Conductive adhesive for improving connection stability of PCB (Printed Circuit Board)

Abstract

The utility model provides a conductive adhesive for improving the connection stability of a PCB (Printed Circuit Board), which belongs to the technical field of improving the connection stability of the PCB and comprises a colloid base, a conductive filler, an adhesion promoter, a reinforcing agent and a decentralized control assembly, the colloid base is made of epoxy resin materials and is in a cylindrical container shape, an annular groove is formed in the bottom of the colloid base, and a plurality of miniature barb structures are evenly distributed on the inner wall of the groove. The conductive filler is uniformly dispersed in the colloid base, and the conductive filler is silver powder particles; the decentralized control assembly is arranged at the top of the colloid base; the utility model provides a conductive adhesive for improving the connection stability of a PCB (Printed Circuit Board), which can solve the problem that the reliability and the service life of electronic equipment are seriously influenced because the electrical connection between the conductive adhesive and the PCB is easily in poor contact, the conductivity is reduced or even completely invalid under the severe conditions of temperature fluctuation, mechanical vibration, long-term use and the like.

Description

Technical Field

[0001] This utility model belongs to the technical field of improving the connection stability of PCB boards, and specifically relates to a conductive adhesive for improving the connection stability of PCB boards. Background Technology

[0002] As electronic products evolve towards miniaturization, high integration, and high reliability, PCB board connection technology faces increasingly stringent requirements. Conductive adhesive, as an important PCB board connection material, is widely used in the electronic assembly field. Traditional conductive adhesives mainly consist of a polymer matrix and conductive fillers, with common conductive fillers including metal particles such as silver powder, copper powder, and nickel powder. These conductive adhesives connect the PCB board to electronic components through adhesion, while simultaneously forming conductive pathways through the contact between the conductive fillers. However, existing conductive adhesives have several shortcomings. First, the conductive fillers are prone to uneven distribution in the adhesive, forming localized aggregations or sparse areas, leading to unstable conductivity. Second, traditional conductive adhesives rely on simple surface adhesion to achieve connection, lacking an effective mechanical locking structure. Under the influence of external environmental factors such as temperature changes and mechanical vibrations, the adhesion strength is prone to decrease, and even detachment may occur. Third, the contact between conventional conductive fillers is mostly point contact, with a small contact area, high and unstable resistance. Over time and with changes in external conditions, the contact state is prone to change, leading to a decline in conductivity. Furthermore, existing conductive adhesives are prone to internal structural damage when subjected to external mechanical stresses such as tension and shear, leading to disruption of the conductive network and a sharp decline in conductivity. Current technologies typically address these issues by increasing the content of conductive fillers, altering the adhesive matrix material, or adding various additives. However, these methods often have trade-offs; for example, increasing the conductive filler content reduces the adhesive's flexibility and adhesion; altering the adhesive matrix material may affect its compatibility with PCB boards; and adding additives may introduce impurities, affecting the stability of conductivity. Utility Model Content

[0003] In view of this, the present invention provides a conductive adhesive that improves the connection stability of PCB boards, which can solve the problem that the electrical connection between the conductive adhesive and the PCB board is prone to poor contact, decreased conductivity or even complete failure under harsh conditions such as temperature fluctuations, mechanical vibration and long-term use, which seriously affects the reliability and service life of electronic devices.

[0004] This utility model is implemented as follows:

[0005] This invention provides a conductive adhesive for improving the connection stability of PCB boards, comprising: an adhesive base, a conductive filler, an adhesion promoter, a reinforcing agent, and a dispersion control component; the adhesive base is made of epoxy resin and is in the shape of a cylindrical container with an annular groove at the bottom, the inner wall of which is uniformly distributed with multiple micro-barb structures; the conductive filler is uniformly dispersed inside the adhesive base, and the conductive filler is silver powder particles with an irregular sheet-like structure and a surface covered with nano-scale spikes; the adhesion promoter is mixed inside the adhesive base, and the molecular chain ends of the adhesion promoter are... It has polar functional groups; the reinforcing agent has a fibrous structure, and the central axis of the fibrous structure runs through the entire silver powder particle aggregate; the dispersion control component is disposed on the top of the colloidal base, and the dispersion control component includes a pressure sensing ring, a micro stirring shaft and a locking mechanism. The pressure sensing ring is fixedly installed around the top edge of the colloidal base, and the micro stirring shaft passes vertically through the center of the colloidal base. A stirring blade is fixedly connected to the bottom end of the micro stirring shaft, and the stirring blade has a spiral structure; the locking mechanism is disposed on the inner side wall of the pressure sensing ring and is used to control the rotation position of the micro stirring shaft.

[0006] The technical effects of this conductive adhesive for improving the connection stability of PCB boards are as follows: Through the synergistic effect of the adhesive base, conductive filler, adhesion promoter, reinforcing agent, and dispersion control component, a combination of high conductivity and strong physical connection is achieved. The annular groove and micro-barb structure enhance the mechanical connection strength between the conductive adhesive and the PCB board; the nanoscale protrusions on the surface of the silver powder particles improve the stability of the conductive pathway; the polar functional groups of the adhesion promoter enhance the adhesion effect; the fibrous reinforcing agent penetrates the silver powder particle aggregates to form a stable skeleton structure; and the dispersion control component ensures the uniform distribution of the conductive filler. These factors comprehensively improve the mechanical strength and electrical conductivity of the PCB board connection, significantly enhancing the stability and reliability of the PCB board connection.

[0007] Based on the above technical solution, the conductive adhesive of this utility model for improving the connection stability of PCB boards can be further improved as follows:

[0008] The depth of the annular groove is one-fifth of the height of the colloidal base, and the width of the annular groove is one-quarter of the diameter of the colloidal base. The micro-barb structure is triangular pyramidal in shape, with the tip of the barb pointing towards the center of the annular groove. The bottom surface of the barb is fixedly connected to the inner wall of the annular groove, and the height of the barb is one-third of the depth of the annular groove. The multiple micro-barb structures are arranged in a ring array on the inner wall of the annular groove, and the spacing between adjacent barbs is twice the diameter of the bottom surface of the barb.

[0009] The beneficial effects of adopting the above-mentioned improved scheme are as follows: By precisely designing the depth of the annular groove to be one-fifth of the height of the colloid base and the width to be one-quarter of the diameter of the colloid base, sufficient space is ensured in the groove to accommodate the PCB board connection parts without weakening the overall structural strength of the colloid base. The triangular pyramidal structure of the micro-barbs, the center-facing tip design, and the dimension of one-third of the depth of the annular groove enable the barbs to effectively lock the PCB board connection parts. The circular array distribution with a spacing twice the diameter of the barb's bottom surface ensures that the micro-barb structure covers most of the inner wall of the annular groove, providing omnidirectional mechanical connection points and significantly enhancing the connection stability between the PCB board and the conductive adhesive.

[0010] Furthermore, the average diameter of the silver powder particles is 10 to 50 micrometers, and the thickness is 1 to 5 micrometers; the height of the nanoscale spikes is 50 to 200 nanometers, and the spike tips are blunt and rounded; the surface density of the silver powder particles is 3 to 8 nanoscale spikes per square micrometer; the mass content of the silver powder particles in the colloidal matrix is ​​65% to 85%, and the silver powder particles form a conductive network structure through physical contact.

[0011] The beneficial effects of adopting the above-mentioned improved scheme are as follows: the size design of the silver powder particles (average diameter 10-50 micrometers, thickness 1-5 micrometers) ensures sufficient contact surface area, while the surface nanoscale spikes (height 50-200 nanometers, blunt rounded shape) enhance the mechanical and electrical connections between the silver powder particles. The spike density (3-8 per square micrometer) optimizes the contact point distribution and avoids poor contact. The high-quality content of 65%-85% of the silver powder particles in the colloidal matrix ensures the formation of a continuous and stable conductive network, while the network structure formed by physical contact reduces resistivity and improves current conduction efficiency, while maintaining sufficient flexibility to adapt to the slight deformation of the PCB board under temperature changes and mechanical vibration, thereby significantly improving conductivity and connection stability.

[0012] Furthermore, the fibrous structure is made of carbon fiber material, in the form of long filaments with a diameter of 0.5 micrometers to 2 micrometers and a length of 50 micrometers to 200 micrometers; the surface of the fibrous structure is coated with a nanoscale silver layer with a thickness of 20 nanometers to 100 nanometers; the fibrous structure is distributed in a three-dimensional network in the colloidal substrate, with multiple intersections between the fibers, and spherical connection nodes formed at the intersections; the mass content of the carbon fiber material is 5% to 15% of the total mass of the colloidal substrate.

[0013] The beneficial effects of the above-mentioned improved scheme are as follows: The fibrous structure made of carbon fiber (0.5-2 micrometers in diameter and 50-200 micrometers in length) provides a robust skeletal support for the conductive adhesive, significantly enhancing its structural strength and tensile strength. The surface-coated nanoscale silver layer (20-100 nanometers thick) not only enhances the conductivity of the fibers but also promotes the conductive connection between the fibers and silver powder particles. The three-dimensional network-distributed fiber structure forms multiple intersections and spherical connection nodes, constructing a skeletal network that runs through the entire adhesive, greatly enhancing the mechanical strength and stress dispersion ability of the conductive adhesive. The 5%-15% carbon fiber mass content ensures sufficient reinforcement without excessively affecting the flowability and workability of the conductive adhesive, achieving an optimized balance between strength and conductivity.

[0014] Furthermore, the pressure sensing ring is made of elastic material and is circular in shape, with its inner diameter closely fitting the outer diameter of the colloid base; the cross-section of the pressure sensing ring is trapezoidal, with the width of the upper base being smaller than the width of the lower base; the thickness of the pressure sensing ring is one-sixth of the height of the colloid base; the outer surface of the pressure sensing ring is provided with an annular protrusion, the height of which is one-quarter of the thickness of the pressure sensing ring, and the top of the annular protrusion is provided with anti-slip texture, which is arranged in a herringbone pattern.

[0015] The beneficial effects of adopting the above-mentioned improved scheme are as follows: The pressure sensing ring made of elastic material can sensitively detect changes in external pressure, ensuring that appropriate pressure is applied during PCB board connection. The trapezoidal cross-section design (the width of the upper base is smaller than the width of the lower base) provides good structural stability and pressure distribution. The annular protrusion design increases the operating surface area and improves finger grip, while the herringbone anti-slip texture further enhances grip and prevents slippage during rotational operation. The thickness of the pressure sensing ring is one-sixth of the height of the colloid base, ensuring sufficient strength without significantly increasing the overall volume, facilitating operation in confined spaces. Its close-fitting design ensures a firm connection with the colloid base, effectively improving operational accuracy and ease of use.

[0016] Furthermore, the micro stirring shaft is made of stainless steel, is cylindrical, and has a diameter that is one-tenth the diameter of the colloid base. The top of the micro stirring shaft is equipped with an operating head, which is hexagonal in shape, with a side length that is half the diameter of the micro stirring shaft. The bottom of the micro stirring shaft is fixedly connected to stirring blades, which have a spiral structure with a spiral angle of 270 degrees. The radius of the spiral structure gradually increases from the center outwards, with the maximum radius being two-thirds of the inner diameter of the colloid base.

[0017] The beneficial effects of adopting the above-mentioned improved scheme are as follows: the micro-stirring shaft made of stainless steel has high strength and corrosion resistance, ensuring stable performance during repeated use. The hexagonal columnar operating head design facilitates precise operation using standard tools, improving the controllability of the stirring process. The spiral stirring blades at the bottom, with a 270-degree expansion angle and a radius design that gradually increases from the center outward (the maximum radius is two-thirds of the inner diameter of the colloid base), create a highly efficient shear flow field and eddy current effect, which can uniformly disperse the conductive filler, prevent silver powder particles from agglomerating, and ensure the uniformity and stability of the conductive network. This precise stirring mechanism design not only improves the uniformity and stability of the conductive adhesive but also allows the operator to easily adjust the state of the conductive adhesive according to specific application requirements.

[0018] Furthermore, the locking mechanism includes a retaining ring and an elastic retaining block; the retaining ring is fixedly disposed on the inner wall of the pressure sensing ring, and the inner side of the retaining ring has a plurality of evenly distributed grooves; the elastic retaining block is fixedly connected to the outer wall of the micro stirring shaft, and the outer end of the elastic retaining block is hemispherical, used to cooperate with the grooves on the inner side of the retaining ring; the elastic retaining block is made of elastic material and can elastically deform during rotation; there are 3 elastic retaining blocks, which are evenly distributed at 120 degrees on the outer wall of the micro stirring shaft; there are 12 grooves on the inner side of the retaining ring, which are evenly distributed at 30 degrees.

[0019] The beneficial effects of the above-mentioned improved scheme are as follows: The locking mechanism composed of the slot ring and the elastic locking block provides precise position control for the micro-stirring shaft. Multiple grooves evenly distributed on the inner side of the slot ring engage with the elastic locking block on the outer wall of the micro-stirring shaft, achieving a positioning and locking function. The locking block, made of elastic material, can elastically deform during rotation, ensuring a smooth transition and reliable locking. The design of three elastic locking blocks evenly distributed at 120 degrees and twelve grooves evenly distributed at 30 degrees provides twelve precise locking positions, allowing the operator to precisely control the rotation angle of the stirring shaft within a 0-360 degree range in 30-degree increments. This achieves precise control over the mixing degree of the conductive adhesive, ensuring the uniform distribution of the conductive filler in the colloid base, thereby improving the consistency and reliability of the conductive adhesive's performance.

[0020] Furthermore, the groove is V-shaped, with the opening of the V-shape facing the inside of the slot ring; the opening angle of the V-shaped groove is 60 degrees, and the depth is half the thickness of the slot ring; the inner wall of the V-shaped groove is provided with a smooth transition arc surface, and the radius of the transition arc surface is one-quarter of the groove depth; the diameter of the hemispherical outer end of the elastic block matches the opening width of the V-shaped groove, so that the elastic block can smoothly enter and lock into the V-shaped groove during rotation.

[0021] The beneficial effects of adopting the above-mentioned improved scheme are as follows: The V-shaped groove design (opening angle of 60 degrees, depth of half the thickness of the groove ring) provides an ideal entry channel and locking space for the locking block, ensuring smooth locking process and stability after locking. The smooth transition arc surface (radius of one-quarter of the groove depth) on the inner wall reduces resistance and wear when the locking block enters and exits the groove, extending the service life of the locking mechanism. The precise match between the hemispherical outer end of the elastic locking block and the opening width of the V-shaped groove ensures accurate positioning and reliable fixation of the locking mechanism, allowing the operator to accurately perceive the locking position feedback, preventing position deviation during fine-tuning, and ensuring easy unlocking and adjustment when needed, greatly improving the accuracy of conductive adhesive dispersion control and ease of operation.

[0022] Furthermore, the inner wall of the colloid base is provided with a spiral guide groove, which starts from the annular groove at the bottom of the colloid base and spirals upward along the inner wall of the colloid base to the top of the colloid base; the depth of the spiral guide groove is one-third of the wall thickness of the colloid base, and the width of the spiral guide groove is twice the depth; the pitch of the spiral guide groove is one-quarter of the height of the colloid base, forming four complete spiral cycles; the inner surface of the spiral guide groove is coated with silicone material, and the thickness of the silicone material is one-tenth of the depth of the spiral guide groove.

[0023] The beneficial effects of the above-mentioned improved design are as follows: The design of the spiral guide groove extending from the bottom annular groove of the colloid base to the top creates a continuous guide channel, guiding the internal material of the conductive adhesive along a specific path and preventing local aggregation. The design of four complete spiral cycles enhances the mixing effect and ensures uniform distribution of the conductive filler. The dimensional ratio of one-third the wall thickness of the colloid base and twice the depth ensures sufficient flow space without excessively weakening the structural strength of the colloid base. The silicone material coated on the inner surface (with a thickness of one-tenth the depth of the guide groove) reduces the frictional resistance between the conductive adhesive and the guide groove wall, improves the flowability of the conductive adhesive, and prevents the conductive filler from accumulating and settling in the guide groove, effectively promoting the uniform dispersion of the conductive filler and improving the integrity and stability of the conductive network.

[0024] Furthermore, the outer wall of the colloid base is provided with three annular clamping protrusions from bottom to top. The height of the annular clamping protrusions is one-fifteenth of the height of the colloid base, and the width of the annular clamping protrusions is three times the height. The outer surface of the annular clamping protrusions is provided with anti-slip teeth, which are distributed radially. The spacing between the annular clamping protrusions is one-fifth of the height of the colloid base. The diameter of the three annular clamping protrusions gradually decreases from bottom to top, forming a stepped structure. The diameter difference between adjacent annular clamping protrusions is one-tenth of the diameter of the colloid base.

[0025] The beneficial effects of adopting the above-mentioned improved design are as follows: The design of three annular clamping bosses significantly enhances the operator's grip and control precision on the adhesive base, especially when precise positioning is required during PCB board connection. The radial distribution of anti-slip serrations increases surface friction and prevents finger slippage. The stepped diameter design of the three bosses (the diameter difference between adjacent bosses is one-tenth of the diameter of the adhesive base) provides multiple grip options to accommodate different hand shapes and operating habits. The reasonable design of the boss height (one-fifteenth of the height of the adhesive base), width (three times the height), and spacing (one-fifth of the height of the adhesive base) provides sufficient gripping surface area without significantly increasing the overall volume, ensuring the ease of operation of the conductive adhesive in confined spaces. This improves the accuracy and efficiency of the PCB board connection process, indirectly enhancing the application effect of the conductive adhesive and the stability of the PCB board connection.

[0026] Compared with existing technologies, the beneficial effects of the conductive adhesive for improving the connection stability of PCB boards provided by this utility model are as follows: By designing an adhesive base with annular grooves and micro-barb structures, a strong mechanical locking between the conductive adhesive and the PCB board is achieved, significantly improving the physical connection strength. Simultaneously, the use of silver powder particles with nano-scale spikes on the surface as conductive fillers increases the contact area and the number of contact points, forming a stable conductive network structure. A fibrous reinforcing agent made of carbon fiber material runs through the silver powder particle aggregates, providing robust skeletal support and enhancing the structural stability and tensile strength of the conductive adhesive. Furthermore, the coordinated operation of the dispersion control components, including a pressure sensing ring, a micro-stirring shaft, and a locking mechanism, achieves precise control over the dispersion state of the conductive filler, ensuring the uniformity and stability of the conductive network. Through the combined effect of these technical measures, this utility model significantly improves the mechanical strength and electrical conductivity of the connection between the conductive adhesive and the PCB board. Even under harsh conditions such as periodic temperature changes, continuous mechanical vibration, and long-term current flow, it maintains stable connection performance, with a conductivity resistance change rate of less than 5%, a peel strength increase of over 40%, and a service life extension of more than 3 times, greatly improving the reliability and service life of electronic devices. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of a conductive adhesive that improves the connection stability of a PCB board;

[0029] Figure 2 This is a schematic diagram of the distributed control component.

[0030] The attached diagram lists the components represented by each number as follows:

[0031] 10. Colloidal base; 20. Conductive filler; 30. Adhesive; 40. Reinforcing agent; 50. Dispersion control component; 51. Pressure sensing ring; 52. Micro stirring shaft; 53. Locking mechanism. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0033] like Figure 1-2 The image shows an embodiment of a conductive adhesive for improving the connection stability of a PCB board provided by this utility model. In this embodiment, it includes: an adhesive base 10, a conductive filler 20, an adhesion promoter 30, a reinforcing agent 40, and a dispersion control component 50. The adhesive base is made of epoxy resin and is in the shape of a cylindrical container with an annular groove at the bottom. Multiple micro-barb structures are evenly distributed on the inner wall of the groove. The conductive filler is uniformly dispersed inside the adhesive base. The conductive filler is silver powder particles with an irregular sheet-like structure and a surface covered with nano-scale spikes. The adhesion promoter is mixed with the interior of the adhesive base to enhance the adhesion stability of the PCB board. The adhesive has polar functional groups at the ends of its molecular chains; the reinforcing agent has a fibrous structure with the central axis of the fibrous structure running through the entire silver powder particle aggregate; the dispersion control component is located on the top of the colloidal base and includes a pressure sensing ring 51, a micro stirring shaft 52, and a locking mechanism 53. The pressure sensing ring is fixedly installed around the top edge of the colloidal base, and the micro stirring shaft passes vertically through the center of the colloidal base. A stirring blade is fixedly connected to the bottom end of the micro stirring shaft, and the stirring blade has a spiral structure; the locking mechanism is located on the inner wall of the pressure sensing ring and is used to control the rotation position of the micro stirring shaft.

[0034] In the above technical solution, the depth of the annular groove is one-fifth of the height of the colloidal base, and the width of the annular groove is one-quarter of the diameter of the colloidal base; the micro-barb structure is triangular pyramidal, with the tip of the barb pointing towards the center of the annular groove, the bottom surface of the barb being fixedly connected to the inner wall of the annular groove, and the height of the barb being one-third of the depth of the annular groove; multiple micro-barb structures are arranged in a ring array on the inner wall of the annular groove, and the spacing between adjacent barbs is twice the diameter of the bottom surface of the barb.

[0035] Furthermore, in the above technical solution, the average diameter of the silver powder particles is 10 micrometers to 50 micrometers, and the thickness is 1 micrometer to 5 micrometers; the height of the nanoscale spikes is 50 nanometers to 200 nanometers, and the spike tips are blunt and rounded; the surface density of the silver powder particles is 3 to 8 nanoscale spikes per square micrometer; the mass content of the silver powder particles in the colloidal matrix is ​​65% to 85%, and the silver powder particles form a conductive network structure through physical contact.

[0036] Furthermore, in the above technical solution, the fibrous structure is made of carbon fiber material, in the form of long filaments with a diameter of 0.5 micrometers to 2 micrometers and a length of 50 micrometers to 200 micrometers; the surface of the fibrous structure is coated with a nanoscale silver layer with a thickness of 20 nanometers to 100 nanometers; the fibrous structure is distributed in a three-dimensional network in the colloidal substrate, with multiple intersections between the fibers, and spherical connection nodes are formed at the intersections; the mass content of the carbon fiber material is 5% to 15% of the total mass of the colloidal substrate.

[0037] Furthermore, in the above technical solution, the pressure sensing ring is made of elastic material and is circular in shape, with its inner diameter closely fitting the outer diameter of the colloid base; the cross-section of the pressure sensing ring is trapezoidal, with the width of the upper base being smaller than the width of the lower base; the thickness of the pressure sensing ring is one-sixth of the height of the colloid base; the outer surface of the pressure sensing ring is provided with an annular protrusion, the height of which is one-quarter of the thickness of the pressure sensing ring, and the top of the annular protrusion is provided with anti-slip texture, which is arranged in a herringbone pattern.

[0038] Furthermore, in the above technical solution, the micro stirring shaft is made of stainless steel and is cylindrical, with a diameter one-tenth the diameter of the colloid base; the top of the micro stirring shaft is equipped with an operating head, which is hexagonal in shape, with a side length of half the diameter of the micro stirring shaft; the bottom of the micro stirring shaft is fixedly connected with stirring blades, which are spiral in structure, with an unfolding angle of 270 degrees, and the radius of the spiral gradually increases from the center outward, with the maximum radius being two-thirds of the inner diameter of the colloid base.

[0039] Furthermore, in the above technical solution, the locking mechanism includes a retaining ring and an elastic retaining block; the retaining ring is fixedly disposed on the inner wall of the pressure sensing ring, and the inner side of the retaining ring has a plurality of evenly distributed grooves; the elastic retaining block is fixedly connected to the outer wall of the micro stirring shaft, and the outer end of the elastic retaining block is hemispherical, used to cooperate with the groove on the inner side of the retaining ring; the elastic retaining block is made of elastic material and can be elastically deformed during rotation; there are 3 elastic retaining blocks, which are evenly distributed at 120 degrees on the outer wall of the micro stirring shaft; there are 12 grooves on the inner side of the retaining ring, which are evenly distributed at 30 degrees.

[0040] Furthermore, in the above technical solution, the groove is V-shaped, with the opening of the V-shape facing the inside of the slot ring; the opening angle of the V-shaped groove is 60 degrees, and the depth is half the thickness of the slot ring; the inner wall of the V-shaped groove is provided with a smooth transition arc surface, and the radius of the transition arc surface is one-quarter of the groove depth; the diameter of the hemispherical outer end of the elastic block matches the opening width of the V-shaped groove, so that the elastic block can smoothly enter and lock into the V-shaped groove during rotation.

[0041] Furthermore, in the above technical solution, the inner wall of the colloid base is provided with a spiral guide groove. The spiral guide groove starts from the annular groove at the bottom of the colloid base and spirals upward along the inner wall of the colloid base to the top of the colloid base. The depth of the spiral guide groove is one-third of the wall thickness of the colloid base, and the width of the spiral guide groove is twice the depth. The pitch of the spiral guide groove is one-quarter of the height of the colloid base, forming four complete spiral cycles. The inner surface of the spiral guide groove is coated with silicone material, and the thickness of the silicone material is one-tenth of the depth of the spiral guide groove.

[0042] Furthermore, in the above technical solution, the outer wall of the colloid base is provided with three annular clamping protrusions from bottom to top. The height of the annular clamping protrusions is one-fifteenth of the height of the colloid base, and the width of the annular clamping protrusions is three times the height. The outer surface of the annular clamping protrusions is provided with anti-slip teeth, which are distributed radially. The spacing between the annular clamping protrusions is one-fifth of the height of the colloid base. The diameter of the three annular clamping protrusions gradually decreases from bottom to top, forming a stepped structure. The diameter difference between adjacent annular clamping protrusions is one-tenth of the diameter of the colloid base.

[0043] Specifically, the principle of this invention is as follows: First, prepare the PCB board and clean the area to be connected, ensuring the surface is free of oxide layers, oil, and dust to improve connection stability. Then, take out the conductive adhesive, hold the adhesive base using the annular clamping boss, align the edge of the PCB board with the annular groove at the bottom of the adhesive base, and gently insert it until the PCB board is completely inside the groove. At this point, the micro-barb structure automatically locks the PCB board, forming a preliminary fixation. Next, gently rotate the hexagonal operating head of the micro-stirring shaft, feeling the locking mechanism's feedback; a noticeable locking sensation occurs every 30 degrees of rotation. Depending on specific application requirements, the stirring shaft can be rotated 90-270 degrees, using the spiral stirring blades to agitate the conductive filler inside the adhesive, ensuring uniform distribution of silver powder particles and fibrous reinforcing agents. After stirring, gently press the pressure sensing ring, feeling its elastic feedback to ensure appropriate pressure is applied, promoting the formation of a stable conductive network by the conductive filler. The best effect is achieved when the pressure is controlled within the range of 0.5-2 MPa, which can be estimated by the degree of deformation of the pressure sensing ring. After completing the above steps, the conductive adhesive will cure on its own within 10-30 minutes, forming a stable connection. Once fully cured, subsequent connection and soldering of electronic components can be performed. Avoid excessive bending or pulling of the PCB board during use to prevent damage to the conductive adhesive connection. If adjustment or replacement of the PCB board is required, rotate the miniature stirring shaft counterclockwise until the locking mechanism is released, then gently pull out the PCB board. If necessary, use appropriate tools to assist in separation. This conductive adhesive is suitable for PCB board connections in various electronic products, and is particularly suitable for electronic equipment used in harsh environments such as high temperature, high humidity, and vibration.

Claims

1. A conductive adhesive for improving the stability of a PCB connection, characterized by, The application relates to a colloidal base, conductive fillers, adhesion promoters, reinforcing agents and dispersion control components; the colloidal base is made of an epoxy resin material and has a cylindrical container shape; the bottom is provided with an annular groove; the inner wall of the groove is uniformly provided with a plurality of micro barb structures; the conductive fillers are uniformly dispersed in the colloidal base; the conductive fillers are silver powder particles; the adhesion promoters are mixed with the colloidal base; the molecular chain ends of the adhesion promoters are provided with polar functional groups; the reinforcing agents have a fibrous structure; the dispersion control components are arranged on the top of the colloidal base; the dispersion control components comprise a pressure sensing ring, a micro stirring shaft and a locking mechanism; the pressure sensing ring is fixedly arranged around the top edge of the colloidal base; the micro stirring shaft vertically penetrates the center position of the colloidal base; the bottom end of the micro stirring shaft is fixedly connected with stirring blades; the stirring blades have a spiral structure; and the locking mechanism is arranged on the inner wall of the pressure sensing ring. The depth of the annular groove is 1 / 5 of the height of the colloidal base; the width of the annular groove is 1 / 4 of the diameter of the colloidal base; the micro barb structure has a triangular pyramid shape; the barb tip faces the center direction of the annular groove; the barb bottom surface is fixedly connected with the inner wall of the annular groove; the height of the barb is 1 / 3 of the depth of the annular groove; the plurality of micro barb structures are arranged in an annular array on the inner wall of the annular groove; and the spacing between adjacent barbs is twice the diameter of the barb bottom surface.

2. The conductive adhesive for improving the connection stability of a PCB according to claim 1, wherein The silver powder particles have a sheet structure and are covered with nano-level protrusions; the average diameter of the silver powder particles is 10-50 microns; the thickness is 1-5 microns; the height of the nano-level protrusions is 50-200 nanometers; the top end of the protrusion has a blunt circular shape; the surface density of the silver powder particles is 3-8 nano-level protrusions per square micron; the mass content of the silver powder particles in the colloidal base is 65-85%; and the silver powder particles form a conductive network structure through physical contact.

3. The conductive adhesive for improving the connection stability of a PCB according to claim 2, wherein The central axis of the fibrous structure penetrates the entire silver powder particle aggregate; the fibrous structure is made of carbon fiber material and has a filament shape; the diameter is 0.5-2 microns; the length is 50-200 microns; the fibrous structure is coated with a nano-level silver layer; the thickness of the silver layer is 20-100 nanometers; the fibrous structure is distributed in a three-dimensional network in the colloidal base; multiple cross points are formed between the fibers; spherical connection nodes are formed at the cross points; and the mass content of the carbon fiber material is 5-15% of the total mass of the colloidal base.

4. The conductive adhesive for improving the connection stability of a PCB according to claim 3, wherein The pressure sensing ring is made of an elastic material and has a circular ring shape; the inner diameter is tightly fitted with the outer diameter of the colloidal base; the cross section of the pressure sensing ring has a trapezoidal shape; the upper base width of the trapezoidal shape is smaller than the lower base width; the thickness of the pressure sensing ring is 1 / 6 of the height of the colloidal base; the outer surface of the pressure sensing ring is provided with an annular protrusion; the height of the annular protrusion is 1 / 4 of the thickness of the pressure sensing ring; the top of the annular protrusion is provided with anti-skid lines; and the anti-skid lines are arranged in a herringbone shape.

5. The conductive adhesive for improving the connection stability of a PCB according to claim 4, wherein ​ 6. The conductive adhesive for improving the connection stability of a PCB according to claim 5, wherein The micro stirring shaft is made of stainless steel material, in a cylindrical shape, with a diameter of one tenth of the diameter of the colloidal base; the top end of the micro stirring shaft is provided with an operating head, which is in a hexagonal column shape, with the side length of the hexagonal column shape being half of the diameter of the micro stirring shaft; the bottom end of the micro stirring shaft is fixedly connected with stirring blades, which are in a spiral structure, with the unfolding angle of the spiral structure being 270 degrees, and the radius of the spiral structure gradually increasing from the center outward, with the maximum radius being two thirds of the inner diameter of the colloidal base.

7. The conductive adhesive for improving the connection stability of a PCB according to claim 6, wherein The locking mechanism comprises a clamping groove ring and elastic clamping blocks; the clamping groove ring is fixedly arranged on the inner side wall of the pressure sensing ring, and a plurality of grooves are uniformly arranged on the inner side of the clamping groove ring; the elastic clamping blocks are fixedly connected to the outer side wall of the micro stirring shaft, and the outer ends of the elastic clamping blocks are in a semispherical shape, which are used for cooperating with the grooves on the inner side of the clamping groove ring; the elastic clamping blocks are made of elastic material and can be elastically deformed during rotation; the number of the elastic clamping blocks is three, which are uniformly distributed at an interval of 120 degrees on the outer side wall of the micro stirring shaft; the number of the grooves on the inner side of the clamping groove ring is twelve, which are uniformly distributed at an interval of 30 degrees.

8. The conductive adhesive for improving the connection stability of a PCB according to claim 7, wherein The shape of the groove is V-shaped, and the opening of the V-shaped groove faces the inner side of the clamping groove ring; the opening angle of the V-shaped groove is 60 degrees, and the depth is one half of the thickness of the clamping groove ring; the inner side wall of the V-shaped groove is provided with a smooth transition arc surface, and the radius of the transition arc surface is one fourth of the depth of the groove; the diameter of the semispherical outer end of the elastic clamping block matches the opening width of the V-shaped groove, so that the elastic clamping block can smoothly enter and be locked in the V-shaped groove during rotation.

9. The conductive adhesive for improving the connection stability of a PCB according to claim 8, wherein The inner wall of the colloidal base is provided with a spiral guide groove, which starts from the annular groove at the bottom of the colloidal base and spirally rises along the inner wall of the colloidal base to the top of the colloidal base; the depth of the spiral guide groove is one third of the wall thickness of the colloidal base, and the width of the spiral guide groove is twice the depth; the pitch of the spiral guide groove is one fourth of the height of the colloidal base, forming four complete spiral periods; the inner surface of the spiral guide groove is coated with silica gel material, and the thickness of the silica gel material is one tenth of the depth of the spiral guide groove.

10. The conductive adhesive for improving the connection stability of a PCB according to claim 9, wherein The outer side wall of the colloidal base is provided with three annular clamping bosses from bottom to top, and the height of the annular clamping boss is one fifteenth of the height of the colloidal base, and the width of the annular clamping boss is three times the height; the outer surface of the annular clamping boss is provided with anti-skid tooth patterns, which are distributed in a radial manner; the spacing between the annular clamping bosses is one fifth of the height of the colloidal base; the diameters of the three annular clamping bosses gradually decrease from bottom to top, forming a stepped structure, and the diameter difference between adjacent annular clamping bosses is one tenth of the diameter of the colloidal base.

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