Adsorption platform capable of ensuring flatness and realizing quick release

Abstract

The utility model relates to an adsorption platform capable of guaranteeing flatness and achieving quick release, the adsorption platform comprises a leveling base and an adsorption plate, adsorption plate fixing screws are arranged on the periphery of the top of the leveling base, and leveling nuts are arranged on the top of the leveling base and located on the outer sides of the adsorption plate fixing screws; leveling base fixing screws are arranged at the positions, corresponding to the leveling nuts, of the bottom of the leveling base, clamping springs are arranged at the positions, located on the outer sides of the leveling base fixing screws, of the bottom of the leveling base, and adsorption plate positioning pins are arranged at the left rear end and the right front end of the top of the leveling base correspondingly. Adsorption plate positioning pin holes are formed in the periphery of the inner surface of the leveling base. The leveling base, the leveling nut, the adsorption plate fixing screw, the air pipe connector, the adsorption plate, the adsorption plate positioning pin, the leveling base fixing screw, the clamping spring and the adsorption plate positioning pin hole are arranged, and the pressing mode and the machining technology are changed, so that the flatness stability of the adsorption platform is higher, the cost is lower, and the service life is longer.

Description

Technical Field

[0001] This application relates to the field of adsorption platform technology, and in particular to an adsorption platform that can guarantee flatness and enable quick disassembly. Background Technology

[0002] The adsorption platform is a structure used in die bonding equipment to flatten the substrate or lead frame. The levelness of the adsorption platform determines whether the substrate or lead frame can be flattened, thus affecting the chip bonding quality. The adsorption platform must meet two conditions: 1. After the adsorption platform is leveled, it must ensure stability and not deteriorate over time; 2. To accommodate substrates or lead frames of different widths, the adsorption platform must be quick-changeable to accommodate substrates or lead frames of different widths.

[0003] Some adsorption platforms on the market typically use a structure similar to dovetail groove positioning and side clamping to achieve fixation and quick replacement. Generally, a set of adsorption platforms will have two or more sets of dovetail groove fixing points. The dovetail groove positioning method requires very high machining accuracy of the parts. If there is a deviation in the fit of one surface, the positioning and flatness of the entire platform cannot meet the requirements. Therefore, the scrap rate of the parts and the processing cycle are very long, and the parts processing cost is very high. With long-term use, the platform needs to be replaced with adsorption plates of different widths. During the replacement process, the dimensional accuracy of the dovetail groove will deteriorate due to friction. Over time, the flatness will become unstable, and the deterioration of flatness will affect the chip bonding effect.

[0004] Therefore, existing technologies have shortcomings and need to be improved. Summary of the Invention

[0005] This application provides an adsorption platform that guarantees flatness and enables quick disassembly, addressing the issue that the dovetail groove positioning method requires extremely high precision in the machining of parts. When the fit of one surface deviates, the positioning and flatness of the entire platform cannot meet the requirements, resulting in a high scrap rate and long machining cycle for parts, leading to high machining costs. Furthermore, long-term use of the platform requires replacement of adsorption plates of different widths. During the replacement process, the dimensional accuracy of the dovetail groove deteriorates due to friction, and over time, flatness instability occurs, affecting the chip bonding effect.

[0006] In a first aspect, this application provides an adsorption platform that can guarantee flatness and achieve quick disassembly, including a leveling base and an adsorption plate. The top of the leveling base is provided with adsorption plate fixing screws on all four sides. A leveling nut is provided on the top of the leveling base and outside the adsorption plate fixing screws. A leveling base fixing screw is provided on the bottom of the leveling base and at the corresponding position of the leveling nut. A retaining spring is provided on the bottom of the leveling base and outside the leveling base fixing screws. Adsorption plate positioning pins are provided on the left rear end and right front end of the top of the leveling base. Adsorption plate positioning pin holes are opened on all four sides of the inner surface of the leveling base.

[0007] Optionally, the positioning pin hole of the adsorption plate is an oblong hole, the upper end of the positioning pin of the adsorption plate is provided with a chamfered guide, and the positioning pin hole of the adsorption plate cooperates with the positioning pin of the adsorption plate.

[0008] Optionally, the leveling base has an overall "convex" structure, and a first reserved groove is provided at the top of the leveling base and at the right front end of the adsorption plate positioning pin.

[0009] Optionally, a duct connector is provided at the right end of the inner surface of the adsorption plate, and a second reserved groove is provided at the connection between the adsorption plate and the duct connector.

[0010] Optionally, the inner surface of the adsorption plate is provided with through holes.

[0011] Optionally, the through-hole has an "X" shaped structure.

[0012] Optionally, a countersunk hole is provided at the connection between the adsorption plate and the adsorption plate fixing screw, and a hexagonal groove is provided on the inner surface of the adsorption plate fixing screw.

[0013] Optionally, the leveling base is provided with chamfers around its perimeter.

[0014] Optionally, the thickness of the leveling base is 1.2-1.8 times the thickness of the adsorption plate.

[0015] Optionally, the adsorption plate has circular holes on both the front and rear sides of its inner surface, with multiple circular holes on each side.

[0016] The technical solutions provided in this application have the following advantages compared with the prior art:

[0017] This embodiment of the application, by setting a leveling base, leveling nut, adsorption plate fixing screw, air pipe connector, adsorption plate, adsorption plate positioning pin, leveling base fixing screw, snap ring, and adsorption plate positioning pin hole, changes the clamping method and processing technology to make the adsorption platform more stable in terms of flatness, lower in cost, and longer in service life. By adopting a pin positioning and threaded fixing method, flatness stability can be guaranteed and quick change can be achieved, reducing costs and extending service life. Compared with the existing adsorption platform, which uses a similar structure of dovetail groove positioning and side clamping to achieve fixing and quick change, the parts processing difficulty is reduced, the processing cycle can be shortened and costs can be reduced. At the same time, the threaded clamping does not have the problem of the dovetail groove losing precision due to friction, resulting in better stability and a longer service life. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0021] Figure 1 This is a three-dimensional structural diagram of the adsorption platform of this utility model that can guarantee flatness and achieve quick disassembly.

[0022] Figure 2 This is a top view of the leveling base of this utility model.

[0023] Figure 3 This is a CC cross-sectional view of the present invention.

[0024] Figure 4 This is a top view of the adsorption plate of this utility model.

[0025] Figure 5 This is a cross-sectional view of the present utility model KK.

[0026] Figure 6 This is a flowchart of the installation process of this utility model.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Leveling base; 2. Leveling nut; 3. Adsorption plate fixing screw; 4. Air pipe connector; 5. Adsorption plate; 6. Adsorption plate positioning pin; 7. Leveling base fixing screw; 8. Snap ring; 9. Adsorption plate positioning pin hole. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0031] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0032] To address the technical problems in existing technologies, this application provides an adsorption platform that ensures flatness and enables quick disassembly. It incorporates a leveling base, leveling nuts, adsorption plate fixing screws, an air pipe connector, an adsorption plate, adsorption plate positioning pins, leveling base fixing screws, a retaining ring, and adsorption plate positioning pin holes. By changing the clamping method and processing technology, the adsorption platform achieves higher flatness stability, lower cost, and longer service life. The use of pin positioning and threaded fixing ensures flatness stability and enables quick replacement, reducing costs and extending service life. Compared to existing adsorption platforms that use a similar dovetail groove positioning and side clamping structure for fixing and quick replacement, this method reduces the difficulty of parts processing, shortens the processing cycle, and lowers costs. Furthermore, the threaded clamping avoids the decrease in precision caused by friction in the dovetail groove, resulting in better stability and a longer service life.

[0033] Figure 1-6An adsorption platform that ensures flatness and enables quick disassembly is provided in this application embodiment. It includes a leveling base 1 and an adsorption plate 5. Adsorption plate fixing screws 3 are provided around the top of the leveling base 1. A leveling nut 2 is provided on the top of the leveling base 1 and outside the adsorption plate fixing screws 3. A leveling base fixing screw 7 is provided on the bottom of the leveling base 1 and at the corresponding position of the leveling nut 2. This prevents the four adsorption plate fixing screws 3 from being manually loosened and having too large a height difference, which would affect secondary assembly. It also prevents the leveling base fixing screws 7 from being completely removed and lost. A retaining spring 8 is provided on the bottom of the leveling base 1 and outside the leveling base fixing screws 7. Adsorption plate positioning pins 6 are provided on the left rear end and right front end of the top of the leveling base 1. Adsorption plate positioning pin holes 9 are provided around the inner surface of the leveling base 1.

[0034] Furthermore, the adsorption plate positioning pin hole 9 is an oblong hole, and the upper end of the adsorption plate positioning pin 6 is provided with a chamfered guide. The adsorption plate positioning pin hole 9 and the adsorption plate positioning pin 6 cooperate to place the adsorption plate 5 downward and flatten it with the top surface of the leveling base 1. After the bottom surface of the adsorption plate 5 is flattened with the top surface of the leveling base 1, push the adsorption plate 5 to the right until the adsorption plate positioning pin 6 contacts the leftmost side of the adsorption plate positioning pin hole 9 to complete the positioning. At this time, the four adsorption plate fixing screws 3 can be tightened to complete the positioning and locking. After the adsorption plate 5 is locked, the leveling nut 2 can be adjusted to level the top of the adsorption plate 5. Finally, the leveling base fixing screws 7 are tightened.

[0035] Please continue reading. Figure 1-6 The leveling base 1 has a convex shape. A first reserved groove is provided at the top of the leveling base 1 and at the right front end of the adsorption plate positioning pin 6. An air pipe connector 4 is provided at the right end of the inner surface of the adsorption plate 5, and a second reserved groove is provided at the connection between the adsorption plate 5 and the air pipe connector 4. A through hole is provided on the inner surface of the adsorption plate 5, and the through hole has an "X" shape. A countersunk hole is provided at the connection between the adsorption plate 5 and the adsorption plate fixing screw 3, and a hexagonal groove is provided on the inner surface of the adsorption plate fixing screw 3. The leveling base 1 has chamfers around its perimeter, and the thickness of the leveling base 1 is 1.2-1.8 times the thickness of the adsorption plate 5. Circular holes are provided on both the front and rear sides of the inner surface of the adsorption plate 5, and there are multiple circular holes on each side.

[0036] The working principle of this application is as follows: A leveling base 1, a leveling nut 2, an adsorption plate fixing screw 3, an air pipe connector 4, an adsorption plate 5, an adsorption plate positioning pin 6, a leveling base fixing screw 7, a snap ring 8, and an adsorption plate positioning pin hole 9 are provided. By changing the clamping method and processing technology, the flatness stability of the adsorption platform is improved, the cost is reduced, and the service life is extended. The use of pin positioning and threaded fixing ensures flatness stability and enables quick replacement, reducing costs and extending service life. Compared with existing adsorption platforms that use a similar dovetail groove positioning and side clamping structure for fixing and quick replacement, the parts processing difficulty is reduced, the processing cycle is shortened, and costs are lowered. At the same time, the threaded clamping avoids the dovetail groove's reduced precision due to friction, resulting in better stability and a longer service life.

[0037] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0038] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0042] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0043] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0044] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An adsorption platform that ensures flatness and allows for quick disassembly, comprising a leveling base and an adsorption plate, characterized in that: The four sides of the top of the leveling base are provided with adsorption plate fixing screws, the top of the leveling base and outside the adsorption plate fixing screws are provided with leveling nuts, the bottom of the leveling base and corresponding positions of the leveling nuts are provided with leveling base fixing screws, the bottom of the leveling base and outside the leveling base fixing screws are provided with clamping springs, the left rear end and the right front end of the top of the leveling base are provided with adsorption plate positioning pins, and the inner surface of the leveling base is provided with adsorption plate positioning pin holes around.

2. The adsorption platform of claim 1, wherein: The adsorption plate positioning pin holes are long circular holes, the upper end of the adsorption plate positioning pin is provided with a chamfer guide, and the adsorption plate positioning pin hole cooperates with the adsorption plate positioning pin.

3. The adsorption platform of claim 1, wherein: The whole leveling base is a "convex" structure, the top of the leveling base and the adsorption plate positioning pin at the right front end are provided with a first reserved slot.

4. The adsorption platform of claim 1, wherein: The right end of the inner surface of the adsorption plate is provided with a gas pipe joint, and the connection between the adsorption plate and the gas pipe joint is provided with a second reserved slot.

5. The adsorption platform of claim 1, wherein: The inner surface of the adsorption plate is provided with a through hole.

6. The adsorption platform of claim 1, wherein: The through hole is an "X" structure.

7. The adsorption platform of claim 1, wherein: The connection between the adsorption plate and the adsorption plate fixing screw is provided with a countersunk hole, and the inner surface of the adsorption plate fixing screw is provided with a hexagonal groove.

8. The adsorption platform of claim 1, wherein: The four sides of the leveling base are provided with chamfers.

9. The adsorption platform of claim 1, wherein: The thickness of the leveling base is 1.2-1.8 times the thickness of the adsorption plate.

10. The adsorption platform of claim 1, wherein: The front and rear sides of the inner surface of the adsorption plate are provided with circular holes, and the number of circular holes on each side is multiple.

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