Precise corrosion-resistant heat exchange device of bonding wire plating line
By designing circulation components and heat exchange assemblies, the flow heat exchange and real-time monitoring of the electroplating solution are realized, solving the problem of uneven heat exchange in traditional bonded wire electroplating lines and improving electroplating quality and equipment efficiency.
Patent Information
- Application Number
- CN202520355976.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2026-03-03
- Estimated Expiration
- 2035-03-03
AI Technical Summary
Traditional bonding wire electroplating lines suffer from uneven heat exchange in their heat exchange devices, and mechanical stirring devices may exacerbate equipment wear and increase energy consumption.
The design incorporates circulation components and heat exchange modules, including a circulation tank, circulation pump, and heat exchange tubes, to achieve the circulation of the electroplating solution. It is combined with temperature and level sensors for real-time monitoring and control.
It improves the uniformity of electroplating solution temperature, avoids local overheating or undercooling, enhances the quality and consistency of bonding wire electroplating, and reduces equipment wear and energy consumption.
Smart Images

Figure CN223965921U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of heat exchange equipment, and specifically relates to a precision corrosion-resistant heat exchange device for bonding wire electroplating lines. Background Technology
[0002] The heat exchange device in a bonded wire electroplating line is a crucial piece of equipment used to achieve heat exchange during the electroplating process, control the temperature of the electroplating solution, and ensure electroplating quality and process stability. In actual operation, the heat exchange uniformity of the heat exchange device in a bonded wire electroplating line still has room for optimization. Traditional immersion heat exchange devices rely on metal pipes directly contacting the electroplating solution. Limited by the heat exchange area and fluid flow characteristics, this easily leads to temperature gradients in localized areas. Currently, the industry often uses the addition of stirring devices to mitigate this problem. However, these methods also have limitations; the introduction of mechanical stirring devices may exacerbate equipment wear and increase energy consumption. Therefore, a new structure is needed to address these technical issues. Utility Model Content
[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a precision corrosion-resistant heat exchange device for bonding wire electroplating lines, so as to solve the problems mentioned in the background technology.
[0004] This utility model is achieved through the following technical solution: a precision corrosion-resistant heat exchange device for bonding wire electroplating lines, comprising: a heat exchange component, wherein a fixing member is installed on the lower surface of the heat exchange component for supporting the heat exchange component, a measuring member for measuring is installed on the upper surface of the heat exchange component, the heat exchange component includes a heat exchange box for storing electroplating solution, a heat exchange tube is installed inside the heat exchange box, and a circulation member for circulating the electroplating solution is installed on the left and right surfaces of the heat exchange box.
[0005] In a preferred embodiment, the fixing component includes fixing rods and reinforcing rods. A fixing rod is installed at each of the four corners of the lower surface of the heat exchange box, and an X-shaped reinforcing rod is installed between the two front fixing rods and the two rear fixing rods.
[0006] In a preferred embodiment, the circulation component includes a circulation box one, a circulation box two, a circulation pipe, and a circulation pump. The circulation box one is installed on the left side surface of the heat exchange box, and the circulation box two is installed on the right side surface of the heat exchange box two. The structure of the circulation box one is the same as that of the circulation box two.
[0007] In a preferred embodiment, the upper surface of the first circulation tank is provided with a liquid outlet, the right side surface of the second circulation tank is provided with a liquid inlet, a circulation pump is installed on the right side surface of the second circulation tank, and the outlet of the circulation pump is connected to the liquid inlet.
[0008] In a preferred embodiment, the inlet of the circulating pump is equipped with a circulating pipe, and the end of the circulating pipe away from the circulating pump is connected to the liquid outlet. The first circulating tank and the second circulating tank are connected to the interior of the heat exchange tank.
[0009] In a preferred embodiment, the measuring element includes a mounting rod, a mounting frame, a mounting plate, a control element, and a measuring device. The mounting frame is mounted on the top of the heat exchange box via four mounting rods, and the mounting plate is mounted on the upper surface of the mounting frame.
[0010] In a preferred embodiment, a control element for controlling the measuring device is mounted on the upper surface of the mounting plate, and a measuring device is mounted on the lower surface of the mounting plate. The measuring device includes a temperature sensor, a liquid level sensor, and a pH sensor.
[0011] In a preferred embodiment, a discharge valve is installed on the lower surface of the heat exchange box, the upper surface of the heat exchange box is designed to be open, and multiple heat exchange tubes are evenly installed between the left inner wall and the right inner wall of the heat exchange box.
[0012] After adopting the above technical solution, the beneficial effects of this utility model are as follows: 1. By setting up circulation components, circulation components for circulating electroplating solution are installed on the left and right surfaces of the heat exchange box. The circulation components include circulation box one, circulation box two, circulation pipe and circulation pump. During use, the circulation components make the electroplating solution continuously circulate between the heat exchange box and circulation box one and circulation box two. When the electroplating solution flows through the heat exchange box, it can fully exchange heat with the heat exchange pipe. Compared with static electroplating solution, flowing electroplating solution can absorb or release heat more efficiently, thereby making the overall temperature of the electroplating solution more uniform, avoiding local overheating or overcooling, which is conducive to improving the quality and consistency of bonding wire heat exchange.
[0013] 2. By setting up a heat exchange assembly, a fixing component is installed on the lower surface of the heat exchange assembly to support it, and a measuring component is installed on the upper surface of the heat exchange assembly. The heat exchange assembly includes a heat exchange box for storing the electroplating solution, and heat exchange tubes are installed inside the heat exchange box. During use, the flow rate of the electroplating solution may fluctuate during the operation of the heat exchange line. The heat exchange box can play a certain buffering role, storing a certain amount of electroplating solution to alleviate the impact of flow fluctuations on subsequent processes, so that the electroplating solution can be supplied to the bonding wire heat exchange stage more evenly and stably. Combined with the first operation step, this allows for better operation. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 This is a schematic diagram of the overall structure of a precision corrosion-resistant heat exchange device for a bonding wire electroplating line according to this utility model.
[0016] Figure 2 This is a schematic diagram of the side structure of a precision corrosion-resistant heat exchange device for a bonding wire electroplating line according to the present invention.
[0017] Figure 3 This is a schematic diagram of the mounting plate of a precision corrosion-resistant heat exchange device for a bonding wire electroplating line according to this utility model.
[0018] Figure 4 This is a schematic diagram of the circulation pipe of a precision corrosion-resistant heat exchange device for a bonding wire electroplating line according to this utility model.
[0019] In the diagram, 100-heat exchange box, 110-circulation box one, 111-liquid outlet, 120-circulation box two, 130-heat exchange tube, 140-circulation tube, 150-circulation pump;
[0020] 200 - Fixed rod, 210 - Reinforcing rod;
[0021] 300-Mounting rod, 310-Mounting frame, 320-Mounting plate, 330-Control components, 340-Measuring device. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Please see Figures 1 to 4This utility model provides a technical solution: a precision corrosion-resistant heat exchange device for bonding wire electroplating lines, comprising: a heat exchange component, a fixing member installed on the lower surface of the heat exchange component for supporting the heat exchange component, a measuring member installed on the upper surface of the heat exchange component for measurement, the heat exchange component including a heat exchange box 100 for storing electroplating solution, a heat exchange tube 130 installed inside the heat exchange box 100, and circulation members for circulating the electroplating solution installed on the left and right surfaces of the heat exchange box 100.
[0024] Please see Figures 1 to 4 As the first embodiment of this utility model: the fixing component includes a fixing rod 200 and a reinforcing rod 210. A fixing rod 200 is installed at each of the four corners of the lower surface of the heat exchange box 100, and a reinforcing rod 210 with an X-shaped structure is installed between the two front fixing rods 200 and the two rear fixing rods 200.
[0025] The circulation components include circulation box 110, circulation box 2 120, circulation pipe and circulation pump 150. Circulation box 110 is installed on the left side surface of heat exchange box 100, and circulation box 2 120 is installed on the right side surface of heat exchange box 2 100. The structure of circulation box 110 is the same as that of circulation box 2 120.
[0026] The upper surface of the first circulation tank 110 is provided with an outlet 111, the right side surface of the second circulation tank 120 is provided with an inlet, and a circulation pump 150 is installed on the right side surface of the second circulation tank 120. The outlet of the circulation pump 150 is connected to the inlet.
[0027] The inlet of the circulating pump 150 is equipped with a circulating pipe 140. The end of the circulating pipe 140 away from the circulating pump 150 is connected to the liquid outlet 111. The first circulating tank 110 and the second circulating tank 120 are connected to the inside of the heat exchange box 100.
[0028] In use, the user first places the bonding wire inside the heat exchange box 100, and then performs electroplating operation in the heat exchange box with an electroplating device (so that the electroplating solution is inside the heat exchange box 100), completely immersing it in the electroplating solution inside the heat exchange box 100. Then, the user activates the heat exchange tubes 130 inside the heat exchange box 100 (the heat exchange tubes 130 are Teflon tube bundles, which are existing technology; their specific structure and working principle will not be detailed here), using the heat exchange tubes 130 with the electroplating solution. At this time, the user can start the circulation pump 150 on the right side of the circulation tank 120, causing the circulation pump 150 to draw the electroplating solution out of the heat exchange box 100 through the circulation tank 120 and into the circulation pipe 140. The electroplating solution is then discharged into the circulation tank 110 through the circulation pipe 140. Subsequently, the electroplating solution is discharged back into the heat exchange tank 100 through the circulation tank 110, causing the electroplating solution inside the heat exchange tank 100 to circulate. At this time, the electroplating solution inside the heat exchange tank 100 will continuously circulate between the heat exchange tank 100, the circulation tank 110, and the circulation tank 120 through the circulation components. When the electroplating solution flows through the heat exchange tank 100, it can fully exchange heat with the heat exchange tube 130. Compared with the static electroplating solution, the flowing electroplating solution can absorb or release heat more efficiently, thereby making the overall temperature of the electroplating solution more uniform, avoiding local overheating or undercooling, and improving the quality and consistency of the bonding wire heat exchange.
[0029] Please see Figures 1 to 4 As a second embodiment of the present utility model: the measuring component includes a mounting rod 300, a mounting frame 310, a mounting plate 320, a control component 330, and a measuring device 340. The mounting frame 310 is mounted on the top of the heat exchange box 100 via four mounting rods 300, and the mounting plate 320 is mounted on the upper surface of the mounting frame 310.
[0030] A control component 330 is mounted on the upper surface of the mounting plate 320 for controlling the measuring device 340, and a measuring device 340 is mounted on the lower surface of the mounting plate 320. The measuring device 340 includes a temperature sensor, a liquid level sensor, and a pH sensor.
[0031] A discharge valve is installed on the lower surface of the heat exchange box 100, the upper surface of the heat exchange box 100 is designed to be open, and multiple heat exchange tubes 130 are evenly installed between the left inner wall and the right inner wall of the heat exchange box 100.
[0032] During use, users can perform a series of measurements on the electroplating solution using the measuring device 340 on the upper surface of the mounting plate 320, which allows users to obtain specific data about the electroplating solution (the measuring device 340 is existing technology, and its specific structure and working principle will not be described in detail here). At the same time, during the operation of the heat exchange line, the flow rate of the electroplating solution may fluctuate to a certain extent. The heat exchange box 100 can play a certain buffering role, storing a certain amount of electroplating solution to alleviate the impact of flow fluctuations on subsequent processes, so that the electroplating solution can be supplied to the bonding wire heat exchange stage more evenly and stably. Combined with the first operation step, this allows for better operation.
[0033] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A precision corrosion-resistant heat exchange device for a bonding wire electroplating line, comprising: A heat exchange assembly is characterized in that a fixing member is installed on the lower surface of the heat exchange assembly for supporting the heat exchange assembly, a measuring member for measuring is installed on the upper surface of the heat exchange assembly, the heat exchange assembly includes a heat exchange box (100) for storing electroplating solution, a heat exchange tube (130) is installed inside the heat exchange box (100), and a circulation member for circulating the electroplating solution is installed on the left and right surfaces of the heat exchange box (100).
2. The precision corrosion-resistant heat exchange device for bonding wire electroplating as described in claim 1, characterized in that: The fasteners include a fixing rod (200) and a reinforcing rod (210). A fixing rod (200) is installed at each of the four corners of the lower surface of the heat exchange box (100). A reinforcing rod (210) with an X-shaped structure is installed between the two front fixing rods (200) and the two rear fixing rods (200).
3. The precision corrosion-resistant heat exchange device for a bonding wire electroplating line as described in claim 2, characterized in that: The circulation components include circulation box one (110), circulation box two (120), circulation pipe (140) and circulation pump (150). Circulation box one (110) is installed on the left side surface of the heat exchange box (100), and circulation box two (120) is installed on the right side surface of the heat exchange box two (100). The structure of circulation box one (110) is the same as that of circulation box two (120).
4. The precision corrosion-resistant heat exchange device for a bonding wire electroplating line as described in claim 3, characterized in that: The upper surface of the first circulation tank (110) is provided with an outlet (111), the right side surface of the second circulation tank (120) is provided with an inlet, and a circulation pump (150) is installed on the right side surface of the second circulation tank (120). The outlet of the circulation pump (150) is connected to the inlet.
5. The precision corrosion-resistant heat exchange device for a bonding wire electroplating line as described in claim 4, characterized in that: The inlet of the circulating pump (150) is equipped with a circulating pipe (140), and the end of the circulating pipe (140) away from the circulating pump (150) is connected to the liquid outlet (111). The first circulating tank (110) and the second circulating tank (120) are connected to the heat exchange tank (100).
6. The precision corrosion-resistant heat exchange device for a bonding wire electroplating line as described in claim 1, characterized in that: The measuring component includes a mounting rod (300), a mounting frame (310), a mounting plate (320), a control component (330), and a measuring device (340). The mounting frame (310) is mounted on the top of the heat exchange box (100) via four mounting rods (300), and the mounting plate (320) is mounted on the upper surface of the mounting frame (310).
7. The precision corrosion-resistant heat exchange device for a bonding wire electroplating line as described in claim 6, characterized in that: The upper surface of the mounting plate (320) is equipped with a control element (330) for controlling the measuring device (340), and the lower surface of the mounting plate (320) is equipped with the measuring device (340), which includes a temperature sensor, a liquid level sensor and a pH sensor.
8. The precision corrosion-resistant heat exchange device for bonding wire electroplating as described in claim 1, characterized in that: A discharge valve is installed on the lower surface of the heat exchange box (100), the upper surface of the heat exchange box (100) is designed to be open, and multiple heat exchange tubes (130) are evenly installed between the left inner wall and the right inner wall of the heat exchange box (100).