Temperature and pressure sensing device
By incorporating a shielding unit and conductive components into the temperature and pressure sensor, the problem of parasitic capacitance in the measurement of conductive media is solved, enabling accurate pressure and temperature measurement of conductive media.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2026-03-06
AI Technical Summary
Existing capacitive temperature and pressure sensors are prone to forming parasitic capacitance when measuring conductive media such as water, which affects measurement accuracy.
By setting shielding units and conductive components on the core of the pressure capacitor to cover the pressure area, a shielding cover is formed, which prevents the conductive medium from forming parasitic capacitance with the core of the pressure capacitor, thereby improving measurement accuracy.
Even when measuring conductive media, it can accurately measure pressure and temperature, avoiding the influence of parasitic capacitance on the measurement and improving measurement accuracy.
Smart Images
Figure CN223976682U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of sensing device technology, specifically to a temperature and pressure sensing device. Background Technology
[0002] Sensor technology is a crucial technology in modern measurement and automation systems. From process control in production to modern technological living, almost every technology relies on sensors. Temperature and pressure sensors are two of the most widely used sensors in the industry, often used together, especially in situations where multiple temperature and pressure measurements are required. Using temperature and pressure sensors separately would complicate the system and increase costs. Temperature and pressure sensors, however, can simultaneously measure both temperature and pressure, making them integrated sensors that effectively solve these problems.
[0003] Existing temperature and pressure sensors are mainly capacitive temperature and pressure sensors. Their main structure includes a housing and, from bottom to top, a temperature sensing element, a capacitor element, a flexible circuit board, and electrical connectors. The temperature sensing element measures the temperature. The capacitor core consists of two plates, a substrate and a thin film. Electrode patterns are printed on the inner sides of both the substrate and the thin film, thus generating a certain initial capacitance value. When the medium pressure acts on the thin film, it causes the thin film to deform, changing the distance between the substrate and the thin film, causing a change in capacitance. This change in capacitance causes a change in the output voltage, thereby detecting the medium pressure. One end of the flexible circuit board is coupled to the ceramic capacitor core to process and convert the pressure signal, while the other end is coupled to the electrical connectors to output pressure and temperature signals.
[0004] Because the parasitic capacitance generated by conductive media such as water and the ceramic core couples with the initial capacitance of the capacitor element, affecting the initial capacitance of the capacitor element itself, and because the more conductive media such as water enters the internal cavity of the temperature and pressure sensor, the larger its area relative to the internal plates of the capacitor element becomes, further increasing the parasitic capacitance. This leads to inaccurate pressure measurement accuracy of conductive liquids such as water by the capacitive temperature and pressure sensor, resulting in deviations in the output signal. Therefore, existing capacitive temperature and pressure sensors are difficult to use directly for measuring conductive media such as water. Utility Model Content
[0005] The purpose of this invention is to overcome the above-mentioned technical deficiencies and propose a temperature and pressure sensing device that solves the technical problem that existing temperature and pressure sensing devices are prone to forming parasitic capacitance during the measurement of conductive media such as water, which affects the measurement accuracy of conductive media such as water.
[0006] To achieve the above-mentioned technical objectives, the present invention adopts the following technical solution:
[0007] This utility model provides a temperature and pressure sensing device, comprising:
[0008] case;
[0009] A temperature sensing element is installed in the housing;
[0010] A pressure capacitor core is installed in the housing and abuts against the temperature sensing element. The pressure capacitor core has a pressure-bearing area that can withstand the pressure of the medium.
[0011] A shielding unit is disposed on the pressure capacitor core and covers the pressure-bearing area; and
[0012] A conductive element connects the shielding unit and the housing.
[0013] In some embodiments, the shielding unit includes a shielding electrode disposed on the pressure capacitor core, the electrode pattern of the shielding electrode covering the pressure area.
[0014] In some embodiments, the shielding electrode includes a shielding portion and a connecting portion, the shielding portion covering the pressure-bearing area, the connecting portion being connected to the edge of the shielding portion, and the conductive element being connected to the connecting portion.
[0015] In some embodiments, the shielding electrode is a gold paste printed electrode or a silver paste printed electrode.
[0016] In some embodiments, the temperature sensing element is disposed on the side of the pressure capacitor core near the pressure area, and the temperature sensing element is provided with a protective channel through which the conductive element passes.
[0017] In some embodiments, the temperature sensing element has a protective portion, the two ends of which are respectively attached to the inner wall of the pressure capacitor core and the mounting cavity, and the protective channel is disposed in the protective portion.
[0018] In some embodiments, the conductive element is a spring element, and the two ends of the spring element abut against the shielding unit and the inner wall of the mounting cavity, respectively.
[0019] In some embodiments, the temperature and pressure sensing device further includes a first sealing ring located on the side of the conductive element near the pressure area and disposed between the pressure capacitor core and the temperature sensing element.
[0020] In some embodiments, the temperature and pressure sensing device further includes a second sealing ring located on the side of the conductive element near the pressure area and disposed between the temperature sensing element and the housing.
[0021] In some embodiments, the housing has an insertion limiting member, the pressure capacitor core is provided with a first limiting groove, the temperature sensing element is provided with a second limiting groove that mates with the first limiting groove, and the insertion limiting member is inserted into the first limiting groove and the second limiting groove.
[0022] Compared with existing technologies, the temperature and pressure sensing device provided by this utility model integrates a housing, a temperature sensing element, a pressure capacitor core, a shielding unit, and a conductive component. The housing has a mounting cavity in which both the pressure capacitor core and the temperature sensing element are installed. The pressure capacitor core has a pressure-bearing area, where the medium contacts and exerts pressure. The pressure capacitor core measures the pressure of the medium by sensing this pressure. The temperature sensing element measures the temperature of the medium by sensing its temperature. Therefore, the measurement functions of medium pressure and temperature are integrated into one device. Furthermore, the shielding unit and conductive component effectively shield the pressure capacitor core by covering the pressure-bearing area and connecting the conductive component to the shielding unit and the housing. This prevents the formation of parasitic capacitance between the conductive medium and the pressure capacitor core. Therefore, even if the medium being measured is conductive, it will not affect the pressure measurement of the medium pressure by the pressure capacitor core, thus improving the measurement accuracy of the conductive medium pressure. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the structure of the temperature and pressure sensing device provided in this embodiment of the utility model;
[0024] Figure 2 This is a front view of the temperature and pressure sensing device provided in this embodiment of the utility model;
[0025] Figure 3 It is along Figure 2 Sectional view along line AA in the middle.
[0026] Figure 4 This is an exploded view of the temperature and pressure sensing device provided in this embodiment of the present invention;
[0027] Figure 5 This is a bottom view of the pressure capacitor core of the temperature and pressure sensing device provided in this embodiment of the utility model;
[0028] Figure 6 This is a schematic diagram of the structure of the temperature sensing element of the temperature and pressure sensing device provided in this embodiment of the present invention.
[0029] Labels for each item in the figure:
[0030] 10—Housing shell 11—Mounting cavity 12—Mounting shell
[0031] 13—Electrical connector; 14—Insertion limiting component; 15—First annular mounting groove
[0032] 20—Temperature sensing element; 21—Temperature sensing chip; 22—Lead wire
[0033] 23—Package 24—Protective Passage 25—Protective Section
[0034] 26—Second limiting groove; 27—Second annular mounting groove; 30—Pressure capacitor core.
[0035] 31—Pressure zone; 32—First limiting groove; 40—Shielding unit
[0036] 41—Shielding electrode; 50—Conductive component; 60—Flexible circuit board
[0037] 70—First sealing ring; 80—Second sealing ring; 141—Clamping hole
[0038] 231—Medium Channel; 261—Snap-fit Protrusion; 411—Shielding Section
[0039] 412—Connecting part. Detailed Implementation
[0040] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.
[0041] To address the technical problem in existing technologies where conductive media easily form parasitic capacitance with the pressure capacitor core of temperature and pressure sensors, affecting the pressure signal output and thus making it difficult for temperature and pressure sensing devices to accurately measure the pressure of conductive media such as water, this utility model provides a temperature and pressure sensing device that shields the pressure capacitor core, thereby preventing the conductive media from forming capacitance with the pressure capacitor core and affecting the output of the medium pressure, thus improving the measurement accuracy of the medium pressure.
[0042] This utility model provides a temperature and pressure sensing device, such as Figure 1-4 As shown, the device includes a housing 10, a temperature sensing element 20, a pressure capacitor core 30, a shielding unit 40, and a conductive element 50. The temperature sensing element 20 and the pressure capacitor core 30 are mounted on the housing 10, with the pressure capacitor core 30 abutting against the temperature sensing element 20. The pressure capacitor core 30 has a pressure-bearing area 31 that withstands the pressure of the medium. The shielding unit 40 is disposed on the pressure capacitor core 30 and covers the pressure-bearing area 31. The conductive element 50 connects the shielding unit 40 and the housing 10.
[0043] Specifically, the temperature and pressure sensing device comprises a housing 10, a temperature sensing element 20, a pressure capacitor core 30, a shielding unit 40, and a conductive element 50. Both the pressure capacitor core 30 and the temperature sensing element 20 are mounted on the housing 10. The pressure capacitor core 30 has a pressure-receiving area 31. The medium contacts the pressure-receiving area 31 and forms pressure acting on it. The pressure capacitor core 30 measures the medium pressure by sensing this pressure. The temperature sensing element 20 measures the medium temperature by sensing the medium temperature. Therefore, the pressure and temperature measurement functions of the medium are integrated into one device. The device is also equipped with a shielding unit 40 and a conductive element 50. By covering the pressure area 31 with the shielding unit 40 and connecting the conductive element 50 with the shielding unit 40 and the housing 10, the shielding unit 40, the conductive element 50 and the housing 10 are combined to form a shielding cover covering the pressure area 31 of the pressure capacitor core 30. This effectively shields the pressure capacitor core 30, thereby preventing the formation of parasitic capacitance between the conductive medium and the pressure capacitor core 30. Therefore, even if the medium to be measured is a conductive medium, it will not affect the measurement of the pressure of the medium by the pressure capacitor core 30, thereby improving the measurement accuracy of the conductive medium pressure.
[0044] In this embodiment, the medium to be measured includes conductive and non-conductive media. The non-conductive medium can be any fluid that does not have conductive function. When measuring the temperature and pressure of the non-conductive medium, the non-conductive medium is not charged and will not couple with the pressure capacitor core 30. The conductive medium is mainly water. When measuring the temperature and pressure of conductive media such as water, the charge of the conductive medium such as water is introduced into the grounded shell 10 through the shielding electrode 41 and the conductive spring, thereby avoiding the change of the electric field of the capacitor itself caused by the external conductive medium. Therefore, under the shielding effect of the shielding unit 40, the conductive component 50 and the shell 10, it will not couple with the pressure capacitor core 30 to form a parasitic capacitance.
[0045] In this embodiment, the housing 10 is provided with a mounting cavity 11, and all electrical components are installed in the mounting cavity 11.
[0046] In this embodiment, as Figure 1-4 As shown, the housing 10 includes a mounting shell 12 and an electrical connector 13. The mounting shell 12 is a metal housing 10 with a threaded end for connection to an external thread and an open cavity at the other end for mounting various components. The electrical connector 13 is installed in the opening of the mounting shell 12 and surrounds the mounting shell 12 to form a mounting cavity 11. The electrical connector 13 is connected to the outside to output the measured medium temperature signal and pressure signal.
[0047] Understandably, the temperature sensing element 20 can be fixed at any point within the mounting cavity 11, as long as it can contact the medium to be measured and measure the temperature of the medium.
[0048] In one embodiment, such as Figure 3-4 As shown, the temperature sensing element 20 is disposed on the side of the pressure capacitor core 30 near the pressure area 31.
[0049] In this embodiment, as Figure 3-4 As shown, the temperature sensing element 20 includes a temperature sensing chip 21, a lead wire 22, and a housing 23. The housing 23 has a "T"-shaped stepped shaft structure, including a large end and a small end. The large end is installed in the mounting cavity 11 and located on the side of the pressure capacitor core 30 near the pressure area 31. The small end is connected to the large end and extends out of the mounting shell 12. The temperature sensing chip 21 is disposed in the small end. The housing 23 is made of high-temperature resistant thermally conductive material. The lead wire 22 is connected to the temperature sensing chip 21 and passes out from the large end to transmit the temperature signal. The small end, through contact with the medium, can transmit the temperature signal of the medium to the temperature sensing chip 21. The temperature sensing chip 21 converts the temperature signal into an electrical signal and then outputs it through the lead wire 22.
[0050] Understandably, the medium can enter the mounting cavity 11 and come into contact with the pressure area 31 through the connecting holes and other structures on the housing 10.
[0051] In one embodiment, such as Figure 3-4 As shown, the package 23 has a through medium channel 231, through which the medium to be tested can enter the mounting cavity 11 and come into contact with the pressure area 31.
[0052] In one embodiment, such as Figure 3-5 As shown, the temperature sensing element 20 is provided with a protective channel 24, through which the conductive element 50 passes. Specifically, the protective channel 24 provides protection and restraint for the conductive element 50, thereby providing a stable shielding ring structure and improving the stability of the pressure capacitor core 30.
[0053] In one embodiment, such as Figure 3-5 As shown, the temperature sensing element 20 has a protective portion 25, with both ends of the protective portion 25 respectively attached to the inner walls of the pressure capacitor core 30 and the mounting cavity 11. A protective channel 24 is disposed in the protective portion 25. Specifically, by attaching both ends of the protective portion 25 to the inner walls of the pressure capacitor core 30 and the mounting cavity 11, the protective channel 24 forms a sealed cavity structure, thereby isolating the conductive element 50 from the outside and preventing contact with conductive external media. This allows the conductive element 50 to form a stable shielding ring structure, ensuring the stability and reliability of the pressure capacitor core 30.
[0054] In this embodiment, as Figure 3-5 As shown, the protective channel 24 and the protective part 25 are located at the large end of the package 23.
[0055] In this embodiment, the pressure capacitor core 30 is a high-ceramic capacitive pressure sensor. The ceramic pressure capacitor core 30 consists of a non-conductive insulating medium and two plates. Electrode patterns are printed on the inner side of the two plates. The non-conductive insulating medium is disposed between the two plates. Through the coupling of the two electrode patterns, a certain initial capacitance value can be generated. The pressure-bearing area 31 is disposed on the thin sheet. When the medium pressure acts on the pressure-bearing area 31 of the thin sheet, it will cause the thin sheet to deform, change the distance between the substrate and the thin sheet, and cause the capacitance value to change. The changed capacitance value will cause the output voltage to change, thereby allowing the medium pressure to be measured. If the shielding unit 40 is not provided, when a conductive medium such as water approaches the thin sheet, the parasitic capacitance generated by the conductive medium such as water and the ceramic core will couple with the initial capacitance of the ceramic core, thereby interfering with the output signal of the product.
[0056] In this embodiment, the pressure-bearing area 31 is the relative area of the electrode pattern on the inner side of the electrode plate, and the range of this area can be adaptively set according to the range of the electrode pattern.
[0057] In one embodiment, such as Figure 4-6 As shown, the housing 10 has an insertion limiting member 14, the pressure capacitor core 30 is provided with a first limiting groove 32, and the temperature sensing element 20 is provided with a second limiting groove 26 that mates with the first limiting groove 32. The insertion limiting member 14 is inserted into the first limiting groove 32 and the second limiting groove 26. Specifically, by being inserted into the first limiting groove 32 and the second limiting groove 26, the insertion limiting member 14 can limit the rotation of the pressure capacitor core 30 and the temperature sensing element 20 in the circumferential direction, thereby improving the stability of the sensing device structure.
[0058] In this embodiment, the second limiting groove 26 is provided with a snap-fit protrusion 261, and the insert limiting member 14 is provided with a snap-fit hole 141, and the snap-fit protrusion 261 snaps into the snap-fit hole 141.
[0059] In this embodiment, as Figure 4 As shown, the insertion limiting member 14 is located at the end of the electrical connector 13 near the mounting housing 12. During the assembly of the electrical connector 13, the electrical connector 13 is connected to the opening of the mounting housing 12, and the insertion limiting member 14 is inserted into the interior of the mounting housing 12 and is inserted into the first limiting groove 32 of the pressure capacitor core 30 and the second limiting groove 26 of the temperature sensing element 20. This limits the rotation of the pressure capacitor core 30 and the temperature sensing element 20 in the circumferential direction. Therefore, it is not necessary to set other limiting structures separately to limit the pressure capacitor core 30 and the temperature sensing element 20, which facilitates the disassembly and assembly of the sensing device.
[0060] Understandably, the shielding unit 40 can be any conductive structure, such as a metal conductive plate or conductive film, that can cover the pressure-bearing area 31 of the pressure capacitor core 30.
[0061] In one embodiment, such as Figure 6 As shown, the shielding unit 40 includes a shielding electrode 41, which is disposed on the pressure capacitor core 30. The electrode pattern of the shielding electrode 41 covers the pressure-bearing area 31. Specifically, the shielding electrode 41 is a printed electrode printed on the pressure-bearing area 31 of the pressure capacitor core 30. The printed electrode is relatively thin and will not affect the pressure of the pressure-bearing area 31, thus not affecting the pressure measurement of the medium. Therefore, capacitor shielding can be achieved without affecting the accuracy of medium pressure measurement.
[0062] Understandably, the conductive component 50 can be connected to any part of the shielding electrode 41, as long as the shielding electrode 41 is connected to the housing 10.
[0063] In one embodiment, such as Figure 6 As shown, the shielding electrode 41 includes a shielding portion 411 and a connecting portion 412. The shielding portion 411 covers the pressure-bearing region 31, and the connecting portion 412 is connected to the edge of the shielding portion 411. The conductive element 50 is connected to the connecting portion 412. Specifically, the shielding portion 411 covers the pressure-bearing region 31, and the connecting portion 412 is specifically used to connect the conductive element 50, thereby allowing the conductive element 50 to be moved away from the pressure-bearing region 31, providing a larger area of shielding for the pressure-bearing region 31.
[0064] Understandably, the electrode shielding layer can take any irregular shape, as long as it completely covers the pressure area 31.
[0065] In this embodiment, as Figure 3-4 As shown, there are two conductive components 50.
[0066] In this embodiment, as Figure 6 As shown, the shielding part 411 is a circular area that covers the electrode pattern inside the pressure capacitor core 30. The connecting part 412 is a fan-shaped area disposed on both sides of the circular area, and the conductive member 50 is connected to the fan-shaped area.
[0067] In one embodiment, the shielding electrode 41 is a gold paste printed electrode or a silver paste printed electrode. Specifically, the electrode pattern of the shielding electrode 41 is easily processed by using a gold paste or silver paste printing process, which makes the formed electrode pattern stable and reliable with good conductivity, thus improving product quality and enhancing the shielding performance of the pressure capacitor core 30.
[0068] Understandably, the conductive component 50 can be any conductive structure of the shielding unit 40 and the housing 10, such as a wire, a rod, or a conductive cylinder.
[0069] In one embodiment, such as Figure 3-4As shown, the conductive component 50 is a spring component, with its two ends abutting against the inner walls of the shielding unit 40 and the mounting cavity 11, respectively. Specifically, by abutting against the inner walls of the shielding unit 40 and the mounting cavity 11, the spring component not only enables the shielding unit 40 to conduct electricity with the housing 10, but also provides elastic support for the pressure capacitor core 30, thereby limiting the axial movement of the pressure capacitor core 30 and preventing damage to the pressure capacitor core 30 during assembly.
[0070] In this embodiment, the spring abuts against the connection portion 412 of the shielding electrode 41.
[0071] In one embodiment, such as Figure 3-4 As shown, the temperature and pressure sensing device also includes a first sealing ring 70. The first sealing ring 70 is located on the side of the conductive element 50 near the pressure-bearing area 31 and is installed between the pressure capacitor core 30 and the temperature sensing element 20. Specifically, the first sealing ring 70 provides a good seal between the pressure capacitor core 30 and the temperature sensing element 20, preventing the medium from entering the sensor's interior through the gap between the pressure capacitor core 30 and the temperature sensing element 20, thus affecting the performance of the sensing device. It also prevents the medium from contacting the conductive element 50, which could interfere with the electric field around the conductive element 50 and affect the shielding effect of the conductive element 50.
[0072] In this embodiment, as Figure 3-4 As shown, the temperature sensing element 20 has a first annular mounting groove 15 on the side near the pressure capacitor core 30, and the first sealing ring 70 is installed in the first annular mounting groove 15.
[0073] In this embodiment, as Figure 3-4 As shown, the temperature and pressure sensing device also includes a flexible circuit board 60. The flexible circuit board 60 is located at the end of the pressure capacitor core 30 away from the temperature sensing element. It is made of PI material (polyimide) and has excellent flexibility. It is a printed circuit board with high wiring density, light weight, thin thickness and good bending. The lead wire 22 is connected to the circuit board of the flexible circuit board 60. One side of the flexible circuit board 60 is coupled to the pressure capacitor core 30 to convert the pressure signal into an electrical signal. The other side of the flexible circuit board 60 is coupled to the electrical connector to output the temperature and pressure electrical signals to the electrical connector.
[0074] In one embodiment, such as Figure 3-4 As shown, the temperature and pressure sensing device also includes a second sealing ring 80. The second sealing ring 80 is located on the side of the conductive element 50 near the pressure-bearing area 31 and is installed between the temperature sensing element 20 and the housing 10. Specifically, the second sealing ring 80 provides a good seal between the housing 10 and the temperature sensing element 20, preventing the medium from entering the interior of the sensor through the gap between the housing 10 and the temperature sensing element 20, thus affecting the performance of the sensing device, and also preventing the medium from contacting the conductive element 50.
[0075] In this embodiment, as Figure 3 and 5 As shown, a second annular mounting groove 27 is provided on the inner wall of the mounting cavity 11 near the temperature sensing element 20, and a second sealing ring 80 is installed in the second annular mounting groove 27.
[0076] In this embodiment, both the first sealing ring 70 and the second sealing ring 80 are O-rings, made of hydrogenated nitrile rubber or other materials that are resistant to high and low temperatures and corrosion.
[0077] To better understand this utility model, the following is combined with... Figures 1 to 6 The technical solution of this utility model is described in detail as follows: When measuring the temperature and pressure of the medium, the fluid medium contacts the small end of the packaging 23. The small end transmits the temperature signal of the medium to the temperature sensing chip 21 through contact with the medium. The temperature sensing chip 21 converts the temperature signal into an electrical signal, which is then output to the flexible circuit board 60 through the lead wire 22. The flexible circuit board 60 then outputs the signal to the electrical connector 13. Part of the fluid medium enters the mounting cavity 11 through the medium channel 231 on the packaging 23 and contacts the pressure area 31 of the pressure capacitor core 30, pressing the pressure medium. The pressure capacitor core 30 converts the pressure signal into an electrical signal. The shielding cover formed by the shielding electrode 41, the conductive element 50, and the housing 10 can prevent the fluid medium from interfering with the pressure capacitor core 30, thereby improving the pressure measurement accuracy. The pressure capacitor core 30 outputs the signal to the flexible circuit board 60 through coupling with the flexible circuit board 60. The flexible circuit board 60 outputs the temperature and pressure electrical signals to the electrical connector through coupling with the electrical connector, ultimately realizing the output of the temperature and pressure electrical signals to the outside.
[0078] The specific embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any other corresponding changes and modifications made based on the technical concept of this utility model should be included within the scope of protection of the claims of this utility model.
Claims
1. A temperature and pressure sensing device, characterized by, The temperature pressure sensing device comprises: a housing provided with a mounting cavity; a temperature sensing element mounted on the housing; a pressure capacitor core mounted on the housing and abutting against the temperature sensing element, the pressure capacitor core having a pressure receiving area for receiving medium pressure; a shielding unit provided on the pressure capacitor core and covering the pressure receiving area; and a conductive member connecting the shielding unit and the housing. The shielding unit comprises a shielding electrode provided on the pressure capacitor core, and an electrode pattern of the shielding electrode covers the pressure receiving area.
2. The temperature and pressure sensing device of claim 1, wherein, The shielding electrode comprises a shielding portion covering the pressure receiving area and a connecting portion connected to an edge of the shielding portion, and the conductive member is connected to the connecting portion.
3. The temperature and pressure sensing device of claim 2, wherein, The shielding electrode is a gold paste printed electrode or a silver paste printed electrode.
4. The temperature and pressure sensing device of claim 2, wherein, The temperature sensing element is provided on a side of the pressure capacitor core close to the pressure receiving area, and the temperature sensing element is provided with a protection channel through which the conductive member passes through the temperature sensing element.
5. The temperature and pressure sensing device according to any one of claims 1 to 4, wherein The temperature sensing element has a protection portion, two ends of the protection portion are respectively attached to the pressure capacitor core and an inner wall of the mounting cavity, and the protection channel is provided on the protection portion.
6. The temperature pressure sensing device of claim 5, wherein, The conductive member is a spring member, and two ends of the spring member are respectively abutted against the shielding unit and the inner wall of the mounting cavity.
7. The temperature and pressure sensing device of any one of claims 1-4, wherein, The temperature pressure sensing device further comprises a first sealing ring located on a side of the conductive member close to the pressure receiving area and mounted between the pressure capacitor core and the temperature sensing element.
8. The temperature and pressure sensing device of any one of claims 1-4, wherein, The temperature pressure sensing device further comprises a second sealing ring located on a side of the conductive member close to the pressure receiving area and mounted between the temperature sensing element and the housing.
9. The temperature and pressure sensing device of any one of claims 1-4, wherein, The housing has a plug-in limiting member, the pressure capacitor core is provided with a first limiting groove, the temperature sensing element is provided with a second limiting groove in abutment with the first limiting groove, and the plug-in limiting member is plugged into the first limiting groove and the second limiting groove.
10. The temperature and pressure sensing device of any one of claims 1-4, wherein,