Circuit board

Abstract

The utility model discloses a circuit board, which comprises a circuit board main body and an ink layer, the ink layer is arranged on the circuit board main body, the ink layer comprises a reinforcing fitting area and a plurality of ink exposure gaps, and the plurality of ink exposure gaps are circumferentially arranged along the edge of the reinforcing fitting area. According to the utility model, the attachment of the reinforcing plate can be judged by referring to the ink exposure gap, so as to quickly confirm whether the reinforcing plate deviates or not, thereby reducing the outflow risk of defective products.

Description

Technical Field

[0001] This utility model relates to a circuit board. Background Technology

[0002] As competition intensifies in the circuit board industry, circuit board designs are increasingly moving towards zero-pitch layouts to improve product utilization and reduce raw material costs. While this design helps reduce material costs, it also increases the difficulty of reinforcing plate bonding, especially after printing black ink across the entire circuit board, which further complicates the bonding process. During bonding, it becomes difficult to quickly and effectively determine if the reinforcing plate is misaligned. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a circuit board that solves the problem that existing circuit boards cannot quickly and effectively determine whether the reinforcing plate is misaligned during bonding.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a circuit board, which includes a circuit board body and an ink layer, the ink layer is disposed on the circuit board body, the ink layer includes a reinforcing bonding area and a plurality of ink exposure gaps, and the plurality of ink exposure gaps are arranged circumferentially along the edge of the reinforcing bonding area.

[0005] Furthermore, the circuit board described in this utility model includes four ink exposure notches, which are evenly spaced along the circumference of the reinforcing bonding area.

[0006] Furthermore, in the circuit board described in this utility model, the plurality of ink exposure notches include at least a first ink exposure notch and a second ink exposure notch, and there is a gap between the first ink exposure notch and the second ink exposure notch.

[0007] Furthermore, in the circuit board described in this utility model, the first ink exposure notch is located on the side of the reinforcing bonding area extending along the first direction.

[0008] Furthermore, in the circuit board described in this utility model, the second ink exposure notch includes a first notch portion and a second notch portion, the first notch portion and the second notch portion are connected, and the extension direction of the first notch portion and the extension direction of the second notch portion are set at an angle.

[0009] Furthermore, in the circuit board described in this utility model, the first notch is located on the side of the reinforcing bonding area extending along the first direction, and the second notch is located on the side of the reinforcing bonding area extending along the second direction.

[0010] Furthermore, in the circuit board described in this utility model, the width of the ink exposure notch is 0.05 mm.

[0011] Furthermore, in the circuit board described in this utility model, the reinforcing bonding area is generally rectangular in shape, and the plurality of ink exposure gaps are located at the corners of the reinforcing bonding area.

[0012] Furthermore, the circuit board described in this utility model also includes a reinforcing plate, which is disposed on the side of the ink layer away from the circuit board body, and the reinforcing plate is located on the reinforcing bonding area.

[0013] Furthermore, in the circuit board described in this utility model, the reinforcing plate is a metal reinforcing plate, and the thickness of the reinforcing plate is 0.08-5mm.

[0014] The beneficial effects of this invention are as follows: In this invention, the bonding of the reinforcing plate can be judged by referring to the ink exposure gaps to confirm whether the reinforcing plate is misaligned. Specifically, when bonding the reinforcing plate, if the reinforcing plate is located in the area formed by multiple ink exposure gaps, and the reinforcing plate does not cover the ink exposure gaps, then the reinforcing plate is accurately bonded to the bonding area, and the reinforcing plate is not misaligned. If the reinforcing plate covers the corresponding ink exposure gaps, then the reinforcing plate is not accurately bonded to the position formed by multiple ink exposure gaps, i.e., the reinforcing plate is misaligned. In summary, this invention, by exposing the corresponding gaps after the product is printed with ink, facilitates rapid identification of misalignment of the reinforcing plate during bonding and inspection, thereby reducing the risk of defective products being exported. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the circuit board described in this utility model from one perspective under one embodiment;

[0016] Figure 2 This is a schematic diagram of the circuit board described in this utility model from one perspective under one embodiment.

[0017] Label Explanation:

[0018] 1. Circuit board body;

[0019] 2. Reinforce the bonding area;

[0020] 3. First ink exposure gap;

[0021] 4. Second ink exposure notch; 41. First notch; 42. Second notch;

[0022] 5. Ink layer. Detailed Implementation

[0023] To explain in detail the technical content, objectives, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0024] The RFPC (rigid-flex PCB) and PCB (Printed Circuit Board) industries are facing increasing competition. To improve product utilization and reduce raw material costs, customers are moving towards zero-pitch layouts in PCB design, which helps reduce material costs. However, this also increases the difficulty of bonding SUS (steel sheet) reinforcements to RFPC and PCB manufacturers. In current technology, the product's shape is created using molds, lasers, or milling machines. During processing by RFPC and PCB manufacturers, the product is positioned and gripped based on a baseline to control and inspect SUS reinforcement bonding misalignment. However, it's important to note that due to changes in customer design, if the customer disagrees with the design modifications, the industry cannot guarantee product bonding misalignment to the manufacturing process. Furthermore, in practical applications, due to customer requirements, both sides of the product are printed with black ink. After the entire product is printed with black ink, it becomes impossible to determine whether there is any misalignment when bonding the SUS reinforcement. To achieve the control requirements for the misalignment of steel sheet (SUS) reinforcement bonding, this utility model exposes corresponding gaps after the product is printed with ink, which facilitates identification during the bonding and inspection of metal steel sheet (SUS) reinforcement, thereby reducing the risk of defects. In other words, the circuit board provided by this utility model can achieve precise bonding of RFPC zero-pitch metal (SUS) reinforcement.

[0025] Please refer to Figure 1 as well as Figure 2 This utility model provides a circuit board, which includes a circuit board body 1 and an ink layer. The ink layer is disposed on the surface of the circuit board body 1. The ink layer includes a reinforcing bonding area 2 and a plurality of ink exposure gaps. The plurality of ink exposure gaps are arranged circumferentially along the edge of the reinforcing bonding area.

[0026] As can be seen from the above description, the beneficial effects of this utility model are as follows: an ink layer 5 is provided on the surface of the circuit board body 1. The ink layer 5 includes a reinforcing bonding area 2 and multiple ink exposure notches. The reinforcing bonding area 2 can be used to bond reinforcing plates; that is, when a reinforcing plate needs to be bonded, it can be bonded to the surface of the reinforcing bonding area 2. The ink exposure notches are notches formed on the circuit board body during ink layer printing through exposure and other operations. There is no ink at these ink exposure notches, meaning the ink in the ink exposure notches has been removed. They are similar to hollow areas formed on the ink layer, i.e., the ink exposure notches are similar to hollow areas on the ink layer used to expose the circuit board body. In practical applications, the bonding of reinforcing plates (such as metal reinforcing plates) can be judged by referring to the ink exposure notches to confirm whether the reinforcing plate is misaligned. Specifically, when bonding the reinforcing plate, if the reinforcing plate is located in the area formed by the multiple ink exposure notches, and the reinforcing plate does not cover the ink exposure notches, then the reinforcing plate is accurately bonded to the reinforcing bonding area 2, and the reinforcing plate is not misaligned. If the reinforcing plate covers the corresponding ink exposure notch, the reinforcing plate is not accurately attached to the position where multiple ink exposure notches are formed, i.e., the reinforcing plate is misaligned. In summary, this invention, by exposing the corresponding notches after ink printing on the product, facilitates rapid misalignment identification of the reinforcing plate during attachment and inspection, thereby reducing the risk of defective products leaking out. Furthermore, it should be noted that, in the ink layer, except for the area corresponding to the ink exposure notch, the remaining portion is coated with black ink.

[0027] It should be noted that this invention adds corresponding ink exposure notches at the edge of the circuit board body 1, and the width of these ink exposure notches is relatively small (e.g., 0.05mm). That is, the design of this invention only involves a minor adjustment to the tolerance, which is within the customer's controlled tolerance range, meets the customer's dimensional requirements, and does not change the customer's original design. Furthermore, in this invention, the shape and number of the aforementioned ink exposure notches can be selected according to actual conditions and are not limited here. For example, the shape of the ink exposure notches can be rectangular or other irregular structures, and the number of ink exposure notches can be four or five.

[0028] Furthermore, the circuit board described in this utility model includes four ink exposure notches, which are evenly spaced along the circumference of the reinforcing bonding area 2.

[0029] Furthermore, in the circuit board described in this utility model, the plurality of ink exposure notches include at least a first ink exposure notch 3 and a second ink exposure notch 4, and there is a gap between the first ink exposure notch 3 and the second ink exposure notch 4.

[0030] Furthermore, in the circuit board described in this utility model, the first ink exposure notch 3 is located on the side of the reinforcing bonding area 2 extending along the first direction.

[0031] Furthermore, in the circuit board described in this utility model, the second ink exposure notch 4 includes a first notch portion 41 and a second notch portion 42, the first notch portion 41 and the second notch portion 42 are connected, and the extending direction of the first notch portion 41 is set at an angle to the extending direction of the second notch portion 42.

[0032] Furthermore, in the circuit board described in this utility model, the first notch 41 is located on the side of the reinforcing bonding area 2 extending along the first direction, and the second notch 42 is located on the side of the reinforcing bonding area 2 extending along the second direction.

[0033] Furthermore, in the circuit board described in this utility model, the width of the ink exposure notch is 0.05 mm.

[0034] As described above, the specific settings of the ink exposure notches, such as their number, size, shape, and location, can be selected according to the actual situation and are not limited here. In an optional embodiment, the dimensions of the ink exposure notches can be: a width of 0.05 mm and a length of 5 mm.

[0035] Furthermore, in the circuit board described in this utility model, the reinforcing bonding area 2 has an overall rectangular structure, and the plurality of ink exposure gaps are located at the corners of the reinforcing bonding area 2.

[0036] As described above, multiple ink exposure notches, such as four, can be provided around the periphery of the reinforcing bonding area 2. Given that the reinforcing bonding area 2 is generally rectangular, these multiple ink exposure notches can be located at the four corners of the reinforcing bonding area 2, thereby more accurately determining whether the reinforcing plate is misaligned based on the ink exposure notches.

[0037] Furthermore, the circuit board described in this utility model also includes a reinforcing plate, which is disposed on the circuit board body 1 and located in the reinforcing plate bonding area.

[0038] Furthermore, in the circuit board described in this utility model, the reinforcing plate is a metal reinforcing plate, and the thickness of the reinforcing plate is 0.08-5mm.

[0039] As can be seen from the above description, attaching appropriate metal reinforcements to the circuit board can effectively prevent damage to the corresponding parts of the circuit board and improve the reliability and service life of the circuit board.

[0040] Please refer to Figures 1 to 2One embodiment of this utility model is as follows: A circuit board includes a circuit board body 1. The surface of the circuit board body 1 is provided with an ink layer. The ink layer includes a reinforcing bonding area 2 and multiple ink exposure notches. The multiple ink exposure notches are disposed around the periphery of the reinforcing bonding area 2. It should be noted that the reinforcing bonding area 2 is used to bond a reinforcing plate, which is a metal reinforcing plate with a thickness of 0.08-5mm. The ink exposure notches are notches formed on the circuit board during ink printing through exposure and other operations. It should be noted that the width of the ink exposure notch is 0.05mm, which can be less than 0.075mm, and the length is 5mm.

[0041] In this embodiment, the number of ink exposure gaps around the periphery of each reinforcing bonding area 2 on the circuit board can be selected according to the actual situation, such as... Figure 2 As shown, the reinforcing bonding area 2 has four ink exposure notches around its perimeter, and the reinforcing bonding area 2 has an overall rectangular structure. The four ink exposure notches are located at the four corners of the reinforcing bonding area 2. These four ink exposure notches include two types: first ink exposure notches 3 and second ink exposure notches 4. There are two of each type. The first ink exposure notches 3 are located on the side of the reinforcing bonding area 2 extending along a first direction; the second ink exposure notches 4 include a first notch portion 41 and a second notch portion 42, which are connected. The extending direction of the first notch portion 41 and the extending direction of the second notch portion 42 form an angle. Figure 2 As shown, the first notch 41 is located on the side of the reinforcing bonding area 2 extending along the first direction, and the second notch 42 is located on the side of the reinforcing bonding area 2 extending along the second direction. In practical applications, such as... Figure 2 As shown, Figure 2 The first shaded areas (i.e., diagonally filled areas) at the four corners of the ink layer 5 are the corresponding ink exposure gaps, and the second shaded areas (i.e., horizontally filled areas) in the ink layer are the reinforcing bonding areas. Furthermore, in this embodiment, the circuit board also includes a reinforcing plate, which is disposed on the circuit board body 1 and located in the reinforcing bonding area. It should also be noted that... Figure 1 The lower half of the ink layer 5 also includes a corresponding reinforcing bonding area (not shown).

[0042] In summary, the circuit board provided by this utility model: (1) After the circuit board is printed with ink, the corresponding ink exposure gap is designed through the exposure operation, which facilitates the identification of the deviation when the reinforcing plate (such as metal steel sheet reinforcement) is bonded and inspected, thereby reducing the risk of defective products and facilitating the control of the bonding deviation of metal reinforcement. In addition, this utility model adds an ink indentation exposure gap (i.e., ink exposure gap) with a width of 0.05mm to the edge of the product. This design is a slight adjustment in tolerance. On the basis of meeting the tolerance range and size requirements of the customer, it does not change the original design of the customer. (2) The engineering team designs the CAM data normally according to the customer's requirements and makes an indentation design of 0.05mm on the graphic corner of the metal reinforcement, so that the metal reinforcement can be judged by referring to the ink gap when it is bonded, and confirm whether the metal reinforcement is misaligned. If the metal reinforcement deviates from the reinforcement bonding area 2 when it is bonded, such as covering part of the ink exposure gap, the bonding deviation of the metal reinforcement can be clearly judged.

[0043] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A circuit board, characterized by, The ink layer is arranged on the circuit board body, and the ink layer comprises a reinforcing bonding area and a plurality of ink exposure gaps.

2. The circuit board of claim 1, wherein The four ink exposure gaps are evenly spaced along the circumference of the reinforcing bonding area.

3. The circuit board of claim 1, wherein, The plurality of ink exposure gaps at least comprises a first ink exposure gap and a second ink exposure gap, and the first ink exposure gap and the second ink exposure gap have a spacing therebetween.

4. The circuit board of claim 3, wherein The first ink exposure gap is located on the side edge of the reinforcing bonding area extending in the first direction.

5. The circuit board of claim 3, wherein, The second ink exposure gap comprises a first gap part and a second gap part, the first gap part and the second gap part are communicated, and the extension direction of the first gap part and the extension direction of the second gap part are arranged at an included angle.

6. The circuit board of claim 5, wherein, The first gap part is located on the side edge of the reinforcing bonding area extending in the first direction, and the second gap part is located on the side edge of the reinforcing bonding area extending in the second direction.

7. The circuit board of claim 1, wherein The width of the ink exposure gap is 0.05mm.

8. The circuit board of claim 1, wherein, The reinforcing bonding area is in a whole rectangular structure, and the plurality of ink exposure gaps are located at the corner positions of the reinforcing bonding area.

9. The circuit board of claim 1, wherein, Further comprising a reinforcing plate, the reinforcing plate is arranged on the side of the ink layer away from the circuit board body, and the reinforcing plate is located on the reinforcing bonding area.

10. The circuit board of claim 9, wherein, The reinforcing plate is a metal reinforcing plate, and the thickness of the reinforcing plate is 0.08-5mm.

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