Multistage filtering device for semiconductor cutting fluid

Abstract

The utility model relates to the field of filtering devices, in particular to a semiconductor cutting fluid multi-stage filtering device which comprises a feeding hopper, a conveying pipe, a filtering cylinder, a multi-stage filtering mechanism and a discharging pipe, a filter cartridge used for filtering impurities in cutting fluid is arranged below the feeding hopper, a conveying pipe is arranged between the filter cartridge and the feeding hopper, the filter cartridge is connected with the feeding hopper through the conveying pipe, a filter cavity is formed in the filter cartridge, and a multi-stage filter mechanism used for filtering the impurities in the cutting fluid in a multi-stage mode is arranged in the filter cavity. The multi-stage filtering mechanism comprises an arc-shaped bottom support, four groups of filter screens are linearly arranged above the arc-shaped bottom support, and a discharging pipe is arranged below the discharging barrel; according to the semiconductor cutting fluid filtering device, the four groups of filter screens are arranged, and the surfaces of the filter screens are provided with the filter holes with different sizes, so that impurities with different particle sizes in semiconductor cutting fluid can be gradually filtered out, and compared with traditional single-stage filtering, the filtering precision and effect are greatly improved, and the cutting fluid flowing back into a container is ensured to be purer.

Description

Technical Field

[0001] This utility model relates to the field of filtration devices, and more particularly to a multi-stage filtration device for semiconductor cutting fluid. Background Technology

[0002] Semiconductor cutting fluid is a key auxiliary material used in the cutting process of semiconductor manufacturing. It is mainly composed of base fluid and various additives. It has excellent cooling performance and can quickly remove the large amount of heat generated during the cutting process, preventing semiconductor materials from being damaged by high temperature. As a cooling medium, semiconductor cutting fluid can usually be recycled. During the recycling process, a filtration device is usually required to remove impurities from the semiconductor cutting fluid.

[0003] Traditional filtration devices typically use single-stage filtration when filtering impurities in semiconductor cutting fluids. Furthermore, the filtration mechanism is located inside the device, making it difficult to clean and impossible to adjust in a timely manner according to different filtration requirements.

[0004] Therefore, for the aforementioned traditional filtration devices, which are usually single-stage filters and inconvenient to clean and adjust, a multi-stage filtration device for semiconductor cutting fluid can be designed. Typically, the outer casing of the filtration device is designed to be openable, and the filtration mechanism is designed to be multi-stage pluggable, thereby easily solving the above problems. Utility Model Content

[0005] To overcome the problems of traditional filtration devices, which typically use single-stage filtration to filter impurities in semiconductor cutting fluids, and whose internal filtration mechanisms are difficult to clean and cannot be adjusted in a timely manner according to different filtration needs.

[0006] The technical solution of this utility model is as follows: a multi-stage filtration device for semiconductor cutting fluid, including a feed hopper, a conveying pipe, a filter cylinder, a multi-stage filtration mechanism, and a discharge pipe; a filter cylinder for filtering impurities in the cutting fluid is provided below the feed hopper, a conveying pipe is provided between the filter cylinder and the feed hopper, the filter cylinder and the feed hopper are connected by the conveying pipe, a filter cavity is provided inside the filter cylinder, a multi-stage filtration mechanism for filtering impurities in the cutting fluid is provided inside the filter cavity, the multi-stage filtration mechanism includes an arc-shaped base, four sets of filter screens are linearly arranged above the arc-shaped base, and a discharge pipe is provided below the discharge cylinder.

[0007] Preferably, this application combines a feed hopper, a conveying pipe, a filter cylinder, a multi-stage filtration mechanism, and a discharge pipe. During operation, the operator first places the feed hopper below the cutting fluid outlet and inserts the lower end of the discharge pipe into the return container. During operation, the cutting fluid enters the filter cylinder through the feed hopper and the conveying pipe. The multi-stage filtration mechanism inside the filter cylinder gradually filters out impurities of different particle sizes. The filtered pure cutting fluid enters the return container through the discharge pipe.

[0008] Preferably, the surface of the feed cylinder is provided with a replacement port, the inside of which is provided with a replacement cover, one side of which is provided with a rotating shaft, and the side wall of one side of the replacement port is provided with a rotating hole corresponding to the rotating shaft, both ends of the rotating shaft extending into the inside of the rotating hole, and the other side of the replacement cover is provided with a handle.

[0009] Preferably, a sealing groove is provided in the center of the replacement port, and a sealing gasket corresponding to the sealing groove is provided at the bottom of the replacement cover.

[0010] Preferably, a flow guide chamfer is provided at one end of the arc-shaped base, and four sets of filter plate slots are linearly provided at the upper end of the arc-shaped base.

[0011] Preferably, each of the four filter screens has a retaining ring at its outer end, and the lower end of the retaining ring has a fitting groove for fitting the filter plate groove. The surface of each of the four filter screens has filter holes of different sizes.

[0012] Preferably, both ends of the filter cylinder are provided with a first connecting flange plate, and the discharge pipe and the conveying pipe are provided with a second connecting flange plate corresponding to the first connecting flange plate at the end near the filter cylinder.

[0013] Preferably, the upper end of the feed hopper is provided with a hopper groove, and the bottom of the hopper groove is provided with a feed hole.

[0014] The beneficial effects of this utility model are as follows: Compared with traditional filtration devices, which are usually single-stage filtration and inconvenient to clean and adjust, this application uses four sets of filter screens, each with filter holes of different sizes on its surface. This allows for the gradual removal of impurities of different particle sizes in semiconductor cutting fluid. Compared with traditional single-stage filtration, this greatly improves the accuracy and effect of filtration, ensuring that the cutting fluid returning to the container is purer. This is beneficial to improving the quality and efficiency of semiconductor processing and reducing the adverse effects of impurity residue on the processing process and product quality. By combining the replacement port with the replacement cover, when it is necessary to clean the inside of the filter cylinder, the operator can open the replacement cover by pulling the handle to easily clean the inside of the filter cylinder, including the multi-stage filtration mechanism. Alternatively, according to actual filtration needs, filter screens of different pore sizes can be inserted into the filter plate slot through the fitting groove of the fixing ring. When replacing, simply pull the fixing ring out of the filter plate slot. Attached Figure Description

[0015] Figure 1 The diagram shown is a schematic representation of the overall structure of the filtration device of this utility model.

[0016] Figure 2 The diagram shown is a schematic representation of the filter cylinder structure of the filter device of this utility model.

[0017] Figure 3 The diagram shown is a schematic representation of the feed hopper structure of the filter device of this utility model.

[0018] Figure 4 The diagram shown is a schematic representation of the multi-stage filtration mechanism of the filtration device of this utility model.

[0019] Figure 5 The diagram shown is a schematic representation of the multi-stage filtration mechanism of the filtration device of this utility model from another angle.

[0020] Explanation of reference numerals in the attached drawings: 1. Feed hopper; 2. Conveyor pipe; 3. Filter cylinder; 4. Multi-stage filtration mechanism; 5. Replacement cover; 6. Discharge pipe; 7. First connecting flange plate; 8. Replacement port; 9. Sealing groove; 10. Rotating shaft; 11. Handle; 12. Sealing gasket; 13. Hopper trough; 14. Feed hole; 15. Second connecting flange plate; 401. Arc-shaped base; 402. Flow guide chamfer; 403. Filter plate slot; 404. Fixing ring; 405. Fitting groove; 406. Filter screen. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Please see Figures 1-5 This utility model provides an embodiment of a semiconductor cutting fluid multi-stage filtration device, including a feed hopper 1, a conveying pipe 2, a filter cylinder 3, a multi-stage filtration mechanism 4, and a discharge pipe 6; a filter cylinder 3 for filtering impurities in the cutting fluid is provided below the feed hopper 1, and a conveying pipe 2 is provided between the filter cylinder 3 and the feed hopper 1, and the filter cylinder 3 and the feed hopper 1 are connected through the conveying pipe 2; a filter cavity is provided inside the filter cylinder 3, and a multi-stage filtration mechanism 4 for multi-stage filtration of impurities in the cutting fluid is provided inside the filter cavity; the multi-stage filtration mechanism 4 includes an arc-shaped base 401, four sets of filter screens 406 are linearly arranged above the arc-shaped base 401, and a discharge pipe 6 is provided below the discharge cylinder.

[0023] Please see Figures 1-3In this embodiment, a replacement port 8 is provided on the surface of the feed cylinder, and a replacement cover 5 is provided inside the replacement port 8. A rotating shaft 10 is provided on one side of the replacement cover 5, and a rotating hole corresponding to the rotating shaft 10 is provided on the side wall of one side edge of the replacement port 8. The two ends of the rotating shaft 10 extend into the interior of the rotating hole. A handle 11 is provided on the outer end of the other side of the replacement cover 5. A sealing groove 9 is provided in the center of the replacement port 8, and a sealing gasket 12 corresponding to the sealing groove 9 is provided at the bottom of the replacement cover 5. By combining the replacement cover 5 with the replacement port 8, when it is necessary to clean the inside of the filter cylinder 3, the operator can open the replacement cover 5 through the handle 11, so that the replacement cover 5 can rotate along the rotating hole through the rotating shaft 10, and conveniently clean the inside of the filter cylinder 3, including the multi-stage filtration mechanism 4. This solves the problem that the internal filtration mechanism of traditional filtration devices is not easy to clean, extends the service life of the device, and reduces maintenance costs. By combining the sealing groove 9 and the sealing gasket 12, after the replacement cover 5 is fastened, the sealing gasket 12 can effectively seal the sealing groove 9, preventing the cutting fluid from flowing out.

[0024] Please see Figures 2-3 In this embodiment, both ends of the filter cylinder 3 are provided with first connecting flange plates 7, and the discharge pipe 6 and the conveying pipe 2 are provided with second connecting flange plates 15 corresponding to the first connecting flange plates 7 at the ends near the filter cylinder 3. The upper end of the feed hopper 1 is provided with a hopper groove 13, and the bottom of the hopper groove 13 is provided with a feed hole 14. By combining the first connecting flange plate 7 and the second connecting flange plate 15, the entire device is easy to install and disassemble, simplifying the on-site construction process. By combining the hopper groove 13 and the feed hole 14, the design of the hopper groove 13 can expand the feeding range, which is convenient for receiving the cutting fluid flowing out of the cutting fluid outlet, preventing the cutting fluid from splashing, and ensuring that the cutting fluid can smoothly enter the conveying pipe 2 through the feed hole 14.

[0025] Please see Figures 3-5 In this embodiment, a flow-guiding chamfer 402 is provided at one edge of the arc-shaped base 401, and four sets of filter plate slots 403 are linearly provided at the upper end of the arc-shaped base 401. Each of the four sets of filter screens 406 has a fixing ring 404 at its outer end, and a fitting groove 405 for fitting the filter plate slots 403 is provided at the lower end of the fixing ring 404. The surfaces of the four sets of filter screens 406 are respectively provided with filter holes of different sizes. By combining the four sets of filter plate slots 403 with the four sets of filter screens 406, impurities of different particle sizes in semiconductor cutting fluid can be filtered out step by step. Compared with traditional single-stage filtration, the filtration accuracy and effect are greatly improved, ensuring that the cutting fluid returned to the container is purer. This is beneficial to improving the quality and efficiency of semiconductor processing and reducing the adverse effects of impurity residue on the processing process and product quality.

[0026] When working, the staff first place the feed hopper 1 below the cutting fluid outlet. At this time, the trough 13 of the feed hopper 1 can effectively receive the cutting fluid. The cutting fluid flows into the conveying pipe 2 through the feed hole 14 at the bottom of the trough 13. Since the conveying pipe 2 connects the filter cylinder 3 and the feed hopper 1, the cutting fluid enters the filter chamber inside the filter cylinder 3 through the conveying pipe 2.

[0027] Next, the multi-stage filtration mechanism 4 starts to work. The guide chamfer 402 at one end of the arc-shaped base 401 helps the cutting fluid to flow more smoothly when entering the multi-stage filtration mechanism 4. The cutting fluid flows through four sets of filter screens 406 arranged linearly above the arc-shaped base 401. Since the filter pore size of each set of filter screens 406 is different, impurities in the cutting fluid will be intercepted by different filter screens 406 in turn according to the particle size.

[0028] For example, larger particles of impurities are first intercepted by the filter screen 406 with larger pores. As the cutting fluid continues to flow, smaller particles of impurities are filtered out by the subsequent filter screen 406 with smaller pores, thus achieving multi-stage filtration of impurities of different particle sizes in the cutting fluid.

[0029] According to actual filtration needs, the staff can insert the filter screens 406 with different pore sizes into the filter plate slot 403 through the fitting groove 405 of the fixing ring 404. After multi-stage filtration, the pure cutting fluid flows out from the filter cylinder 3 and enters the return container through the discharge pipe 6, completing the entire filtration process.

[0030] When it is necessary to clean the inside of the filter cartridge 3 or adjust the multi-stage filtration mechanism 4 according to different filtration needs, the staff can open the replacement cover 5 from the replacement port 8 to operate inside.

[0031] Through the above steps, this application combines a feed hopper 1, a conveying pipe 2, a filter cylinder 3, a multi-stage filtration mechanism 4, and a discharge pipe 6. During operation, the operator first places the feed hopper 1 below the cutting fluid outlet and inserts the lower end of the discharge pipe 6 into the return container. During operation, the cutting fluid passes through the feed hopper 1 and the conveying pipe 2 into the filter cylinder 3. The multi-stage filtration mechanism 4 inside the filter cylinder 3 gradually filters out impurities of different particle sizes. The filtered pure cutting fluid enters the return container through the discharge pipe 6, greatly improving the filtration accuracy and effect, ensuring that the cutting fluid returning to the container is purer, which is beneficial to improving the quality and efficiency of semiconductor processing.

Claims

1. A multi-stage filtering device for semiconductor cutting fluid, comprising a feeding hopper (1); characterized in that: It also includes the feed pipe (2), filter cartridge (3), multi-stage filtering mechanism (4) and discharge pipe (6); the lower part of the feed hopper (1) is provided with a filter cartridge (3) for filtering impurities in cutting fluid, a feed pipe (2) is arranged between the filter cartridge (3) and the feed hopper (1), the filter cartridge (3) and the feed hopper (1) are connected through the feed pipe (2), a filter cavity is formed in the filter cartridge (3), a multi-stage filtering mechanism (4) for filtering impurities in cutting fluid is arranged in the filter cavity, the multi-stage filtering mechanism (4) includes an arc-shaped bottom support (401), four groups of filter screens (406) are linearly arranged above the arc-shaped bottom support (401), and a discharge pipe (6) is arranged below the discharge cylinder.

2. The multi-stage filtration apparatus for semiconductor cutting fluid according to claim 1, wherein: A replacement opening (8) is formed in the surface of the feed cylinder, a replacement cover (5) is arranged in the replacement opening (8), a rotating shaft (10) is arranged on one side of the replacement cover (5), a rotating hole corresponding to the rotating shaft (10) is formed in the side wall of one side edge of the replacement opening (8), both ends of the rotating shaft (10) extend into the rotating hole, and a handle (11) is arranged on the other side of the replacement cover (5).

3. The multi-stage filtration apparatus for semiconductor cutting fluid according to claim 2, wherein: A sealing groove (9) is formed in the center of the replacement opening (8), and a sealing gasket (12) corresponding to the sealing groove (9) is arranged on the bottom of the replacement cover (5).

4. The multi-stage filtration apparatus for semiconductor cutting fluid according to claim 1, wherein: A flow guide chamfer (402) is formed in the edge of one end of the arc-shaped bottom support (401), and four groups of filter plate clamping grooves (403) are linearly formed in the upper end of the arc-shaped bottom support (401).

5. The multi-stage filtration apparatus for semiconductor cutting fluid according to claim 4, wherein: The outer ends of the four groups of filter screens (406) are provided with fixed clamping rings (404), the lower ends of the fixed clamping rings (404) are provided with abutting grooves (405) abutting the filter plate clamping grooves (403), and the surfaces of the four groups of filter screens (406) are respectively provided with filter holes of different sizes.

6. The multi-stage filtration apparatus for semiconductor cutting fluid according to claim 1, wherein: The two ends of the filter cartridge (3) are provided with first connecting flange plates (7), and the one end of the discharge pipe (6) and the feed pipe (2) close to the filter cartridge (3) is provided with a second connecting flange plate (15) corresponding to the first connecting flange plate (7).

7. The multi-stage filtration apparatus for semiconductor cutting fluid according to claim 1, wherein: The upper end of the feed hopper (1) is provided with a hopper groove (13), and the bottom of the hopper groove (13) is provided with a feed hole (14).

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