semiconductor component packaging box, comprising:
[0006] The first plate has a protective wall fixedly connected to it, which encloses a hollow storage section. The semiconductor component is placed inside the hollow storage section. The protective wall provides protection while limiting its position. At least one adjusting limiting device is installed on the first plate. At least one end of the adjusting limiting device extends into the hollow storage section. The semiconductor component can be conveniently limited by the adjusting limiting device, reducing the cost of filler and the manpower required for filling.
[0007] The second plate has a pressure block fixedly connected to it. The pressure block can be pressed into the hollow storage compartment. The pressure block also has a groove that cooperates with the adjustment and limiting device. By pressing the pressure block into the hollow storage compartment, the position of the semiconductor parts is further defined and more protection is provided to prevent unnecessary damage during transportation.
[0008] Preferably, the adjusting limiting device includes a fixed column, the first end of which is fixedly connected to the first plate, and the second end of which is rotatably connected to the first end of the rotating block. A guide groove is provided inside the rotating block along the radial direction of the fixed column, and a limiting bolt is slidably connected in the guide groove. Before use, the adjusting limiting device is turned to the side to facilitate the insertion of semiconductor parts. After the semiconductor parts are inserted, the adjusting limiting device is turned back to its original position. The position of the limiting bolt is adjusted to replace the filler to fix the semiconductor parts.
[0009] Preferably, a rotation positioning device is provided at the connection between the fixed column and the rotating block. The rotation positioning device can quickly rotate the adjustment limit device to the required angle, reducing the fixation failure caused by inaccurate rotation angle.
[0010] Preferably, the rotation angle range of the rotary positioning device is -90° to 90°.
[0011] Based on the above solution, a connecting plate is also included. The first end of the connecting plate is connected to the first end of the first plate, and the second end of the connecting plate is connected to the first end of the second plate, so that the pressing block of the second plate can be quickly pressed into the hollow storage part.
[0012] Based on the above scheme, the second and third ends of the first plate are respectively symmetrically provided with a third plate and a fourth plate, and the first end of the third plate and the first end of the fourth plate are respectively provided with a first socket and a second socket.
[0013] Based on the above scheme, the third end of the third plate and the third end of the fourth plate are respectively connected to the third end and the fourth end of the connecting plate. This connection method strengthens the overall strength of the box.
[0014] Based on the above scheme, the fourth end of the first plate is connected to the first end of the fifth plate, the second end of the fifth plate is connected to the first end of the third plate, and the third end of the fifth plate is connected to the first end of the fourth plate, further enhancing the overall stability of the box.
[0015] Based on the above scheme, the second end of the second plate is connected to the first end of the sixth plate. The second and third ends of the sixth plate are respectively provided with a first insert plate and a second insert plate. In use, the first insert plate and the second insert plate are inserted into the first socket and the second socket respectively. The relative position of the second plate and the first plate is kept stable by the plugging method.
[0016] Based on the above scheme, the third and fourth ends of the second plate are connected to the first and second wing plates respectively, further enhancing the protective performance of the packaging box.
[0017] This utility model has the following advantages:
[0018] 1. Current methods of filling packaging boxes with filler are limited by the varying thickness of the filler each time, making automated boxing difficult. Furthermore, static electricity generated during the filling process due to friction between materials poses a risk of damaging semiconductor components. This invention eliminates the need for filler, is highly compatible with automated production lines, and reduces the waste of manpower and resources.
[0019] 2. This utility model uses a limiting structure to conveniently limit the movement of semiconductor parts of different sizes, reducing the need for a large number of special molds and lowering the design and maintenance costs of molds. The same packaging box can accommodate parts with a wider size range, solving the problem of poor adaptability of traditional fixed packaging boxes.
[0020] 3. The hollow storage compartment enclosed by protective walls provides restraint and protection for semiconductor components. The pressure block pressed into the hollow storage compartment further defines the component's position and provides additional protection, preventing unnecessary damage during transportation. Furthermore, the connection method between the plates enhances the overall strength and stability of the box, and the first and second wing plates further strengthen the protective performance of the packaging box.
[0021] 4. The adjustable limit device can be rotated to the side before use to facilitate the insertion of semiconductor components. After insertion, it can be rotated back to its original position and the position of the limit bolts can be adjusted to fix the components. At the same time, the rotary positioning device can quickly rotate the adjustable limit device to the required angle, reducing fixation failure caused by inaccurate rotation angle. Attached Figure Description
[0022] Figure 1 This is a perspective view of the present utility model.
[0023] Figure 2 This is a three-dimensional view of the rotary positioning device. Detailed Implementation
[0024] To enable those skilled in the art to fully understand this solution, the solution will be further described below in conjunction with specific embodiments and accompanying drawings.
[0025] like Figure 1 As shown, this solution provides a semiconductor component packaging box, including:
[0026] The first plate 1 has a protective wall 101 fixedly connected to it, which encloses a hollow storage part 102. Four adjustment limiting devices 103 are installed on the first plate 1, and one end of each adjustment limiting device 103 extends into the hollow storage part 102.
[0027] The second plate 2 is fixedly connected to a pressure block 201. The pressure block 201 can be pressed into the hollow storage part 102. The pressure block 201 has a groove 202 that cooperates with the adjustment limiting device 103. When the pressure block 201 is pressed into the hollow storage part 102, the pressure block 201 presses the semiconductor component tightly onto the first plate 1. At this time, the adjustment limiting device 103 is located in the groove 202 to ensure the tight pressing of the semiconductor component.
[0028] Among them, the protective wall 101 and the pressure block 201 are made of antistatic foam material.
[0029] In other embodiments, the protective wall 101 and the pressure block 201 are made of other soft, antistatic materials.
[0030] In use, the semiconductor component is placed into the hollow storage section 102, the adjusting limit device 103 is adjusted to fix the semiconductor component, and finally the pressure block 201 on the second plate 2 is pressed into the hollow storage section 102 to further fix the semiconductor component.
[0031] In other embodiments, instead of using the adjusting limit device 103 to fix the semiconductor components, filler is used for fixing, in which case the groove 202 does not need to be provided on the pressure block 201.
[0032] In this embodiment, the adjusting limiting device 103 is fixed on the first plate 1 and passes through the protective wall 101. This setting method facilitates the fixing of the position of the protective wall 101 and can also prevent damage caused by collision with hard objects when semiconductor components are placed in.
[0033] In other embodiments, both ends of the adjusting limiting device 103 are located inside the hollow storage section 102.
[0034] like Figure 2 As shown, the adjusting limit device 103 includes a fixed column 1031. The first end of the fixed column 1031 is fixedly connected to the first plate 1, and the second end of the fixed column 1031 is rotatably connected to the first end of the rotating block 1034. A guide groove 1032 is provided in the rotating block 1034 along the radial direction of the fixed column, and a limit bolt 1033 is slidably connected in the guide groove 1032.
[0035] The limit bolt 1033 is coated with a rubber film to prevent damage to semiconductor components when the limit contact occurs.
[0036] Furthermore, a rotation positioning device is provided at the connection between the fixed column 1031 and the rotating block 1034. To prevent collision with the box body, the rotation angle range is set to -90° to 90° for rapid rotation positioning. The rotation angle is based on the fixed column 1031 as the origin. Figure 1 The angle of the adjustment limit device 103 is 0°. When multiple adjustment limit devices 103 are set in the semiconductor component packaging box, the rotation angle of each adjustment limit device 103 is determined individually.
[0037] One method of implementing a rotary positioning device is as follows:
[0038] A protrusion is provided at the connection between the fixed post 1031 and the rotating block 1034. Recesses that cooperate with the protrusion are provided at the aforementioned 0°, -90° and 90° positions of the rotating block 1034. When the rotating block rotates to the 0°, -90° and 90° positions, the protrusion is engaged in the recess to fix the current position of the adjustment limit device 103, which facilitates the installation of semiconductor components and the fixing of the position of the semiconductor components after installation.
[0039] In other embodiments, protrusions and recesses can be provided at any desired angle, allowing for more flexible insertion and fixation of semiconductor components.
[0040] When placing semiconductor components, rotate the rotating block 1034 90° along the fixed post 1031. The rotation positioning device automatically locks in place to prevent resetting, facilitating the placement of semiconductor components. After placement, gently push the rotating block to reset it to the 0° position. At this time, adjust the limiting bolt 1033 so that it abuts against the side of the semiconductor component to adapt to the current size of the semiconductor component and fix its position without the need for additional filler.
[0041] The first end of the connecting plate 7 is connected to the first end of the first plate 1, and the second end of the connecting plate 7 is connected to the first end of the second plate 2.
[0042] The second and third ends of the first plate 1 are respectively provided with a third plate 3 and a fourth plate 4. The first end of the third plate 3 and the first end of the fourth plate 4 are respectively provided with a first socket 301 and a second socket 401.
[0043] The third end of the third plate 3 and the third end of the fourth plate 4 are respectively connected to the third end and the fourth end of the connecting plate 7.
[0044] The fourth end of the first plate 1 is connected to the first end of the fifth plate 5, the second end of the fifth plate 5 is connected to the first end of the third plate 3, and the third end of the fifth plate 5 is connected to the first end of the fourth plate 4.
[0045] The second end of the second board 2 is connected to the first end of the sixth board 6. The second and third ends of the sixth board 6 are respectively provided with a first insert plate 601 and a second insert plate 602. In use, the first insert plate 601 is inserted into the first socket 301 and the second insert plate 602 is inserted into the second socket 302 to fix the relative position of the first board 1 and the second board 2, so that the semiconductor components are securely stored inside the packaging box.
[0046] The third and fourth ends of the second plate 2 are connected to the first wing plate 203 and the second wing plate 204, respectively.
[0047] Working principle:
[0048] In use, first rotate the adjusting limit device to a certain angle to facilitate the placement of the semiconductor component into the hollow storage compartment. After placement, reset the adjusting limit device and adjust the position of the limit bolt to fix the semiconductor component. Then, press the pressure block on the second plate into the hollow storage compartment, pressing the semiconductor component tightly onto the second plate. At this time, the connecting plate, the third plate, the fourth plate, and the fifth plate form the first layer of protection. The first and second insert plates of the sixth plate are inserted into the first and second insertion holes, respectively, so that the pressure block fits tightly against the semiconductor component. At the same time, the first and second wing plates are inserted into the inner sides of the third and fourth plates, respectively. At this time, the first wing plate is located between the third plate and the protective wall, and the second wing plate is located between the fourth plate and the protective wall, forming the second layer of protection. The pressure block, the first plate, and the protective wall form the third layer of protection. The first and second layers of protection are used to prevent large particulate contaminants from entering the box, and the third layer of protection prevents finer particulate contaminants from contaminating the surface of the semiconductor component. This utility model has a simple structure, is easy to use, and can provide multi-level protection.
[0049] The above description is merely a preferred embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this application should be included within the scope of protection of this application.
[0050] While the specific embodiments of this utility model have been described above, they are not intended to limit the scope of protection of this utility model. Those skilled in the art should understand that various modifications or variations that can be made by those skilled in the art without creative effort based on the technical solution of this utility model are still within the scope of protection of this utility model.
Claims
1. A semiconductor component packaging box, characterized in that, include: A first plate is fixedly connected to a protective wall, which encloses a hollow storage section. At least one adjustment limiting device is installed on the first plate, and at least one end of the adjustment limiting device extends into the hollow storage section. The second plate has a pressure block fixedly connected to it. The pressure block can be pressed into the hollow storage part. The pressure block has a groove that cooperates with the adjustment and limiting device.
2. A semiconductor component packaging box as described in claim 1, characterized in that, The adjusting and limiting device includes a fixed column, the first end of which is fixedly connected to the first plate, and the second end of which is rotatably connected to the first end of the rotating block. A guide groove is provided inside the rotating block along the radial direction of the fixed column, and a limiting bolt is slidably connected in the guide groove.
3. A semiconductor component packaging box as described in claim 2, characterized in that, A rotation positioning device is provided at the connection between the fixed column and the rotating block.
4. A semiconductor component packaging box as described in claim 3, characterized in that, The rotation angle range of the rotary positioning device is -90° to 90°.
5. A semiconductor component packaging box as described in claim 1, characterized in that, It also includes a connecting plate, the first end of which is connected to the first end of the first plate, and the second end of which is connected to the first end of the second plate.
6. A semiconductor component packaging box as described in claim 5, characterized in that, The second and third ends of the first plate are respectively symmetrically provided with a third plate and a fourth plate, and the first end of the third plate and the first end of the fourth plate are respectively provided with a first socket and a second socket.
7. A semiconductor component packaging box as described in claim 6, characterized in that, The third end of the third plate and the third end of the fourth plate are respectively connected to the third end and the fourth end of the connecting plate.
8. A semiconductor component packaging box as described in claim 7, characterized in that, The fourth end of the first plate is connected to the first end of the fifth plate, the second end of the fifth plate is connected to the first end of the third plate, and the third end of the fifth plate is connected to the first end of the fourth plate.
9. A semiconductor component packaging box as described in claim 6, characterized in that, The second end of the second plate is connected to the first end of the sixth plate. The second end and the third end of the sixth plate are respectively provided with a first insert plate and a second insert plate. The first insert plate and the second insert plate are used to be inserted into the first socket and the second socket, respectively.
10. A semiconductor component packaging box as described in claim 1, characterized in that, The third and fourth ends of the second plate are connected to the first wing plate and the second wing plate, respectively.