Lens driving device

Abstract

The utility model belongs to the technical field of optical imaging equipment, and particularly relates to a lens driving device which comprises a base, a carrier, a frame, a cover plate and a circuit board, and AF balls are arranged between the side wall of the frame and the side wall of the base; the carrier is sleeved with the frame and can move in the X-axis direction and the Y-axis direction in the carrier containing cavity, an OIS ball is arranged between the bottom end of the carrier and the inner bottom end of the frame, and three magnets are installed on the carrier; and three coils are arranged on the circuit board, are respectively opposite to the three magnets and are matched with the three magnets to realize three-axis movement of the carrier. Through the ingenious design of the frame and the cover plate, when the carrier moves in the Z-axis direction, the frame can be driven to move in the Z-axis direction while the carrier moves in the X-axis direction and the Y-axis direction, so that the OIS anti-shake operation of the lens is realized. According to the utility model, the OIS balls and the AF balls are arranged, so that the friction force when the carrier moves can be reduced.

Description

Technical Field

[0001] This utility model belongs to the field of optical imaging equipment technology, and specifically relates to a lens driving device. Background Technology

[0002] With the development of technology, many electronic devices today (such as smartphones or digital cameras) have the function of taking pictures or recording videos. The use of these electronic devices is becoming more and more common, and they are developing towards convenient and thinner designs to provide users with more choices.

[0003] Some electronic devices with photographic or video recording capabilities are equipped with a lens drive mechanism to move optical components such as a lens, thereby achieving autofocus and optical image stabilization (OIS). Light can pass through the optical components to form an image on the photosensitive element.

[0004] Existing lens drive mechanisms typically include an OIS coil assembly to prevent lens shake, a magnet assembly, a zoom coil, and a mount for the lens. Under the action of the OIS coil assembly and the magnet assembly, the mount, along with the lens, moves along the X and Y axes. Under the action of the zoom coil and the magnet assembly, the mount, along with the lens, moves along the Z axis, thus achieving three-axis lens movement. However, existing lens drive mechanisms often experience difficulty in movement during the X and Y axis movements due to significant friction between the mount and the base, sometimes resulting in impossibility of movement or shaking during movement, severely impacting the three-axis lens movement. Utility Model Content

[0005] The present invention addresses the aforementioned technical problems by providing a lens driving device.

[0006] A lens driving device includes a base, a carrier, a frame, a cover plate, and a circuit board. The frame is sleeved inside the base, and AF balls are disposed between the side wall of the frame and the side wall of the base. The frame and the cover plate are connected to form a carrier receiving cavity.

[0007] The carrier is fitted inside the frame and can move in the X-axis and Y-axis directions within the carrier cavity. OIS balls are provided between the bottom end of the carrier and the bottom end of the frame. Three magnets are installed on the carrier.

[0008] The circuit board is located on the outside of the base, and three coils are provided on the circuit board. The three coils are respectively arranged opposite to the three magnets. The carrier moves relative to the frame in the X-axis and Y-axis directions, the carrier drives the cover plate, and the frame moves relative to the base in the Z-axis direction through the cooperation of the three coils and the three magnets.

[0009] Optionally, the cover plate is located at the top of the carrier and the top of the frame, and the frame is snap-fitted to the cover plate.

[0010] Optionally, the circuit board is an FPC board.

[0011] Optionally, the circuit board is provided with an extension board, the extension board is provided with a first power point, the frame is provided with a frame-integrated circuit, the frame-integrated circuit is connected to a second power point provided on one side of the top of the frame, the first power point is connected to the second power point and supplies power to the frame-integrated circuit;

[0012] An X-axis transmitting electrode plate and an X-axis receiving electrode plate are arranged at the bottom of the frame along the X-axis direction, and a Y-axis transmitting electrode plate and a Y-axis receiving electrode plate are arranged at the bottom of the frame along the Y-axis direction. The X-axis transmitting electrode plate, the X-axis receiving electrode plate, the Y-axis transmitting electrode plate, and the Y-axis receiving electrode plate are respectively connected to the built-in circuit of the frame and respectively connected to a first capacitor IC chip. The first capacitor IC chip is used to monitor the capacitance value between the X-axis transmitting electrode plate and the X-axis receiving electrode plate, and the capacitance value between the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate.

[0013] The bottom end of the carrier is provided with an X-axis metal plate corresponding to the X-axis transmitting electrode plate and the X-axis receiving electrode plate, and a Y-axis metal plate corresponding to the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate.

[0014] Optionally, there are two X-axis receiving electrode plates, which are arranged side by side along the Y-axis.

[0015] Optionally, there are two Y-axis receiving electrode plates, which are arranged side by side along the X-axis.

[0016] Optionally, when the carrier moves relative to the frame in the X-axis direction, the relative area between the X-axis metal plate and the X-axis transmitting electrode plate remains unchanged, while the relative area between the carrier and the X-axis receiving electrode plate changes.

[0017] Optionally, when the carrier moves relative to the frame in the Y-axis direction, the relative area between the Y-axis metal plate and the Y-axis transmitting electrode plate remains unchanged, while the relative area between the carrier and the Y-axis receiving electrode plate changes.

[0018] Optionally, two of the three magnets are coated with a metal layer and are respectively the X-axis magnet and the Y-axis magnet. The X-axis magnet and the Y-axis magnet are exposed at the bottom of the carrier. The X-axis magnet is arranged opposite to the X-axis transmitting electrode plate and the X-axis receiving electrode plate as the X-axis metal plate, and the Y-axis magnet is arranged opposite to the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate as the Y-axis metal plate.

[0019] Optionally, the circuit board is provided with a third power point, the base has a built-in base circuit, the built-in base circuit is connected to a fourth power point, the third power point is connected to the fourth power point and supplies power to the built-in base circuit;

[0020] A Z-axis transmitting electrode plate and a Z-axis receiving electrode plate are provided on the inner wall of one side of the base along the X-axis or Y-axis direction. The Z-axis transmitting electrode plate and the Z-axis receiving electrode plate are respectively connected to the built-in circuit of the base and respectively connected to the second capacitor IC chip. The second capacitor IC chip is used to monitor the capacitance value between the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate.

[0021] The frame sidewall is provided with a Z-axis metal plate corresponding to the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate.

[0022] Optionally, there are two Z-axis receiving electrode plates, which are arranged side by side along the Z-axis direction.

[0023] Optionally, one of the three magnets is coated with a metal layer and is a Z-axis magnet. The Z-axis magnet is exposed on the outer wall of the frame, and the Z-axis magnet is arranged opposite to the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate as the Z-axis metal plate.

[0024] Optionally, when the carrier moves the cover plate and the frame relative to the base in the Z-axis direction, the relative area between the Z-axis metal plate and the Z-axis transmitting electrode plate remains unchanged, while the relative area between the carrier and the Z-axis receiving electrode plate changes.

[0025] Optionally, an X-axis fixed electrode plate and a Y-axis fixed electrode plate are provided at the bottom of the frame. The X-axis fixed electrode plate and the Y-axis fixed electrode plate are respectively connected to a third capacitor IC chip. An X-axis movable electrode plate corresponding to the X-axis fixed electrode plate and a Y-axis movable electrode plate corresponding to the Y-axis fixed electrode plate are provided at the bottom of the carrier. After the X-axis fixed electrode plate, the Y-axis fixed electrode plate, the X-axis movable electrode plate, and the Y-axis movable electrode plate are powered on, the third capacitor IC chip monitors the capacitance value between the X-axis fixed electrode plate and the X-axis movable electrode plate, and the capacitance value between the Y-axis fixed electrode plate and the Y-axis movable electrode plate, respectively.

[0026] Optionally, there are two X-axis fixed electrode plates, which are arranged side by side along the X-axis direction.

[0027] Optionally, there are two Y-axis fixed electrode plates, which are arranged side by side along the Y-axis direction.

[0028] Optionally, a Z-axis fixed electrode plate is provided on the inner wall of one side of the base. The Z-axis fixed electrode plate is connected to a fourth capacitor IC chip. A Z-axis movable electrode plate corresponding to the Z-axis fixed electrode plate is provided on the side wall of the frame. After the Z-axis fixed electrode plate and the Z-axis movable electrode plate are powered on, the fourth capacitor IC chip monitors the capacitance value between the Z-axis fixed electrode plate and the Z-axis movable electrode plate.

[0029] Optionally, there are two Z-axis fixed electrode plates, which are arranged side by side along the Z-axis direction.

[0030] Optionally, the lens driving device further includes a housing, which is detachably connected to the base and forms a hollow cavity, and the carrier, the frame and the cover plate are all disposed in the hollow cavity.

[0031] Beneficial effects: This utility model has at least one or more of the following advantages:

[0032] 1. Through the ingenious design of the frame and cover plate, this utility model can achieve OIS image stabilization of the lens by driving the frame to move in the Z-axis direction when the carrier moves in the Z-axis direction, without hindering the carrier's movement in the X-axis and Y-axis directions.

[0033] In addition, by setting OIS balls between the carrier and the frame, this utility model can reduce friction when the carrier moves relative to the frame in the X-axis and Y-axis directions; by setting AF balls between the frame and the base, this utility model can reduce friction when the frame moves relative to the base in the Z-axis direction.

[0034] 2. This utility model can form a floating capacitor structure by combining the X / Y / Z emitting electrode plate, the X / Y / Z axis receiving electrode plate, and the X / Y / Z axis metal plate. When the X / Y / Z axis metal plate moves with the carrier, the capacitance value between the X / Y / Z axis emitting electrode plate and the X / Y / Z axis receiving electrode plate will change and be monitored by their respective capacitor IC chips. Based on the change in capacitance value, the movement position of the carrier in the X / Y / Z axis direction can be monitored. This structure acts as a position sensor.

[0035] 3. Since the X / Y / Z axis metal plates in the floating capacitor structure do not require power, magnets with a metal coating can be used instead of metal plates. This achieves the same effect as a floating capacitor. In this case, the X / Y / Z axis magnets work in conjunction with their corresponding coils to drive the X / Y / Z axes. Simultaneously, the X / Y / Z axis magnets work in conjunction with the X / Y / Z axis transmitting and receiving electrode plates to monitor the position along the X / Y / Z axes. Replacing metal plates with X / Y / Z axis magnets reduces the number of metal plates required, simplifying the overall device layout.

[0036] 4. This utility model achieves a conventional capacitor structure by combining the X / Y / Z fixed electrode plate and the X / Y / Z movable electrode plate, which can also realize position monitoring in the X / Y / Z axis direction. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the structure of this utility model;

[0038] Figure 2 for Figure 1 AA section view;

[0039] Figure 3 for Figure 1 BB cross-sectional view;

[0040] Figure 4 for Figure 1 Exploded view;

[0041] Figure 5 for Figure 4 Further exploded view;

[0042] Figure 6 for Figure 5 Further exploded view of the part;

[0043] Figure 7 This is an exploded view of the circuit board, base, frame, and carrier of this utility model.

[0044] Figure 8 This is a diagram showing the positional relationship between the circuit board, base, and frame of this utility model;

[0045] Figure 9 for Figure 8 Exploded view;

[0046] Figure 10 This is a schematic diagram of the structure of the carrier of this utility model;

[0047] Figure 11 This is a schematic diagram of one structure of the frame of this utility model;

[0048] Figure 12 Exploded view of the circuit board, the circuitry built into the base, the circuitry built into the frame, the electrode plates, and the metal plates of the utility model.

[0049] Figure 13 for Figure 12 Another perspective illustration;

[0050] Figure 14 (a) to (c) are three positional relationships of the floating capacitor structure of this utility model;

[0051] Figure 15 (a) to (c) are three positional relationships of the conventional capacitor structure of this utility model. Detailed Implementation

[0052] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so as to better understand the purpose, features and advantages of the present invention. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of the present invention, but are only for illustrating the essential spirit of the technical solution of the present invention.

[0053] In the following description, certain specific details are set forth for the purpose of illustrating various disclosed embodiments in order to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the art will recognize that embodiments may be practiced without one or more of these specific details. In other instances, well-known apparatuses, structures, and techniques associated with this application may not have been shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0054] Throughout this specification, references to "an embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the appearance of "in an embodiment" or "an embodiment" in various places throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any manner in one or more embodiments.

[0055] In the following description, in order to clearly demonstrate the structure and working method of this utility model, a number of directional terms will be used. However, terms such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and not as limiting terms.

[0056] Reference Figures 1 to 13 This utility model provides a lens driving device, which has a communicating lens through hole in the middle along the optical axis (Z-axis direction). The lens driving device includes a housing 10, a base 20, a carrier 30, a frame 40, a cover plate 50, and a circuit board 60.

[0057] The outer shell 10 is an optional structure. The outer shell 10 and the base 20 are detachably connected and form a hollow cavity. The carrier 30, frame 40 and cover plate 50 are all disposed within the hollow cavity. The outer shell 10 and the base 20 are preferably connected by a snap-fit ​​connection to form the hollow cavity.

[0058] The frame 40 is fitted inside the base 20 and is located below the cover plate 50. The frame 40 and the cover plate 50 are connected to form a carrier receiving cavity. The carrier 30 is fitted inside the frame 40. That is, when the carrier 30 is located in the carrier receiving cavity between the frame 40 and the cover plate 50, the bottom end of the carrier 30 contacts the frame 40 (when there is an OIS ball 74 between the carrier 30 and the frame 40, the carrier 40 indirectly contacts the frame 40 through the OIS ball 74) but they are not physically connected. The top end of the carrier 30 may have a gap with the cover plate 50, or it may contact the cover plate 50 but not be physically connected, so that the carrier 30 can move in the X-axis and Y-axis directions within the carrier receiving cavity, and the carrier 30 can move in the Z-axis direction with the cover plate 50 and the frame 40 within the hollow cavity. A lens is mounted on the carrier 30. By moving the carrier 30 in three axes within the hollow cavity, the OIS image stabilization and automatic zoom operation of the lens are achieved.

[0059] The carrier 30 achieves three-axis movement through a drive mechanism, which includes three magnets 71 and three coils 72. The three magnets 71 are respectively the X-axis magnet, Y-axis magnet, and Z-axis magnet. Specifically, the carrier 30 is equipped with three magnets 71, the circuit board 60 is located on the outside of the base 20, and the circuit board 60 is equipped with three coils 72. The three coils 72 are respectively arranged opposite to the three magnets 71. Through the cooperation of the three coils 72 and the three magnets 71, the carrier 30 moves relative to the frame 40 in the X-axis and Y-axis directions, the carrier 30 drives the cover plate 50, and the frame 40 moves relative to the base 20 in the Z-axis direction.

[0060] An AF ball bearing 73 is provided between the side wall of the frame 40 and the side wall of the base 20, and an OIS ball bearing 74 is provided between the bottom end of the carrier 30 and the inner bottom end of the frame 40.

[0061] This invention, through the ingenious design of the frame 40 and cover plate 50, allows the carrier 30 to move along the X and Y axes without hindering its movement. When the carrier 30 moves along the Z axis, it drives the frame 40 to move along with it, thus achieving OIS image stabilization of the lens. Furthermore, by incorporating OIS ball bearings 74 between the carrier and the frame, this invention reduces friction during X and Y axis movement of the carrier relative to the frame. Additionally, by incorporating AF ball bearings 73 between the frame and the base, this invention reduces friction during Z axis movement of the frame relative to the base.

[0062] In one embodiment, AF ball grooves are respectively provided on the side wall of the frame 40 and the side wall of the base 20. After the frame 40 is placed in the base 20, the AF ball grooves on the side wall of the frame 40 are opposite to the AF ball grooves on the side wall of the base 20 and are provided with AF balls 73.

[0063] In one embodiment, the number of AF balls 73 can be determined according to the actual situation. Preferably, one AF ball 73 is provided between each of the four corner positions of the side wall of the frame 40 and the four corner positions of the side wall of the base 20.

[0064] In one embodiment, OIS ball grooves are respectively provided on the bottom end of the carrier 30 and the bottom end of the frame 40. After the carrier 30 is placed inside the frame 40, the OIS ball groove at the bottom end of the carrier 30 is opposite to the OIS ball groove at the bottom end of the frame 40 and is provided with OIS balls 74.

[0065] In one embodiment, the number of OIS balls 74 can be determined according to the actual situation. Preferably, one OIS ball 74 is provided between the four corner positions at the bottom of the carrier 30 and the four corner positions at the bottom of the frame 40.

[0066] In one embodiment, the cover plate 50 is located at the top of the carrier 30 and the top of the frame 40, and the frame 40 and the cover plate 50 are snap-fitted together.

[0067] In practical implementation, a buckle or latch can be provided at the bottom of the cover plate 50, and a latch or buckle can be provided on the outer wall of the frame 40. The two are connected by the buckle fastening to the latch. Figure 6 As shown, a downward protruding snap-fit ​​ear is provided at the bottom of the cover plate 50, and a snap-fit ​​opening 51 is provided on the snap-fit ​​ear. A buckle 41 is provided on the outer wall of the frame 40 near the top. The frame 40 and the cover plate 50 are snapped together by the buckle 41 and the snap-fit ​​opening 51.

[0068] In one embodiment, the circuit board 60 is an FPC board.

[0069] The circuit board 60 is preferably arranged around the outside of the side wall of the base 20. For example... Figure 6As shown, circuit board 60 has a U-shaped structure.

[0070] In one embodiment, reference is made to Figure 12 and Figure 13 An extension plate 61 is provided on the circuit board 60, and the extension plate 61 is preferably an extension flexible board with an FPC board structure. A first power-on point 611 is provided on the extension plate 61.

[0071] Reference Figure 12 and Figure 13 The frame 40 has a built-in frame circuit 42. A second power-on point 421 is set on one side of the top of the frame 40. The built-in frame circuit 42 is connected to the second power-on point 421. The first power-on point 611 is connected to the second power-on point 421. The circuit board 60 supplies power to the built-in frame circuit 42 through the first power-on point 611 and the second power-on point 421 in sequence.

[0072] In specific implementation, the number of the first energizing point 611 and the second energizing point 421 can be arranged according to the number of X / Y axis transmitting electrode plates and X / Y axis receiving electrode plates set in the frame's built-in circuit 42. For example... Figure 12 and Figure 13 As shown, there are five first power-on points 611 and five second power-on points 421. Each X / Y axis receiving electrode plate is individually connected to a second power-on point 421, while the X / Y axis transmitting electrode plates share a second power-on point 421.

[0073] Reference Figure 12 and Figure 13 An X-axis transmitting electrode plate 431 and an X-axis receiving electrode plate 432 are arranged along the X-axis direction at the bottom inner end of the frame 40, and a Y-axis transmitting electrode plate 433 and a Y-axis receiving electrode plate 434 are arranged along the Y-axis direction at the bottom inner end of the frame 40. The X-axis transmitting electrode plate 431, X-axis receiving electrode plate 432, Y-axis transmitting electrode plate 433, and Y-axis receiving electrode plate 434 are respectively connected to the frame's built-in circuit 42 and are powered by the frame's built-in circuit 42. The X-axis transmitting electrode plate 431, X-axis receiving electrode plate 432, Y-axis transmitting electrode plate 433, and Y-axis receiving electrode plate 434 are respectively connected to a first capacitor IC chip, which is used to monitor the capacitance value between the X-axis transmitting electrode plate 431 and the X-axis receiving electrode plate 432, and the capacitance value between the Y-axis transmitting electrode plate 433 and the Y-axis receiving electrode plate 434.

[0074] Reference Figure 12 and Figure 13 The bottom of the carrier 30 is provided with an X-axis metal plate 311 corresponding to the X-axis transmitting electrode plate 431 and the X-axis receiving electrode plate 432, and a Y-axis metal plate 312 corresponding to the Y-axis transmitting electrode plate 433 and the Y-axis receiving electrode plate 434.

[0075] The X-axis transmitting electrode plate 431, X-axis receiving electrode plate 432, and X-axis metal plate 311 can be combined to form a floating capacitor structure. In this structure, the X-axis metal plate 311 does not require power, greatly reducing wiring complexity and facilitating installation. As the X-axis metal plate 311 moves with the carrier 30, the projection areas between the X-axis metal plate 311 and the X-axis transmitting electrode plate 431, and between the X-axis metal plate 311 and the X-axis receiving electrode plate 432, change with the movement of the X-axis metal plate 311. This results in a change in capacitance between the X-axis transmitting electrode plate 431 and the X-axis receiving electrode plate 432, which is detected by the first capacitor IC chip. Based on the change in capacitance, the movement position of the carrier 30 in the X-axis direction can be monitored, thus this structure functions as a position sensor.

[0076] Similarly, the combination of the Y-axis transmitting electrode plate 433, the Y-axis receiving electrode plate 434, and the Y-axis metal plate 312 forms a floating capacitor structure, which can realize the monitoring of the movement position of the carrier in the Y-axis direction. In this structure, the Y-axis metal plate 312 does not need to be powered, which greatly reduces the wiring difficulty and facilitates installation.

[0077] In this embodiment, the positions of the transmitting electrode plate and the receiving electrode plate can be interchanged; the positions of the electrode plate and the metal plate can also be interchanged, which can achieve the same position monitoring effect.

[0078] In one embodiment, the first capacitor IC chip is preferably disposed on the circuit board 60. There are several first power-on points 611 and second power-on points 421, and the first capacitor IC chip is connected to the X-axis transmitting electrode plate 431, the X-axis receiving electrode plate 432, the Y-axis transmitting electrode plate 433, and the Y-axis receiving electrode plate 434 through each of the first power-on points 611 and the second power-on points 421, respectively.

[0079] In one embodiment, reference is made to Figure 12 and Figure 13 There are two X-axis receiving electrode plates 432, which are arranged side by side along the Y-axis.

[0080] In this embodiment, refer to Figure 14(a) to (c), taking the floating capacitor structure formed in the X-axis direction requiring four electrode plates as an example, one electrode plate, as the X-axis metal plate 311, is located on the moving part, i.e., the carrier 30. The other three electrode plates are located on the fixed part, i.e., the frame 40, as an X-axis transmitting electrode plate 431 and two X-axis receiving electrode plates 432, respectively. The shape of the electrode plates is not limited and can be changed. For example, the cross-section can be any of the following: triangular, trapezoidal, circular, or elliptical. Any central axis of each electrode plate is parallel to the preset motion path, preferably the longest central axis of each electrode plate is parallel to the preset motion path. When the moving part moves along the preset motion path, i.e., the X-axis direction, the overlapping area between the X-axis metal plate 311 and the X-axis transmitting electrode plate 431 and the two X-axis receiving electrode plates 432 changes, resulting in a change in capacitance between the X-axis transmitting electrode plate 431 and the two X-axis receiving electrode plates 432. Since the change in capacitance corresponds one-to-one with the amount of movement, it can be used as a measure of displacement.

[0081] In one embodiment, reference is made to Figure 12 and Figure 13 There are two Y-axis receiving electrode plates 434, which are arranged side by side along the X-axis.

[0082] In one embodiment, when the carrier 30 moves relative to the frame 40 in the X-axis direction, the relative area between the X-axis metal plate 311 and the X-axis emitting electrode plate 431 remains unchanged, while the relative area between the carrier 30 and the X-axis receiving electrode plate 432 changes, so as to facilitate the calculation of the change in capacitance between the emitting electrode plate and the receiving electrode plate.

[0083] In specific implementation, it can be as follows: Figure 14 Rotating the X-axis emitting electrode plate 431 by 90 degrees in (a) to (c) means orthogonalizing the longest central axis of the X-axis emitting electrode plate 431 to the preset motion path, thus achieving the goal of keeping the relative area between the X-axis metal plate 311 and the X-axis emitting electrode plate 431 constant. Alternatively, the size of the X-axis emitting electrode plate 431 can be made smaller so that the X-axis metal plate 311 can fully cover the area of ​​the X-axis emitting electrode plate 431 during movement, also achieving the goal of keeping the relative area between the X-axis metal plate 311 and the X-axis emitting electrode plate 431 constant. Of course, other measures can also be used to achieve the goal of keeping the relative area between the X-axis metal plate 311 and the X-axis emitting electrode plate 431 constant.

[0084] In one embodiment, when the carrier 30 moves relative to the frame 40 in the Y-axis direction, the relative area between the Y-axis metal plate 312 and the Y-axis transmitting electrode plate 433 remains unchanged, while the relative area between the carrier 30 and the Y-axis receiving electrode plate 434 changes, so as to facilitate the calculation of the change in capacitance between the transmitting electrode plate and the receiving electrode plate.

[0085] In one embodiment, two of the three magnets 71 are coated with a metal layer and are respectively the X-axis magnet and the Y-axis magnet. The X-axis magnet and the Y-axis magnet are exposed at the bottom of the carrier 30. The X-axis magnet 71 is arranged opposite to the X-axis transmitting electrode plate 431 and the X-axis receiving electrode plate 432 as the X-axis metal plate 311. The Y-axis magnet 71 is arranged opposite to the Y-axis transmitting electrode plate 433 and the Y-axis receiving electrode plate 434 as the Y-axis metal plate 312.

[0086] In this embodiment, a magnet with a metal coating is used instead of a metal plate, which can achieve the same technical effect as a floating capacitor.

[0087] In one embodiment, reference is made to Figure 12 and Figure 13 The circuit board 60 is provided with a third power point 621, and the base 20 has a built-in base circuit 21. The built-in base circuit 21 is connected to a fourth power point 211. The third power point 621 is connected to the fourth power point 211. The circuit board 60 supplies power to the built-in base circuit 21 through the third power point 621 and the fourth power point 211 in sequence.

[0088] In specific implementation, the number of the third power-on point 621 and the fourth power-on point 211 can be arranged according to the number of Z-axis transmitting electrode plates 221 and Z-axis receiving electrode plates 222 set in the base's built-in circuit 21. For example... Figure 12 and Figure 13 As shown, there are three third power-on points 621 and three fourth power-on points 211. The Z-axis transmitting electrode 221 and the two Z-axis receiving electrode plates 222 are respectively connected to one fourth power-on point 211.

[0089] Reference Figure 12 and Figure 13 A Z-axis transmitting electrode plate 221 and a Z-axis receiving electrode plate 222 are disposed on the inner wall of one side of the base 20 along the X-axis or Y-axis direction. The Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 are respectively connected to the base's built-in circuit 21 and are powered by the base's built-in circuit 21. The Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 are respectively connected to a second capacitor IC chip, which is used to monitor the capacitance value between the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222.

[0090] Reference Figure 12 and Figure 13 The frame 40 has a Z-axis metal plate 441 on its side wall, which corresponds to the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222.

[0091] Similarly, the combination of the Z-axis transmitting electrode plate 221, the Z-axis receiving electrode plate 222, and the Z-axis metal plate 441 forms a floating capacitor structure, which can realize the monitoring of the movement position of the carrier in the Z-axis direction. In this structure, the Z-axis metal plate 441 does not need to be powered, which greatly reduces the difficulty of wiring and facilitates installation.

[0092] In this embodiment, the positions of the transmitting electrode plate and the receiving electrode plate can be interchanged; the positions of the electrode plate and the metal plate can also be interchanged, which can achieve the same position monitoring effect.

[0093] In specific implementation, the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 are arranged side by side according to their positions on the side wall of the base 20. When the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 are arranged side by side along the X-axis direction on the side wall with the length direction being the X-axis. Figure 12 and Figure 13 As shown, the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 are disposed on the side wall with the length direction of the Y-axis, and are arranged side by side along the Y-axis.

[0094] In one embodiment, the second capacitor IC chip is preferably disposed on the circuit board 60. There are several third power-on points 621 and fourth power-on points 211, and the second capacitor IC chip is connected to the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 through each of the third power-on points 621 and the fourth power-on points 211, respectively.

[0095] In one embodiment, there are two Z-axis receiving electrode plates 222, which are arranged side by side along the Z-axis direction.

[0096] In one embodiment, one of the three magnets 71 is coated with a metal plating and is a Z-axis magnet 71. The Z-axis magnet 71 is exposed on the outer wall of the frame. The Z-axis magnet 71 is arranged opposite to the Z-axis transmitting electrode plate 221 and the Z-axis receiving electrode plate 222 as a Z-axis metal plate 441.

[0097] In this embodiment, a magnet with a metal coating is used instead of a metal plate, which can achieve the same technical effect as a floating capacitor.

[0098] In one embodiment, when the carrier 30 moves the cover plate 50 and the frame 40 relative to the base 20 in the Z-axis direction, the relative area between the Z-axis metal plate 441 and the Z-axis transmitting electrode plate 221 remains unchanged, while the relative area between the carrier 30 and the Z-axis receiving electrode plate 222 changes, so as to calculate the change in capacitance between the transmitting electrode plate and the receiving electrode plate.

[0099] In one embodiment, an X-axis fixed electrode plate and a Y-axis fixed electrode plate are provided at the bottom of the frame 40. The X-axis fixed electrode plate and the Y-axis fixed electrode plate are respectively connected to a third capacitor IC chip. The bottom of the carrier 30 is provided with an X-axis movable electrode plate corresponding to the X-axis fixed electrode plate and a Y-axis movable electrode plate corresponding to the Y-axis fixed electrode plate. After the X-axis fixed electrode plate, the Y-axis fixed electrode plate, the X-axis movable electrode plate, and the Y-axis movable electrode plate are powered on, the third capacitor IC chip monitors the capacitance value between the X-axis fixed electrode plate and the X-axis movable electrode plate, and the capacitance value between the Y-axis fixed electrode plate and the Y-axis movable electrode plate, respectively.

[0100] In this embodiment, the fixed X / Y axis electrode plate and the movable X / Y axis electrode plate need to be energized. A conventional capacitor structure is formed between the energized fixed X / Y axis electrode plate and the movable X / Y axis electrode plate. When the movable X / Y axis electrode plate moves, the capacitance value between the two changes, thereby achieving the position monitoring effect.

[0101] In this embodiment, the power supply to the X-axis fixed electrode plate and the Y-axis fixed electrode plate can be achieved by the circuit board sequentially supplying power to the frame's built-in circuits through the first power-on point and the second power-on point.

[0102] In this embodiment, the power supply for the X-axis moving electrode plate and the Y-axis moving electrode plate can be achieved using existing power supply methods.

[0103] In one embodiment, there are two X-axis fixed electrode plates, which are arranged side by side along the X-axis direction.

[0104] In this embodiment, refer to Figure 15 (a) to (c), taking a conventional capacitor structure formed along the X-axis requiring three electrode plates as an example, one electrode plate serves as the X-axis movable electrode plate 313 located on the moving component, i.e., the carrier 30, and the other two electrode plates serve as the X-axis fixed electrode plates 435 located on the fixed component, i.e., the frame 40. The shape of the electrode plates is not limited and can be changed; for example, the cross-section may include, but is not limited to, any one of the following: triangular, trapezoidal, circular, or elliptical. Any central axis of each electrode plate is parallel to a preset motion path, preferably the longest central axis of each electrode plate is parallel to the preset motion path. When the X-axis movable electrode plate 313 moves along the preset motion path, i.e., the X-axis direction, the overlapping area between the X-axis movable electrode plate 313 and the X-axis fixed electrode plate 435 changes, resulting in a change in capacitance between the X-axis movable electrode plate 313 and the X-axis fixed electrode plate 435. Since the change in capacitance corresponds one-to-one with the amount of movement, it can be used as a measure of displacement.

[0105] In one embodiment, there are two Y-axis fixed electrode plates, which are arranged side by side along the Y-axis direction.

[0106] In one embodiment, a Z-axis fixed electrode plate is provided on the inner wall of one side of the base 20. The Z-axis fixed electrode plate is connected to the fourth capacitor IC chip. A Z-axis movable electrode plate corresponding to the Z-axis fixed electrode plate is provided on the side wall of the frame 40. After the Z-axis fixed electrode plate and the Z-axis movable electrode plate are powered on, the fourth capacitor IC chip monitors the capacitance value between the Z-axis fixed electrode plate and the Z-axis movable electrode plate.

[0107] In one embodiment, there are two Z-axis fixed electrode plates, which are arranged side by side along the Z-axis direction.

[0108] In one embodiment, reference is made to Figure 6 The base 20 has three coil clearance openings 23 that are connected internally and externally. When the circuit board 60 is set outside the base 20, the three coils 72 are respectively located in one of the corresponding coil clearance openings 23.

[0109] Reference Figure 6 , Figure 7 , Figure 9 and Figure 11 The frame 40 has three magnetic clearance openings 45 that are connected internally and externally. When the carrier 30 is inside the frame 40, the three magnets 71 are located in the corresponding magnetic clearance opening 45.

[0110] The above design of this embodiment, as follows: Figure 2 and Figure 3 As shown, when the magnet 71 and the coil 72 are facing each other, there are no other obstructions between them, which makes it easy for the coil 72 to work stably with the magnet 71 after being energized to achieve the purpose of three-axis movement.

[0111] The preferred embodiments of this utility model have been described in detail above. However, it should be understood that after reading the above teachings, those skilled in the art can make various alterations or modifications to this utility model. These equivalent forms also fall within the scope defined by the appended claims.

Claims

1. A lens driving device characterized by comprising: The lens driving device comprises a base, a carrier, a frame, a cover plate and a circuit board, the frame is sleeved in the base, AF balls are arranged between the side wall of the frame and the side wall of the base, and the frame and the cover plate are connected to form a carrier accommodating cavity; The carrier is sleeved in the frame and can move in the X-axis direction and the Y-axis direction in the carrier accommodating cavity, OIS balls are arranged between the bottom end of the carrier and the inner bottom end of the frame, and three magnets are mounted on the carrier; The circuit board is arranged outside the base, three coils are arranged on the circuit board, the three coils are respectively arranged opposite to the three magnets, and the carrier moves relative to the frame in the X-axis direction and the Y-axis direction through cooperation of the three coils and the three magnets, the carrier drives the cover plate and the frame to move relative to the base in the Z-axis direction.

2. The lens driving device according to claim 1, wherein The cover plate is located at the top end of the carrier and the top end of the frame, and the frame is connected to the cover plate in a clamping manner; And / or, the circuit board is an FPC board; And / or, the lens driving device further comprises a shell, the shell is detachably connected with the base and constitutes a hollow cavity, and the carrier, the frame and the cover plate are arranged in the hollow cavity.

3. The lens driving apparatus according to claim 1 or 2, wherein The circuit board is provided with an extension plate, the extension plate is provided with a first power supply point, the frame is provided with a frame built-in circuit, the frame built-in circuit is connected with a second power supply point arranged on one side of the top end of the frame, and the first power supply point is connected with the second power supply point and supplies power to the frame built-in circuit; The inner bottom end of the frame is provided with an X-axis transmitting electrode plate and an X-axis receiving electrode plate along the X-axis direction, and is provided with a Y-axis transmitting electrode plate and a Y-axis receiving electrode plate along the Y-axis direction, the X-axis transmitting electrode plate, the X-axis receiving electrode plate, the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate are respectively connected to the frame built-in circuit and are respectively connected to a first capacitor IC chip, and the first capacitor IC chip is used for monitoring the capacitance value between the X-axis transmitting electrode plate and the X-axis receiving electrode plate and the capacitance value between the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate. The bottom end of the carrier is provided with an X-axis metal plate corresponding to the X-axis transmitting electrode plate and the X-axis receiving electrode plate, and a Y-axis metal plate corresponding to the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate.

4. The lens driving apparatus according to claim 3, wherein The X-axis receiving electrode plate is two, and the two X-axis receiving electrode plates are arranged side by side along the Y-axis direction; And / or, the Y-axis receiving electrode plate is two, and the two Y-axis receiving electrode plates are arranged side by side along the X-axis direction; And / or, when the carrier moves relative to the frame in the X-axis direction, the relative area between the X-axis metal plate and the X-axis transmitting electrode plate remains unchanged, and the relative area between the X-axis metal plate and the X-axis receiving electrode plate changes; And / or, when the carrier moves relative to the frame in the Y-axis direction, the relative area between the Y-axis metal plate and the Y-axis transmitting electrode plate remains unchanged, and the relative area between the Y-axis metal plate and the Y-axis receiving electrode plate changes; And / or, two of the three magnets are coated with a metal plating on the outer surface and are X-axis magnets and Y-axis magnets, respectively, the X-axis magnets and the Y-axis magnets are exposed at the bottom end of the carrier, the X-axis magnets are arranged opposite to the X-axis transmitting electrode plate and the X-axis receiving electrode plate as the X-axis metal plate, and the Y-axis magnets are arranged opposite to the Y-axis transmitting electrode plate and the Y-axis receiving electrode plate as the Y-axis metal plate.

5. The lens driving apparatus according to claim 1 or 2, wherein The circuit board is provided with a third power supply point, and the base is provided with a base built-in circuit, the base built-in circuit is connected with a fourth power supply point, and the third power supply point is connected with the fourth power supply point and supplies power to the base built-in circuit. The Z-axis transmitting electrode plate and the Z-axis receiving electrode plate are arranged on the inner wall of one side of the base along the X-axis direction or the Y-axis direction, the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate are connected to the base built-in circuit and connected with a second capacitor IC chip respectively, and the second capacitor IC chip is used for monitoring the capacitance between the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate. The Z-axis metal plate corresponding to the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate is arranged on the side wall of the frame.

6. The lens driving apparatus according to claim 5, wherein The Z-axis receiving electrode plate is two, and the two Z-axis receiving electrode plates are arranged side by side along the Z-axis direction. And / or, when the carrier drives the cover plate and the frame to move relative to the base along the Z-axis direction, the relative area between the Z-axis metal plate and the Z-axis transmitting electrode plate remains unchanged, and the relative area between the Z-axis metal plate and the Z-axis receiving electrode plate changes. And / or, one of the three magnets is coated with a metal plating on the outer surface and is a Z-axis magnet, and the Z-axis magnet is exposed on the outer side wall of the frame, and the Z-axis magnet is arranged opposite to the Z-axis transmitting electrode plate and the Z-axis receiving electrode plate as the Z-axis metal plate.

7. The lens driving apparatus according to claim 1 or 2, wherein The X-axis fixed electrode plate and the Y-axis fixed electrode plate are arranged at the inner bottom end of the frame, the X-axis fixed electrode plate and the Y-axis fixed electrode plate are connected with a third capacitor IC chip respectively, the carrier is provided with an X-axis moving electrode plate corresponding to the X-axis fixed electrode plate and a Y-axis moving electrode plate corresponding to the Y-axis fixed electrode plate at the bottom end, and after the X-axis fixed electrode plate, the Y-axis fixed electrode plate, the X-axis moving electrode plate and the Y-axis moving electrode plate are powered, the third capacitor IC chip respectively monitors the capacitance between the X-axis fixed electrode plate and the X-axis moving electrode plate and the capacitance between the Y-axis fixed electrode plate and the Y-axis moving electrode plate.

8. The lens driving apparatus according to claim 7, wherein The X-axis fixed electrode plate is two, and the two X-axis fixed electrode plates are arranged side by side along the X-axis direction. And / or, the Y-axis fixed electrode plate is two, and the two Y-axis fixed electrode plates are arranged side by side along the Y-axis direction.

9. The lens driving apparatus according to claim 1 or 2, wherein The Z-axis fixed electrode plate is arranged on the inner wall of one side of the base, the Z-axis fixed electrode plate is connected with the fourth capacitor IC chip, the Z-axis moving electrode plate corresponding to the Z-axis fixed electrode plate is arranged on the side wall of the frame, and the fourth capacitor IC chip monitors the capacitance value between the Z-axis fixed electrode plate and the Z-axis moving electrode plate after the Z-axis fixed electrode plate and the Z-axis moving electrode plate are electrified.

10. The lens driving apparatus according to claim 9, wherein The Z-axis fixed electrode plate is two, and the two Z-axis fixed electrode plates are arranged side by side along the Z-axis direction.

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