All-metal tab composite copper foil
By forming an upper and lower copper vapor-deposited layer on the substrate surface and employing an electron beam evaporation coating process, the problems of environmental protection and high factory construction requirements in the manufacturing of composite copper foil have been solved, achieving low-cost and high-efficiency copper foil production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2026-03-03
AI Technical Summary
Existing composite copper foil manufacturing processes have stringent environmental protection requirements, involving the treatment of hazardous chemicals, wastewater, exhaust gas, and solid waste, and the factory construction conditions are demanding, resulting in high technical barriers.
The copper layer is formed on the substrate surface by upper and lower evaporation copper layers. The electron beam evaporation coating process avoids the discharge of chemicals and wastewater, reduces the requirements for factory construction, and uses evaporation coating equipment to form the copper layer.
It enables copper foil manufacturing without chemicals or wastewater discharge, lowering the manufacturing threshold and fixed asset investment costs, shortening the production cycle, and improving the production efficiency of clients.
Smart Images

Figure CN223967346U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of lithium battery material technology, and in particular to an all-metal tab composite copper foil. Background Technology
[0002] With the continuous advancement and widespread application of lithium battery technology, market demands for battery performance are constantly increasing, particularly in terms of improved energy density, reduced weight, enhanced safety, and lower costs. As a crucial material for the negative electrode current collector in lithium batteries, composite copper foil, with its higher energy density, lighter weight, excellent conductivity, and stronger safety, is gradually replacing traditional pure copper foil, becoming a key material for improving battery performance, and also demonstrating significant advantages in terms of environmental friendliness.
[0003] Currently, the manufacturing process of composite copper foil typically employs a two-step method: first, double-sided copper plating is performed on the surface of a polymer substrate using magnetron sputtering technology, resulting in a copper layer thickness of approximately 80 nm; then, an electroplating process is used to further increase the copper layer thickness to approximately 1000 nm. While electroplating can provide the required thickness, it faces stringent environmental requirements, involving the treatment of hazardous chemicals, wastewater, exhaust gas, and solid waste, and demanding stringent plant construction conditions. Some regions even restrict the use of such electroplating equipment, making the application of electroplating in composite copper foil production a high-tech challenge. Utility Model Content
[0004] The purpose of this utility model is to solve the problems of strict environmental protection requirements in the existing technology, involving the treatment of hazardous chemicals, wastewater, waste gas and solid waste, and the harsh conditions of factory construction. It provides an all-metal tab composite copper foil formed on the surface of a substrate by upper and lower evaporation copper layers. It is an electron beam evaporation coating, which is free of chemicals and wastewater discharge, and has low requirements for factory construction, thus lowering the manufacturing threshold of composite copper foil.
[0005] To achieve the above objectives, this utility model provides an all-metal tab composite copper foil, comprising: a substrate, tabs, an upper evaporated copper layer and a lower evaporated copper layer, wherein one side of the tab is welded to the substrate; the upper evaporated copper layer is disposed on the upper surface of the substrate; and the lower evaporated copper layer is disposed on the lower surface of the substrate.
[0006] As a further description of the above technical solution: the upper copper vapor deposition layer includes a first copper vapor deposition layer and a second copper vapor deposition layer, one side of the first copper vapor deposition layer is attached to the upper surface of the substrate, and the other side of the first copper vapor deposition layer is attached to the second copper vapor deposition layer.
[0007] As a further description of the above technical solution: the lower copper vapor deposition layer includes a third copper vapor deposition layer and a fourth copper vapor deposition layer, one side of the third copper vapor deposition layer is attached to the lower surface of the substrate, and the other side of the third copper vapor deposition layer is attached to the fourth copper vapor deposition layer.
[0008] As a further description of the above technical solution: the substrate is made of PET, PP, PI or PPS material.
[0009] As a further description of the above technical solution: the electrode tab is made of pure copper foil.
[0010] As a further description of the above technical solution: the thickness of both the substrate and the tab is 3.8 μm.
[0011] As a further description of the above technical solution: the thickness of both the upper and lower copper vapor-deposited layers is 1.0 μm.
[0012] As a further description of the above technical solution: the thickness of the first, second, third, and fourth evaporated copper layers is 0.5 μm.
[0013] As a further description of the above technical solution: both the upper and lower copper vapor-deposited layers are vapor-deposited onto the substrate surface using an evaporation coating machine.
[0014] As a further description of the above technical solution: the substrate is connected to the electrode by welding.
[0015] The above technical solution has the following advantages or beneficial effects:
[0016] This invention forms an upper and lower copper evaporation layer on the surface of a substrate through electron beam evaporation coating. It is free of chemicals and wastewater discharge, has low requirements for factory construction, lowers the manufacturing threshold of composite copper foil, and has fewer environmental protection requirements for evaporation equipment, thus reducing fixed asset investment costs. At the same time, the tabs are pre-welded to the substrate, eliminating the tab welding step for the customer, shortening the production cycle, and improving the customer's subsequent production efficiency. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the composite copper foil structure in one embodiment of the present invention;
[0018] Figure 2 This is a schematic diagram of the cutting of composite copper foil in one embodiment of the present invention. Figure 1 ;
[0019] Figure 3 This is a schematic diagram of the cutting of composite copper foil in one embodiment of the present invention. Figure 2 ;
[0020] Figure 4This is a schematic diagram of the electron beam evaporation coating structure of the composite copper foil in one embodiment of the present invention.
[0021] Legend:
[0022] 1. Substrate; 2. Tab; 3. Upper copper layer; 4. Lower copper layer; 31. First copper layer; 32. Second copper layer; 41. Third copper layer; 42. Fourth copper layer. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] In the description of this utility model, it should be noted that the terms "vertical", "up", "down", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0025] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0026] like Figure 1-4 As shown, the present invention provides an all-metal tab composite copper foil, comprising: a substrate 1, a tab 2, an upper evaporated copper layer 3, and a lower evaporated copper layer 4. One side of the tab 2 is welded to the substrate 1; the upper evaporated copper layer 3 is disposed on the upper surface of the substrate 1; and the lower evaporated copper layer 4 is disposed on the lower surface of the substrate 1.
[0027] In the technical solution of the present invention, an upper copper layer 3 and a lower copper layer 4 are formed on the surface of the substrate 1 by electron beam evaporation coating, which is free of chemicals and wastewater discharge, and has low requirements for factory construction, thus lowering the manufacturing threshold of composite copper foil. The evaporation equipment involves fewer environmental protection requirements, reducing fixed asset investment costs. At the same time, the tab 2 is pre-welded to the substrate 1, eliminating the tab welding step for the client, shortening the production cycle, and improving the subsequent production efficiency of the client.
[0028] Among them, the electron beam evaporation principle uses an electron beam to bombard the surface of copper material, generating local high temperature to evaporate the copper. It has high heating efficiency, can evaporate high melting point materials, separates the copper material from the heating source, reduces pollution, and can precisely control the evaporation rate and film thickness, making it suitable for high-precision, high-quality industrial production.
[0029] like Figure 1 and Figure 2 As shown, the upper copper layer 3 includes a first copper layer 31 and a second copper layer 32. One side of the first copper layer 31 is bonded to the upper surface of the substrate 1, and the other side of the first copper layer 31 is bonded to the second copper layer 32. The lower copper layer 4 includes a third copper layer 41 and a fourth copper layer 42. One side of the third copper layer 41 is bonded to the lower surface of the substrate 1, and the other side of the third copper layer 41 is bonded to the fourth copper layer 42. An electron beam evaporation coating process is used, with two evaporation processes (0.5μm / time) to avoid contamination and improve coating uniformity. The upper copper layer 3 and the lower copper layer 4 are coated in two separate processes: the first copper layer 31 and the second copper layer 32 are coated to the third copper layer 41 and the fourth copper layer 42, which reduces internal stress and enhances interfacial adhesion.
[0030] Specifically, the first and third copper vapor-deposited layers 31 and 41 are directly vapor-deposited on the surface of the substrate as an interface transition layer. The second and fourth copper vapor-deposited layers 32 and 42 cover the transition layer to form a dense conductive network with a total thickness of 1.0 μm. The two vapor-deposited layers (0.5 μm / time) can reduce substrate deformation caused by thermal stress and improve the density of the coating.
[0031] The thickness of the upper copper layer 3 and the lower copper layer 4 is 1.0 μm, and the thickness of the first copper layer 31, the second copper layer 32, the third copper layer 41, and the fourth copper layer 42 is 0.5 μm.
[0032] like Figure 1 and Figure 2 As shown, the thickness of substrate 1 is 3.8μm. Substrate 1 is made of PET, PP, PI or PPS material. The thickness of substrate 1 is 3.8μm. It is made of polymer materials such as PET / PP / PI / PPS and has high mechanical strength, high temperature resistance and electrolyte stability.
[0033] like Figure 1 and Figure 2 As shown, the thickness of the tab 2 is 3.8μm. The tab 2 is made of pure copper foil. The pure copper foil, with a thickness of 3.8μm, is welded to the edge of the substrate to form a conductive path. A double-sided induction vapor-deposited copper layer with a single layer thickness of 1.0μm provides high conductivity. The total thickness is 5.8μm, and the weight is reduced by 59% compared to pure copper foil.
[0034] The upper copper layer 3 and the lower copper layer 4 are both deposited onto the surface of the substrate 1 by evaporation coating machine, and the substrate 1 is connected to the tab 2 by welding.
[0035] Specifically, such as Figure 3 and Figure 4 As shown, the specifications for manufacturing all-metal tab composite copper foil rolls are: tab 15mm * composite copper foil 180mm.
[0036] First, prepare a roll of substrate material of PET / PP / PI / PPS, etc., with a width of 1350mm and a thickness of 3.8μm. Feed the material to the roll-to-roll rewinding machine, cut off the width of the welded pure copper foil tabs, and cut 3 strips with a width of 30mm. The running speed is 150±30m / min, the unwinding tension is 100N±10N, and the winding tension can be adjusted adaptively by the equipment.
[0037] Then, the cut material is fed into the roll-to-roll welding machine for roll-to-roll rolling welding. The running speed is 90±30m / min, the unwinding tension is 90N±10N, and the winding tension can be adjusted adaptively by the equipment. The welding width is 2±1mm, the welding pressure is 0.35±0.1Mpa, and the amplitude is 38±10%.
[0038] The film with welded pure copper foil tabs is then fed into a winding evaporation coating machine for A-side evaporation copper plating. The specific evaporation method is electron beam evaporation coating. The equipment is equipped with two cold rollers, each corresponding to 21 graphite crucibles with a diameter of 120mm and an electron gun kit for generating the electron beam, for a total of 42 graphite crucibles. The 21 graphite crucibles are arranged in two rows, with 11 crucibles in the first row and 10 crucibles in the second row, which can achieve uniform coating while having sufficient evaporation. The process parameters are as follows: winding speed 10±2m / min, single electron gun voltage 13±1KV, current 800±100mA, electron beam spot size is a circle with a diameter of 70±10mm, unwinding tension 90±10N, winding tension 80±10N, coating times 2 times, and after each coating, a new copper block needs to be added to the graphite crucible. The coating thickness is about 500nm each time, and the total coating thickness of the two coatings is 1000±50nm.
[0039] After A-side is plated, the machine needs to be cleaned to remove excess waste copper layer in the evaporation area. Alternatively, a cleaned protective plate can be directly replaced. After cleaning, B-side is plated. The process parameters are as follows: winding speed 10±2m / min, single electron gun voltage 13±1KV, current 800±100mA, unwinding tension 90±10N, winding tension 80±10N, and two plating passes. After each plating pass, a new copper block needs to be added to the graphite crucible. Each plating pass is about 500nm thick, and the total plating thickness for both passes is 1000±50nm.
[0040] Finally, the material is fed into the precision slitting machine for slitting and winding as shown in the diagram. There are seven circular slitting blades, each spaced 197mm apart. The slitting speed is 50m / min, the machine speed is 80m / min, the unwinding tension is 100N±20N, and the winding tension can be adjusted adaptively by the machine.
[0041] Six rolls of all-metal tab composite copper foil with a width of 15mm*180mm and a total thickness of 5.8μm were obtained.
[0042] By employing seven slitting circular blades, each spaced 197mm apart, highly efficient slitting operations are achieved, ensuring cutting precision and efficiency even at high speeds. This configuration effectively improves production efficiency and reduces production cycles. Each slitting process, with seven blades cutting, yields six independent rolls of composite copper foil. This not only increases production output but also significantly improves production efficiency, while maintaining consistent size and quality for each roll.
[0043] Working principle: The upper copper layer 3 and the lower copper layer 4 are formed on the surface of the substrate 1 by electron beam evaporation coating. There are no chemicals or wastewater discharges, which reduces the requirements for factory construction, lowers the manufacturing threshold of composite copper foil, and the evaporation equipment involves fewer environmental protection requirements, reducing fixed asset investment costs. At the same time, the tab 2 is pre-welded to the substrate 1, eliminating the tab welding step for the client, shortening the production cycle and improving the client's subsequent production efficiency.
[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0045] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A full metal tab composite copper foil, characterized by, It comprises: a substrate (1); a tab (2) welded to one side of the substrate (1); an upper evaporated copper layer (3) arranged on the upper surface of the substrate (1); a lower evaporated copper layer (4) arranged on the lower surface of the substrate (1).
2. The full metal tab composite copper foil according to claim 1, characterized by: The upper evaporated copper layer (3) comprises a first evaporated copper layer (31) and a second evaporated copper layer (32), one side of the first evaporated copper layer (31) is attached to the upper surface of the substrate (1), and the other side of the first evaporated copper layer (31) is attached to the second evaporated copper layer (32).
3. The full metal tab composite copper foil according to claim 2, characterized in that: The lower evaporated copper layer (4) comprises a third evaporated copper layer (41) and a fourth evaporated copper layer (42), one side of the third evaporated copper layer (41) is attached to the lower surface of the substrate (1), and the other side of the third evaporated copper layer (41) is attached to the fourth evaporated copper layer (42).
4. The full metal tab composite copper foil according to claim 1, wherein: The substrate (1) is made of PET, PP, PI or PPS material.
5. The full metal tab composite copper foil according to claim 1, wherein: The tab (2) is made of pure copper foil.
6. The full metal tab composite copper foil according to claim 1, wherein: The thickness of the substrate (1) and the tab (2) is 3.8μm.
7. The full metal tab composite copper foil according to claim 1, wherein: The thickness of the upper evaporated copper layer (3) and the lower evaporated copper layer (4) is 1.0μm.
8. The full metal tab composite copper foil according to claim 3, wherein: The thickness of the first evaporated copper layer (31), the second evaporated copper layer (32), the third evaporated copper layer (41) and the fourth evaporated copper layer (42) is 0.5μm.
9. The full metal tab composite copper foil according to claim 1, wherein: The upper evaporated copper layer (3) and the lower evaporated copper layer (4) are evaporated onto the surface of the substrate (1) by an evaporated film coating machine.
10. The full metal tab composite copper foil according to claim 7, wherein: The connection mode of the substrate (1) and the tab (2) is welding.