Horizontal compartment heat dissipation air duct structure of computer case
By adopting a horizontal compartment design and optimizing the position of heat dissipation components in the computer chassis, the heat dissipation problem of dual-chamber chassis has been solved, and the safety and aesthetics have been improved.
Patent Information
- Application Number
- CN202520660046.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-09
- Publication Date
- 2026-03-03
- Estimated Expiration
- 2035-04-09
AI Technical Summary
Existing computer case cooling structures are ineffective at cooling dual-chamber structures, and their installation locations are flawed in terms of both safety and aesthetics.
The chassis adopts a horizontal compartmentalized design, dividing the internal space of the main body into a first compartment and a second compartment. Using partitions and heat dissipation components, including a lower cooling fan and an upper cooling fan, the air intake and exhaust are respectively used. Combined with a heat dissipation mesh and observation glass, the installation position of the heat dissipation components is optimized.
It achieves effective heat dissipation for the dual-chassis chassis, improves safety and dust prevention, and enhances aesthetics and practicality.
Smart Images

Figure CN223966857U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of computer chassis technology, and in particular to a horizontal compartmentalized heat dissipation airflow structure for a computer chassis. Background Technology
[0002] A computer case is an important component of computer hardware, primarily used to house and protect the various components of the computer. It typically includes the outer shell, bracket, and front panel. Cases are designed and functionally diverse to meet different usage needs. Since components such as the motherboard, CPU, power supply, and graphics card are also installed inside the computer case, these components easily generate heat during operation. Therefore, the heat dissipation airflow structure of the computer case is particularly important.
[0003] Chinese Patent Publication No. CN212723845U discloses a heat dissipation structure for a computer chassis, comprising a chassis, heat sinks, a mounting plate, a cooling fan, a cover, and elastic components. A baffle is provided on the inner wall of the chassis. The heat sink is disposed inside the chassis, located inside the baffle. The mounting plate is slidably disposed inside the chassis, positioned between the baffle and the elastic components. The cooling fan is mounted on the mounting plate. The cover is disposed on the chassis. The elastic components are disposed on the inner walls of the chassis on both sides. This invention can dissipate heat from the circuit components inside the computer chassis, slowing down the damage time of the components. Multiple cooling fans can be added according to user needs, providing high flexibility. The elastic components and baffles facilitate the installation and removal of the mounting plate.
[0004] The existing heat dissipation structures of computer cases described above are only suitable for single-chamber cases. For existing dual-chamber cases, the heat dissipation structure cannot effectively dissipate heat from both chambers. Furthermore, the heat dissipation structure is located at the outer end of the case, which has defects in terms of both safety and aesthetics. In response, we propose a horizontal compartmentalized heat dissipation airflow structure for computer cases. Utility Model Content
[0005] One object of this invention is to solve at least the problems described above and to provide at least the advantages that will be explained later.
[0006] Another objective of this invention is to provide a horizontally compartmented heat dissipation duct structure for a computer chassis, which enables heat dissipation for a computer chassis containing two compartments and optimizes the installation position of the heat dissipation components, ensuring both safety and aesthetics.
[0007] To achieve the above objectives and some other objectives, the present invention adopts the following technical solution:
[0008] A horizontally compartmented heat dissipation duct structure for a computer chassis includes: a chassis body, an internal partition of which divides the space inside the chassis body into a first compartment and a second compartment; a heat dissipation assembly installed inside the first compartment, the heat dissipation assembly being located at the upper and lower ends of the first compartment; an assembly plate for connecting the two compartments being installed on the outer wall of the partition; and a rear cooling fan for exhausting hot air from the second compartment being installed on the rear end face of the second compartment.
[0009] Preferably, the heat dissipation assembly includes a lower heat dissipation fan installed at the bottom of the first engine compartment for air intake operation, and an upper heat dissipation fan installed at the top of the first engine compartment for air extraction operation. There are multiple lower and upper heat dissipation fans, and the multiple lower and upper heat dissipation fans are arranged horizontally at intervals.
[0010] Preferably, a heat dissipation assembly is installed at the heat dissipation vent above the upper cooling fan. The heat dissipation assembly includes a limiting plate, a first heat dissipation mesh is installed on the outer wall of the limiting plate, and a second heat dissipation mesh is installed at the air inlet below the lower cooling fan.
[0011] Preferably, the outer wall of the assembly plate is provided with multiple wire holes, and several traction holes are provided above the wire holes.
[0012] Preferably, a plurality of assembly frames are installed on the outer wall of the partition near the second cabin, and a plurality of heat dissipation holes are provided on the outer wall of the assembly frames. A second side plate is installed on the outer wall of the second cabin, and a third heat dissipation mesh is installed on the outer wall of the second side plate.
[0013] Preferably, the upper surface of the main body of the chassis is provided with two sets of assembly slots, a first side plate is installed on the outer wall of the first compartment, an observation glass is installed on the outer wall of the first side plate, two sets of first assembly blocks are installed above the first side plate, and a second assembly block is installed at the bottom of the limiting plate. Positioning holes are provided on the outer walls of the assembly slots, the first assembly blocks and the second assembly blocks, and bolts are used to assemble the assembly slots, the first assembly blocks and the second assembly blocks together in the positioning holes.
[0014] This utility model has at least the following beneficial effects:
[0015] 1. Compared with existing computer cooling structures, this horizontal compartmentalized cooling airflow structure of the computer chassis divides the internal space of the chassis into a first compartment and a second compartment using a partition. The second compartment is used to house the power supply, hard drive, and other components, while the first compartment is used to house the motherboard, graphics card, and other components. This structure isolates the power supply from other heat-generating components, preventing heat accumulation between them and effectively improving safety. The cooling components in the first compartment are used to dissipate heat from the internal space. Specifically, the lower cooling fan draws cool external air into the interior, while the upper cooling fan extracts internal heat. Both the lower and upper cooling fans are arranged horizontally, effectively increasing the heat dissipation area and effect. While cooling is being carried out in the first compartment, the rear cooling fan in the second compartment draws air backward, causing internal heat to be expelled from the inside to the outside, thus achieving the purpose of cooling the second compartment.
[0016] 2. Compared with existing computer cooling structures, the horizontal compartmentalized heat dissipation airflow structure of this computer chassis has an upper cooling fan that is isolated from external dust by a first heat dissipation mesh cover during the heat dissipation process, and a lower cooling fan that is isolated from external dust by a second heat dissipation mesh cover. This improves the dustproof effect of the chassis and prevents excessive dust from entering the chassis during the heat dissipation process.
[0017] 3. Compared with existing computer cooling structures, this horizontal compartmentalized heat dissipation structure of the computer chassis features a first side panel installed in the first compartment. The viewing glass allows users to easily observe the interior of the chassis, improving its aesthetics. This first side panel is detachable; during disassembly, the bolts are removed, followed by the removal of the limiting plate, freeing it from its constraint. The first side panel can then be removed. During installation, the first assembly block of the first side panel is aligned and inserted into the assembly slot. Then, the second assembly block at the bottom of the limiting plate is similarly inserted into the assembly slot, positioned above the first assembly block. The limiting plate restricts the first side panel, and bolts are installed through positioning holes to assemble the first assembly block, second assembly block, and assembly slot together, improving stability and robustness. This structure not only provides heat dissipation and dust protection for the top but also restricts the first side panel, effectively enhancing the functionality and practicality of the structure.
[0018] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description
[0019] Figure 1 This is a perspective view of the overall structure of this utility model;
[0020] Figure 2This is a schematic diagram of the second side plate structure of this utility model;
[0021] Figure 3 This is a bottom view of the main body of the chassis of this utility model;
[0022] Figure 4 This is a schematic diagram of the second engine compartment structure of this utility model;
[0023] Figure 5 This is a schematic diagram of the heat dissipation assembly structure of this utility model;
[0024] Figure 6 This is a schematic diagram of the first side plate assembly structure of this utility model. Detailed Implementation
[0025] The present invention will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can implement it after referring to this specification.
[0026] like Figure 1-6 As shown, a horizontally compartmented heat dissipation structure for a computer chassis includes: a chassis body 1; a partition 4 is installed inside the chassis body 1, dividing the space inside the chassis body 1 into a first compartment 103 and a second compartment 104; a heat dissipation assembly 5 is installed inside the first compartment 103, located at the upper and lower ends of the first compartment 103; an assembly plate 401 for connecting the two compartments is installed on the outer wall of the partition 4; and a rear end plate for exhausting hot air from the second compartment 104 is installed on the rear end face of the second compartment 104. The cooling fan 9 and the cooling assembly 5 include a lower cooling fan 501 installed at the bottom of the first machine compartment 103 for air intake operation, and an upper cooling fan 502 installed at the top of the first machine compartment 103 for air extraction operation. There are multiple lower cooling fans 501 and upper cooling fans 502, and the multiple lower cooling fans 501 and upper cooling fans 502 are arranged horizontally at intervals. Multiple wire holes 403 are opened on the outer wall of the mounting plate 401, and several traction holes 402 are opened above the wire holes 403.
[0027] In the above solution, the internal space of the chassis is divided into a first compartment and a second compartment by a partition. The second compartment is used to house the power supply, hard drives, and other components, while the first compartment is used to house the motherboard, graphics card, and other components. This structure isolates the power supply from other heat-generating components, preventing heat from accumulating between them and effectively improving safety. The cooling components in the first compartment are used to dissipate heat from the internal space. Specifically, the lower cooling fan draws cool air from outside into the interior, while the upper cooling fan extracts internal heat. Both the lower and upper cooling fans are arranged horizontally at intervals, effectively increasing the heat dissipation area and effect. While cooling is being carried out in the first compartment, the rear cooling fan in the second compartment draws air backward, causing internal heat to be expelled from the inside out, thus achieving the purpose of cooling the second compartment.
[0028] In a preferred embodiment, a heat dissipation assembly 3 is installed at the heat dissipation vent above the upper cooling fan 502. The heat dissipation assembly 3 includes a limiting plate 301, a first heat dissipation mesh 302 is installed on the outer wall of the limiting plate 301, and a second heat dissipation mesh 6 is installed at the air inlet below the lower cooling fan 501.
[0029] In the above solution, the upper cooling fan is isolated from external dust by the first heat dissipation mesh during the heat dissipation process, and the lower cooling fan is isolated from external dust by the second heat dissipation mesh, which is used to improve the dustproof effect of the chassis and prevent too much dust from entering the chassis during the heat dissipation process.
[0030] In a preferred embodiment, a plurality of assembly frames 8 are installed on the outer wall of the partition 4 near the second compartment 104. Several heat dissipation holes 801 are provided on the outer wall of the assembly frames 8. A second side plate 7 is installed on the outer wall of the second compartment 104. A third heat dissipation mesh 701 is installed on the outer wall of the second side plate 7.
[0031] In the above scheme, the assembly frame is used for the installation of components in the second compartment, and the second compartment can be laterally cooled by the third heat dissipation mesh on the second side plate, thereby improving the heat dissipation effect of the second compartment.
[0032] In a preferred embodiment, the upper surface of the main body 1 of the chassis is provided with two sets of assembly slots 101, the outer wall of the first compartment 103 is provided with a first side plate 2, the outer wall of the first side plate 2 is provided with an observation glass 201, the upper part of the first side plate 2 is provided with two sets of first assembly blocks 202, the lower bottom of the limiting plate 301 is provided with a second assembly block 303, and the outer walls of the assembly slots 101, the first assembly blocks 202 and the second assembly blocks 303 are all provided with positioning holes 102, and the assembly slots 101, the first assembly blocks 202 and the second assembly blocks 303 are assembled together by bolts in the positioning holes 102.
[0033] In the above solution, the first side panel is installed in the first chassis compartment. The observation glass allows users to directly observe the inside of the chassis, improving the aesthetics of the chassis. The first side panel has a detachable structure. During disassembly, the bolts are removed, and then the limiting plate is removed so that the limiting plate no longer restricts the first side panel. Finally, the first side panel can be removed. During installation, the first assembly block of the first side panel is first aligned and inserted into the assembly slot. Then, the second assembly block at the bottom of the limiting plate is also inserted into the assembly slot, so that the second assembly block is above the first assembly block. The limiting plate restricts the first side panel, and bolts are installed at the positioning holes to assemble the first assembly block, the second assembly block, and the assembly slot together, improving the stability and firmness of the assembly. The above structure enables the heat dissipation assembly to not only provide heat dissipation and dust protection for the top, but also to restrict the first side panel, effectively improving the functionality and practicality of the structure.
[0034] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.
Claims
1. A horizontally compartmented heat dissipation airflow structure for a computer chassis, wherein, include: The chassis body has an internal partition that divides the space inside the chassis body into a first compartment and a second compartment. The first compartment has a heat dissipation assembly installed inside, located at the top and bottom ends of the first compartment. An assembly plate for connecting the two compartments is installed on the outer wall of the partition. A rear cooling fan for exhausting hot air from the second compartment is installed on the rear end face of the second compartment.
2. The horizontal compartmentalized heat dissipation airflow structure of the computer chassis as described in claim 1, wherein, The heat dissipation assembly includes a lower cooling fan installed at the bottom of the first engine compartment for air intake operation, and an upper cooling fan installed at the top of the first engine compartment for air extraction operation. There are multiple lower and upper cooling fans, and the multiple lower and upper cooling fans are arranged horizontally at intervals.
3. The horizontal compartmentalized heat dissipation airflow structure of the computer chassis as described in claim 2, wherein, A heat dissipation assembly is installed at the heat dissipation vent above the upper cooling fan. The heat dissipation assembly includes a limiting plate, and a first heat dissipation mesh is installed on the outer wall of the limiting plate. A second heat dissipation mesh is installed at the air inlet below the lower cooling fan.
4. The horizontal compartmentalized heat dissipation airflow structure of the computer chassis as described in claim 1, wherein, The outer wall of the assembly plate has multiple wire holes, and above the wire holes are several traction holes.
5. The horizontal compartmentalized heat dissipation airflow structure of the computer chassis as described in claim 1, wherein, Multiple assembly frames are installed on the outer wall of the partition near the second engine compartment. Several heat dissipation holes are opened on the outer wall of the assembly frames. A second side plate is installed on the outer wall of the second engine compartment, and a third heat dissipation mesh is installed on the outer wall of the second side plate.
6. The horizontal compartmentalized heat dissipation airflow structure of the computer chassis as described in claim 3, wherein, The upper surface of the main body of the chassis is provided with two sets of assembly slots. A first side plate is installed on the outer wall of the first compartment. An observation glass is installed on the outer wall of the first side plate. Two sets of first assembly blocks are installed above the first side plate. A second assembly block is installed at the bottom of the limiting plate. Positioning holes are provided on the outer walls of the assembly slots, the first assembly blocks and the second assembly blocks. The assembly slots, the first assembly blocks and the second assembly blocks are assembled together by bolts in the positioning holes.