Circuit board assembly and sensor structure
By embroidering conductive wires on a flexible material substrate and combining them with an insulating layer and terminals, the high cost problem caused by high-precision equipment is solved, enabling low-cost and high-efficiency manufacturing of flexible circuit board assemblies.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-03-03
AI Technical Summary
Existing technologies for forming flexible circuit boards by screen printing silver paste or electroplating conductive materials on PI or PET films require high-precision equipment, resulting in high costs for circuit board assemblies.
The substrate layer is made of flexible material, and conductive wires are inserted into the substrate layer by embroidery to form a conductive layer. It is then combined with an insulating layer and terminal components to connect to the PCBA board, thus avoiding the use of high-precision equipment.
It reduces the manufacturing cost of circuit board assemblies, simplifies the process, and maintains the stability and flexibility of conductivity.
Smart Images
Figure CN223968023U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board assembly and sensor structure. Background Technology
[0002] Printed circuit boards (PCBs) are carriers of electronic components. Compared to PCBs, flexible circuit boards are thinner and can be bent. Flexible circuit boards and PCBs work together to form rigid-flex circuit board assemblies.
[0003] In related technologies, silver paste is screen-printed or conductive materials are electroplated onto PI or PET films to form flexible circuit boards. Since PI or PET films are polymer film materials, high-precision equipment is required to realize the screen-printing silver paste or electroplating process, resulting in high cost of circuit board components. Utility Model Content
[0004] The purpose of this invention is to provide a circuit board assembly and sensor structure to solve the technical problem of high cost of circuit board assemblies caused by screen printing silver paste, gold plating, or carbon and other conductive materials on thin films to form flexible circuit boards.
[0005] In a first aspect, the present invention provides a circuit board assembly, including a conductive structure and a PCBA board. The conductive structure includes a substrate layer and a conductive layer. The conductive layer includes multiple conductive wires, which are interlaced on the substrate layer along the extension direction of the substrate layer. The conductive layer is electrically connected to the PCBA board. The substrate layer can deform under external force.
[0006] In the circuit board assembly of this application, the conductive wire includes a plurality of first conductive portions and a plurality of second conductive portions, and each first conductive portion and each second conductive portion are alternately connected;
[0007] The substrate layer has a first surface and a second surface that are opposite to each other. The first conductive part is disposed on the first surface of the substrate layer, and the second conductive part is disposed on the second surface of the substrate layer.
[0008] In the circuit board assembly of this application, the conductive structure includes an insulating layer, which is attached to the surface of the substrate layer and covers the conductive layer. The insulating layer can deform under external force.
[0009] In the circuit board assembly of this application, the side of the insulating layer facing the substrate layer is adhesive.
[0010] In the circuit board assembly of this application, the conductive structure further includes a plurality of terminal pieces, and the plurality of terminal pieces are connected one-to-one with the plurality of conductive wires;
[0011] The PCBA board includes multiple pin headers, and each of the pin headers is connected to a corresponding terminal block.
[0012] In the circuit board assembly of this application, the circuit board assembly further includes a terminal housing, the terminal housing having mounting holes, and a plurality of terminal pieces being inserted into the mounting holes; the terminal housing is detachably mounted on the PCBA board, and the pin headers are connected to the terminal pieces in the mounting holes.
[0013] Secondly, this utility model provides a sensor structure, which includes a sensor module and the circuit board assembly. The sensor module includes a first electrode layer, a second electrode layer and a pressure-sensitive layer. The first electrode layer, the pressure-sensitive layer and the second electrode layer are stacked sequentially. The conductive layer is connected between the first electrode layer and the pressure-sensitive layer and between the second electrode layer and the pressure-sensitive layer.
[0014] In the sensor structure of this application, the first electrode layer, the pressure-sensitive layer, and the second electrode layer can deform under the action of external force.
[0015] In the sensor structure of this application, the sensor module includes conductive foam, and the first electrode layer and the conductive layer, as well as the second electrode layer and the conductive layer, are electrically connected through the conductive foam.
[0016] In the sensor structure of this application, the first electrode layer includes a first substrate and a plurality of first electrodes, the plurality of first electrodes being arranged at intervals on the first substrate; the second electrode layer includes a second substrate and a plurality of second electrodes, the plurality of second electrodes being arranged at intervals on the second substrate, and the extension direction of the second electrodes intersects the extension direction of the first electrodes; the first electrodes and the second electrodes are respectively connected to two sides of the pressure-sensitive layer and electrically connected to the pressure-sensitive layer.
[0017] This invention provides a circuit board assembly, including a substrate layer and a conductive layer. The substrate layer is made of a flexible material and can deform under external force. Multiple conductive wires are interlaced along the extension direction of the substrate layer to form the conductive layer, allowing the conductive structure to deform under external force without affecting its conductivity. The conductive structure is connected to a PCBA board to form the circuit board assembly. In this embodiment, the conductive wires are directly interlaced on the substrate layer to form the conductive layer, eliminating the need for high-precision equipment to manufacture the conductive structure. Compared to methods such as screen printing silver paste or electroplating conductive materials on polymer films, the circuit board assembly of this embodiment has lower manufacturing costs and a relatively simpler process. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of the circuit board assembly provided in an embodiment of the present utility model;
[0020] Figure 2 An exploded view of the circuit board assembly provided in an embodiment of this utility model;
[0021] Figure 3 This is a schematic diagram of the sensor structure provided in an embodiment of the present invention.
[0022] The markings in the image are as follows:
[0023] 1. Conductive structure; 11. Substrate layer; 12. Conductive layer; 13. Insulating layer; 14. Terminal component; 2. PCBA board; 21. Pin header; 3. Terminal shell; 31. Mounting hole; 4. First electrode layer; 5. Second electrode layer; 6. Pressure-sensitive layer; 7. Conductive foam; 100. Circuit board assembly. Detailed Implementation
[0024] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.
[0025] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "inner", "outer" and other terms used in this utility model to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device and components referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0026] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.
[0027] Traditional techniques involve screen printing silver paste, gold plating, or carbon plating onto PI or PET films to form flexible circuit boards. However, screen printing silver paste or plating conductive materials requires high-precision equipment and involves processes such as printing, plating, circuit patterning, and etching. These processes are complex and have high manufacturing costs.
[0028] like Figure 1 and Figure 2 As shown, this utility model embodiment provides a circuit board assembly 100, which includes a conductive structure 1 and a PCBA board 2. The conductive structure 1 includes a substrate layer 11 and a conductive layer 12. The conductive layer 12 includes multiple conductive wires, which are interlaced on the substrate layer 11 along the extension direction of the substrate layer 11. The conductive layer 12 is electrically connected to the PCBA board 2. The substrate layer 11 can deform under the action of external force.
[0029] Based on the above technical solution, the substrate layer 11 is made of a flexible material and has a certain degree of flexibility, allowing it to deform under external force. Multiple conductive wires are interlaced along the extension direction of the substrate layer 11 by embroidery to form a conductive layer 12. This allows the conductive structure 1 to deform under external force without affecting its conductivity. The conductive structure 1 is then connected to the PCBA board 2 to form a circuit board assembly 100. In this embodiment, the conductive wires are directly interlaced on the substrate layer 11 to form the conductive layer 12, eliminating the need for high-precision equipment to manufacture the conductive structure 1. Compared to screen printing silver paste or electroplating conductive materials on a polymer film, the manufacturing cost of the circuit board assembly 100 in this embodiment is lower, and the process is relatively simpler.
[0030] In this embodiment, the substrate layer 11 can be any material selected from fabric, foam, rubber film, or silicone film, or other flexible substrate materials that can deform under external force, folding or bending. The conductive wire can be a metal wire, such as copper or silver wire, possessing both electrical conductivity and tensile strength. The conductive wire is embroidered on the substrate layer 11, allowing it to deform with the substrate layer 11 while maintaining its electrical conductivity.
[0031] In some embodiments, the conductive wire includes a plurality of first conductive portions and a plurality of second conductive portions (not shown in the figures), with each first conductive portion and each second conductive portion alternately connected; the substrate layer 11 has a first surface and a second surface that are opposite to each other, the first conductive portion is disposed on the first surface of the substrate layer 11, and the second conductive portion is disposed on the second surface of the substrate layer 11.
[0032] Specifically, the first conductive portion and the second conductive portion are alternately disposed on the base layer 11 by embroidery or knitting. Each first conductive portion is spaced apart on the first surface, and each second conductive portion is spaced apart on the second surface, so that the conductive wires are interlaced on the base layer 11. In this embodiment, the embroidery or knitting can be performed by machine or by hand.
[0033] In a specific example, the substrate layer 11 is fabric, and the conductive wire is copper wire. The copper wire is embroidered onto the fabric by a machine to form the conductive structure 1.
[0034] In a specific example, the substrate layer 11 is a rubber film, and the conductive wire is a silver wire. The silver wire is artificially embroidered onto the rubber film to form the conductive structure 1.
[0035] In the above example, the conductive wires are embroidered onto the fabric or rubber film by means of embroidery or knitting. The process is relatively simple and can reduce manufacturing costs.
[0036] In some embodiments, such as Figure 2 As shown, the conductive structure 1 includes an insulating layer 13, which is attached to the surface of the substrate layer 11 and covers the conductive layer 12. The insulating layer 13 can deform under external force.
[0037] Specifically, the insulating layer 13 is a thin insulating film. The insulating film is attached to the surface of the substrate layer 11 by hot pressing or bonding, and the insulating film covers the conductive layer 12, thereby protecting the conductive wire. The insulating film can be deformed under external force, such as bending, stretching or twisting, without affecting the conductivity of the conductive layer 12, so that the conductive structure 1 can be bent or folded.
[0038] In some embodiments, the side of the insulating layer 13 facing the substrate layer 11 is adhesive, or an adhesive element (not shown in the figures) is provided between the insulating layer 13 and the substrate layer 11.
[0039] Specifically, in this embodiment, by selecting an adhesive insulating layer 13 material or providing an adhesive element on the surface of the insulating layer 13, the insulating layer 13 is bonded to the surface of the substrate layer 11, thereby achieving stable adhesion between the insulating layer 13 and the substrate layer 11 and simplifying the manufacturing process.
[0040] In some embodiments, such as Figure 2 As shown, the conductive structure 1 also includes multiple terminal pieces 14, which are connected to multiple conductive wires one by one; the PCBA board 2 includes multiple pin headers 21, which are connected to multiple terminal pieces 14 one by one.
[0041] Specifically, terminal 14 is a metal pin made of hard alloy material, such as tungsten carbide (also known as hard alloy), which has high hardness and strength. Each metal pin is connected to a conductive wire by welding or crimping to ensure stable contact between the metal pin and the conductive wire. The pin header 21 of PCBA board 2 is connected to the metal pins, thereby realizing the electrical connection between conductive structure 1 and PCBA board 2.
[0042] In other embodiments, the terminal 14 may also be a conductive wire or a conductive metal sheet, etc. The terminal 14 has conductive properties and realizes the electrical connection between the conductive wire and the pin 21.
[0043] In some embodiments, such as Figure 1 and Figure 2 As shown, the circuit board assembly 100 also includes a terminal housing 3, which has mounting holes 31, and multiple terminal pieces 14 are inserted into the mounting holes 31. The terminal housing 3 is detachably mounted on the PCBA board 2, and the pin header 21 is connected to the terminal piece 14 in the mounting holes 31.
[0044] Specifically, the terminal housing 3 is a plastic shell with insulating properties. The terminal housing 3 is used to ensure a reliable connection between the terminal 14 and the pin header 21, while also protecting and securing the terminal 14. During long-term use, the terminal housing 3 maintains a stable connection between the terminal 14 and the pin header 21.
[0045] After the terminal piece 14 is connected and fixed to the conductive wire, the terminal piece 14 is inserted into the mounting hole 31 of the terminal housing 3. Then, the terminal housing 3 is assembled onto the PCBA board 2, and the pin header 21 of the PCBA board 2 is connected to the terminal piece 14 of the conductive structure 1 within the mounting hole 31, thereby achieving an electrical connection between the conductive structure 1 and the PCBA board 2. The terminal housing 3 can be fixed to the PCBA board 2 by clips, screws, or other detachable methods.
[0046] Secondly, such as Figure 3 As shown, this utility model provides a sensor structure, including a sensor module and a circuit board assembly 100. The sensor module includes a first electrode layer 4, a second electrode layer 5 and a pressure-sensitive layer 6. The first electrode layer 4, the pressure-sensitive layer 6 and the second electrode layer 5 are stacked sequentially. A conductive layer 12 is connected between the first electrode layer 4 and the pressure-sensitive layer 6 and between the second electrode layer 5 and the pressure-sensitive layer 6.
[0047] Specifically, the first electrode layer 4 and the second electrode layer 5 are respectively attached to the front and back sides of the pressure-sensitive layer 6. Applying pressure causes the pressure-sensitive layer 6 to generate a resistance signal. The first electrode layer 4 and the second electrode layer 5 transmit the resistance signal to the PCBA board 2 through the conductive layer 12. The PCBA board 2 performs corresponding control according to the change and distribution of the pressure value.
[0048] In some embodiments, the first electrode layer 4, the pressure-sensitive layer 6, and the second electrode layer 5 may deform under the action of external force.
[0049] In this embodiment, the first electrode layer 4, the pressure-sensitive layer 6, and the second electrode layer 5 all have a certain degree of flexibility, and the sensor structure of this embodiment is a flexible pressure sensor. The first electrode layer 4 and the second electrode layer 5 can be made of fabric, with conductive lines set on the fabric as a substrate to form the electrode layer; the pressure-sensitive layer 6 is made of piezoresistive film or resistive thin film.
[0050] For example, the sensor structure of this embodiment is applied to a smart seat.
[0051] It should be noted that while a single electrode layer on one side of the pressure-sensitive layer 6 can also achieve pressure detection, the detection results are not accurate due to incomplete coverage of the conductive circuit. Therefore, in this embodiment, a first electrode layer 4 and a second electrode layer 5 are respectively provided on both sides of the pressure-sensitive layer 6. This provides a wider coverage of the conductive circuit, is applicable to both sides, and results in more accurate pressure detection.
[0052] In some embodiments, such as Figure 3 As shown, the sensor module includes conductive foam 7, the first electrode layer 4 and the conductive layer 12 are electrically connected through the conductive foam 7, and the second electrode layer 5 and the conductive layer 12 are electrically connected through the conductive foam 7.
[0053] It should be noted that conductive foam 7 is a type of foam material with conductive properties, consisting of a flame-retardant sponge wrapped with conductive cloth, or a foam substrate and conductive particles or coating.
[0054] Specifically, a conductive structure 1 is provided between the first electrode layer 4 and the pressure-sensitive layer 6, and a conductive structure 1 is also provided between the second electrode layer 5 and the pressure-sensitive layer 6. The conductive layer 12 transmits the resistance value signals received by the first electrode layer 4 and the second electrode layer 5 to the PCBA board 2. Because the conductive wires in the conductive layer 12 have small diameters and thin thicknesses, the contact between the conductive wires and the first electrode layer 4 and the second electrode layer 5 is unstable. In this embodiment, conductive foam 7 is used to connect the conductive wires. By attaching the conductive foam 7 to the first electrode layer 4 and the second electrode layer 5 respectively, the contact area between the conductive wires and the first electrode layer 4 and the second electrode layer 5 is indirectly expanded, resulting in more stable contact and better reliability.
[0055] In other embodiments, the conductive foam 7 can be replaced with conductive adhesive, conductive rubber block, or conductive fabric, etc.
[0056] In some embodiments, the first electrode layer 4 includes a first substrate and a plurality of first electrodes (not shown in the figures), the plurality of first electrodes being arranged at intervals on the first substrate; the second electrode layer 5 includes a second substrate and a plurality of second electrodes, the plurality of second electrodes being arranged at intervals on the second substrate, the extension direction of the second electrodes intersecting the extension direction of the first electrodes; the first electrodes and the second electrodes are respectively connected to the two sides of the pressure-sensitive layer 6 and electrically connected to the pressure-sensitive layer 6.
[0057] Specifically, the conductive lines of the first electrode layer 4 intersect with the conductive lines of the second electrode layer 5, and the first electrode layer 4 and the second electrode layer 5 are attached to both sides of the pressure-sensitive layer 6 so that both the first electrode and the second electrode are electrically connected to the pressure-sensitive layer 6. Since multiple second electrodes are arranged intersectingly with multiple first electrodes, the conductive lines of the two electrode layers can cover most of the surface of the pressure-sensitive layer 6. The pressure-sensitive layer 6 can sense the pressure applied to each point on the surface and transmit it outward in the form of a resistance value signal, thereby improving the accuracy of pressure detection.
[0058] It should be understood that the term "and / or" as used in this specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations. It should be noted that, herein, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system.
[0059] The sequence numbers of the above-described embodiments of this utility model are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above descriptions are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model.
Claims
1. A circuit board assembly, characterized in that, The device includes a conductive structure and a PCBA board. The conductive structure includes a substrate layer and a conductive layer. The conductive layer includes multiple conductive wires, which are interspersed on the substrate layer along its extension direction. The conductive layer is electrically connected to the PCBA board. The substrate layer can deform under external force.
2. The circuit board assembly according to claim 1, characterized in that, The conductive wire includes a plurality of first conductive portions and a plurality of second conductive portions, with each first conductive portion and each second conductive portion being alternately connected; The substrate layer has a first surface and a second surface that are opposite to each other. The first conductive part is disposed on the first surface of the substrate layer, and the second conductive part is disposed on the second surface of the substrate layer.
3. The circuit board assembly according to claim 1, characterized in that, The conductive structure includes an insulating layer, which is attached to the surface of the substrate layer and covers the conductive layer. The insulating layer can deform under external force.
4. The circuit board assembly according to claim 3, characterized in that, The side of the insulating layer facing the substrate layer is adhesive.
5. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The conductive structure also includes multiple terminal pieces, and each of the multiple terminal pieces is connected to one of the multiple conductive wires in a corresponding manner. The PCBA board includes multiple pin headers, and each of the pin headers is connected to a corresponding terminal block.
6. The circuit board assembly according to claim 5, characterized in that, The circuit board assembly also includes a terminal housing with mounting holes, and a plurality of terminal pieces are inserted into the mounting holes; the terminal housing is detachably mounted on the PCBA board, and the pin headers are connected to the terminal pieces in the mounting holes.
7. A sensor structure, comprising a sensor module and a circuit board assembly as described in any one of claims 1 to 6, characterized in that, The sensor module includes a first electrode layer, a second electrode layer, and a pressure-sensitive layer. The first electrode layer, the pressure-sensitive layer, and the second electrode layer are stacked sequentially. The conductive layer is connected between the first electrode layer and the pressure-sensitive layer, and between the second electrode layer and the pressure-sensitive layer.
8. The sensor structure according to claim 7, characterized in that, The first electrode layer, the pressure-sensitive layer, and the second electrode layer can deform under the action of external force.
9. The sensor structure according to claim 7, characterized in that, The sensor module includes conductive foam, and the first electrode layer and the conductive layer, as well as the second electrode layer and the conductive layer, are electrically connected through the conductive foam.
10. The sensor structure according to claim 7, characterized in that, The first electrode layer includes a first substrate and a plurality of first electrodes, which are spaced apart on the first substrate; the second electrode layer includes a second substrate and a plurality of second electrodes, which are spaced apart on the second substrate, and the extension direction of the second electrodes intersects the extension direction of the first electrodes; the first electrodes and the second electrodes are respectively connected to two sides of the pressure-sensitive layer and electrically connected to the pressure-sensitive layer.