Electroplating device for circuit board

Abstract

The utility model discloses an electroplating device for a circuit board, which comprises an electroplating tank, a base is arranged on the rear side of the electroplating tank, a guide rod is arranged above the base, a connecting seat is arranged outside the guide rod, the top of an electric telescopic rod is fixedly connected with the connecting seat, the front end of the connecting seat is connected with an electroplating frame, and the electroplating frame is connected with a motor. A sliding groove is formed in the electroplating frame, and a sliding rod is installed in the sliding groove. A mounting groove is formed in the right side of the sliding rod, a rubber pad is connected to the left side of the clamping plate, a pressing plate is connected to the right side of the clamping plate, the clamping plate and the pressing plate are connected through a connecting spring, and inclined grooves are formed in the contact surfaces of the clamping plate and the pressing plate. According to the electroplating device for the circuit boards, the circuit boards can be conveniently clamped, so that electroplating is facilitated, multiple circuit boards can be electroplated at a time, the electroplating efficiency is improved, in the electroplating process, the circuit boards can be conveniently disassembled and assembled, and time is saved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, specifically to an electroplating device for circuit boards. Background Technology

[0002] Electroplating equipment can be used in the circuit board manufacturing process. Electroplating is the process of depositing a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation, such as rust, improving wear resistance, conductivity, reflectivity, corrosion resistance, and enhancing aesthetics.

[0003] Existing electroplating equipment is inconvenient for clamping circuit boards, making electroplating inconvenient and limiting the ability to electroplat multiple circuit boards at once, resulting in low electroplating efficiency. Therefore, we propose an electroplating device for circuit boards to solve the problems mentioned above. Utility Model Content

[0004] The purpose of this utility model is to provide an electroplating apparatus for circuit boards, so as to solve the problems of the current electroplating apparatus mentioned in the background art, which is inconvenient to clamp the circuit board, resulting in inconvenience in electroplating the circuit board, and inconvenience in electroplating multiple circuit boards at one time, resulting in low electroplating efficiency.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an electroplating apparatus for circuit boards, comprising:

[0006] An electroplating tank is provided with a base on the rear side of the electroplating tank, and a guide rod is installed on the top of the base. A connecting seat is provided on the outside of the guide rod, and an electric telescopic rod is provided on the rear side of the guide rod. The top of the electric telescopic rod is fixedly connected to the connecting seat, and an electroplating rack is connected to the front end of the connecting seat. A sliding groove is opened inside the electroplating rack, and a sliding rod is installed inside the sliding groove.

[0007] The slide bar has an installation groove on its right side, and a clamping plate is installed inside the installation groove. A rubber pad is connected to the left side of the clamping plate, and a pressure plate is connected to the right side of the clamping plate. The clamping plate and the pressure plate are connected by a connecting spring. The contact surfaces of the clamping plate and the pressure plate are both provided with inclined grooves, and a handle is connected to the outside of the pressure plate.

[0008] Preferably, the rear side of the electroplating tank is provided with several sets of bases, and the connecting base forms a lifting mechanism with the base through a guide rod and an electric telescopic rod.

[0009] Preferably, the electroplating rack has an "E" shaped structure, and the slide bar forms a telescopic structure with the electroplating rack through a slide groove.

[0010] Preferably, a groove is provided below the slide bar, and the left side of the groove is longer than the right side of the groove.

[0011] Preferably, the clamps are evenly spaced on the slide rod, and the clamps and the slide rod form a telescopic structure.

[0012] Preferably, the pressure plate is rotatably connected to the slide rod, and the pressure plate is movably fitted to the clamping plate, with the inclined grooves on the pressure plate and the clamping plate being arranged opposite to each other.

[0013] Compared with the prior art, the beneficial effects of this utility model are: the circuit board electroplating device makes it easy to clamp the circuit board, thus facilitating electroplating, and can electroplat multiple circuit boards at one time, improving electroplating efficiency. In addition, during the electroplating process, it can facilitate the disassembly and installation of the circuit board, saving time.

[0014] 1. The base and guide rod are provided. Several sets of bases are provided on the back of the electroplating tank, which makes it easy to set up multiple sets of electroplating racks. The guide rods facilitate the stable lifting and lowering of the electroplating racks. The multiple sets of bases make it easy to disassemble and install the circuit board during the electroplating process, saving time.

[0015] 2. An electroplating rack and sliding rods are provided. The sliding rods and the electroplating rack form a telescopic structure, which facilitates the installation and removal of circuit boards. The electroplating rack is equipped with several sets of sliding rods, which can facilitate the electroplating of multiple circuit boards at one time and improve the electroplating efficiency.

[0016] 3. A clamping plate and a pressure plate are provided. The contact surfaces of the clamping plate and the pressure plate are provided with inclined grooves. When the pressure plate rotates, it is convenient for the clamping plate and the pressure plate to be squeezed through the inclined grooves, thereby driving the clamping plate to slide in the slide bar. The circuit board is clamped by the rubber pad, which facilitates electroplating. Attached Figure Description

[0017] Figure 1 This is a side view sectional diagram of the present invention;

[0018] Figure 2 This is a top view of the structure of this utility model;

[0019] Figure 3 This is a front view sectional view of the connection between the electroplating rack and the slide bar of this utility model;

[0020] Figure 4 This is a schematic diagram of the overall structure of the connection between the clamping plate and the pressure plate of this utility model.

[0021] In the diagram: 1. Electroplating tank; 2. Base; 3. Guide rod; 4. Electric telescopic rod; 5. Connecting seat; 6. Electroplating rack; 7. Slide groove; 8. Slide rod; 9. Mounting groove; 10. Clamping plate; 11. Rubber pad; 12. Pressure plate; 13. Connecting spring; 14. Inclined groove; 15. Handle. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4 This utility model provides a technical solution: an electroplating device for circuit boards, comprising: an electroplating tank 1, a base 2, a guide rod 3, an electric telescopic rod 4, a connecting seat 5, an electroplating rack 6, a sliding groove 7, a sliding rod 8, a mounting groove 9, a clamping plate 10, a rubber pad 11, a pressure plate 12, a connecting spring 13, an inclined groove 14, and a handle 15.

[0024] An electroplating tank 1 is provided with a base 2 at the rear of the electroplating tank 1, and a guide rod 3 is installed on the top of the base 2. A connecting seat 5 is provided on the outside of the guide rod 3, and an electric telescopic rod 4 is provided on the rear of the guide rod 3. The top of the electric telescopic rod 4 is fixedly connected to the connecting seat 5, and an electroplating rack 6 is connected to the front end of the connecting seat 5. A sliding groove 7 is opened inside the electroplating rack 6, and a sliding rod 8 is installed inside the sliding groove 7.

[0025] The slide bar 8 has a mounting groove 9 on its right side, and a clamping plate 10 is installed inside the mounting groove 9. A rubber pad 11 is connected to the left side of the clamping plate 10, and a pressure plate 12 is connected to the right side of the clamping plate 10. The clamping plate 10 and the pressure plate 12 are connected by a connecting spring 13. The contact surfaces of the clamping plate 10 and the pressure plate 12 are both provided with inclined grooves 14, and a handle 15 is connected to the outside of the pressure plate 12.

[0026] like Figure 1 , Figure 2 and Figure 3 Several sets of bases 2 are provided on the rear side of the electroplating tank 1, and the connecting seat 5 forms a lifting mechanism with the base 2 through the guide rod 3 and the electric telescopic rod 4, which facilitates the installation of multiple sets of electroplating racks 6 and improves electroplating efficiency. The electroplating rack 6 has an "E" shaped structure, and the slide rod 8 forms a telescopic structure with the electroplating rack 6 through the slide groove 7, which facilitates the installation of multiple circuit boards at one time. A groove is provided below the slide rod 8, and the left side of the groove is longer than the right side of the groove, which facilitates the installation of circuit boards below the slide rod 8.

[0027] like Figure 1 , Figure 3 and Figure 4The middle clamping plate 10 is evenly spaced on the slide rod 8, and the clamping plate 10 and the slide rod 8 form a telescopic structure, which makes it convenient for the slide rod 8 to extend out of the outside of the electroplating tank 1. The pressure plate 12 is rotatably connected to the slide rod 8, and the pressure plate 12 is movably fitted to the clamping plate 10. The inclined groove 14 on the pressure plate 12 and the clamping plate 10 is arranged opposite to each other, which makes it convenient for the clamping plate 10 to clamp the circuit board.

[0028] Working principle: When using this circuit board electroplating device, by pulling the slide bar 8, the slide bar 8 slides in the slide groove 7 and extends outward from the electroplating tank 1, allowing the top of the circuit board to be installed in the groove of the slide bar 8. Figure 3 As shown, by rotating the handle 15, the pressure plate 12 rotates, causing the inclined groove 14 on the pressure plate 12 to shift from the inclined groove 14 on the clamping plate 10. This causes the pressure plate 12 to press against the clamping plate 10, causing the clamping plate 10 to slide in the mounting groove 9 and clamp the circuit board using the rubber pad 11. After the circuit board is installed, the slide bar 8 is reset, and the next circuit board on the slide bar 8 is installed. After all the slide bars 8 on the electroplating rack 6 are filled with circuit boards, as shown... Figure 1 As shown, by retracting the electric telescopic rod 4, the connecting seat 5 moves downward, thereby causing the electroplating rack 6 to move downward, so that the circuit board is lowered into the electroplating tank 1 for electroplating. Several sets of bases 2 are provided above the electroplating tank 1, which facilitates the disassembly and installation of the circuit board during the electroplating process and improves the electroplating efficiency. This is the entire working process of the electroplating device for the circuit board. The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0029] All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0030] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electroplating apparatus for circuit boards, characterized in that, Include: Electroplating tank (1), the rear side of the electroplating tank (1) is provided with base (2), and the upper portion of base (2) is provided with guide rod (3), the outer portion of guide rod (3) is provided with connecting seat (5), and the rear side of guide rod (3) is provided with electric telescopic rod (4), the top of electric telescopic rod (4) is fixedly connected with connecting seat (5), and the front end of connecting seat (5) is connected with electroplating frame (6), the inner portion of electroplating frame (6) is provided with sliding groove (7), and sliding groove (7) is provided with sliding rod (8); Sliding rod (8), the right side of sliding rod (8) is provided with mounting groove (9), and mounting groove (9) is provided with clamping plate (10), the left side of clamping plate (10) is connected with rubber pad (11), and the right side of clamping plate (10) is connected with pressing plate (12), clamping plate (10) and pressing plate (12) are connected through connecting spring (13), and the contact surface of clamping plate (10) and pressing plate (12) is provided with inclined groove (14), and the outer portion of pressing plate (12) is connected with handle (15).

2. The electroplating apparatus for a circuit board according to claim 1, wherein: The rear side of the electroplating tank (1) is provided with several groups of base (2), and connecting seat (5) is connected with base (2) through guide rod (3) and electric telescopic rod (4) to form a lifting mechanism.

3. The electroplating apparatus for a circuit board according to claim 1, wherein: The electroplating frame (6) is in the form of "E", and the sliding rod (8) is connected with the electroplating frame (6) through the sliding groove (7) to form a telescopic structure.

4. The electroplating apparatus for a circuit board according to claim 1, wherein: The lower portion of the sliding rod (8) is provided with a groove, and the left side length of the groove is greater than the right side length of the groove.

5. The electroplating apparatus for a circuit board according to claim 1, wherein: The clamping plates (10) are arranged at equal intervals on the sliding rod (8), and the clamping plates (10) and the sliding rod (8) form a telescopic structure.

6. The electroplating apparatus for a circuit board according to claim 1, wherein: The pressing plate (12) is rotatably connected with the sliding rod (8), and the pressing plate (12) is movably connected with the clamping plate (10), and the inclined grooves (14) on the pressing plate (12) and the clamping plate (10) are oppositely arranged.

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