Heating film welding spot packaging double-plate multi-layer laminating device

Abstract

The utility model relates to the technical field of heating film processing, and discloses a heating film welding spot packaging double-plate multi-layer laminating device which comprises a machine body, laminating mechanisms symmetrically arranged on the two sides of the machine body and a lifting mechanism arranged on the machine body and used for driving the laminating mechanisms to ascend and descend. The overlying mechanism comprises a top plate and a plurality of overlying plates located between the top plate and the machine body, and overlying gaps can be formed between the top plate and the adjacent overlying plates and between the adjacent overlying plates; the utility model has the effect of improving the processing efficiency.

Description

Technical Field

[0001] This utility model relates to the field of drilling technology, and in particular to a heating film solder joint encapsulation double-board multilayer stacking device. Background Technology

[0002] PI heating film is made by heat-sealing polyimide film as the outer insulator and metal foil or wire as the inner conductive heating element under high temperature and pressure. Polyimide film heating film has excellent insulation strength, excellent dielectric strength, excellent thermal conductivity, and excellent resistance stability, which makes it widely applicable in heating fields and capable of achieving a high degree of temperature control accuracy.

[0003] In the process of manufacturing PI heating plates, the heating film solder joints at both ends of the heating plate need to be laminated and encapsulated. Existing lamination equipment can usually only encapsulate both ends of a heating plate at a time, resulting in low processing efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a heating film solder joint encapsulation double-board multilayer stacking device, which improves processing efficiency.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: including a body, a stacking mechanism symmetrically arranged on both sides of the body, and a lifting mechanism arranged on the body for driving the stacking mechanism to rise and fall. The stacking mechanism includes a top plate and a plurality of stacking plates located between the top plate and the body. Stacking gaps can be formed between the top plate and adjacent stacking plates as well as between adjacent stacking plates.

[0006] A further feature of this invention is that the lifting mechanism includes a driving cylinder vertically disposed at the bottom of the machine body and a push rod disposed at the output end of the driving cylinder. The push rod moves sequentially through the machine body and the stacking plates. The top of the push rod is fixedly connected to the top plate. The top plate can sequentially push several stacking plates to rise and fall. A first connecting member is disposed between the two sides of the top plate and the adjacent stacking plates. A second connecting member is disposed between the adjacent stacking plates. A third connecting member is disposed between the stacking plates and the machine body.

[0007] The present invention is further configured as follows: the first connecting member includes a first connecting rod horizontally disposed on one side of the top plate and a first connecting block in the shape of a racetrack; the second connecting member includes a second connecting rod horizontally disposed on one side of the stacked plate and a second connecting block in the shape of a racetrack sleeved between adjacent second connecting rods; the first connecting block is sleeved between the first connecting rod and the second connecting rod adjacent to the first connecting rod; the third connecting member includes a third connecting rod horizontally disposed on one side of the body and a third connecting block in the shape of a racetrack; the third connecting block is sleeved between the third connecting rod and the second connecting rod adjacent to the third connecting rod.

[0008] A further configuration of this utility model is as follows: the second connecting rod is located directly below the first connecting rod, the third connecting rod is located directly below the second connecting rod, and the first connecting block, the second connecting block, and the third connecting block are arranged alternately in sequence.

[0009] A further feature of this invention is that the number of lifting mechanisms located on one side of the machine body is two, and the two push rods located on one side of the machine body are symmetrically arranged at both ends of the top plate.

[0010] A further feature of this invention is that the number of the first connector, the second connector, and the third connector located on one side of the body is two; the two first connectors are symmetrically arranged on both sides of the top plate; the two second connectors are symmetrically arranged on both sides of the stacked plate; and the two third connectors are symmetrically arranged on both sides of the body.

[0011] A further feature of this invention is that the end of the first connecting rod is threadedly connected to a first limiting block, and the first limiting block can abut against the first connecting block.

[0012] A further feature of this invention is that the end of the second connecting rod is threadedly connected to a second limiting block, which can abut against the second connecting block.

[0013] A further feature of this invention is that a third limiting block is threadedly connected to the end of the third connecting rod, and the third limiting block can abut against the third connecting block.

[0014] A further feature of this invention is that guide rods are symmetrically arranged on both sides of the machine body along the vertical direction, the guide rods are located between two adjacent push rods, and the guide rods movably pass through the adjacent top plate and the stacking plate.

[0015] The beneficial effects of this utility model are:

[0016] 1. By setting up a top plate, stacking plates, and a lifting mechanism, when it is necessary to encapsulate the heating film solder joints at both ends of the heating plate, the top plate and multiple stacking plates are first driven to rise by the lifting mechanism, so that there is a certain gap between the top plate and the stacking plates and between the stacking plates. Then, multiple heating plates are placed on the stacking plates on both sides at the same horizontal plane. After that, the top plate and stacking plates are driven to fall by the lifting mechanism, so that a stacking gap is formed between the top plate and the stacking plates and between the stacking plates, and the two ends of the heating plate are stacked and encapsulated. Then, the top plate and stacking plates are driven to rise again, and the encapsulated heating plates at both ends can be removed. Therefore, by setting up a top plate and multiple stacking plates, the two ends of multiple heating plates can be encapsulated at the same time, which greatly improves the processing efficiency.

[0017] 2. By setting up a first connecting block, a second connecting block, etc., when the driving cylinder drives the push rod and the top plate to rise, the top plate drives the second connecting rod and the stacked plate to rise through the first connecting rod and the first connecting block. Then, the stacked plates drive the remaining stacked plates to rise in sequence through the second connecting rod and the second connecting block, thereby realizing the sequential rise of the top plate and multiple stacked plates. When the driving cylinder drives the push rod and the top plate to fall, the top plate can directly push the adjacent stacked plates to fall. Then, the adjacent stacked plates push each other to fall in sequence until they contact the heating plate on the stacked plates and apply pressure to the heating plate for stacking. During this process, the first connecting rod slides along the first connecting block, and the second connecting rod slides along the second connecting block. Therefore, by setting up the first connecting block and the second connecting block, the top plate drives the stacked plates to rise and fall, which is simple in structure and convenient in operation.

[0018] 3. By setting a first limit block, a second limit block, and a third limit block, the first limit block, the second limit block, and the third limit block can limit the first connecting block, the second connecting block, and the third connecting block, preventing them from separating from the first connecting rod, the second connecting rod, and the third connecting rod during the lifting process, thus improving the stability of the device. At the same time, the first limit block, the second limit block, and the third limit block are threadedly connected to the first connecting rod, the second connecting rod, and the third connecting rod, respectively, thereby improving the ease of installation. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of an embodiment of a heating film solder joint encapsulation double-board multilayer stacking device of this utility model;

[0021] Figure 2 yes Figure 1 Enlarged diagram of A in the middle;

[0022] Figure 3 yes Figure 1 Enlarged diagram of B in the diagram.

[0023] In the diagram, 1. Body; 2. Stacking mechanism; 2a. Top plate; 2b. Stacking plate; 3. Lifting mechanism; 3a. Drive cylinder; 3b. Push rod; 4. Stacking gap; 5. First connecting piece; 5a. First connecting rod; 5b. First connecting block; 6. Second connecting piece; 6a. Second connecting rod; 6b. Second connecting block; 7. Third connecting piece; 7a. Third connecting rod; 7b. Third connecting block; 8. First limiting block; 9. Second limiting block; 10. Third limiting block; 11. Guide rod. Detailed Implementation

[0024] The technical solution of this utility model will now be clearly and completely described with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0025] This utility model provides a heating film solder joint encapsulation double-board multilayer stacking device, such as... Figures 1 to 3 As shown, it includes a body 1, a stacking mechanism 2 symmetrically arranged on both sides of the body 1, and a lifting mechanism 3 arranged on the body 1 for driving the stacking mechanism 2 to rise and fall. The stacking mechanism 2 includes a top plate 2a and a plurality of stacking plates 2b located between the top plate 2a and the body 1. Stacking gaps 4 can be formed between the top plate 2a and adjacent stacking plates 2b as well as between adjacent stacking plates 2b.

[0026] Furthermore, the lifting mechanism 3 includes a drive cylinder 3a vertically disposed at the bottom of the body 1 and a push rod 3b disposed at the output end of the drive cylinder 3a. The push rod 3b moves sequentially through the body 1 and the stacking plate 2b. The top of the push rod 3b is fixedly connected to the top plate 2a. The top plate 2a can sequentially push several stacking plates 2b to rise and fall. A first connecting member 5 is disposed between the two sides of the top plate 2a and the adjacent stacking plate 2b. A second connecting member 6 is disposed between the adjacent stacking plates 2b. A third connecting member 7 is disposed between the stacking plate 2b and the body 1.

[0027] Furthermore, the first connecting member 5 includes a first connecting rod 5a horizontally disposed on one side of the top plate 2a and a first connecting block 5b in the shape of a racetrack. The second connecting member 6 includes a second connecting rod 6a horizontally disposed on one side of the stacked plate 2b and a second connecting block 6b in the shape of a racetrack sleeved between adjacent second connecting rods 6a. The first connecting block 5b is sleeved between the first connecting rod 5a and the second connecting rod 6a adjacent to the first connecting rod 5a. The third connecting member 7 includes a third connecting rod 7a horizontally disposed on one side of the body 1 and a third connecting block 7b in the shape of a racetrack. The third connecting block 7b is sleeved between the third connecting rod 7a and the second connecting rod 6a adjacent to the third connecting rod 7a.

[0028] Furthermore, the second connecting rod 6a is located directly below the first connecting rod 5a, and the third connecting rod 7a is located directly below the second connecting rod 6a. The first connecting block 5b, the second connecting block 6b, and the third connecting block 7b are arranged alternately in sequence.

[0029] Furthermore, there are two lifting mechanisms 3 located on one side of the body 1, and two push rods 3b located on one side of the body 1 are symmetrically arranged at both ends of the top plate 2a.

[0030] Furthermore, the number of the first connector 5, the second connector 6, and the third connector 7 located on one side of the body 1 are all 2. The two first connectors 5 are symmetrically arranged on both sides of the top plate 2a, the two second connectors 6 are symmetrically arranged on both sides of the stacked plate 2b, and the two third connectors 7 are symmetrically arranged on both sides of the body 1.

[0031] Furthermore, the end of the first connecting rod 5a is threadedly connected to a first limiting block 8, which can abut against the first connecting block 5b.

[0032] Furthermore, the end of the second connecting rod 6a is threadedly connected to a second limiting block 9, which can abut against the second connecting block 6b.

[0033] Furthermore, the end of the third connecting rod 7a is threadedly connected to a third limiting block 10, which can abut against the third connecting block 7b.

[0034] Furthermore, guide rods 11 are symmetrically arranged on both sides of the body 1 along the vertical direction. The guide rods 11 are located between two adjacent push rods 3b and move through the adjacent top plate 2a and the stacking plate 2b.

[0035] When it is necessary to encapsulate the heating film solder joints at both ends of the heating plate, firstly, the drive cylinder 3a is opened to drive the top plate 2a and the push rod 3b to rise. The top plate 2a drives the second connecting rod 6a and the stacked plate 2b to rise through the first connecting rod 5a and the first connecting block 5b. The stacked plate 2b then drives the remaining stacked plates 2b to rise through the second connecting rod 6a and the second connecting block 6b in sequence until there is a certain gap between the top plate 2a and the stacked plates 2b, and between the stacked plates 2b. Then, multiple heating plates are placed on the stacked plates 2b on both sides that are on the same horizontal plane. After that, the drive cylinder 3a drives the push rod 3b and the top plate 2a to descend. The adjacent stacked plates 2b can be directly pushed down, and then the adjacent stacked plates 2b are pushed down in sequence until they contact the heating plate on the stacked plate 2b. The top plate 2a and the stacked plates 2b form a stacking gap 4, which applies pressure to the heating plate for stacking, thereby achieving stacking and sealing of both ends of the heating plate. Then, the drive cylinder 3a is opened again to drive the top plate 2a, the push rod 3b and the stacked plates 2b to rise, and the heating plate with both ends sealed can be taken out. Therefore, by setting the top plate 2a and multiple stacked plates 2b, the ends of multiple heating plates can be sealed at one time, which greatly improves the processing efficiency.

[0036] By setting up a first connecting block 5b, a second connecting block 6b, etc., when the driving cylinder 3a drives the push rod 3b and the top plate 2a to rise, the top plate 2a drives the second connecting rod 6a and the stacked plate 2b to rise through the first connecting rod 5a and the first connecting block 5b. Then, the stacked plate 2b drives the remaining stacked plates 2b to rise in sequence through the second connecting rod 6a and the second connecting block 6b, thereby realizing the sequential rise of the top plate 2a and multiple stacked plates 2b. When the driving cylinder 3a drives the push rod 3b and the top plate 2a to fall, the top plate 2a can directly push the adjacent stacked plates 2b to fall. Then, the adjacent stacked plates 2b push each other to fall in sequence until they contact the heating plate on the stacked plate 2b and apply pressure to the heating plate for stacking. During this process, the first connecting rod 5a slides along the first connecting block 5b, and the second connecting rod 6a slides along the second connecting block 6b. Therefore, by setting up the first connecting block 5b and the second connecting block 6b, the top plate 2a drives the stacked plates 2b to rise and fall, which is simple in structure and convenient in operation.

[0037] By symmetrically arranging two lifting mechanisms 3 on one side of the body 1, the two push rods 3b simultaneously push the two ends of the top plate 2a to lift and lower, thereby improving the stability of the lifting and lowering process of the top plate 2a, and at the same time making the force more uniform when the heating plates are stacked.

[0038] By symmetrically arranging two first connecting parts 5, second connecting parts 6 and third connecting parts 7 on one side of the body 1, the connection between the top plate 2a and the stacking plate 2b and the stacking plate 2b and the body 1 is increased, making the lifting process of the top plate 2a and the stacking plate 2b more stable.

[0039] By setting a first limiting block 8, a second limiting block 9, and a third limiting block 10, the first limiting block 8, the second limiting block 9, and the third limiting block 10 can limit the first connecting block 5b, the second connecting block 6b, and the third connecting block 7b, preventing them from separating from the first connecting rod 5a, the second connecting rod 6a, and the third connecting rod 7a during the lifting process, thus improving the stability of the device. At the same time, the first limiting block 8, the second limiting block 9, and the third limiting block 10 are threadedly connected to the first connecting rod 5a, the second connecting rod 6a, and the third connecting rod 7a, respectively, thereby improving the ease of installation.

[0040] By setting guide rod 11, the lifting and lowering of the top plate 2a and the stacked plate 2b are guided, making the lifting and lowering process of the top plate 2a and the stacked plate 2b more stable.

[0041] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0042] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A heating film solder joint encapsulation double-board multilayer stacking device, characterized in that: The machine body (1), the stacking mechanism (2) symmetrically arranged on both sides of the machine body (1), and the lifting mechanism (3) arranged on the machine body (1) for driving the stacking mechanism (2) to lift, the stacking mechanism (2) includes a top plate (2a) and a plurality of stacking plates (2b) between the top plate (2a) and the machine body (1), the top plate (2a) and the adjacent stacking plate (2b) and the adjacent stacking plate (2b) can form a stacking gap (4).

2. The heating film solder joint encapsulation double-plate multi-layer lamination device according to claim 1, characterized in that: The lifting mechanism (3) includes a drive cylinder (3a) vertically arranged at the bottom of the machine body (1) and a push rod (3b) arranged at the output end of the drive cylinder (3a), the push rod (3b) sequentially passes through the machine body (1) and the stacking plate (2b), the top of the push rod (3b) is fixedly connected with the top plate (2a), the top plate (2a) can sequentially push a plurality of stacking plates (2b) to lift, the first connecting piece (5) is arranged between the two sides of the top plate (2a) and the adjacent stacking plate (2b), the second connecting piece (6) is arranged between the adjacent stacking plates (2b), and the third connecting piece (7) is arranged between the stacking plate (2b) and the machine body (1).

3. The double board multi-layer laminating device for heating film welding point packaging according to claim 2, characterized in that: The first connecting piece (5) includes a first connecting rod (5a) horizontally arranged on one side of the top plate (2a) and a runway-shaped first connecting block (5b), the second connecting piece (6) includes a second connecting rod (6a) horizontally arranged on one side of the stacking plate (2b) and a runway-shaped second connecting block (6b) sleeved between the adjacent second connecting rods (6a), the first connecting block (5b) is sleeved between the first connecting rod (5a) and the second connecting rod (6a) adjacent to the first connecting rod (5a), and the third connecting piece (7) includes a third connecting rod (7a) horizontally arranged on one side of the machine body (1) and a runway-shaped third connecting block (7b), the third connecting block (7b) is sleeved between the third connecting rod (7a) and the second connecting rod (6a) adjacent to the third connecting rod (7a).

4. The double board multi-layer laminating device for heating film welding point packaging according to claim 3, characterized in that: The second connecting rod (6a) is located directly below the first connecting rod (5a), the third connecting rod (7a) is located directly below the second connecting rod (6a), and the first connecting block (5b), the second connecting block (6b) and the third connecting block (7b) are sequentially staggered.

5. The heating film solder joint encapsulation double-plate multi-layer lamination device according to claim 3, characterized in that: The number of the lifting mechanism (3) on one side of the machine body (1) is 2, and the two push rods (3b) on one side of the machine body (1) are symmetrically arranged at the two ends of the top plate (2a).

6. The heating film solder joint encapsulation double board multi-layer lamination device according to claim 3, characterized in that: The first connecting piece (5), the second connecting piece (6) and the third connecting piece (7) are arranged on one side of the machine body (1), and the number of each of the first connecting piece (5), the second connecting piece (6) and the third connecting piece (7) is two, two first connecting pieces (5) are symmetrically arranged on both sides of the top plate (2a), two second connecting pieces (6) are symmetrically arranged on both sides of the laminated plate (2b), and two third connecting pieces (7) are symmetrically arranged on both sides of the machine body (1).

7. The heating film solder joint encapsulation double board multi-layer lamination device according to claim 3, characterized in that: The end of the first connecting rod (5a) is threadedly connected with a first limiting block (8), and the first limiting block (8) can abut against the first connecting block (5b).

8. The heating film solder joint encapsulation double-plate multi-layer lamination device according to claim 7, characterized in that: The end of the second connecting rod (6a) is threadedly connected with a second limiting block (9), and the second limiting block (9) can abut against the second connecting block (6b).

9. The heating film solder joint encapsulation double board multi-layer lamination device according to claim 8, characterized in that: The end of the third connecting rod (7a) is threadedly connected with a third limiting block (10), and the third limiting block (10) can abut against the third connecting block (7b).

10. The heating film solder joint encapsulation double board multi-layer lamination device according to claim 5, characterized in that: The machine body (1) is symmetrically provided with guide rods (11) in the vertical direction on both sides, the guide rods (11) are located between adjacent two push rods (3b), and the guide rods (11) movably pass through adjacent top plates (2a) and laminated plates (2b).

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