Assembly type wafer bearing box for 2.8 inch wafer

Abstract

The utility model discloses an assembly type wafer bearing box for 2.8 inch wafers, which relates to the technical field of wafer boxes and comprises a first wafer frame and a second wafer frame, a first fixing plate is arranged at the top between the first wafer frame and the second wafer frame, and a plurality of wafer placing grooves are horizontally formed between the first wafer frame and the second wafer frame. A first fixing plate is arranged at the bottom between the first wafer frame and the second wafer frame, a second fixing plate is arranged at the bottom between the first wafer frame and the second wafer frame, and two mounting positioning holes and two threaded holes are respectively formed in two ends of the first wafer frame and two ends of the second wafer frame. Meanwhile, due to the fact that split machining is adopted, the difficulty of all parts in the machining process is greatly reduced, and the problem that finish machining cannot be conducted on the interior due to overall die sinking is also solved.

Description

Technical Field

[0001] This utility model relates to the field of wafer carrier technology, and in particular to an assembled wafer carrier for 2.8-inch wafers. Background Technology

[0002] In existing technologies, wafer carriers are mostly manufactured using molds, which is costly and requires mass production to offset the mold costs. Furthermore, even after the mold is formed, secondary processing is still required. However, due to the complex structure of the wafer carrier, machining within the slots is difficult after the overall mold is created, resulting in numerous processing steps and increased time costs. Additionally, the actual application scenarios for 2.8-inch wafer carriers are far fewer than those for conventional sizes such as 6-inch, 8-inch, and 12-inch wafers. This leads to the high cost of mold manufacturing. Especially when different operating conditions require wafer carriers with specific slot numbers, such as 13 or 25 slots, mold manufacturing further increases costs. If a mold-manufactured wafer carrier is damaged, it must be scrapped because it is essentially a single piece. Utility Model Content

[0003] The main objective of this invention is to provide an assembled wafer carrier for 2.8-inch wafers, which can effectively solve the problems in the background art.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0005] A 2.8-inch wafer carrier assembly includes a wafer rack 1 and a wafer rack 2. A fixing plate 1 is provided at the top between the wafer rack 1 and the wafer rack 2. Several wafer placement slots are horizontally chiseled between the wafer rack 1 and the wafer rack 2. A fixing plate 2 is provided at the bottom between the wafer rack 1 and the wafer rack 2. Two mounting positioning holes and a threaded hole are chiseled at each end of the wafer rack 1 and the wafer rack 2. Mounting positioning points are provided near the mounting positioning holes on both the fixing plate 1 and the fixing plate 2. Through holes are chiseled at the positions of the threaded holes on both the fixing plate 1 and the fixing plate 2. Fixing screws are installed inside the through holes.

[0006] Preferably, the mounting positioning points are respectively inserted into mounting positioning holes with matching positions, and the outer dimensions of the mounting positioning points are respectively matched with the inner diameter of the mounting positioning holes.

[0007] Preferably, one end of the fixing screw that passes through the through hole is inserted into a threaded hole that matches the position and is threadedly connected to it.

[0008] Compared with the prior art, the present invention has the following beneficial effects:

[0009] In this invention, the wafer carrier box is manufactured by assembling the components one by one after processing them separately. This avoids the high cost of mold development. At the same time, because it is processed separately, the difficulty of processing all the components is greatly reduced, and the problem of not being able to perform fine processing inside due to overall mold opening is also solved.

[0010] Because it is processed in separate parts and then assembled, it is convenient for users to combine multiple sizes according to actual use. Only wafer carrier one and wafer carrier two need to be replaced according to actual working conditions. There is no need to replace the fixing plates one and two at both ends. Even if the wafer carrier is partially damaged, only the damaged parts need to be replaced, instead of scrapping the whole thing, which greatly reduces the production and manufacturing costs and subsequent costs. Attached Figure Description

[0011] Figure 1 This is an exploded view of the assembled wafer carrier box for 2.8-inch wafers according to this utility model.

[0012] Figure 2 This is a schematic diagram of the structure of an assembled wafer carrier box for a 2.8-inch wafer according to the present invention.

[0013] In the diagram: 1. Fixing screw; 2. Fixing plate one; 3. Wafer rack one; 4. Wafer rack two; 5. Fixing plate two; 6. Mounting positioning point; 7. Mounting positioning hole; 8. Threaded hole; 9. Wafer placement slot; 10. Through hole. Detailed Implementation

[0014] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0015] like Figure 1-2 As shown, a 2.8-inch wafer carrier assembly includes a wafer rack 3 and a wafer rack 4. A fixing plate 2 is provided at the top between the wafer rack 3 and the wafer rack 4. Several wafer placement slots 9 are horizontally carved between the wafer rack 3 and the wafer rack 4. A fixing plate 2 5 is provided at the bottom between the wafer rack 3 and the wafer rack 4. Two mounting positioning holes 7 and threaded holes 8 are carved at both ends of the wafer rack 3 and the wafer rack 4, respectively. Mounting positioning points 6 are provided near the mounting positioning holes 7 on the fixing plate 2 and the fixing plate 2 5. Through holes 10 are carved at the positions of the threaded holes 8 on the fixing plate 2 and the fixing plate 2 5. Fixing screws 1 are installed inside the through holes 10.

[0016] Specifically, the mounting positioning points 6 are respectively inserted into the mounting positioning holes 7 that match the position, and the outer dimensions of the mounting positioning points 6 match the inner diameter of the mounting positioning holes 7.

[0017] Specifically, the end of the fixing screw 1 that passes through the through hole 10 is inserted into the threaded hole 8 that matches the position and is threadedly connected to it.

[0018] Working principle:

[0019] Fixing plate 1 2 and fixing plate 2 5 are located at the top and bottom of wafer rack 1 3 and wafer rack 2 4 respectively. The mounting positioning points 6 on fixing plate 1 2 and fixing plate 2 5 are inserted into the mounting positioning holes 7 on wafer rack 1 3 and wafer rack 2 4 respectively to complete the basic positioning. Several fixing screws 1 pass through the through holes 10 of fixing plate 1 2 and fixing plate 2 5 respectively and are inserted into the threaded holes 8 of wafer rack 1 3 and wafer rack 2 4 to connect with them by threads, thus completing the installation work.

[0020] Because it is processed in separate parts and then assembled, it is convenient for users to combine multiple sizes according to actual use. Only wafer carrier 1 3 and wafer carrier 2 4 need to be replaced according to actual working conditions. There is no need to replace the fixing plates 1 2 and 2 5 at both ends. Even if the wafer carrier is partially damaged, only the damaged parts need to be replaced, instead of scrapping the whole thing, which greatly reduces the production and manufacturing costs and subsequent costs.

[0021] The circuits, electronic components, and control modules involved are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve any improvement to the software and methods.

[0022] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A 2.8-inch wafer carrier assembly, comprising wafer rack one (3) and wafer rack two (4), characterized in that: A fixing plate 1 (2) is provided at the top between the wafer rack 1 (3) and the wafer rack 2 (4). Several wafer placement slots (9) are horizontally chiseled between the wafer rack 1 (3) and the wafer rack 2 (4). A fixing plate 2 (5) is provided at the bottom between the wafer rack 1 (3) and the wafer rack 2 (4). Two mounting positioning holes (7) and threaded holes (8) are chiseled at both ends of the wafer rack 1 (3) and the wafer rack 2 (4). Mounting positioning points (6) are provided near the mounting positioning holes (7) of the fixing plate 1 (2) and the fixing plate 2 (5). Through holes (10) are chiseled at the positions of the threaded holes (8) of the fixing plate 1 (2) and the fixing plate 2 (5). Fixing screws (1) are installed inside the through holes (10).

2. The assembled wafer carrier box for a 2.8-inch wafer according to claim 1, characterized in that: The mounting positioning points (6) are respectively inserted into the mounting positioning holes (7) that match the position, and the outer dimensions of the mounting positioning points (6) match the inner diameter of the mounting positioning holes (7).

3. The assembled wafer carrier box for a 2.8-inch wafer according to claim 1, characterized in that: The fixing screw (1) is inserted into the threaded hole (8) with a matching position and is threadedly connected to it.

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