Printed circuit board electroplating device

Abstract

The utility model discloses a printed circuit board electroplating device which comprises a printed circuit board electroplating device body, the printed circuit board electroplating device body comprises an electroplating hanger, two conductive mechanisms are installed on the electroplating hanger, the bottoms of the two conductive mechanisms are provided with the same base, the conductive mechanisms are electrically connected with first conductive rods, and the first conductive rods are electrically connected with second conductive rods. The two first conducting rods are symmetrically arranged and fixedly connected with the electroplating hanging frame, and the two sides of the bottom of the electroplating hanging frame are fixedly connected with mounting rods. According to the utility model, through the arrangement of a series of structures, the plurality of second conductive clamping plates can be synchronously driven to move to clamp and fix the corresponding printed circuit board in a rapid pressure control manner, so that the situation that the printed circuit board is influenced by a relatively large clamping force or a relatively small clamping force can be effectively reduced, and the clamping and fixing stability is improved; and the vertical position of the printed circuit board can be adjusted according to electroplating requirements, so that the electroplating operation of personnel is facilitated.

Description

Technical Field

[0001] This utility model relates to the technical field of printed circuit board electroplating equipment, and in particular to a printed circuit board electroplating device. Background Technology

[0002] In the electroplating process of printed circuit boards (PCBs), a hanger is used to suspend the PCB and place it on an electrode plate to conduct current. Then, a machine immerses the fixture holding the PCB into the electroplating solution, ensuring the solution is evenly distributed on the PCB to achieve electroplating. A search report from a novelty search agency reveals that publication number CN215050822U discloses a PCB electroplating device, including a base, a conductive rail, a horizontal drive mechanism, an electroplating hanger, and a supporting rail. The electroplating hanger can slide along the supporting rail and is equipped with a guide rail. The conductive strip is located above the conductive rail. Multiple conductive blocks are arranged between the conductive strip and the conductive rail. Each conductive block is connected to the conductive rail or conductive strip through a conductive spring. When the horizontal drive mechanism moves the electroplating rack along the length of the conductive rail, the conductive strip or conductive rail comes into contact with the multiple conductive blocks to achieve circuit conduction. Its advantages are: when the electroplating rack is picked up or removed, the conductive spring is compressed and released in its elastic direction, without the effect of vertical friction. The electroplating rack is easy to pick up and put down. The conductive spring will not be twisted or deformed during the picking and putting down process, and the impact on the conductive spring is small. The conductive spring is not easily deformed or damaged.

[0003] The printed circuit board electroplating device disclosed in the aforementioned patent uses electroplating clips to clamp the printed circuit board, thus connecting the electroplating rack to the printed circuit board. However, this clamping method has the following drawbacks: 1. The electroplating clips rely on their elasticity to clamp the printed circuit board. When the printed circuit board is thin, the clamping force is small, resulting in low clamping stability. When the printed circuit board is thick, the clamping force is large, posing a risk of damage. Furthermore, multiple electroplating clips need to be operated individually, leading to low clamping efficiency. In summary, the printed circuit board electroplating device disclosed in the aforementioned patent cannot effectively and quickly achieve stable pressure control and clamping of the printed circuit board. Therefore, we propose a printed circuit board electroplating device. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a printed circuit board electroplating device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A printed circuit board (PCB) electroplating apparatus includes a PCB electroplating apparatus body. The PCB electroplating apparatus body includes an electroplating rack. Two conductive mechanisms are mounted on the electroplating rack. The bottom of the two conductive mechanisms is mounted on the same base. A first conductive rod is electrically connected to each conductive mechanism. The two first conductive rods are symmetrically arranged and fixedly connected to the electroplating rack. Mounting rods are fixedly connected to both sides of the bottom of the electroplating rack. A first guide mechanism is fixedly connected to the side of each mounting rod that is close to each other. The top of the first guide mechanism is fixedly connected to the corresponding first conductive rod. A first conductive clamp is fixedly connected to the bottom of the first guide mechanism, providing vertical guidance for the first conductive clamp. Multiple second conductive rods are fixedly connected to the top of the side of each of the two first conductive clamps that is close to each other. Two first electric telescopic rods are fixedly mounted on the bottom of the electroplating rack. The output shaft end of the first electric telescopic rod is fixedly connected to the top of the corresponding second conductive rod. The first electric telescopic rod drives the corresponding second conductive rod to move vertically. A second conductive clamp is slidably fitted onto the second conductive rod. The second conductive rod... The first and second conductive clamps are energized. Two elastic guide mechanisms are fixedly connected to the sides of the two opposing second conductive clamps that are close to each other. Multiple second conductive rods on the same side have the same L-shaped insulating rod fixedly connected to their ends. An insulating plate is slidably fitted onto the L-shaped insulating rod, and the insulating plate is fitted onto the corresponding elastic guide mechanisms. The elastic guide mechanisms provide lateral guidance for the corresponding second conductive clamps. A pressure detection mechanism is fixedly connected to the sides of the two insulating plates that are far apart from each other. The pressure detection mechanism is fixedly connected to the corresponding multiple second conductive clamps and is used to detect the clamping force of the second conductive clamps. A second electric telescopic rod is embedded and fixedly installed on the inner wall of the side of the two L-shaped insulating rods that are close to each other. The output shaft end of the second electric telescopic rod is fixedly connected to the corresponding insulating plate. The second electric telescopic rod is used to drive the corresponding insulating plate to move laterally. A controller is fixedly connected to the side of the two L-shaped insulating rods that are close to each other. The controller is electrically connected to the corresponding pressure detection mechanism and the second electric telescopic rod and is used to control the second electric telescopic rod.

[0007] Preferably, the first guiding mechanism includes a conductive outer tube, two conductive outer tubes are respectively fixedly connected to the two mounting rods on the side close to each other, the top end of the conductive outer tube is fixedly connected to the corresponding first conductive rod, a conductive inner rod is slidably sleeved inside the conductive outer tube, the bottom end of the conductive inner rod is fixedly connected to the top of the corresponding first conductive clamp, the conductive outer tube and the conductive inner rod cooperate to provide a vertical guiding effect for the first conductive clamp, and the conductive outer tube and the conductive inner rod can realize the power supply between the first conductive rod and the first conductive clamp.

[0008] Preferably, the elastic guiding mechanism includes an L-shaped guide rod. One end of the L-shaped guide rod near the corresponding second conductive clamp is fixedly connected to the second conductive clamp. Two elastic rubber sleeves are fixedly connected between the second conductive clamp and the corresponding insulating plate. The elastic rubber sleeves are movably sleeved on the corresponding L-shaped guide rod. The insulating plate is slidably sleeved on the corresponding multiple L-shaped guide rods. The L-shaped guide rods provide lateral guidance for the corresponding second conductive clamp.

[0009] Preferably, the extrusion pressure detection mechanism includes a pressure sensor, which is electrically connected to a corresponding controller. Two pressure sensors are respectively fixedly installed on the opposite sides of two insulating plates. A U-shaped elastic block is glued to the opposite side of each pressure sensor. The side of the U-shaped elastic block away from the corresponding insulating plate is glued to a plurality of second conductive clamps. The pressure sensor and the U-shaped elastic block cooperate to detect the extrusion pressure of the second conductive clamps.

[0010] Preferably, the sides of the two second conductive clamps that are close to each other are provided with an insulating layer. The provision of the insulating layer can effectively prevent the power on the second conductive clamps from being conducted to the L-shaped guide rod.

[0011] Preferably, conductive anti-slip rubber is bonded and fixed on the side of the first conductive clamp and the corresponding second conductive clamp that are close to each other. The conductive anti-slip rubber can effectively reduce slippage during the clamping and fixing process.

[0012] Preferably, the bottom of the electroplating rack is fixedly connected to two first insulating rods, the bottom end of the first insulating rod is fixedly connected to the top end of the corresponding first electric telescopic rod, and the first conductive rod is movably sleeved on the corresponding first insulating rod, so that the connection between the electroplating rack and the first electric telescopic rod is realized through the first insulating rod.

[0013] Compared with existing technologies, the beneficial effects of this utility model are:

[0014] 1. By cooperating with the first conductive clamping plate, the second conductive clamping plate, the elastic guiding mechanism, the extrusion pressure detection mechanism, the second electric telescopic rod, the insulating plate and the controller, multiple second conductive clamping plates can be driven to move synchronously to quickly control the pressure and clamp the corresponding printed circuit board, which can effectively reduce the impact of large or small clamping force on the printed circuit board and improve the clamping and fixing stability.

[0015] 2. By cooperating with the first guide mechanism and the first electric telescopic rod, the printed circuit board can be driven to move down when it cannot be completely immersed in the electroplating solution, so that it can be completely immersed in the electroplating solution, thereby improving the electroplating stability.

[0016] This invention, through a series of structural designs, can synchronously drive multiple second conductive clamping plates to quickly control and clamp the corresponding printed circuit board, effectively reducing the impact of excessive or insufficient clamping force on the printed circuit board, improving clamping stability, and allowing adjustment of the vertical position of the printed circuit board according to electroplating requirements, facilitating electroplating operations. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a printed circuit board electroplating device proposed in this utility model.

[0018] Figure 2 for Figure 1 Enlarged cross-sectional view of section A;

[0019] Figure 3 This is a top view of the second conductive clamping plate, insulating plate, elastic guiding mechanism, and extrusion pressure detection mechanism on the left side of a printed circuit board electroplating device proposed in this utility model.

[0020] In the diagram: 100, electroplating hanger; 101, base; 102, conductive mechanism; 103, first conductive rod; 104, mounting rod; 1, conductive outer tube; 2, conductive inner rod; 3, first conductive clamp; 4, second conductive rod; 5, first electric telescopic rod; 6, first insulating rod; 7, second conductive clamp; 701, insulating layer; 8, insulating plate; 9, L-shaped guide rod; 10, elastic rubber sleeve; 11, U-shaped elastic rubber block; 12, pressure sensor; 13, L-shaped insulating rod; 14, controller; 15, second electric telescopic rod; 16, conductive anti-slip rubber. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figure 1-3A printed circuit board (PCB) electroplating apparatus includes a PCB electroplating apparatus body. The PCB electroplating apparatus body includes an electroplating rack 100. Two conductive mechanisms 102 are mounted on the electroplating rack 100. The bottom of the two conductive mechanisms 102 is mounted on the same base 101. First conductive rods 103 are electrically connected to the conductive mechanisms 102. The two first conductive rods 103 are symmetrically arranged and fixedly connected to the electroplating rack 100. Mounting rods 104 are fixedly connected to both sides of the bottom of the electroplating rack 100. A first guide mechanism is fixedly connected to the side of each mounting rod 104 that is close to the other. The top end of the first guide mechanism is fixedly connected to the corresponding first conductive rod 103. The first guide mechanism includes a conductive outer tube 1. Two conductive outer tubes 1 are fixedly connected to the two mounting rods 104 on the side close to each other. The top end of the conductive outer tube 1 is fixedly connected to the corresponding first conductive rod 103. A conductive inner rod 2 is slidably sleeved inside the conductive outer tube 1. Limiting holes are opened on the inner wall of the side close to each other of the two conductive outer tubes 1. Limiting blocks that are slidably connected to the corresponding limiting holes are fixedly connected on the side close to each other of the two conductive inner rods 2. The limiting blocks cooperate with the corresponding limiting holes to limit and prevent the conductive inner rods 2 from falling off.

[0023] The bottom end of the conductive inner rod 2 is fixedly connected to a first conductive clamping plate 3. The conductive outer tube 1 and the conductive inner rod 2 cooperate to provide vertical guidance for the first conductive clamping plate 3. The conductive outer tube 1 and the conductive inner rod 2 enable energization between the first conductive rod 103 and the first conductive clamping plate 3. Multiple second conductive rods 4 are fixedly connected to the top of the two first conductive clamping plates 3 on their adjacent sides. Two first electric telescopic rods 5 are fixedly installed at the bottom of the electroplating rack 100. Two first insulating rods 6 are fixedly connected to the bottom of the electroplating rack 100. The bottom end of the first insulating rod 6 is fixedly connected to the top end of the corresponding first electric telescopic rod 5. The first conductive rod 103 is movably sleeved on the corresponding first insulating rod 6. The connection between the electroplating rack 100 and the first electric telescopic rod 5 is achieved through the first insulating rod 6. The output shaft end of the first electric telescopic rod 5 is connected to the corresponding... The top of the second conductive rod 4 is fixedly connected, and an insulating block is fixedly connected to the bottom of the output shaft of the first electric telescopic rod 5. The bottom of the insulating block is fixedly connected to the top of the corresponding second conductive rod 4. The insulating block can effectively prevent the second conductive rod 4 from conducting electricity with the first electric telescopic rod 5. The first electric telescopic rod 5 is used to drive the corresponding second conductive rod 4 to move vertically. The second conductive rod 4 is slidably fitted with a second conductive clamping plate 7. The top of one side of the second conductive clamping plate 7 is provided with a sliding hole that slides and fits on the outside of the corresponding second conductive rod 4. The second conductive rod 4 enables the first conductive clamping plate 3 and the second conductive clamping plate 7 to conduct electricity. The first conductive clamping plate 3 and the corresponding second conductive clamping plate 7 are both bonded and fixed with conductive anti-slip rubber 16 on the sides that are close to each other. The conductive anti-slip rubber 16 can effectively reduce slippage during clamping and fixing.

[0024] Two elastic guide mechanisms are fixedly connected to the sides of two opposing second conductive clamps 7 that are close to each other. Multiple second conductive rods 4 located on the same side have the same L-shaped insulating rod 13 fixedly connected to their ends. An insulating plate 8 is slidably fitted onto the L-shaped insulating rod 13. A positioning hole is formed on the top of one side of the insulating plate 8, and the inner wall of the positioning hole slidably fits against the outer side of the corresponding L-shaped insulating rod 13. The insulating plate 8 is fitted onto the corresponding multiple elastic guide mechanisms. Each elastic guide mechanism includes an L-shaped guide rod 9, with one end of the L-shaped guide rod 9 near the corresponding second conductive clamp 7 fixedly connected to it. The sides of the two second conductive clamps 7 that are close to each other are both insulated. The insulation layer 701 effectively prevents the power on the second conductive clamp 7 from being conducted to the L-shaped guide rod 9. Two elastic rubber sleeves 10 are fixedly connected between the second conductive clamp 7 and the corresponding insulating plate 8. The elastic rubber sleeves 10 are movably sleeved on the corresponding L-shaped guide rod 9. The elastic rubber sleeves 10 provide movable space for the insulating plate 8 by utilizing their expansion and contraction characteristics. The insulating plate 8 is slidably sleeved on the corresponding multiple L-shaped guide rods 9. Multiple guide holes are opened on one side of the insulating plate 8. The inner wall of the guide hole is slidably sleeved with the outer side of the corresponding L-shaped guide rod 9. The L-shaped guide rod 9 plays a lateral guiding role for the corresponding second conductive clamp 7.

[0025] A pressure detection mechanism is fixedly connected to the side of each of the two insulating plates 8 that is far apart from each other. The pressure detection mechanism is fixedly connected to the corresponding multiple second conductive clamps 7. The pressure detection mechanism includes a pressure sensor 12. The two pressure sensors 12 are respectively fixedly installed on the side of each of the two insulating plates 8 that is far apart from each other. A U-shaped elastic block 11 is glued and fixed to the side of each of the two pressure sensors 12 that is far apart from each other. The side of the U-shaped elastic block 11 that is far away from the corresponding insulating plate 8 is glued and fixed to the multiple second conductive clamps 7. The pressure sensor 12 and the U-shaped elastic block 11 cooperate to detect the pressure of the second conductive clamps 7.

[0026] Two L-shaped insulating rods 13 are each fitted with a second electric telescopic rod 15 on the inner wall of their adjacent sides. One side of each L-shaped insulating rod 13 has a mounting hole for the corresponding second electric telescopic rod 15. The output shaft end of the second electric telescopic rod 15 is fixedly connected to the corresponding insulating plate 8. The second electric telescopic rod 15 drives the corresponding insulating plate 8 to move laterally. A controller 14 is fixedly connected to the adjacent sides of each L-shaped insulating rod 13. The controller 14 is electrically connected to the corresponding pressure sensor 12 and the second electric telescopic rod 15. The controller 14 receives signals from the pressure sensor 12 to control the corresponding second electric telescopic rod 15. The control principle is existing technology and will not be elaborated here. This invention, through a series of structural settings, can synchronously drive multiple second conductive clamping plates 7 to move and quickly control and clamp the corresponding printed circuit board. This effectively reduces the impact of excessive or insufficient clamping force on the printed circuit board, improves clamping stability, and allows adjustment of the vertical position of the printed circuit board according to electroplating requirements, facilitating electroplating operations.

[0027] Working principle: During use, when clamping the printed circuit board, the controller 14 pre-sets the closing pressure value of the second electric telescopic rod 15. The printed circuit board is placed between the corresponding first conductive clamp 3 and multiple second conductive clamps 7, with the printed circuit board in close contact with the conductive anti-slip rubber 16 on the first conductive clamp 3. Then, the second electric telescopic rod 15 is started in the forward direction. The output shaft of the second electric telescopic rod 15 drives the corresponding insulating plate 8 to move closer to the printed circuit board. The insulating plate 8, through the corresponding elastic rubber sleeve 10, drives multiple second conductive clamps 7 to move simultaneously closer to the printed circuit board. When the second conductive clamps 7 move the corresponding conductive anti-slip rubber 16 to close contact with the printed circuit board, the movement of the second conductive clamps 7 is restricted. At this time, the continuing to move insulating plate 8 slides on the corresponding multiple L-shaped guide rods 9 and compresses the elastic rubber sleeve 10. The insulating plate 8 is controlled by the corresponding pressure sensor. The 12th layer compresses the U-shaped elastic rubber block 11. Both the elastic rubber sleeve 10 and the U-shaped elastic rubber block 11 compress the corresponding second conductive clamping plate 7. The second conductive clamping plate 7 drives the corresponding conductive anti-slip rubber 16 to clamp the printed circuit board. At the same time, the pressure sensor 12 detects the compressing force. When the compressing force reaches the preset value, it proves that the clamping force on the printed circuit board has reached the preset value. The pressure sensor 12 transmits the signal to the corresponding controller 14. The controller 14 controls the corresponding second electric telescopic rod 15 to close and drives the corresponding multiple second conductive clamping plates 7 to clamp the printed circuit board simultaneously. This achieves a fast pressure-controlled clamping and fixing method for the printed circuit board, improving the clamping and fixing stability. It can effectively reduce the impact on the printed circuit board caused by large or small clamping forces. Furthermore, by driving multiple second conductive clamping plates 7 to clamp simultaneously, it is not necessary for personnel to operate them one by one, thus improving the clamping and fixing efficiency.

[0028] After the printed circuit board is clamped and fixed, it is placed in a tank containing electroplating solution. If the printed circuit board cannot be completely immersed in the electroplating solution, the first electric telescopic rod 5 can be activated in the forward direction. The output shaft of the first electric telescopic rod 5 drives the first conductive clamp 3 and the second conductive clamp 7 to move downward through the corresponding second conductive rod 4. The first conductive clamp 3 drives the corresponding conductive inner rod 2 to slide downward in the conductive outer tube 1. The first conductive clamp 3 and the second conductive clamp 7 simultaneously drive the corresponding printed circuit board into the electroplating solution. After immersion, the electroplating operation can be performed.

[0029] Furthermore, the principle by which the electroplating hanger 100, conductive mechanism 102, first conductive rod 103, conductive outer tube 1, conductive inner rod 2, first conductive clamping plate 3, second conductive rod 4, and second conductive clamping plate 7 work together to electroplat the printed circuit board has been mentioned in the patent with publication number CN215050822U, and will not be elaborated here. Moreover, the principle by which the first conductive rod 103 of this application is energized through the conductive outer tube 1, conductive inner rod 2, and second conductive rod 4 with the first conductive clamping plate 3 and the second conductive clamping plate 7 is the same as the principle by which the second conductive component is energized with the electroplating fixture mentioned in the patent with publication number CN215050822U. Therefore, it can be determined that the principle by which it electroplats the printed circuit board is the same.

[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A printed circuit board electroplating apparatus, comprising a printed circuit board electroplating apparatus body, the printed circuit board electroplating apparatus body including an electroplating hanger (100), two conductive mechanisms (102) mounted on the electroplating hanger (100), the bottom of the two conductive mechanisms (102) being mounted on the same base (101), and a first conductive rod (103) electrically connected to the conductive mechanism (102), characterized in that, Two first conductive rods (103) are symmetrically arranged. The first conductive rods (103) are fixedly connected to the electroplating rack (100). Mounting rods (104) are fixedly connected to both sides of the bottom of the electroplating rack (100). A first guide mechanism is fixedly connected to the side of the two mounting rods (104) that are close to each other. The top of the first guide mechanism is fixedly connected to the corresponding first conductive rod (103). A first conductive clamp (3) is fixedly connected to the bottom of the first guide mechanism. Multiple second conductive rods (4) are fixedly connected to the top of the side of the two first conductive clamps (3) that are close to each other. Two first electric telescopic rods (5) are fixedly installed at the bottom of the electroplating rack (100). The output shaft end of the first electric telescopic rod (5) is fixedly connected to the top of the corresponding second conductive rod (4). A second conductive clamp (7) is slidably sleeved on the second conductive rod (4). The two second conductive clamps (7) that are opposite each other on the left and right are... Two elastic guide mechanisms are fixedly connected to each other on the side that is close to each other. The ends of multiple second conductive rods (4) located on the same side are fixedly connected to the same L-shaped insulating rod (13). An insulating plate (8) is slidably sleeved on the L-shaped insulating rod (13). The insulating plate (8) is sleeved on the corresponding multiple elastic guide mechanisms. A pressure detection mechanism is fixedly connected to each other on the side that is far apart from each other. The pressure detection mechanism is fixedly connected to the corresponding multiple second conductive clamps (7). A second electric telescopic rod (15) is embedded and fixed on the inner wall of the side that is close to each other of the two L-shaped insulating rods (13). The output shaft end of the second electric telescopic rod (15) is fixedly connected to the corresponding insulating plate (8). A controller (14) is fixedly connected to each other on the side that is close to each other of the two L-shaped insulating rods (13). The controller (14) is electrically connected to the corresponding pressure detection mechanism and the second electric telescopic rod (15).

2. The printed circuit board electroplating apparatus according to claim 1, characterized in that, The first guiding mechanism includes a conductive outer tube (1), two conductive outer tubes (1) are respectively fixedly connected to the two mounting rods (104) on the side close to each other, the top end of the conductive outer tube (1) is fixedly connected to the corresponding first conductive rod (103), a conductive inner rod (2) is slidably sleeved inside the conductive outer tube (1), and the bottom end of the conductive inner rod (2) is fixedly connected to the top of the corresponding first conductive clamp (3).

3. The printed circuit board electroplating apparatus according to claim 2, characterized in that, The elastic guiding mechanism includes an L-shaped guide rod (9), one end of which is fixedly connected to the corresponding second conductive clamp (7). Two elastic rubber sleeves (10) are fixedly connected between the second conductive clamp (7) and the corresponding insulating plate (8). The elastic rubber sleeves (10) are movably sleeved on the corresponding L-shaped guide rod (9), and the insulating plate (8) is slidably sleeved on the corresponding multiple L-shaped guide rods (9).

4. The printed circuit board electroplating apparatus according to claim 3, characterized in that, The extrusion pressure detection mechanism includes a pressure sensor (12), which is electrically connected to the corresponding controller (14). The two pressure sensors (12) are respectively fixedly installed on the side of the two insulating plates (8) that are far apart from each other. A U-shaped elastic block (11) is glued and fixed on the side of the two pressure sensors (12) that is far apart from each other. The side of the U-shaped elastic block (11) that is far away from the corresponding insulating plate (8) is glued and fixed to a plurality of second conductive clamps (7).

5. The printed circuit board electroplating apparatus according to claim 1, characterized in that, The two second conductive clamps (7) are provided with an insulating layer (701) on the side that is close to each other.

6. The printed circuit board electroplating apparatus according to claim 1, characterized in that, The first conductive clamp (3) and the corresponding second conductive clamp (7) are both bonded and fixed with conductive anti-slip rubber (16) on the side that is close to each other.

7. The printed circuit board electroplating apparatus according to claim 1, characterized in that, The bottom of the electroplating hanger (100) is fixedly connected to two first insulating rods (6). The bottom end of the first insulating rod (6) is fixedly connected to the top end of the corresponding first electric telescopic rod (5). The first conductive rod (103) is movably sleeved on the corresponding first insulating rod (6).

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