Microelectronic self-adaptive heat dissipation device

Abstract

The utility model belongs to the technical field of electronic heat dissipation, and particularly relates to a microelectronic self-adaptive heat dissipation device which comprises a fan frame. The inner surface wall of the fan frame is in sliding connection with a rotating block; the bottom of the rotating block is fixedly connected with an adjusting outer rod; the inner surface wall of the adjusting outer rod is in threaded connection with an adjusting screw rod; the bottom of the adjusting screw rod is fixedly connected with a limiting block; the outer surface wall of the limiting block is slidably connected with a fixed base. A fixed screw hole is formed in the fixed base; the inner surface wall of the fan frame is fixedly connected with an object blocking frame; during work, a rotating block is arranged, after rotating, the rotating block drives an adjusting outer rod to move on the outer surface wall of an adjusting screw rod in a threaded mode, meanwhile, due to the fact that a limiting block is limited by a fixing base to rotate, the fan frame can change the heat dissipation position according to the height of a GPU, and the heat dissipation effect of the GPU is improved. Meanwhile, independent installation of GPU heat dissipation can be achieved, and the problem that local overheating is extremely prone to occurring during GPU peak value operation is solved.

Description

Technical Field

[0001] This utility model belongs to the field of electronic heat dissipation technology, specifically a microelectronic adaptive heat dissipation device. Background Technology

[0002] Cooling devices are a collective term for a series of devices used to conduct and release heat. They can be applied to GPU coolers, graphics card coolers, chassis coolers, etc., to ensure the normal operation of computer hardware.

[0003] In current technologies, heat dissipation devices are typically composed of fan cooling, water cooling, or heat pipe cooling. Common fan cooling uses a fan to drive airflow and carry away the heat.

[0004] Existing heat dissipation devices, when in use, are prone to local overheating due to insufficient heat capacity under transient high power loads, such as peak GPU computing, which can lead to performance degradation or device damage. Therefore, a microelectronic adaptive heat dissipation device is proposed to address the above problems. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art and solve at least one of the technical problems mentioned in the background art, this utility model proposes a microelectronic adaptive heat dissipation device.

[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: A microelectronic adaptive heat dissipation device according to this utility model includes a fan frame; a rotating block is slidably connected to the inner wall of the fan frame; an adjusting outer rod is fixedly connected to the bottom of the rotating block; an adjusting screw is threadedly connected to the inner wall of the adjusting outer rod; a limiting block is fixedly connected to the bottom of the adjusting screw; a fixed base is slidably connected to the outer wall of the limiting block; the fixed base has a fixing screw hole; a baffle is fixedly connected to the inner wall of the fan frame; and a heat dissipation fan is installed at the bottom of the fan frame.

[0007] Preferably, a dust plate body is slidably connected to the inner surface of the fan frame; a snap-fit ​​groove is provided at the bottom of the dust plate body; and a filter screen is fixedly connected to the inner surface of the dust plate body.

[0008] Preferably, a snap-fit ​​body is fixedly connected to the bottom of the fan frame; a sliding rod is fixedly connected to the inner bottom wall of the snap-fit ​​body.

[0009] Preferably, the outer wall of the sliding rod is slidably connected to a locking block; the locking block is fixedly connected to a return spring via a locking body.

[0010] Preferably, a connecting rod is fixedly connected to the side of the snap-fit ​​block; a pressing rod is fixedly connected to one end of the connecting rod.

[0011] Preferably, a damping rod is fixedly connected to the bottom of the cooling fan; a movable block is slidably connected to the bottom of the damping rod.

[0012] Preferably, the movable block is fixedly connected to a pressure-reducing spring via a cooling fan; and a flexible plate is fixedly connected to the bottom of the movable block.

[0013] The beneficial effects of this utility model are:

[0014] This utility model provides a microelectronic adaptive heat dissipation device. By setting a rotating block, the rotating block drives the adjusting outer rod to move threadedly on the outer wall of the adjusting screw. At the same time, because the limiting block is limited by the fixed base, the fan frame can change the heat dissipation position according to the height of the GPU. It can also realize the separate installation of GPU heat dissipation, thus optimizing the problem of local overheating that is very easy to occur during peak GPU operation.

[0015] This utility model provides a microelectronic adaptive heat dissipation device. By setting a filter screen to prevent dust from the fan, it can also be easily fixed by a snap-fit ​​block, which facilitates the subsequent replacement and cleaning of the fan dust protection. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and are used to explain the present invention, but do not constitute an undue limitation of the present invention.

[0017] In the attached diagram:

[0018] Figure 1 This is a perspective view of the entire utility model;

[0019] Figure 2 This is a perspective view of the snap-fit ​​main body in this utility model;

[0020] Figure 3 This is a perspective view of the dust plate body in this utility model;

[0021] Figure 4 This is an enlarged view of point A in this utility model;

[0022] Figure 5 This is an enlarged view of section B in this utility model.

[0023] Legend:

[0024] 1. Fixed base; 2. Fixed screw hole; 3. Adjusting screw; 4. Fan frame; 5. Rotating block; 6. Baffle; 7. Limiting block; 8. Cooling fan; 9. Snap-fit ​​body; 10. Dust plate body; 11. Snap-fit ​​groove; 12. Filter screen; 13. Sliding rod; 14. Return spring; 15. Snap-fit ​​block; 16. Pressing rod; 17. Adjusting outer rod; 18. Connecting rod; 19. Damping rod; 20. Flexible plate; 21. Pressure relief spring; 22. Movable block. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0026] Specific implementation examples are given below.

[0027] Please see Figures 1-4 This utility model provides a microelectronic adaptive heat dissipation device, including a fan frame 4; a rotating block 5 is slidably connected to the inner wall of the fan frame 4; an adjusting outer rod 17 is fixedly connected to the bottom of the rotating block 5; an adjusting screw 3 is threadedly connected to the inner wall of the adjusting outer rod 17; a limiting block 7 is fixedly connected to the bottom of the adjusting screw 3; a fixed base 1 is slidably connected to the outer wall of the limiting block 7; the fixed base 1 has a fixing screw hole 2; a baffle 6 is fixedly connected to the inner wall of the fan frame 4; and a heat dissipation fan 8 is installed at the bottom of the fan frame 4. During operation, when the heat dissipation device needs to be installed, it can be fixed to the outer wall of the GPU using bolts and fixing screw holes 2, thereby achieving separate heat dissipation for the GPU. At the same time, the rotating block 5 can be rotated to cause the adjusting outer rod 17 to move threadedly on the outer wall of the adjusting screw 3, thereby allowing the fan frame 4 to be lowered via the rotating block 5, so that the heat dissipation device can be fixed according to the different heights of the GPU.

[0028] Furthermore, such as Figure 2 , Figure 4 and Figure 5As shown, a dust plate body 10 is slidably connected to the inner wall of the fan frame 4; a snap-fit ​​groove 11 is provided at the bottom of the dust plate body 10; a filter screen 12 is fixedly connected to the inner wall of the dust plate body 10; a snap-fit ​​body 9 is fixedly connected to the bottom of the fan frame 4; a sliding rod 13 is fixedly connected to the inner bottom wall of the snap-fit ​​body 9; a snap-fit ​​block 15 is slidably connected to the outer wall of the sliding rod 13; a return spring 14 is fixedly connected to the snap-fit ​​block 15 through the snap-fit ​​body 9; a connecting rod 18 is fixedly connected to the side of the snap-fit ​​block 15; a pressing rod 16 is fixedly connected to one end of the connecting rod 18; a damping rod 19 is fixedly connected to the bottom of the cooling fan 8; a movable block 22 is slidably connected to the bottom of the damping rod 19; a pressure-reducing spring 21 is fixedly connected to the movable block 22 through the cooling fan 8; and a flexible plate 20 is fixedly connected to the bottom of the movable block 22. When the filter screen 12 needs to be replaced during operation, the pressing rod 16 can be pulled down to allow the locking block 15 to slide on the outer wall of the sliding rod 13. At the same time, the return spring 14 is compressed synchronously. At this time, the locking block 15 disengages from the dust plate body 10, and the dust plate body 10 can be disengaged from the fan frame 4. The soft plate 20 and the pressure relief spring 21 can play a buffering role.

[0029] Working principle: When the heat dissipation device needs to be installed, it can be fixed to the outer wall of the GPU using bolts and fixing screw holes 2, thereby achieving separate heat dissipation for the GPU. At the same time, rotating the rotating block 5 causes the adjusting rod 17 to move threaded on the outer wall of the adjusting screw 3, thereby allowing the fan frame 4 to be lowered through the rotating block 5. This allows the heat dissipation device to be fixed according to the different heights of the GPU. When the filter screen 12 needs to be replaced, the pressing rod 16 can be pulled down, allowing the locking block 15 to slide on the outer wall of the sliding rod 13. At the same time, the reset spring 14 is compressed synchronously. At this time, the locking block 15 disengages from the dust plate body 10, allowing the dust plate body 10 to be detached from the fan frame 4. The flexible plate 20 and the pressure relief spring 21 provide a buffering effect.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A microelectronic adaptive heat dissipation device, comprising a fan frame (4); characterized in that: A rotating block (5) is slidably connected to the inner wall of the fan frame (4); an adjusting outer rod (17) is fixedly connected to the bottom of the rotating block (5); an adjusting screw (3) is threadedly connected to the inner wall of the adjusting outer rod (17); a limiting block (7) is fixedly connected to the bottom of the adjusting screw (3); a fixed base (1) is slidably connected to the outer wall of the limiting block (7); a fixing screw hole (2) is provided on the fixed base (1); a baffle (6) is fixedly connected to the inner wall of the fan frame (4); and a cooling fan (8) is installed at the bottom of the fan frame (4).

2. The microelectronic adaptive heat dissipation device as described in claim 1, characterized in that: The inner wall of the fan frame (4) is slidably connected to a dust plate body (10); a snap-fit ​​groove (11) is provided at the bottom of the dust plate body (10); and a filter screen (12) is fixedly connected to the inner wall of the dust plate body (10).

3. The microelectronic adaptive heat dissipation device as described in claim 2, characterized in that: The bottom of the fan frame (4) is fixedly connected to a snap-fit ​​body (9); the inner bottom wall of the snap-fit ​​body (9) is fixedly connected to a sliding rod (13).

4. The microelectronic adaptive heat dissipation device as described in claim 3, characterized in that: The outer wall of the sliding rod (13) is slidably connected to a snap-fit ​​block (15); the snap-fit ​​block (15) is fixedly connected to a return spring (14) through a snap-fit ​​body (9).

5. The microelectronic adaptive heat dissipation device as described in claim 4, characterized in that: A connecting rod (18) is fixedly connected to the side of the snap-fit ​​block (15); a pressing rod (16) is fixedly connected to one end of the connecting rod (18).

6. The microelectronic adaptive heat dissipation device as described in claim 1, characterized in that: The bottom of the cooling fan (8) is fixedly connected to a damping rod (19); the bottom of the damping rod (19) is slidably connected to a movable block (22).

7. The microelectronic adaptive heat dissipation device as described in claim 6, characterized in that: The movable block (22) is fixedly connected to a pressure-reducing spring (21) via a cooling fan (8); a flexible plate (20) is fixedly connected to the bottom of the movable block (22).

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