Miniaturized 2-18G ultra-wideband band-pass filter
By combining an LC high-pass filter with a thin-film low-pass filter, the frequency and size limitations of existing ultra-wideband bandpass filters are solved, enabling a miniaturized design with a bandwidth extension of 2-18GHz, suitable for high-density integration scenarios and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2026-03-03
AI Technical Summary
Existing ultra-wideband bandpass filters are difficult to design in a way that combines wide bandwidth, miniaturization, and low cost. Cavity filters cannot meet the size and weight requirements, while suspended microstrip filters are difficult to assemble and have a frequency limit of 13 GHz.
An innovative combination of LC high-pass filter and thin-film low-pass filter is adopted, which combines high-Q chip inductors and capacitors, and the thin-film low-pass filter is fabricated by low-temperature co-fired ceramic process and connected by gold wire bonding to achieve frequency extension to 2-18GHz.
It achieves a bandwidth extension to 2-18GHz, is small in size and light in weight, is suitable for high-density integration scenarios, reduces manufacturing costs, and facilitates mass production.
Smart Images
Figure CN223967845U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of microwave component technology, specifically to a miniaturized 2-18G ultra-wideband bandpass filter. Background Technology
[0002] A miniaturized ultrawideband bandpass filter is composed of a miniaturized LC high-pass filter and a thin-film low-pass filter cascaded together. Existing ultrawideband bandpass filters are typically implemented as cavity filters or suspended microstrip filters.
[0003] The shortcomings of existing solutions are: cavity filters require a 10th order or higher, and the high-end cutoff frequency generally cannot exceed three times the low-end start frequency; the size and weight of cavity filters cannot meet the current requirements for device miniaturization; suspended microstrip filters can only achieve 2-13 GHz bandpass filters, and are large in size and difficult to assemble. Therefore, there is an urgent need for a new filter solution that combines wide bandwidth (2-18 GHz), miniaturization, and low cost. Utility Model Content
[0004] To address the problems in the background technology, this invention proposes a miniaturized 2-18G ultra-wideband bandpass filter. This invention significantly reduces the size and expands the bandwidth through an innovative combination of LC high-pass and thin-film low-pass filters.
[0005] To solve the above problems, this utility model adopts the following technical solution: a miniaturized 2-18G ultra-wideband bandpass filter, including a shielding shell and a PCB board, wherein the PCB board is disposed inside the shielding shell, and an LC high-pass filter and a thin-film low-pass filter are encapsulated inside the shielding shell. The bottoms of the LC high-pass filter and the thin-film low-pass filter are fixed on the PCB board, and the LC high-pass filter and the thin-film low-pass filter are connected by gold wire bonding. The cutoff frequency of the LC high-pass filter is 2GHz, and the cutoff frequency of the thin-film low-pass filter is 18GHz.
[0006] Furthermore, the LC high-pass filter uses high-Q chip inductors and capacitors.
[0007] Furthermore, the thin-film low-pass filter is prepared using a low-temperature co-fired ceramic process.
[0008] Furthermore, the diameter of the gold wire is 20-25 μm, and the bonding pressure is 0.2-0.3 N.
[0009] The beneficial effects of this utility model are as follows: The frequency band of this utility model is extended to 2-18GHz, breaking through the 13GHz limitation of suspended microstrip filters. It also features small size and light weight, which can meet the needs of high-density integration scenarios. In addition, the adoption of standardized micro-assembly process reduces manufacturing costs and facilitates mass production. Attached Figure Description
[0010] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0011] Figure 1 These are the three views of this utility model;
[0012] Figure 2 Simulation curves for miniaturized 2-18GHz ultrawideband bandpass filters;
[0013] Figure 3 The measured curves are for a miniaturized 2-18 GHz ultra-wideband bandpass filter.
[0014] 1. Shielding shell; 2. PCB board; 3. Gold wire. Detailed Implementation
[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0016] This utility model extends the frequency band to 2-18GHz, breaking through the 13GHz limitation of suspended microstrip filters. It also features small size and light weight, meeting the needs of high-density integration scenarios. In addition, it adopts standardized micro-assembly process, reducing manufacturing costs and facilitating mass production.
[0017] A miniaturized 2-18G ultrawideband bandpass filter, such as Figure 1 As shown, the system includes a shielding housing 1 and a PCB board 2. The PCB board 2 is disposed inside the shielding housing 1. An LC high-pass filter and a thin-film low-pass filter are encapsulated within the shielding housing 1. The bottoms of the LC high-pass filter and the thin-film low-pass filter are fixed to the PCB board 2. The LC high-pass filter and the thin-film low-pass filter are bonded together via gold wires 3. The cutoff frequency of the LC high-pass filter is 2 GHz, and the cutoff frequency of the thin-film low-pass filter is 18 GHz. Specifically, as... Figure 2 and Figure 3As shown, the theory and implementation method of the miniaturized 2-18GHz ultra-wideband bandpass filter of this utility model are feasible, and the size of the planar space is greatly reduced by combining the LC high-pass filter and the thin-film low-pass filter.
[0018] Furthermore, the LC high-pass filter uses high-Q chip inductors and capacitors.
[0019] Furthermore, the thin-film low-pass filter is prepared using a low-temperature co-fired ceramic process.
[0020] This invention extends the frequency band to 2-18GHz, breaking through the 13GHz limitation of suspended microstrip filters. It also features small size and light weight, meeting the needs of high-density integration scenarios and device miniaturization. In addition, the adoption of standardized micro-assembly process reduces manufacturing costs and facilitates mass production.
[0021] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A miniaturized 2-18G ultrawideband bandpass filter, comprising a shielding housing (1) and a PCB board (2), wherein the PCB board (2) is disposed within the shielding housing (1), characterized in that, The shielding shell (1) encapsulates an LC high-pass filter and a thin-film low-pass filter. The bottoms of the LC high-pass filter and the thin-film low-pass filter are fixed on the PCB board (2). The LC high-pass filter and the thin-film low-pass filter are bonded together by gold wire (3). The cutoff frequency of the LC high-pass filter is 2GHz, and the cutoff frequency of the thin-film low-pass filter is 18GHz.
2. The miniaturized 2-18G ultrawideband bandpass filter according to claim 1, characterized in that: The LC high-pass filter uses high-Q chip inductors and capacitors.
3. A miniaturized 2-18G ultrawideband bandpass filter according to claim 1, characterized in that: The thin-film low-pass filter is fabricated using a low-temperature co-fired ceramic process.
4. A miniaturized 2-18G ultrawideband bandpass filter according to claim 1, characterized in that: The diameter of the gold wire (3) is 20-25 μm, and the bonding pressure is 0.2-0.3 N.