Electromagnetic fusion head testing device of multilayer printed circuit board

Abstract

The utility model provides an electromagnetic fusion head testing device for a multilayer printed circuit board, and the device comprises an upper pressing plate assembly which is used for fixing a first electromagnetic fusion head; the lower pressing plate is arranged below the upper pressing plate assembly and used for fixing the second electromagnetic fusion head; the lifting assembly comprises a supporting part, a handle rod and a connecting part, the supporting part is arranged in the vertical direction and penetrates through the upper pressing plate assembly, one end of the supporting part is fixedly connected with the lower pressing plate, the other end of the supporting part is rotationally connected with one end of the handle rod, and the two ends of the connecting part are rotationally connected with the middle of the handle rod and the upper pressing plate assembly respectively; when the handle rod is rotated, the handle rod drives the connecting part to move, so that the upper pressing plate assembly ascends and descends relative to the lower pressing plate. When the handle rod is rotated, the handle rod can drive the connecting part to enable the upper pressing plate assembly to ascend and descend relative to the lower pressing plate so as to control the electromagnetic fusion head to clamp the multi-layer printed circuit board, so that the multi-layer printed circuit board is clamped simply and quickly, the fusion test difficulty is reduced, and the requirements of convenient and efficient test and electromagnetic parameter optimization are met.

Description

Technical Field

[0001] This application relates to the field of electromagnetic fusion technology, specifically to a testing device for an electromagnetic fusion head of a multilayer printed circuit board. Background Technology

[0002] Printed circuit boards (PCBs) are carriers for the electrical connection of electronic components. Based on the number of layers, they can be classified as single-sided, double-sided, four-layer, and other multi-layer PCBs. Multi-layer PCBs can be bonded using electromagnetic fusion heads, where an upper electromagnetic fusion head and a lower electromagnetic fusion head work together to heat and bond the multi-layer PCB held between them.

[0003] Because printed circuit boards with different layer structures and materials have different applicable electromagnetic parameters, fusion testing is required before mass fusion of multilayer printed circuit boards. This testing assesses the interlayer fusion quality to optimize parameters such as electromagnetic frequency, power, and time. Existing electromagnetic fusion head testing devices are complex in structure, and the operation steps for controlling the electromagnetic fusion head to clamp multilayer printed circuit boards are numerous and difficult, increasing the difficulty and time of testing and making it difficult to meet the needs for convenient, efficient, and reliable optimization of electromagnetic parameters. Summary of the Invention

[0004] This application is proposed based on the above-mentioned needs of the prior art. The technical problem to be solved by this application is to provide an electromagnetic fusion head testing device for multilayer printed circuit boards, which can control the electromagnetic fusion head to clamp multilayer printed circuit boards through simple operation, and complete the fusion test conveniently, efficiently and reliably.

[0005] To address the aforementioned problems, this application provides the following technical solution.

[0006] This application discloses an electromagnetic fusion head testing device for multilayer printed circuit boards, comprising: an upper pressure plate assembly for fixing a first electromagnetic fusion head; a lower pressure plate disposed below the upper pressure plate assembly for fixing a second electromagnetic fusion head; and a lifting assembly including a support portion, a handle rod, and a connecting portion. The support portion is arranged vertically, passes through the upper pressure plate assembly, has one end fixedly connected to the lower pressure plate, and its other end rotatably connected to one end of the handle rod. The two ends of the connecting portion are rotatably connected to the middle of the handle rod and the upper pressure plate assembly, respectively. When the handle rod is rotated, the handle rod drives the connecting portion to move, causing the upper pressure plate assembly to rise and fall relative to the lower pressure plate.

[0007] Furthermore, when the handle is rotated to the first position, the first electromagnetic welding head abuts against the upper surface of the multilayer printed circuit board, and the second electromagnetic welding head abuts against the lower surface of the multilayer printed circuit board.

[0008] Furthermore, the support includes a support rod passing through the upper pressure plate assembly, the bottom end of the support rod being fixedly connected to the lower pressure plate, and the top end of the support rod being provided with a mounting seat, which is rotatably connected to one end of the handle rod.

[0009] Furthermore, the number of support rods is multiple.

[0010] Furthermore, the support rod has a polygonal cross-section.

[0011] Furthermore, the upper pressure plate assembly includes a first upper pressure plate and a pressure rod, the support portion passes through the first upper pressure plate, the pressure rod is fixedly disposed above the first upper pressure plate, and the connecting portion is rotatably connected to the pressure rod.

[0012] Furthermore, the lifting assembly includes a guide sleeve disposed between the connecting portion and the first upper pressure plate, the guide sleeve being fixedly connected to the support portion, the pressure rod being disposed in a vertical direction, and the pressure rod passing through the guide sleeve.

[0013] Furthermore, the inner wall of the guide sleeve is provided with an anti-slip layer, which is interference-fitted with the pressure rod. The anti-slip layer is used to restrict the pressure rod from sliding within the guide sleeve when the handle rod is stopped from being rotated.

[0014] Furthermore, the upper pressure plate assembly includes a second upper pressure plate and a spring. The second upper pressure plate is disposed below the first upper pressure plate. The support portion passes through the second upper pressure plate. The spring is compressibly disposed between the first upper pressure plate and the second upper pressure plate. The first electromagnetic welding head is fixedly disposed on the lower surface of the second upper pressure plate.

[0015] Furthermore, there are two of each of the first electromagnetic fusion head and the second electromagnetic fusion head.

[0016] The beneficial effects of this application include:

[0017] (1) When the handle is rotated, the handle can drive the connecting part to raise and lower the upper pressure plate assembly relative to the lower pressure plate, so as to control the electromagnetic fusion head to clamp the multi-layer printed circuit board, thereby clamping the multi-layer printed circuit board simply and quickly, reducing the difficulty of performing fusion test, and meeting the need for convenient and efficient optimization of electromagnetic parameters.

[0018] (2) A handle rod of a certain length is rotatably connected to the support part. Rotating the handle rod uses the lever principle to drive the upper pressure plate assembly to rise and fall, so that the operation of clamping multi-layer printed circuit boards can be easily completed.

[0019] (3) The lifting assembly can simultaneously use the support and guide sleeve to restrict the movement direction of the upper pressure plate assembly, so that it can only move in the vertical direction, effectively preventing the upper pressure plate assembly from rotating around the support as an axis during the lifting process, thereby enabling the first electromagnetic welding head fixed to the upper pressure plate assembly to be aligned with the heating position, thus improving the reliability of the bonding.

[0020] (4) The inner wall of the guide sleeve is provided with an anti-slip layer. The anti-slip layer is interference-fitted with the pressure rod. When the handle rod is rotated to the first position and the pressure is stopped, the friction between the anti-slip layer and the pressure rod can be greater than the reaction force transmitted from the multilayer printed circuit board to the pressure rod, thereby restricting the pressure rod from sliding in the guide sleeve. This allows the first electromagnetic welding head and the second electromagnetic welding head to still clamp the multilayer printed circuit board, improving the reliability of the bonding.

[0021] (5) The upper pressure plate assembly includes two upper pressure plates and a spring. The spring is compressibly disposed between the two upper pressure plates. When the electromagnetic welding head clamps the multilayer printed circuit board, the spring can be deformed by pressure, so the tilt of the two upper pressure plates can also be automatically adjusted, so that the first electromagnetic welding head can abut well against the upper surface of the multilayer printed circuit board, further improving the reliability of the bonding. Attached Figure Description

[0022] To more clearly illustrate the specific embodiments described in this specification, the accompanying drawings used in the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some specific embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings.

[0023] Figure 1 This is a perspective view of the electromagnetic fusion head testing device in this specific embodiment.

[0024] Figure 2 This is a front view of the electromagnetic fusion head testing device in this specific embodiment.

[0025] Figure 3 This is a right view of the electromagnetic fusion head testing device in this specific embodiment.

[0026] Figure 4 This is a perspective view of the electromagnetic welding head testing device when the handle is rotated to the first position in this specific embodiment.

[0027] Figure label:

[0028] 1000 Electromagnetic fusion head testing device; 1100 Upper pressure plate assembly; 1110 First upper pressure plate; 1120 Pressure rod; 1130 Second upper pressure plate; 1140 Spring; 1200 Lower pressure plate; 1300 Lifting assembly; 1310 Support part; 1311 Support rod; 1312 Mounting base; 1320 Handle rod; 1330 Connecting part; 1340 Guide sleeve;

[0029] 2000, First Electromagnetic Fusion Head;

[0030] 3000, Second Electromagnetic Fusion Head;

[0031] 4000, First pivot;

[0032] 5000, Second Shaft;

[0033] 6000, the third shaft. Detailed Implementation

[0034] The technical solutions in the embodiments of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the embodiments described in this application are only a part of the embodiments, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0035] like Figure 1 As shown, an electromagnetic fusion head testing device 1000 for a multilayer printed circuit board includes an upper pressure plate assembly 1100 for fixing a first electromagnetic fusion head 2000, a lower pressure plate 1200 for fixing a second electromagnetic fusion head 3000, and a lifting assembly 1300 for controlling the height of the upper pressure plate assembly 1100 relative to the lower pressure plate 1200.

[0036] In this specific embodiment, there are two first electromagnetic fusion heads 2000 and two second electromagnetic fusion heads 3000. The two first electromagnetic fusion heads 2000 and the two second electromagnetic fusion heads 3000 are arranged opposite to each other. A changing electromagnetic field can be formed between each pair of oppositely arranged first electromagnetic fusion heads 2000 and two second electromagnetic fusion heads 3000. The changing electromagnetic field generates an induced electromotive force in the metal layer of the multilayer printed circuit board to drive the charge to move inside the metal layer, thereby forming eddy currents and causing the metal layer to heat up rapidly. The adhesive material adjacent to the metal layer is heated and melted to achieve rapid bonding of the multilayer printed circuit board.

[0037] The lifting assembly 1300 includes, for example: Figure 2 , Figure 3 and Figure 4The support portion 1310, handle rod 1320, and connecting portion 1330 are shown. The support portion 1310 is arranged vertically and passes through the upper pressure plate assembly 1100. One end of the support portion 1310 is fixedly connected to the lower pressure plate 1200, and the other end is rotatably connected to one end of the handle rod 1320. The two ends of the connecting portion 1330 are rotatably connected to the middle of the handle rod 1320 and the upper pressure plate assembly 1100, respectively.

[0038] Specifically, the support part 1310 includes a support rod 1311 passing through the upper pressure plate assembly 1100. The bottom end of the support rod 1311 is fixedly connected to the lower pressure plate 1200 by screws. The top end of the support rod 1311 is provided with a mounting seat 1312. The mounting seat 1312 has a through hole extending in the left-right direction. A first rotating shaft 4000 passes through the through hole of the mounting seat 1312 and the bottom end of the handle rod 1320. The support part 1310 and the handle rod 1320 are rotatably connected through the first rotating shaft 4000. The connecting part 1330 consists of two metal plates disposed on the left and right sides of the handle rod 1320. A second rotating shaft 5000 passes through the top of the two metal plates and the middle of the handle rod 1320. The handle rod 1320 and the connecting part 1330 are rotatably connected through the second rotating shaft 5000. The third rotating shaft 6000 passes through the bottom of the two metal plates and the top of the upper pressure plate assembly 1100, and the upper pressure plate assembly 1100 and the connecting part 1330 are rotatably connected by the third rotating shaft 6000.

[0039] When bonding multilayer printed circuit boards, first place the stacked multilayer printed circuit boards on the second electromagnetic welding head 3000. Then, when the handle rod 1320 is rotated, the handle rod 1320 drives the connecting part 1330 to move, causing the upper pressure plate assembly 1100 to descend to the desired position. Figure 4 The positions are shown, and the first electromagnetic fusion head 2000 abuts against the upper surface of the multilayer printed circuit board, and the second electromagnetic fusion head 3000 abuts against the lower surface of the multilayer printed circuit board.

[0040] Using the electromagnetic fusion head testing device proposed in this application, the first electromagnetic fusion head 2000 and the second electromagnetic fusion head 3000 can be quickly controlled to clamp multilayer printed circuit boards through simple operation, and the fusion test can be completed conveniently and efficiently. Therefore, it can meet the needs of convenient and efficient optimization of electromagnetic parameters.

[0041] In addition, the handle 1320 of a certain length is rotatably connected to the support 1310. Rotating the handle 1320 uses the lever principle to drive the upper pressure plate assembly 1100 to rise and fall, so that the operation of clamping multi-layer printed circuit boards can be easily completed.

[0042] like Figure 4As shown, the support portion 1310 may include multiple support rods 1311 passing through the upper pressure plate assembly 1100. In this specific embodiment, there are two support rods 1311, which are spaced a certain distance apart. This prevents the upper pressure plate assembly 1100 from rotating around a single support rod 1311, thereby ensuring that the first electromagnetic welding head 2000 fixed to the upper pressure plate assembly 1100 can be aligned with the heating position, improving the reliability of the bonding.

[0043] To more effectively limit the rotation of the upper pressure plate assembly 1100 during lifting and lowering, and to prevent the first electromagnetic fusion head 2000 from failing to align with the heating position, the cross-section of the support rod 1311 can be polygonal. In this specific embodiment, the support rod 1311 is a rectangular rod, and the first upper pressure plate 1110 has a rectangular through hole matching the shape of the rectangular rod. The rectangular rod passes through the rectangular through hole, and its four side walls contact the inner wall of the rectangular through hole to limit the rotation of the upper pressure plate assembly 1100 relative to the support part 1310.

[0044] Furthermore, the upper pressure plate assembly 1100 may include a first upper pressure plate 1110 and a pressure rod 1120. A support portion 1310 passes through the first upper pressure plate 1110, and the pressure rod 1120 is fixedly disposed above the first upper pressure plate 1110. A connecting portion 1330 is rotatably connected to the pressure rod 1120. The lifting assembly 1300 may include a guide sleeve 1340 disposed between the connecting portion 1330 and the first upper pressure plate 1110. The guide sleeve 1340 is fixedly connected to the support portion 1310, and the pressure rod 1120 is disposed vertically, passing through the guide sleeve 1340.

[0045] The first upper pressure plate 1110 of the upper pressure plate assembly 1100 slides vertically relative to the support portion 1310 of the lifting assembly 1300, and the pressure rod 1120 of the upper pressure plate assembly 1100 slides vertically relative to the guide sleeve 1340 of the lifting assembly 1300. Therefore, the lifting assembly 1300 can simultaneously use the support portion 1310 and the guide sleeve 1340 to restrict the movement direction of the upper pressure plate assembly 1100, so that it can only move in the vertical direction, and more effectively prevent the upper pressure plate assembly 1100 from rotating around the support portion 1310 as an axis during the lifting process.

[0046] When the handle 1320 is rotated to the first position, the first electromagnetic welding head 2000 clamps the multilayer printed circuit board. When the handle 1320 is stopped, the first electromagnetic welding head 2000 will be subjected to the reaction force of the multilayer printed circuit board, causing the first electromagnetic welding head 2000 and the second electromagnetic welding head 3000 to be unable to clamp the multilayer printed circuit board.

[0047] In this specific embodiment, the inner wall of the guide sleeve 1340 is provided with an anti-slip layer, which is interference-fitted with the pressure rod 1120. For example, the anti-slip layer is an elastic rubber coating. During the rotation of the handle rod 1320, the rubber coating undergoes elastic deformation. When the handle rod 1320 is rotated to the first position and the pressure is stopped, due to the elastic deformation of the rubber coating, the surfaces of the rubber coating and the pressure rod 1120 are pressed against each other, resulting in a large pressure between them. Furthermore, the inner wall of the guide sleeve 1340, which has a smoother rubber coating, has a larger coefficient of friction. Therefore, the frictional force between them is greater than the reaction force transmitted from the multilayer printed circuit board to the pressure rod 1120, thereby restricting the pressure rod 1120 from sliding within the guide sleeve 1340. This allows the first electromagnetic fusion head 2000 and the second electromagnetic fusion head 3000 to still clamp the multilayer printed circuit board, improving the reliability of the bonding.

[0048] like Figure 3 As shown, the upper pressure plate assembly 1100 may include a second upper pressure plate 1130 and a spring 1140. The second upper pressure plate 1130 is disposed below the first upper pressure plate 1110, the support portion 1310 passes through the second upper pressure plate 1130, and the spring 1140 is compressibly disposed between the first upper pressure plate 1110 and the second upper pressure plate 1130. The first electromagnetic fusion head 2000 is fixedly disposed on the lower surface of the second upper pressure plate 1130. Because the spring 1140 is compressibly disposed between the first upper pressure plate 1110 and the second upper pressure plate 1130, when the first electromagnetic fusion head 2000 and the second electromagnetic fusion head 3000 clamp the multilayer printed circuit board, the spring 1140 can be deformed under pressure, thus automatically adjusting the tilt of the two upper pressure plates. This ensures that the first electromagnetic fusion head 2000 makes good contact with the upper surface of the multilayer printed circuit board, further improving the reliability of the bonding.

[0049] The above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A testing device for an electromagnetic fusion head of a multilayer printed circuit board, characterized in that, include: Upper pressure plate assembly (1100) is used to fix the first electromagnetic welding head (2000); The lower pressure plate (1200) is located below the upper pressure plate assembly (1100) and is used to fix the second electromagnetic welding head (3000); The lifting assembly (1300) includes a support part (1310), a handle rod (1320), and a connecting part (1330). The support part (1310) is arranged vertically and passes through the upper pressure plate assembly (1100). One end of the support part (1310) is fixedly connected to the lower pressure plate (1200), and the other end is rotatably connected to one end of the handle rod (1320). The two ends of the connecting part (1330) are rotatably connected to the middle part of the handle rod (1320) and the upper pressure plate assembly (1100), respectively. When the handle (1320) is rotated, the handle (1320) drives the connecting part (1330) to move, causing the upper pressure plate assembly (1100) to rise and fall relative to the lower pressure plate (1200).

2. The electromagnetic fusion head testing device according to claim 1, characterized in that, When the handle (1320) is rotated to the first position, the first electromagnetic welding head (2000) abuts against the upper surface of the multilayer printed circuit board, and the second electromagnetic welding head (3000) abuts against the lower surface of the multilayer printed circuit board.

3. The electromagnetic fusion head testing device according to claim 2, characterized in that, The support part (1310) includes a support rod (1311) passing through the upper pressure plate assembly (1100). The bottom end of the support rod (1311) is fixedly connected to the lower pressure plate (1200). The top end of the support rod (1311) is provided with a mounting seat (1312). The mounting seat (1312) is rotatably connected to one end of the handle rod (1320).

4. The electromagnetic fusion head testing device according to claim 3, characterized in that, The number of support rods (1311) is multiple.

5. The electromagnetic fusion head testing device according to claim 3, characterized in that, The support rod (1311) has a polygonal cross-section.

6. The electromagnetic fusion head testing device according to claim 2, characterized in that, The upper pressure plate assembly (1100) includes a first upper pressure plate (1110) and a pressure rod (1120). The support part (1310) passes through the first upper pressure plate (1110), the pressure rod (1120) is fixedly disposed above the first upper pressure plate (1110), and the connecting part (1330) is rotatably connected to the pressure rod (1120).

7. The electromagnetic fusion head testing device according to claim 6, characterized in that, The lifting assembly (1300) includes a guide sleeve (1340) disposed between the connecting part (1330) and the first upper pressure plate (1110). The guide sleeve (1340) is fixedly connected to the support part (1310). The pressure rod (1120) is arranged in a vertical direction and passes through the guide sleeve (1340).

8. The electromagnetic fusion head testing device according to claim 7, characterized in that, The inner wall of the guide sleeve (1340) is provided with an anti-slip layer, which is interference-fitted with the pressure rod (1120). The anti-slip layer is used to restrict the pressure rod (1120) from sliding within the guide sleeve (1340) when the handle rod (1320) is stopped from being rotated.

9. The electromagnetic fusion head testing device according to claim 6, characterized in that, The upper pressure plate assembly (1100) includes a second upper pressure plate (1130) and a spring (1140). The second upper pressure plate (1130) is disposed below the first upper pressure plate (1110). The support portion (1310) passes through the second upper pressure plate (1130). The spring (1140) is compressibly disposed between the first upper pressure plate (1110) and the second upper pressure plate (1130). The first electromagnetic welding head (2000) is fixedly disposed on the lower surface of the second upper pressure plate (1130).

10. The electromagnetic fusion head testing device according to any one of claims 1-9, characterized in that, There are two of each of the first electromagnetic fusion head (2000) and the second electromagnetic fusion head (3000).

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