Door body and cooking equipment
By installing a power generation component and a fan inside the oven door, electricity is generated using the temperature difference between the inner and outer doors, and heat is recovered, thus solving the problem of heat loss from the oven door and improving energy efficiency and safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-10
- Publication Date
- 2026-03-06
AI Technical Summary
Existing ovens suffer from severe heat loss through the door, resulting in low energy efficiency, increased energy consumption, and the high temperature of the door affects sealing performance and user safety.
A power generation component is installed inside the oven door to generate electricity using the temperature difference between the inner and outer doors. The electricity is then dissipated and cooled by a fan, thus achieving heat recovery and temperature control.
It improves energy efficiency, reduces energy consumption, improves door temperature, enhances security and sealing performance, and provides a good user experience.
Smart Images
Figure CN223969018U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of kitchen appliance technology, and in particular to doors and cooking equipment. Background Technology
[0002] Ovens, as an example of cooking equipment, primarily function to heat food to a predetermined temperature to achieve cooking purposes, with a common cooking temperature range of approximately 60℃ to 230℃. To ensure temperature stability within the cooking cavity and improve cooking results, existing cooking equipment typically employs excellent heat insulation designs for the cooking cavity. Among these, multi-layered glass doors with an intermediate air layer are a common method for oven door insulation.
[0003] However, despite the aforementioned insulation measures, heat inevitably escapes through the door during actual cooking. This heat loss not only reduces the oven's energy efficiency, requiring more electricity to maintain the internal cooking temperature and significantly lowering overall energy efficiency, but also increases energy costs. Furthermore, there are currently no effective technologies on the market to recover and reuse this lost heat.
[0004] Meanwhile, as cooking continues, the oven door temperature gradually rises. Excessive door temperature brings several problems. Besides the risk of burns, the high temperature causes surrounding air to rise, creating a hot airflow. This hot airflow can interfere with the normal heat dissipation of other appliances in the kitchen. Furthermore, excessive door temperature can affect the oven door's sealing performance. Rubber seals on the door are prone to aging and deformation under high temperatures, leading to a poor seal and further exacerbating heat loss from the oven, creating a vicious cycle and severely impacting the oven's normal performance. Therefore, excessive door temperature not only provides a poor user experience but also poses a potential threat to user safety and adversely affects the kitchen environment and other appliances.
[0005] Therefore, there is an urgent need to develop a technical solution that can effectively solve the problem of heat loss from the oven door, realize heat recovery and utilization, and at the same time reduce the door temperature to improve safety and user experience. Utility Model Content
[0006] Therefore, it is necessary to provide a door and cooking equipment that address the problems of heat loss and excessively high door temperature in existing cooking equipment.
[0007] A door body includes a main body and a power generation device; the main body includes an inner door and an outer door spaced apart and having a temperature difference; the power generation device includes a power generation component located within the gap between the inner door and the outer door, the power generation component including a hot end and a cold end connected to each other, the hot end being connected to the inner door and the cold end being connected to the outer door, the power generation component being configured to generate electrical energy using the temperature difference between the hot end and the cold end.
[0008] In one embodiment, the power generation component further includes a fan electrically connected to the power generation component, the power generation component being used to supply power to the fan, the fan's airflow direction being towards the outer door.
[0009] In one embodiment, the fan is located within the gap between the inner door and the outer door, and the fan is connected to the body.
[0010] In one embodiment, the fan is attached to the end face of the outer door facing the inner door.
[0011] In one embodiment, the door body further includes thermally conductive adhesive, which is an adhesive thermally conductive material, and the hot end is attached to the inner door by the thermally conductive adhesive.
[0012] In one embodiment, the power generation device includes a plurality of the power generation components, all of which are connected in series.
[0013] In one embodiment, each of the power generation components includes an N-type semiconductor, a P-type semiconductor, and a conductive plate. The ends of the N-type semiconductor and the P-type semiconductor near the inner gate are connected through the conductive plate to form the hot end. The conductive plate is made of a conductive material. The ends of the N-type semiconductor and the P-type semiconductor near the outer gate are the cold ends.
[0014] In one embodiment, the N-type semiconductor and the P-type semiconductor are respectively connected to different conductive sheets at the ends near the outer gate. The conductive sheets are made of conductive materials, and the conductive sheets of the power generation components located on the P-type semiconductor are connected to the conductive sheets of the adjacent power generation components located on the N-type semiconductor, so that the adjacent power generation components are connected in series.
[0015] In one embodiment, adjacent power generation components are spaced apart.
[0016] A cooking device includes a door as described in any of the above embodiments, and an inner liner having an open cooking cavity. The door covers the inner liner, and the inner door covers the openness of the cooking cavity.
[0017] The door body provided in the above solution has a power generation component installed inside the door body, with its two ends connected to the inner door and the outer door respectively. By utilizing the temperature difference between the inner door and the outer door, the power generation component generates electrical energy, thereby enabling the power generation device to utilize the heat transferred from the cooking cavity to the inner door, thus achieving heat recovery and utilization. Attached Figure Description
[0018] Figure 1 This is a cross-sectional structural diagram of a cooking device in one embodiment of this application.
[0019] Figure 2 for Figure 1 A schematic diagram of the exploded structure of the middle gate.
[0020] Figure 3 for Figure 2 Enlarged diagram of point A in the middle.
[0021] Figure 4 for Figure 2 A partial cross-sectional view of the central gate.
[0022] Figure 5 for Figure 2 A cross-sectional view of the central gate.
[0023] Explanation of reference numerals in the attached figures:
[0024] 10. Cooking equipment; 100. Door; 110. Main body; 111. Inner door; 112. Outer door; 113. Placement cavity; 120. Power generation device; 121. Power generation component; 1211. Hot end; 1212. Cold end; 1213. N-type semiconductor; 1214. P-type semiconductor; 1215. Conductive plate; 1216. Conductive plate; 130. Fan; 200. Inner liner; 210. Cooking cavity. Detailed Implementation
[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0026] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0027] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0028] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0029] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0030] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0031] See Figure 1 , Figure 1 A cross-sectional schematic diagram of a cooking device 10 according to an embodiment of this application is shown. The cooking device 10 provided in this embodiment can be an oven, a steam oven, or any other device with cooking functions, without limitation. Figure 1 As shown, the cooking device 10 includes a door 100 as described in any of the following embodiments, and also includes an inner liner 200. The inner liner 200 has an open cooking cavity 210 for cooking food, and the cooking cavity 210 has a high temperature when the cooking device 10 is in operation. Figure 1 As shown, the door 100 covers the inner liner 200, and the inner door 111 of the door 100 covers the opening of the cooking cavity 210. It is understood that since the inner door 111 directly covers the opening of the cooking cavity 210, the higher temperature inside the cooking cavity 210 will inevitably cause the temperature of the inner door 111 to rise when the cooking device 10 is in operation.
[0032] Combination Figure 2 As shown, Figure 2 An exploded view of the door 100 in one embodiment of this application is shown. The door 100 provided in this embodiment can be applied to the cooking equipment 10 described above, or to other fields, without limitation. Figure 1 and Figure 2 As shown, the door 100 includes a main body 110 and a power generation device 120. The main body 110 includes an inner door 111 and an outer door 112 spaced apart and having a temperature difference. In this specification, the space between the inner door 111 and the outer door 112 is named the placement cavity 113 for ease of explanation. It is understood that the inner door 111 experiences a temperature rise due to the high temperature within the cooking cavity 210. However, the outer door 112 is spaced apart from the inner door 111 and faces the outside of the cooking device 10. On the one hand, the outer door 112 receives less heat transfer from the inner door 111; on the other hand, the outer door 112 can also dissipate heat to the outside of the cooking device 10 in a timely manner, resulting in a lower temperature for the outer door 112 than for the inner door 111, i.e., a temperature difference exists between the outer door 112 and the inner door 111. Optionally, in some embodiments, the inner door 111 and the outer door 112 are respectively inner and outer glass.
[0033] Combination Figure 2 and Figure 4 As shown, the power generation device 120 includes power generation components 121. In one embodiment, the power generation device 120 includes multiple power generation components 121, all of which are connected in series, so that the power generation device 120 can obtain more electrical energy than a single power generation component 121, thereby making greater use of the heat inside the door 100.
[0034] like Figure 2 and Figure 3 As shown, the power generation component 121 is located within the gap between the inner door 111 and the outer door 112, that is, within the placement cavity 113. Figure 3 and Figure 4 As shown, the power generation component 121 includes a hot end 1211 and a cold end 1212 connected to each other. The hot end 1211 is connected to the inner door 111, and the cold end 1212 is connected to the outer door 112. The power generation component 121 is configured to generate electrical energy by utilizing the temperature difference between the hot end 1211 and the cold end 1212. The power generation component 121 directly converts heat energy into electrical energy by utilizing the temperature difference, so as to utilize the heat transferred from the cooking cavity 210 to the inner door 111 through the power generation device 120, thereby realizing heat recovery and utilization.
[0035] like Figure 1 and Figure 2 As shown, in one embodiment, the power generation component 121 further includes a fan 130 electrically connected to the power generation component 121, so that the power generation component 121 supplies power to the fan 130. In this embodiment, the fan 130 is connected to the power generation component 121 via a wire. The airflow direction of the fan 130 is towards the outer door 112, so as to dissipate heat and cool the outer door 112 through the fan 130. On the one hand, this can increase the temperature difference between the inner door 111 and the outer door 112, thereby improving the efficiency of the power generation component 121 in generating electricity. On the other hand, it can improve the problem of the outer door 112 being too hot, thereby reducing the safety risks of the cooking equipment 10.
[0036] like Figure 1 and Figure 5 As shown, in one embodiment, the fan 130 is located in the gap between the inner door 111 and the outer door 112, i.e., in the placement cavity 113, and the fan 130 is connected to the main body 110 so that the position of the fan 130 is fixed by the main body 110.
[0037] like Figure 5 As shown, in one embodiment, the fan 130 is bonded to the end face of the outer door 112 facing the inner door 111, so that the fan 130 is fixed to the outer door 112, and the air outlet of the fan 130 can stably blow towards the outer door 112, thereby cooling the outer door 112.
[0038] In one embodiment, the door body 100 also includes thermally conductive adhesive, which is an adhesive and thermally conductive material. The hot end 1211 is attached to the inner door 111 by the thermally conductive adhesive, so that the connection between the hot end 1211 and the inner door 111 is more stable and thermally conductive, so that the heat of the inner door 111 can be transferred to the hot end 1211 for the power generation component 121 to generate electrical energy.
[0039] like Figure 3 and Figure 4 As shown, in one embodiment, each power generation component 121 includes an N-type semiconductor 1213, a P-type semiconductor 1214, and a conductive plate 1215. The N-type semiconductor 1213 refers to an intrinsic semiconductor (pure semiconductor) doped with a small amount of a pentavalent element (such as phosphorus or arsenic), making its extra electron a free electron, thereby increasing the number of free electrons in the semiconductor. These free electrons are mainly responsible for conducting electricity, hence the name N-type semiconductor 1213. "N" represents negative charge, meaning that the majority carriers are negatively charged electrons. In the N-type semiconductor 1213, free electrons move in the conduction band. When an external electric field is applied, these free electrons are subjected to the electric field force and move directionally, forming a current. Simultaneously, due to the movement of free electrons, vacancies, i.e., holes, are left in their original positions, but the number of holes is relatively small, constituting minority carriers. P-type semiconductor 1214 is an intrinsic semiconductor doped with a small amount of trivalent elements (such as boron or gallium), causing them to lack one electron and form holes. These holes can accept electrons, thus increasing the number of holes in the semiconductor. Holes are primarily responsible for conducting electricity, hence the name P-type semiconductor 1214. "P" stands for positive charge, meaning that the majority carriers are positively charged holes. In P-type semiconductor 1214, holes move in the valence band. When an external electric field is applied, the holes are subjected to the electric field force and move directionally, forming a current. Simultaneously, due to the movement of holes, new holes are created in their original positions, but the number of free electrons is relatively small, making them minority carriers.
[0040] like Figure 3 and Figure 4 As shown, the ends of the N-type semiconductor 1213 and the P-type semiconductor 1214 near the inner gate 111 are connected by a conductive piece 1215, forming a hot end 1211. The conductive piece 1215 is made of a conductive material so that current can flow through the conductive piece 1215 from the N-type semiconductor 1213 to the P-type semiconductor 1214. The ends of the N-type semiconductor 1213 and the P-type semiconductor 1214 near the outer gate 112 are cold ends 1212.
[0041] like Figure 3 and Figure 4As shown, in one embodiment, the ends of the N-type semiconductor 1213 and the P-type semiconductor 1214 near the outer gate 112 are respectively connected to different conductive sheets 1216. The conductive sheets 1216 are made of conductive material to facilitate the series connection of the power generation component 121 to another power generation component 121, or to facilitate the connection of the power generation component 121 to a wire. The conductive sheet 1216 of the power generation component 121 located on the P-type semiconductor 1214 is connected to the conductive sheet 1216 of the adjacent power generation component 121 located on the N-type semiconductor 1213, so that the adjacent power generation components 121 are connected in series. In this embodiment, the conductive sheets 1216 of the adjacent power generation components 121 are connected by a wire. In other embodiments, the conductive sheets 1216 of the adjacent power generation components 121 may also be in contact and electrically connected, thereby realizing the series connection of the adjacent power generation components 121.
[0042] like Figure 3 and Figure 4 As shown, in one embodiment, adjacent power generation components 121 are spaced apart to avoid interference between adjacent power generation components 121 and cause current leakage.
[0043] The cooking device 10 and door 100 provided in this application, when the cooking device 10 starts working, the temperature of the cooking cavity 210 rises, the temperature of the inner door 111 rises with the heat in the cooking cavity 210, and the temperature of the outer door 112 lags behind due to the air gap between the inner door 111 and the outer door 112, so a significant temperature difference is generated between the inner door 111 and the outer door 112. According to the Seebeck effect (the thermoelectric phenomenon that causes a voltage difference between two different electrical conductors or semiconductors due to the temperature difference between the two substances), this temperature difference is converted into electrical energy through the power generation component 121, which powers the cooling fan 130. The cooling fan 130 can effectively reduce the temperature of the outer door 112, thereby maintaining the temperature difference between the inner door 111 and the outer door 112, thus forming a virtuous cycle.
[0044] In some embodiments, the electrical energy generated by the power generation component 121 can also be used for other purposes such as lighting the door 100, depending on the different operating conditions of the cooking equipment 10.
[0045] The cooking device 10 and door 100 provided in this application utilize a power generation component 121 installed inside the door 100, with its two ends connected to the inner door 111 and the outer door 112 respectively. This allows the power generation component 121 to generate electricity based on the temperature difference between the inner door 111 and the outer door 112, thus utilizing the heat transferred from the cooking cavity 210 to the inner door 111, achieving heat recovery and utilization. Furthermore, a fan 130, electrically connected to the power generation component 121, is installed and blows towards the outer door 112 to dissipate heat and cool the outer door 112. This increases the temperature difference between the inner door 111 and the outer door 112, thereby improving the efficiency of the power generation component 121 in generating electricity. It also mitigates the problem of excessively high temperatures on the outer door 112, thereby reducing the safety risks of the cooking device 10.
[0046] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0047] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A door body, characterized by, The door body comprises: a main body comprising an inner door and an outer door arranged in a space and having a temperature difference; and a power generation device comprising a power generation assembly arranged in the space between the inner door and the outer door, the power generation assembly comprising a hot end and a cold end connected to each other, the hot end being connected to the inner door and the cold end being connected to the outer door, the power generation assembly being configured to generate electric energy by using the temperature difference between the hot end and the cold end.
2. The door of claim 1, wherein, The power generation assembly further comprises a fan connected to the power generation assembly for supplying power to the fan, the fan having an air outlet direction towards the outer door.
3. The door of claim 2, wherein, The fan is arranged in the space between the inner door and the outer door and is connected to the main body.
4. The door of claim 3, wherein, The fan is bonded to an end surface of the outer door facing the inner door.
5. The door of claim 1, wherein, The door body further comprises a heat-conducting adhesive, which is a piece of adhesive material capable of conducting heat, the hot end being bonded to the inner door through the heat-conducting adhesive.
6. The door of claim 1, wherein, The power generation device comprises a plurality of the power generation assemblies arranged in series.
7. The door of claim 1 or 6, wherein, Each of the power generation assemblies comprises an N-type semiconductor, a P-type semiconductor and a conductive sheet, the N-type semiconductor and the P-type semiconductor being connected by the conductive sheet at one end close to the inner door to form the hot end, the conductive sheet being a piece of conductive material, the N-type semiconductor and the P-type semiconductor at the other end close to the outer door being the cold end.
8. The door of claim 7, wherein, The N-type semiconductor and the P-type semiconductor at the other end close to the outer door are respectively connected to different conductive sheets, the conductive sheets being pieces of conductive material, and the conductive sheet of one of the power generation assemblies located at the P-type semiconductor is connected in communication with the conductive sheet of an adjacent one of the power generation assemblies located at the N-type semiconductor, so that the adjacent power generation assemblies are connected in series.
9. The door of claim 8, wherein, The adjacent power generation assemblies are arranged in a space.
10. A cooking apparatus, characterized by, The door body as claimed in any one of claims 1-9 further comprises an inner container having a cooking cavity with an opening, the door body being arranged on the inner container and the inner door covering the opening of the cooking cavity.