Packaging device and electronic equipment

Abstract

The utility model provides a packaging device and electronic equipment, and the packaging device comprises a bottom plate; the tube shell is arranged on one side of the bottom plate in a surrounding mode, and a containing cavity is formed by the tube shell and the bottom plate; the packaging chip is arranged in the accommodating cavity and is connected with the bottom plate; the blocking structure is arranged around the tube shell and faces the side of the packaging chip, and the distance between the blocking structure and the bottom plate is not smaller than the distance between the side, away from the bottom plate, of the packaging chip and the bottom plate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a packaging device and electronic device. Background Technology

[0002] MEMS (Micro-Electro-Mechanical Systems) are widely used for pressure measurement in consumer electronics, automotive industry, aerospace, and biomedicine due to their miniaturization, high precision, high sensitivity, low power consumption, and ease of mass production, making them the most widely used MEMS sensors. Since the sensitive components in MEMS sensors are in direct contact with the external environment and require protection, the effectiveness of the sensitive component encapsulation directly reflects the yield rate of the MEMS sensor. Utility Model Content

[0003] In view of this, the purpose of this utility model is to provide a packaging device and electronic device that overcomes or at least partially solves the above problems.

[0004] To achieve the above objectives, this utility model provides a packaging device, comprising:

[0005] Base plate;

[0006] The tube shell is arranged around one side of the base plate and forms a cavity with the base plate;

[0007] The packaged chip is disposed within the cavity and connected to the base plate;

[0008] A blocking structure is disposed around the casing and facing the side of the packaged chip, and the distance between the blocking structure and the base plate is not less than the distance between the side of the packaged chip away from the base plate and the base plate.

[0009] Optionally, the casing includes a first casing, which is connected to the base plate, and the middle of the first casing protrudes in a direction away from the packaged chip.

[0010] The blocking structure is arranged around the first casing and facing the side of the packaged chip.

[0011] Optionally, the casing includes a first casing connected to the base plate, and the first casing extends in a direction away from the base plate and close to the packaged chip;

[0012] The blocking structure is arranged around the first casing and facing the side of the packaged chip.

[0013] Optionally, the housing further includes a second housing connected to the side of the first housing away from the base plate, the second housing extending away from the base plate; or the second housing extending away from the base plate and away from the packaged chip.

[0014] Optionally, the housing further includes a second housing connected to the side of the first housing away from the base plate, the second housing extending away from the base plate; or the second housing extending away from the base plate and away from the packaged chip.

[0015] Optionally, the tubular shell includes a first tubular shell and a second tubular shell, the first tubular shell being connected to the base plate and extending away from the base plate;

[0016] The second housing is connected to the side of the first housing away from the base plate, and the second housing extends away from the base plate; or the second housing extends away from the base plate and toward the packaged chip.

[0017] Optionally, the blocking structure includes a protrusion that is disposed around the side of the first housing facing the packaged chip.

[0018] Optionally, there are multiple protrusions, and the multiple protrusions are evenly distributed along the side of the first tube shell near the bottom plate to the side away from the bottom plate;

[0019] Furthermore, the distance between the protrusion furthest from the base plate and the base plate is not less than the distance between the side of the packaged chip furthest from the base plate and the base plate.

[0020] Optionally, the blocking structure includes a groove, which is disposed around the side of the first housing facing the packaged chip.

[0021] Optionally, there are multiple grooves, and the multiple grooves are evenly distributed along the side of the first tube shell near the bottom plate to the side away from the bottom plate;

[0022] Furthermore, the distance between the groove furthest from the base plate and the base plate is not less than the distance between the side of the packaged chip furthest from the base plate and the base plate.

[0023] Optionally, the blocking structure includes a protrusion and a groove, the protrusion being disposed around the side of the first casing facing the packaged chip, the groove being disposed adjacent to the side of the protrusion facing the base plate, and the groove being disposed around the side of the first casing facing the packaged chip.

[0024] Optionally, there are multiple protrusions and multiple grooves. The multiple protrusions are evenly arranged along the side of the first tube shell near the bottom plate to the side away from the bottom plate, and the multiple grooves are respectively arranged adjacent to the side of the multiple protrusions facing the bottom plate.

[0025] Furthermore, the distance between the protrusion furthest from the base plate and the base plate is not less than the distance between the side of the packaged chip furthest from the base plate and the base plate.

[0026] Optionally, the blocking structure includes a plurality of protrusions and a plurality of grooves, wherein the plurality of protrusions and the plurality of grooves are arranged around the first tube shell on the side facing the cavity, and the plurality of protrusions and the plurality of grooves are spaced apart along the side of the first tube shell facing the bottom plate to the side away from the bottom plate;

[0027] Furthermore, the distance between the protrusion or groove on the side away from the base plate and the base plate is not less than the distance between the packaged chip on the side away from the base plate and the base plate.

[0028] Optionally, the second tube shell has an injection port on the side away from the base plate, and the size of the injection port is greater than 1 mm.

[0029] Optionally, the distance between the side of the protrusion away from the first tube shell and the side facing the first tube shell is not less than 100 micrometers, and the distance between the side of the protrusion away from the base plate and the side facing the base plate is not less than 100 micrometers.

[0030] Optionally, the depth of the groove is not less than 100 micrometers, and the distance between the side of the groove away from the base plate and the side facing the base plate is not less than 100 micrometers; wherein, the depth of the groove represents the distance between the side of the groove near the cavity and the side away from the cavity.

[0031] Optionally, the cavity is provided with encapsulating adhesive, which is configured to encapsulate the packaged chip; the distance difference between the encapsulating adhesive located at the center of the cavity and the side of the encapsulating adhesive located at the blocking structure away from the base plate and the base plate is not greater than 500 micrometers.

[0032] A second aspect of this application provides an electronic device including the packaging device described in the first aspect.

[0033] As can be seen from the above, the packaging device and electronic device provided by this utility model, by setting a blocking structure on the inner wall of the tube shell, uses the blocking structure to block the encapsulating adhesive filled in the cavity, thereby suppressing the phenomenon of encapsulating adhesive crawling from the inner wall of the tube shell.

[0034] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and in order to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of an embodiment of the present invention without a blocking structure;

[0037] Figure 2a This is a schematic diagram of a flip-chip package with protrusions, according to an embodiment of the present invention.

[0038] Figure 2b This is a schematic diagram of a chip with a protrusion and in the correct orientation according to an embodiment of the present invention;

[0039] Figure 3 This is a schematic diagram of an embodiment of the present utility model with multiple protrusions;

[0040] Figure 4a This is a schematic diagram of a grooved and flip-chip packaged according to an embodiment of the present invention;

[0041] Figure 4b This is a schematic diagram of a grooved and flip-chip packaged according to an embodiment of the present invention;

[0042] Figure 5 This is a schematic diagram of an embodiment of the present invention having multiple grooves;

[0043] Figure 6 This is a schematic diagram of an embodiment of the present invention, showing a plurality of closely spaced grooves and protrusions;

[0044] Figure 7 This is a schematic diagram of an embodiment of the present invention having multiple protrusions and grooves;

[0045] Figure 8a This is a schematic diagram of another packaging structure according to an embodiment of the present utility model;

[0046] Figure 8b This is a schematic diagram of another packaging structure according to an embodiment of the present utility model;

[0047] Figure 9aThis is a schematic diagram of another embodiment of the present invention having a protrusion;

[0048] Figure 9b This is a schematic diagram of another embodiment of the present utility model having a protrusion;

[0049] Figure 10 for Figure 9a A schematic diagram with multiple protrusions;

[0050] Figure 11a This is a schematic diagram of another embodiment of the present invention having a groove;

[0051] Figure 11b This is a schematic diagram of another embodiment of the present invention having a groove;

[0052] Figure 12 for Figure 11a A schematic diagram showing multiple grooves;

[0053] Figure 13 for Figure 9a A schematic diagram showing adjacent grooves and protrusions;

[0054] Figure 14 for Figure 13 A schematic diagram showing multiple adjacent grooves and protrusions;

[0055] Figure 15 for Figure 9a A schematic diagram showing multiple protrusions and grooves;

[0056] Figure 16a This is a schematic diagram of another embodiment of the present invention having a protrusion;

[0057] Figure 16b This is a schematic diagram of another embodiment of the present utility model having a protrusion;

[0058] Figure 17a This is a schematic diagram of another embodiment of the present invention having a groove;

[0059] Figure 17b This is a schematic diagram of another embodiment of the present invention having a groove;

[0060] Figure 18 for Figure 16a A schematic diagram with multiple protrusions;

[0061] Figure 19 for Figure 17a A schematic diagram showing multiple grooves;

[0062] Figure 20 for Figure 16a A schematic diagram showing adjacent grooves and protrusions;

[0063] Figure 21 for Figure 20 A schematic diagram showing multiple adjacent grooves and protrusions;

[0064] Figure 22 for Figure 16a A schematic diagram with multiple protrusions and grooves. Detailed Implementation

[0065] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0066] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this utility model should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0067] MEMS (Micro-Electro-Mechanical Systems) are widely used for pressure measurement in consumer electronics, automotive industry, aerospace, and biomedicine due to their miniaturization, high precision, high sensitivity, low power consumption, and ease of mass production, making them the most widely used MEMS sensors. Because MEMS sensors contain packaged chips that are in direct contact with the external environment and require protection, the effectiveness of the packaged chip directly reflects the yield rate of the MEMS sensor.

[0068] In an exemplary embodiment, the sensitive device includes a MEMS chip, an ASIC (Application Specific Integrated Circuit) chip, and connecting wires.

[0069] In some embodiments, reference Figure 1As shown, the sensitive film on the surface of the MEMS chip 31 must not be touched, meaning it cannot be in direct contact with the outside world, otherwise it will affect the performance of the MEMS chip 31. Direct contact between the ASIC chip 32 and the connecting line 33 and the outside world may also cause damage and affect performance; therefore, the ASIC chip 32 and the connecting line 33 also need protection.

[0070] In some embodiments, encapsulating adhesive is used to encapsulate the sensitive device. However, due to the small size of the cavity formed between the housing and the base plate 1, and the interaction between the encapsulating adhesive and the housing, the encapsulating adhesive tends to creep along the housing near the housing. This creeping phenomenon results in a significant difference in the liquid level of the encapsulating adhesive, with a higher liquid level at the edge of the cavity and a lower liquid level at the center, thus preventing effective encapsulation of the sensitive device.

[0071] Based on this, the inventors of this application increased the height of the casing, thereby enlarging the cavity and increasing the amount of encapsulating adhesive, enabling the encapsulating adhesive to effectively encapsulate the chip, meaning that the liquid level of the encapsulating adhesive at the center of the cavity can also cover the chip. However, while increasing the cavity leads to a larger volume of the MEMS sensor, it cannot prevent adhesive creep. The encapsulating adhesive still creeps along the inner wall of the casing, causing the liquid level of the encapsulating adhesive at the center of the cavity to drop, thus reducing the yield of the MEMS sensor.

[0072] Based on this, the inventors of this application propose a packaging device that can effectively protect the packaged chip while preventing adhesive creep.

[0073] refer to Figures 2a to 22 As shown, this application provides a packaging device, including: a base plate 1; a housing 2, which is disposed around one side of the base plate 1 and forms a cavity with the base plate 1; a packaged chip 3, which is disposed in the cavity and connected to the base plate 1; and a blocking structure, which is disposed around the housing 2 and facing the side of the packaged chip, wherein the distance between the blocking structure and the base plate 1 is not less than the distance between the side of the packaged chip 3 away from the base plate 1 and the base plate 1.

[0074] In an exemplary embodiment, the packaged chip 3 may include a MEMS chip 31 and an ASIC chip 32.

[0075] In an exemplary embodiment, the base plate 1 can be a PCB board.

[0076] In an exemplary embodiment, the packaged chip 3 can be connected to the base plate 1 either upright or flip-chip. (See reference...) Figure 2b and Figure 4bAs shown, the packaged chip is mounted upright and connected to the base plate 1. The MEMS chip 31 and the ASIC chip 32 are connected via a connecting wire 33, and the ASIC chip 32 is connected to the base plate 1 via the connecting wire 33. (Reference) Figure 2a and Figure 4a As shown, the packaged chip is flip-chip connected to the base plate 1, the MEMS chip 31 and the ASIC chip 32 are connected through the base plate 1, and the ASIC chip 32 is connected to the base plate 1 through the connecting wire 33.

[0077] In an exemplary implementation, from Figures 2a to 4b In the schematic diagram of a packaging device shown, the casing can be cylindrical.

[0078] By setting a blocking structure on the side of the ring-shaped casing facing the packaged chip, the encapsulating adhesive 4 is used to block the encapsulating adhesive 4 during the encapsulation of the packaged chip 3, preventing the encapsulating adhesive 4 from creeping along the casing 2 near the casing 2. Simultaneously, since the distance between the blocking structure and the base plate 1 is not less than the distance between the side of the packaged chip 3 away from the base plate 1 and the base plate 1, combined with the blocking effect of the blocking structure, when a sufficient amount of encapsulating adhesive 4 is injected into the cavity, the height difference between the liquid level of the encapsulating adhesive 4 at the center of the cavity and the liquid level of the encapsulating adhesive 4 at the blocking structure is small, which is sufficient for effective encapsulation of the packaged chip 3. Without increasing the height of the casing 2, i.e., the size of the cavity, encapsulation of the packaged chip 3 is achieved while preventing and suppressing adhesive creep.

[0079] In some embodiments, the distance difference between the encapsulating adhesive 4 located at the center of the cavity and the side of the encapsulating adhesive located at the blocking structure away from the base plate 1 is no more than 500 micrometers.

[0080] In an exemplary embodiment, the distance difference between the encapsulating adhesive 4 located at the center of the cavity and the side of the encapsulating adhesive located at the blocking structure away from the base plate 1 is 300 to 500 micrometers.

[0081] The liquid level difference of encapsulant 4 is within the controllable range of 300-500 micrometers in MEMS sensors, which can ensure better consistency in the calibration performance of MEMS sensors.

[0082] In some embodiments, reference Figure 8a and Figure 8b As shown, the housing 2 includes a first housing 21, which is connected to the base plate 1, and the middle part of the first housing 21 protrudes in a direction away from the packaged chip; a blocking structure ring is provided around the first housing 21 and is disposed on the side facing the packaged chip.

[0083] In an exemplary embodiment, the cross-sectional shape of the first shell 21 can be an outwardly protruding arc or a semi-circle. No specific limitation is made here.

[0084] In this embodiment, during the encapsulation of the chip using encapsulating adhesive, a blocking structure arranged around the first housing 21 and facing the chip prevents the encapsulating adhesive from creeping along the first housing 21. Furthermore, the cross-sectional shape of the first housing 21 has a certain curvature, with a protruding section in the middle away from the chip, and a tapered section on the side away from the base plate 1. Correspondingly, the curvature of the first housing 21 from its most protruding position to the side away from the base plate 1 increases the creeping angle of the encapsulating adhesive, further increasing the difficulty of creeping under the weight of the encapsulating adhesive itself.

[0085] By utilizing the blocking structure and the adhesive creep angle of the first casing 21, the adhesive creep phenomenon is further suppressed, while the encapsulation of the packaged chip is completed.

[0086] In some embodiments, reference Figure 8a and Figure 8b The housing 2 also includes a second housing 22, which is connected to the side of the first housing 21 away from the base plate 1. The second housing 22 extends away from the base plate 1; or the second housing 22 extends away from the base plate 1 and away from the packaged chip.

[0087] In an exemplary embodiment, the second shell 22 can be cylindrical or funnel-shaped, and no specific limitation is made here.

[0088] In this embodiment, with Figure 8a For example, a second shell 22 is provided on the side of the first shell 21 away from the base plate 1. The second shell 22 extends away from the base plate 1, and the second shell 22 has a "narrow waist" shape relative to the first shell 21 and the second shell 22 as a whole. On the one hand, the "narrow waist" design of the second shell 22 facilitates subsequent mounting on the whole device via O-rings. The whole device can be a sensor, mobile terminal, laptop, etc. On the other hand, the "narrow waist" design of the second shell 22 can serve as a liquid level limit for the encapsulating adhesive, ensuring that the liquid level of the encapsulating adhesive is controllable. Due to process errors, the amount of encapsulating adhesive injected each time during the encapsulation of the chip in the cavity is not exactly the same. By using the second shell 22 as a liquid level limit hole for the encapsulating adhesive, when the amount of encapsulating adhesive injected is large and exceeds the first shell 21 and the blocking structure, the second shell 22 can be used to further limit the overflow of the encapsulating adhesive. At the same time, the amount of encapsulating adhesive injected can be observed through the opening on the side of the second shell 22 away from the first shell 21.

[0089] Similarly, refer to Figure 8bAs shown, a second shell 22 is provided on the side of the first shell 21 away from the base plate 1. The second shell 22 extends away from the base plate 1 and away from the packaged chip, achieving the same effect as in the above embodiment. The "waist-shaped" design at the connection between the first shell 21 and the second shell 22 also facilitates the subsequent installation of the O-ring onto the entire device. With the opening of the second shell 22 on the side of the first shell 21 away from the base plate 1 gradually increasing, when a large amount of encapsulating adhesive is injected, the cavity formed by the second shell 22 is larger, preventing encapsulating adhesive overflow. At the same time, the larger opening facilitates observation of the amount of encapsulating adhesive injected.

[0090] In other embodiments, reference is made to... Figure 9a , Figure 9b , Figure 10 , Figure 11a , Figure 11b , Figure 12 , Figure 13 , Figure 14 and Figure 15 As shown, the housing 2 includes a first housing 21, which is connected to the base plate 1 and extends away from the base plate 1 and closer to the packaged chip; a blocking structure ring is provided around the first housing 21 and facing the packaged chip.

[0091] In an exemplary embodiment, the first shell 21 can be conical, that is, the cross-sectional shape of the first shell 21 can be trapezoidal.

[0092] In this embodiment, during the encapsulation of the chip using encapsulating adhesive, a blocking structure disposed around the first housing 21 and facing the chip blocks the encapsulating adhesive near the first housing 21, suppressing the adhesive from creeping along the first housing 21. Furthermore, the first housing 21 has a trapezoidal cross-sectional shape. The extension direction of the first housing 21 from the side facing the base plate 1 to the side away from the base plate 1 increases the creeping angle of the encapsulating adhesive, further increasing the difficulty of adhesive creeping under the influence of the adhesive's own gravity.

[0093] By utilizing the blocking structure and the adhesive creep angle of the first casing 21, the adhesive creep phenomenon is further suppressed, while the encapsulation of the packaged chip is completed.

[0094] In some embodiments, reference Figure 9a , Figure 9b , Figure 10 , Figure 11a , Figure 11b , Figure 12 , Figure 13 , Figure 14 and Figure 15As shown, the casing 2 also includes a second casing 22, which is connected to the side of the first casing 21 away from the base plate 1. The second casing 22 extends in a direction away from the base plate 1; or the second casing 22 extends in a direction away from the base plate 1 and away from the packaged chip.

[0095] In an exemplary embodiment, the second shell 22 can be cylindrical or funnel-shaped.

[0096] In this embodiment, with Figure 9a For example, a second shell 22 is provided on the side of the first shell 21 away from the base plate 1. The second shell 22 extends away from the base plate 1 and away from the packaged chip. The connection between the second shell 22 and the first shell 21 also has a "waist-shaped" design. On the one hand, the "waist-shaped" design facilitates subsequent mounting on the whole device via O-rings. The whole device can also be a sensor, mobile terminal, laptop, etc. On the other hand, the "waist-shaped" design can serve as a liquid level limit for the encapsulating adhesive, ensuring that the liquid level of the encapsulating adhesive is controllable.

[0097] Similarly, refer to Figure 9b As shown, a second tube shell 22 is provided on the side of the first tube shell 21 away from the base plate 1. The second tube shell 22 extends in the direction away from the base plate 1, which has the same effect as the above embodiment, and will not be described again here.

[0098] In some embodiments, reference Figure 16a , Figure 16b , Figure 17a , Figure 17b , Figure 18 , Figure 19 , Figure 20 , Figure 21 and Figure 22 As shown, the housing 2 includes a first housing 21 and a second housing 22. The first housing 21 is connected to the base plate 1 and extends away from the base plate 1 and away from the packaged chip. The second housing 22 is connected to the side of the first housing 21 away from the base plate 1 and extends away from the base plate 1. Alternatively, the second housing 22 extends away from the base plate 1 and toward the packaged chip.

[0099] In an exemplary embodiment, the cross-sectional shape of the first shell 21 can be an inverted trapezoid, and the cross-sectional shape of the second shell 22 can be a trapezoid.

[0100] In this embodiment, the cavity requirements differ for different application scenarios of packaged chips. Some packaged chips have a large number of interconnecting lines 33 between them, which occupy a large cavity space. Therefore, while suppressing glue creep, it is also necessary to ensure that the cavity space is sufficient and to avoid making the packaged device too large as much as possible.

[0101] The first housing 21 extends away from the ground plane and away from the packaged chip, while the second housing 22 extends away from the base plate 1, such as... Figure 16b and Figure 17b As shown, or the second casing 22 extends away from the ground and toward the packaged chip, as... Figure 16a and Figure 16b As shown, the connection between the first housing 21 and the second housing 22 is designed with a "thick waist" shape. This "thick waist" design increases the cavity formed between the first housing 21 and the base plate 1, allowing for the accommodation of more packaged chips and / or connecting lines 33.

[0102] It should be noted that, compared to the overall diameter of the tube shell being consistent with the "thick waist" design, this application reduces the footprint of the base plate 1 and also has a smaller volume.

[0103] Furthermore, during the encapsulation of the chip using encapsulating adhesive, a blocking structure positioned around the first housing 21 facing the chip blocks the encapsulating adhesive near the first housing 21, suppressing adhesive creep along the first housing 21. By utilizing the blocking structure and the extension direction of the first housing 21 to suppress creep, encapsulation of more connecting lines 33 or more space-consuming chips is achieved, preventing the encapsulation device from becoming too large.

[0104] Furthermore, the second housing 22 can extend in a direction away from the base plate 1 or away from the base plate 1 and towards the packaged chip. Due to process errors, the amount of encapsulating adhesive injected each time during the encapsulation of the chip within the cavity is not exactly the same. The second housing 22 acts as a liquid level limiting hole for the encapsulating adhesive. When the amount of encapsulating adhesive injected is large and exceeds the first housing 21 and the blocking structure, the second housing 22 can further limit the overflow of the encapsulating adhesive. Simultaneously, the opening on the side of the second housing 22 away from the first housing 21 can be used to observe the amount of encapsulating adhesive injected. This achieves liquid level limiting of the encapsulating adhesive.

[0105] In some embodiments, reference Figure 2a , Figure 2b , Figure 8a , Figure 8b , Figure 9a , Figure 9b , Figure 16a and Figure 16b As shown, the blocking structure includes a protrusion 51, which is arranged around the first housing 21 on the side facing the packaged chip.

[0106] In an exemplary embodiment, protrusion 51 may be a single one.

[0107] By using the protrusion 51 structure provided around the first casing 21 and facing the packaged chip, during the process of encapsulating the packaged chip with encapsulating adhesive, the protrusion 51 provided around the first casing 21 and facing the packaged chip blocks the encapsulating adhesive near the first casing 21, and suppresses the encapsulating adhesive near the first casing 21 from crawling along the first casing 21.

[0108] In other embodiments, reference is made to... Figure 3 , Figure 10 and Figure 18 As shown, in some embodiments, there are multiple protrusions 51, which are evenly arranged along the side of the first casing 21 near the base plate 1 to the side away from the base plate 1; and the distance between the protrusion 51 farthest from the base plate 1 and the base plate 1 is not less than the distance between the packaged chip on the side away from the base plate 1 and the base plate 1.

[0109] In an exemplary embodiment, the blocking structure includes a protrusion 51, and the first tube shell 21 can be cylindrical, conical, spherical, "narrow waist" structure or "thick waist" structure, without specific limitation.

[0110] In an exemplary embodiment, the number of protrusions 51 can be 2, 3, 4, etc., and no specific limitation is made here.

[0111] It is understandable that the encapsulating adhesive creeping phenomenon is not merely due to the interaction between the liquid surface of the encapsulating adhesive and the first housing 21, causing the encapsulating adhesive to adhere to the first housing 21. Rather, the entire contact area between the encapsulating adhesive and the first housing 21 is subject to adsorption, resulting in creeping. By providing multiple protrusions 51 around the side of the first housing 21 near the packaged chip, the encapsulating adhesive creeping can be blocked, delaying or inhibiting it.

[0112] Furthermore, the distance between the protrusion 51 furthest from the base plate 1 and the base plate 1 is not less than the distance between the side of the packaged chip furthest from the base plate 1 and the base plate 1. That is, the protrusion 51 furthest from the base plate 1 is higher than the height of the packaged chip, so that during the packaging process, the encapsulating adhesive can at least cover the packaged chip, thereby achieving effective encapsulation of the packaged chip.

[0113] In an exemplary embodiment, the blocking structure includes a plurality of protrusions 51, and the first tube shell 21 may be cylindrical, conical, spherical, "narrow waist" structure or "thick waist" structure, without specific limitation.

[0114] In some embodiments, reference Figure 4a , Figure 4b , Figure 11a , Figure 11b , Figure 17a and Figure 17bAs shown, the blocking structure includes a groove 52, which is arranged around the first housing 21 on the side facing the packaged chip.

[0115] In an exemplary embodiment, the groove 52 may be a single groove.

[0116] The groove 52 structure provided around the first housing 21 and facing the packaged chip allows the encapsulating adhesive to be used to encapsulate the chip during the process of encapsulating the chip. The groove 52 accommodates the encapsulating adhesive near the first housing 21 and blocks the encapsulating adhesive, thus preventing the encapsulating adhesive near the first housing 21 from creeping along the first housing 21.

[0117] In an exemplary embodiment, the blocking structure includes a groove 52, and the first tube shell 21 can be cylindrical, conical, spherical, "narrow waist" structure or "thick waist" structure, without specific limitation.

[0118] In other embodiments, reference is made to... Figure 5 , Figure 12 and Figure 19 As shown, there are multiple grooves 52, which are evenly arranged along the side of the first casing 21 near the base plate 1 to the side away from the base plate 1; and the distance between the groove 52 farthest from the base plate 1 and the base plate 1 is not less than the distance between the side of the packaged chip away from the base plate 1 and the base plate 1.

[0119] In an exemplary embodiment, the number of protrusions 51 can be 2, 3, 4, etc., and no specific limitation is made here.

[0120] It is understandable that the encapsulating adhesive adheres to the first housing 21 at the contact points, resulting in adhesive creep. Multiple grooves 52 are provided around the first housing 21 near the packaged chip to contain and block the encapsulating adhesive, thus delaying or suppressing its creep.

[0121] Furthermore, the distance between the groove 52 furthest from the base plate 1 and the base plate 1 is not less than the distance between the side of the packaged chip furthest from the base plate 1 and the base plate 1. That is, the groove 52 furthest from the base plate 1 is higher than the height of the packaged chip, so that during the packaging process, the encapsulating adhesive can at least cover the packaged chip, thus achieving effective encapsulation of the packaged chip.

[0122] In an exemplary embodiment, the blocking structure includes a plurality of grooves 52, and the first tube shell 21 may be cylindrical, conical, spherical, "narrow waist" structure or "thick waist" structure, without specific limitation.

[0123] In some embodiments, reference Figure 13 and Figure 20As shown, the blocking structure includes a protrusion 51 and a groove 52. The protrusion 51 is arranged around the first tube shell 21 on the side facing the packaged chip, and the groove 52 is adjacent to the side of the protrusion 51 facing the base plate 1, and the groove 52 is arranged around the side of the first tube shell 21 facing the packaged chip.

[0124] In an exemplary embodiment, the number of protrusions 51 and grooves 52 can be one.

[0125] In this embodiment, a protrusion 51 structure is provided on the side of the first casing 21 facing the packaged chip, and a groove 52 is further provided adjacent to the side of the protrusion 51 facing the base plate 1. By using the length of the protrusion 51 and the depth of the groove 52, the distance between the protrusion 51 and the side of the first casing 21 facing the packaged chip is made larger. The groove 52 is used to accommodate and block the encapsulating adhesive near the first casing 21, and the protrusion 51 is also used to block the encapsulating adhesive. This greatly suppresses the phenomenon of encapsulating adhesive crawling along the first casing 21.

[0126] Furthermore, the distance between the protrusion 51 furthest from the base plate 1 and the base plate 1 is not less than the distance between the side of the packaged chip furthest from the base plate 1 and the base plate 1. That is, the protrusion 51 furthest from the base plate 1 is higher than the height of the packaged chip, so that during the packaging process, the encapsulating adhesive can at least cover the packaged chip, thereby achieving effective encapsulation of the packaged chip.

[0127] In an exemplary embodiment, the blocking structure includes a protrusion 51 and a groove 52. The first tube shell 21 can be cylindrical, conical, spherical, "narrow waist" structure or "thick waist" structure, without specific limitation.

[0128] In other embodiments, reference is made to... Figure 6 , Figure 14 and Figure 21 As shown, there can be multiple protrusions 51 and grooves 52. Multiple protrusions 51 are evenly arranged along the side of the first casing 21 near the base plate 1 to the side away from the base plate 1. Multiple grooves 52 are respectively arranged adjacent to the side of multiple protrusions 51 facing the base plate 1. The distance between the protrusion 51 farthest from the base plate 1 and the base plate 1 is not less than the distance between the packaged chip on the side away from the base plate 1 and the base plate 1.

[0129] In an exemplary embodiment, the number of protrusions 51 and grooves 52 can be 2, 3, 4, etc., respectively, and no specific limitation is made here.

[0130] In this embodiment, the encapsulating adhesive adheres to the first housing 21 at all contact points, resulting in adhesive creep. Multiple protrusions 51 are provided around the first housing 21 near the encapsulated chip, and multiple grooves 52 are further provided adjacent to the protrusions 51 facing the base plate 1. The length of the protrusions 51 and the depth of the grooves 52 are combined to increase the distance between the protrusions 51 and the side of the first housing 21 facing the encapsulated chip. The multiple protrusions 51 and grooves 52 work together to both accommodate and block the encapsulating adhesive near the first housing 21, while the protrusions 51 further block the adhesive, thus significantly suppressing the creep of the encapsulating adhesive along the first housing 21.

[0131] In an exemplary embodiment, the blocking structure includes a plurality of protrusions 51 and a plurality of grooves 52. The first tube shell 21 may be cylindrical, conical, spherical, "narrow waist" structure or "thick waist" structure, without specific limitation.

[0132] In some embodiments, reference Figure 7 , Figure 15 and Figure 22 As shown, the blocking structure includes multiple protrusions 51 and multiple grooves 52. The multiple protrusions 51 and multiple grooves 52 are all arranged around the first tube shell 21 towards the cavity side, and the multiple protrusions 51 and multiple grooves 52 are spaced apart along the side of the first tube shell 21 towards the base plate 1. The distance between the protrusions 51 or grooves 52 away from the base plate 1 and the base plate 1 is not less than the distance between the side of the packaged chip away from the base plate 1 and the base plate 1.

[0133] In an exemplary embodiment, the number of protrusions 51 and grooves 52 can be 2, 3, 4, etc., respectively, and no specific limitation is made here.

[0134] In this embodiment, similar to the above embodiment, multiple protrusions 51 and multiple grooves 52 are spaced apart. The protrusions 51 and grooves 52 work together to block the encapsulating adhesive and suppress the phenomenon of adhesive creep.

[0135] Furthermore, the distance between the farthest protrusion 51 or groove 52 from the base plate 1 and the base plate 1 is not less than the distance between the side of the packaged chip furthest from the base plate 1 and the base plate 1. That is, the farthest protrusion 51 or groove 52 from the base plate 1 is higher than the height of the packaged chip, so that during the packaging process, the encapsulating adhesive can at least cover the packaged chip, thereby achieving effective encapsulation of the packaged chip.

[0136] It should be noted that the part furthest from the base plate 1 can be either a protrusion 51 or a groove 52; no specific limitation is made here. (Refer to...) Figure 7 , Figure 15 and Figure 22 As shown, in this embodiment of the application, the structure furthest from the base plate 1 is the protrusion 51.

[0137] In some embodiments, the second tube shell 22 is provided with an injection port on the side away from the base plate 1, and the size of the injection port is greater than 1 mm.

[0138] In an exemplary embodiment, the size of the injection port can be either the diameter or the side length, and is not specifically limited here.

[0139] In an exemplary embodiment, during the filling of encapsulating adhesive, a dispensing needle is used for filling, and the diameter of the dispensing needle can be 0.1 to 0.5 mm.

[0140] In an exemplary embodiment, the size of the dispensing nozzle is 10 times the diameter of the dispensing needle.

[0141] In this embodiment, during the encapsulation of the chip using encapsulating adhesive through a dispensing process, the size of the dispensing port must be sufficient to ensure that the adhesive completely enters the cavity and does not accumulate at the dispensing port. Simultaneously, the opening design of the dispensing port also allows for sufficient space to ensure precise dispensing positioning.

[0142] In some embodiments, reference Figure 2a , Figure 2b As shown, the distance between the side of the protrusion 51 away from the first tube shell 21 and the side facing the first tube shell 21 is not less than 100 micrometers, and the distance between the side of the protrusion 51 away from the base plate 1 and the side facing the base plate 1 is not less than 100 micrometers.

[0143] In an exemplary embodiment, the distance between the side of the protrusion 51 away from the first housing 21 and the side facing the first housing 21 can be 100 micrometers to 200 micrometers.

[0144] In this embodiment, the distance between the side of the protrusion 51 away from the first housing 21 and the side facing the first housing 21 is not less than 100 micrometers, and the distance between the side of the protrusion 51 away from the base plate 1 and the side facing the base plate 1 is not less than 100 micrometers. That is, the lateral dimension of the protrusion 51 is not less than 100 micrometers, and the longitudinal dimension is not less than 100 micrometers. This can effectively prevent the encapsulating adhesive from crossing the protrusion 51, thus blocking the encapsulating adhesive and effectively suppressing the phenomenon of adhesive creep. It can also ensure that the liquid level difference of the encapsulating adhesive is within a controllable range of 300 micrometers to 500 micrometers, thereby ensuring the effectiveness and consistency of encapsulation.

[0145] In some embodiments, reference Figure 4a , Figure 4b As shown, the depth of the groove 52 is not less than 100 micrometers, and the distance between the side of the groove 52 away from the base plate 1 and the side facing the base plate 1 is not less than 100 micrometers; wherein, the depth of the groove 52 represents the distance between the side of the groove 52 close to the cavity and the side away from the cavity.

[0146] In an exemplary embodiment, the depth of the groove 52 can be 100 micrometers to 200 micrometers.

[0147] In this embodiment, the distance between the side of the groove 52 closest to the cavity and the side furthest from the cavity is not less than 100 micrometers, and the distance between the side furthest from the base plate 1 and the side facing the base plate 1 is not less than 100 micrometers. That is, the depth of the groove 52 is not less than 100 micrometers, and the longitudinal dimension is not less than 100 micrometers. This can effectively prevent the encapsulating adhesive from crossing the groove 52, thus blocking the encapsulating adhesive and effectively suppressing the phenomenon of adhesive creep. It can also ensure that the liquid level difference of the encapsulating adhesive is within a controllable range of 300 micrometers to 500 micrometers, thereby ensuring the effectiveness and consistency of encapsulation.

[0148] Based on the same inventive concept, this application provides an electronic device, including the packaging device in any of the above embodiments. The electronic device can be a mobile electronic device with MEMS sensor function, such as a smartphone, sports watch, tablet computer, laptop computer, or drone, or a fixed device with MEMS sensor function, such as an in-vehicle device, engineering robot, or instrument.

[0149] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the scope of this utility model, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this utility model as described above, which are not provided in the details for the sake of brevity.

[0150] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0151] Although this application has been described in conjunction with specific embodiments of the present invention, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0152] The embodiments of this utility model are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this utility model should be included within the protection scope of this utility model.

Claims

1. A packaging device, characterized in that, include: Base plate; The tube shell is arranged around one side of the base plate and forms a cavity with the base plate; The packaged chip is disposed within the cavity and connected to the base plate; A blocking structure is disposed around the casing and facing the side of the packaged chip, and the distance between the blocking structure and the base plate is not less than the distance between the side of the packaged chip away from the base plate and the base plate.

2. The packaging device according to claim 1, characterized in that, The casing includes a first casing, which is connected to the base plate, and the middle part of the first casing protrudes in a direction away from the packaged chip. The blocking structure is arranged around the first casing and facing the side of the packaged chip.

3. The packaging device according to claim 1, characterized in that, The casing includes a first casing, which is connected to the base plate, and the first casing extends in a direction away from the base plate and close to the packaged chip; The blocking structure is arranged around the first casing and facing the side of the packaged chip.

4. The packaging device according to claim 2, characterized in that, The casing also includes a second casing, which is connected to the side of the first casing away from the base plate, and the second casing extends away from the base plate; or the second casing extends away from the base plate and away from the packaged chip.

5. The packaging device according to claim 3, characterized in that, The casing also includes a second casing, which is connected to the side of the first casing away from the base plate, and the second casing extends away from the base plate; or the second casing extends away from the base plate and away from the packaged chip.

6. The packaging device according to claim 1, characterized in that, The tubular shell includes a first tubular shell and a second tubular shell, the first tubular shell being connected to the base plate and extending away from the base plate; The second tube shell is connected to the side of the first tube shell away from the base plate, and the second tube shell extends in a direction away from the base plate; Alternatively, the second casing may extend away from the base plate and toward the packaged chip.

7. The packaging apparatus according to any one of claims 2 to 6, characterized in that, The blocking structure includes a protrusion, which is arranged around the first casing on the side facing the packaged chip.

8. The packaging apparatus according to claim 7, characterized in that, The protrusions are multiple, and the multiple protrusions are evenly distributed along the side of the first tube shell near the bottom plate to the side away from the bottom plate; Furthermore, the distance between the protrusion furthest from the base plate and the base plate is not less than the distance between the side of the packaged chip furthest from the base plate and the base plate.

9. The packaging apparatus according to any one of claims 2 to 6, characterized in that, The blocking structure includes a groove, which is disposed around the side of the first casing facing the packaged chip.

10. The packaging apparatus according to claim 9, characterized in that, The grooves are multiple, and the multiple grooves are evenly distributed along the side of the first tube shell near the bottom plate to the side away from the bottom plate; Furthermore, the distance between the groove furthest from the base plate and the base plate is not less than the distance between the side of the packaged chip furthest from the base plate and the base plate.

11. The packaging apparatus according to any one of claims 2 to 6, characterized in that, The blocking structure includes a protrusion and a groove. The protrusion is arranged around the side of the first casing facing the packaged chip, and the groove is arranged adjacent to the side of the protrusion facing the base plate, and the groove is arranged around the side of the first casing facing the packaged chip.

12. The packaging apparatus according to claim 11, characterized in that, Both the protrusions and the grooves are multiple. The multiple protrusions are evenly arranged along the side of the first tube shell close to the bottom plate to the side away from the bottom plate. The multiple grooves are respectively arranged adjacent to the multiple protrusions on the side facing the bottom plate. Furthermore, the distance between the protrusion furthest from the base plate and the base plate is not less than the distance between the side of the packaged chip furthest from the base plate and the base plate.

13. The packaging apparatus according to any one of claims 2 to 6, characterized in that, The blocking structure includes multiple protrusions and multiple grooves. The multiple protrusions and multiple grooves are all arranged around the first tube shell on the side facing the cavity, and the multiple protrusions and multiple grooves are spaced apart along the side of the first tube shell facing the bottom plate to the side away from the bottom plate. Furthermore, the distance between the protrusion or groove on the side away from the base plate and the base plate is not less than the distance between the packaged chip on the side away from the base plate and the base plate.

14. The packaging apparatus according to any one of claims 4 to 6, characterized in that, The second tube shell has an injection port on the side away from the base plate, and the size of the injection port is greater than 1 mm.

15. The packaging apparatus according to claim 7, characterized in that, The distance between the side of the protrusion away from the first tube shell and the side facing the first tube shell is not less than 100 micrometers, and the distance between the side of the protrusion away from the base plate and the side facing the base plate is not less than 100 micrometers.

16. The packaging apparatus according to claim 9, characterized in that, The depth of the groove is not less than 100 micrometers, and the distance between the side of the groove away from the base plate and the side facing the base plate is not less than 100 micrometers; wherein, the depth of the groove represents the distance between the side of the groove close to the cavity and the side away from the cavity.

17. The packaging apparatus according to claim 1, characterized in that, The cavity contains encapsulating adhesive, which is configured to encapsulate the packaged chip; the distance difference between the encapsulating adhesive located at the center of the cavity and the side of the encapsulating adhesive located at the blocking structure away from the base plate and the base plate is no greater than 500 micrometers.

18. An electronic device, characterized in that, Includes the packaging device as described in any one of claims 1 to 17.

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