Ultrasonic scanning guide pasting device of chip capacitor
By designing an ultrasonic scanning and bonding device with a guide hole and fixing components, the problem of manually standing up chip capacitors during testing was solved, realizing the automatic standing and fixing of batch chip capacitors and improving production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-03-06
AI Technical Summary
In existing technologies, chip capacitors need to be manually erected and fixed one by one during ultrasonic scanning inspection, which is cumbersome and results in low production efficiency.
An ultrasonic scanning and bonding device was designed. It uses the guiding holes and guiding slopes on the guiding plate to change the chip capacitor from a horizontal state to an upright state, and fixes it with detachable fasteners and cover plates, simplifying the operation process.
This technology enables the mass production and fixing of chip capacitors, improving production efficiency, simplifying the operation process, and reducing manual intervention.
Smart Images
Figure CN223977182U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of capacitor testing technology, and in particular to an ultrasonic scanning and bonding device for chip capacitors. Background Technology
[0002] Ultrasonic scanning inspection is a non-destructive testing technique primarily used to detect internal defects in components, such as delamination, cracks, pores, and impurities. The device used in ultrasonic scanning inspection utilizes an ultrasonic transducer to transmit ultrasonic waves in pulses into the sample. Because ultrasonic waves are reflected at the interfaces between different materials, creating echoes of varying intensities, defects such as delamination will produce distinct echoes. The receiving probe collects these echo signals, which are then processed by a computer to generate an image of the material's interior, thus enabling the detection and location of defects. Liquid contact scanning is commonly used for the inspection and analysis of small electronic components such as capacitors. It utilizes a liquid (usually purified water) applied between the probe and the component surface to eliminate air gaps and facilitate the transmission of sound energy. When performing ultrasonic scanning inspection on capacitors, due to their small size and light weight, multiple capacitors are often attached to expanding foam and then submerged in water for batch scanning and analysis.
[0003] Chip capacitors have advantages such as small size, thin thickness, low equivalent series resistance, and low loss, and are therefore widely used in electronic equipment. For example... Figure 1 As shown, the chip capacitor 1 is generally square and flat, comprising a ceramic body 1a and metal end electrodes 1b disposed on opposite sides of the ceramic body 1a along its thickness direction. Because the end electrodes 1b of the chip capacitor 1 have a large area, in its natural state, the end electrodes 1b of the chip capacitor 1 are in contact with the bearing surface, placing it horizontally. Therefore, when performing ultrasonic scanning inspection on the chip capacitor 1, it is necessary to manually stand the chip capacitor 1 upright, fix it to expanding foam, and then scan and analyze the ceramic body 1b. When performing ultrasonic scanning inspection on a batch of chip capacitors 1, it is necessary to manually stand them up one by one, which is cumbersome and has low production efficiency. Utility Model Content
[0004] Based on this, the purpose of this utility model is to overcome the defects or deficiencies of the prior art and provide an ultrasonic scanning and bonding device for chip capacitors, which can realize the upright processing of batch chip capacitors before ultrasonic scanning and testing, which is simple to operate and greatly improves production efficiency.
[0005] An ultrasonic scanning and bonding device for a chip capacitor is disclosed, suitable for a hexahedral chip capacitor. The chip capacitor has a cross-section along its thickness direction that is a quadrilateral formed by two opposing first sides and two opposing second sides, where the length of the first side is greater than or equal to the length of the second side and greater than the thickness. The ultrasonic scanning and bonding device includes a guide plate, which comprises a guide plate body. The guide plate body has m through-holes penetrating its top and bottom surfaces, where m ≥ 1. The chip capacitor can be inserted into the through-holes through a first port and exited through a second port. The through-holes are interconnected. It consists of a first chamber and a second chamber; the first chamber is provided with a guide slope, which slopes from the outside to the inside from the first port of the guide hole, so that a single chip capacitor passing through the first port can slide into the second chamber along the guide slope; the second chamber has a rectangular cross-section along its depth direction, the length of which is greater than or equal to the length of the second side of the chip capacitor, and its width is greater than the thickness of the chip capacitor and less than the length of the second side of the chip capacitor, so that the ceramic body of the chip capacitor falling into the second chamber faces the second port of the guide hole.
[0006] Compared to existing technologies, the ultrasonic scanning and bonding device for chip capacitors described in this utility model uses a guide hole with a guide slope to turn the chip capacitors, which are naturally placed horizontally, into upright positions. This allows the ceramic surface of the chip capacitor to come into contact with the bearing surface, enabling batch upright processing of chip capacitors before ultrasonic scanning and testing. The operation is simple and effectively improves production efficiency.
[0007] In one embodiment, the length of the cross-section of the second chamber along its own depth direction is 1.2-1.5 times the length of the first or second side of the chip capacitor, and the width of the cross-section is 1.2-1.5 times the thickness of the chip capacitor.
[0008] In one embodiment, the depth of the second chamber is 0.5-1.5 times the length of the first or second side of the chip capacitor.
[0009] In one embodiment, when m≥2, all through holes form an array of through holes in rows a and columns b, where a≥1, b≥1, and a*b=m; any two adjacent through holes are separated by a partition wall, the width of the top of the partition wall being less than 1 / 2 of the length of the second side of the chip capacitor.
[0010] In one embodiment, the ultrasonic scanning and bonding device for the chip capacitor further includes a fixing member detachably connected to the bottom of the guide plate. When the fixing member is connected to the bottom of the guide plate, the fixing member covers the second port of the guide hole to be reversibly fixedly connected to the chip capacitor passing through the second port.
[0011] In one embodiment, when the surface of the fastener is adhesive, the bottom of the guide plate is provided with 2n supporting bosses, where n≥1, and the supporting bosses are symmetrically distributed at the bottom of the guide plate; when the fastener is connected to the bottom of the guide plate, the supporting bosses abut against the fastener so that there is a gap between the fastener and the guide plate.
[0012] In one embodiment, the height of the support boss along the thickness direction of the guide plate is 0.2-0.6 times the length of the first or second side of the chip capacitor.
[0013] In one embodiment, the ultrasonic scanning and bonding device for the chip capacitor further includes a cover plate detachably covering the top of the guide plate. The cover plate includes a cover plate body, and the bottom of the cover plate body is provided with cover protrusions corresponding to the guide holes. The cover protrusions can extend into the corresponding guide holes, and the sum of the height of the cover protrusions along the thickness direction of the cover plate and the length of the second side of the chip capacitor is greater than the depth of the guide hole.
[0014] In one embodiment, the bottom of the cover protrusion is provided with a buffer layer, the buffer layer being made of an elastic material.
[0015] In one embodiment, the guide plate further includes a limiting structure, which is arranged along the outer periphery of the guide plate body and surrounds the top surface of the guide plate body to form an open loading cavity; the limiting structure is provided with a cleaning port that connects the loading cavity to the external environment, and the orthographic projection of the cleaning port on a vertical plane extending along the row or column direction of the guide through hole array does not overlap with the orthographic projection of any guide through hole on the vertical plane, wherein the vertical plane is perpendicular to the horizontal plane.
[0016] To better understand and implement this invention, the following detailed description is provided in conjunction with the accompanying drawings. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of an existing chip capacitor;
[0018] Figure 2 This is a top view of one embodiment of the ultrasonic scanning and bonding device for chip capacitors of this utility model.
[0019] Figure 3 This is a cross-sectional view of one embodiment of the ultrasonic scanning and bonding device for chip capacitors of this utility model.
[0020] Figure 4 This is a top view of the guide through hole of the guide plate in one embodiment of the ultrasonic scanning and bonding device for chip capacitors of this utility model.
[0021] Figure 5 This is a partial enlarged view of a guide plate containing a chip capacitor in another embodiment of the ultrasonic scanning and bonding device for chip capacitors of this utility model. Figure 5 (a) A partial magnified view of the chip capacitor located at one angle within the second chamber of the feed plate; Figure 5 (b) A partial magnified view of the chip capacitor located in the second chamber of the guide plate at another angle;
[0022] Figure 6 This is a front view and a partial enlarged view of the cover plate in another embodiment of the ultrasonic scanning and bonding device for chip capacitors of this utility model.
[0023] Figure 7 This is a cross-sectional view of a guide plate with a fixing member attached to the bottom and a cover plate covering the top in another embodiment of the ultrasonic scanning and bonding device for chip capacitors of this utility model.
[0024] Figure label:
[0025] 1. Chip capacitor; 1a. Ceramic body of chip capacitor; 1b. Terminal electrode of chip capacitor;
[0026] 10. Guide plate; 100. Guide plate body; 1000. Partition wall; 102. Guide through hole; 1021. First chamber; 1022. Second chamber; 1021a. Guide slope; 104. Support boss; 106. Limiting structure;
[0027] 20. Fasteners;
[0028] 30. Cover plate; 300. Cover plate body; 302. Cover protrusion; 304. Buffer layer;
[0029] D1, row direction; D2, column direction. Detailed Implementation
[0030] like Figure 1 As shown, the existing chip capacitor 1 has a generally flat structure, including a ceramic body 1a and metal end electrodes 1b disposed on opposite sides of the ceramic body 1a along its thickness direction. Figure 1As can be seen, the flat chip capacitor 1 is placed horizontally in its natural position. This lowers the center of gravity of the chip capacitor 1, making it less prone to tipping over. In this case, only the end electrode 1a is in contact with the bearing surface (not shown in the figure). However, ultrasonic scanning requires scanning the ceramic body 1a. Therefore, before ultrasonic scanning, the chip capacitor 1 needs to be erected vertically, with one of the four sides of the ceramic body 1b contacting and fixing it to the bearing surface (not shown in the figure). Then, the bearing surface with the chip capacitor 1 fixed is transferred into water, allowing the ultrasonic scanning device to scan and inspect the ceramic body 1a of the chip capacitor 1. Currently, erecting and fixing the chip capacitor 1 usually requires manual operation one by one, which is extremely cumbersome and results in very low production efficiency, especially when ultrasonic scanning is needed for batches of chip capacitors 1.
[0031] Based on this, the present invention provides an ultrasonic scanning and bonding device for a chip capacitor. The device uses a guide hole with a guide slope to convert a horizontally placed chip capacitor 1 into an upright position, allowing the surface of the ceramic body 1a of the chip capacitor 1 to contact the bearing surface, facilitating ultrasonic scanning of the interior of the ceramic body 1a. Furthermore, a fixing member detachably connected to the guide plate is provided to fix the position of the chip capacitor 1 after its placement has been changed by the guide plate, facilitating the transfer of the ultrasonic scanning device for testing. Even further, a cover plate detachably connected to the guide plate is provided to apply force to the chip capacitor 1, which is in contact with the fixing member, ensuring a firm bond between the chip capacitor 1 and the fixing member, preventing the chip capacitor 1 from tipping over or falling off.
[0032] The following is applicable Figure 1 Taking the chip capacitor 1 shown as an example, the solution of this utility model will be described in detail with reference to the accompanying drawings.
[0033] Figure 1 The chip capacitor 1 shown has a quadrilateral cross-section along its thickness direction, formed by a first side and a second side. The cross-sectional area is the product of the first and second sides, where the length L1 of the first side ≥ the length L2 of the second side > the thickness T. The acoustic scanning bonding device includes a guide plate 10, which comprises a guide plate body 100. The guide plate body 100 is generally rectangular, and has m through-holes 102 penetrating its top and bottom surfaces, where m ≥ 1. When m ≥ 2, the multiple through-holes 102 are arranged in a matrix of rows a and columns b, forming a through-hole matrix, where a ≥ 1, b ≥ 1, and a * b = m. Figure 2-4 The diagram illustrates the specific structure of one embodiment of the ultrasonic scanning and bonding device for the chip capacitor of this invention. (See diagram for details.) Figure 2-3As shown, in this embodiment, the material guiding holes 102 form a matrix of 20 rows and 22 columns, with any two adjacent material guiding holes 102 separated by a partition wall 1000. Each material guiding hole 102 consists of a first chamber 1021 and a second chamber 1022 that are interconnected, wherein the second chamber 1022 is located below the first chamber 1021.
[0034] Specifically, such as Figure 2 and Figure 4 As shown, from a top view, the upper port of the first chamber 1021 is rectangular, and the length of its side extending along the column direction D2 is greater than the length L1 of the first side of the chip capacitor 1. The opposite side walls of the guide via matrix in the row direction D1 and the opposite side walls in the column direction D2 of the first chamber 1021 are respectively provided with guide slopes 1021a. The guide slopes 1021a slope from the outside to the inside from the top surface of the guide plate 10. That is, each first chamber 1021 has four guide slopes 1021a, making the first chamber 1021 form a "trumpet mouth" that is wide at the top and narrow at the bottom. The lower port of the first chamber 1021 is rectangular, and its width along the row direction D1 is greater than the thickness T of the chip capacitor 1 and less than the length L2 of the second side. Its length along the column direction D2 is greater than or equal to the length L2 of the second side of the chip capacitor 1 (of course, it can also be set to be greater than the length L1 of the first side). The lower port of the first chamber 1021 is connected to the upper port of the second chamber 1022.
[0035] The second chamber 1022 is a rectangular space, with its upper port connected to the lower part of the first chamber 1021, making the longitudinal section of the guide hole 102 funnel-shaped. This allows the chip capacitor 1 to enter from the upper port of the first chamber 1021 and exit from the lower port of the second chamber 1022. The length of the cross-section of the second chamber 1022 along the depth direction is 1.2-1.5 times the length of the first side L1 or the second side L2 of the chip capacitor 1, and its width is 1.2-1.5 times the thickness T of the chip capacitor 1. This provides sufficient space between the chip capacitor 1 falling into the second chamber 1022 and the inner wall of the chamber, reducing contact with the inner wall and ensuring that the chip capacitor 1 remains upright. The depth of the second chamber 1022 is 0.5-1.5 times the length of the first side L1 or the second side L2 of the chip capacitor 1. If the depth is too shallow, it will be difficult to limit the chip capacitor 1; if the depth is too deep, it will increase the frictional force generated during the chip capacitor 1's sliding.
[0036] In use, the guide plate 10 is first placed horizontally on the support surface, and multiple chip capacitors 1 are naturally scattered on the top surface of the guide plate 10. Then, the chip capacitors 1 naturally scattered on the top surface of the guide plate 10 are moved to the adjacent guide through hole 102. Due to the size limitation of the upper port of the first chamber 1021 of the guide through hole 102, the chip capacitors 1 cannot enter the first chamber 1021 horizontally, but need to enter at a certain angle. At this time, one side of the ceramic body 1a of the chip capacitor 1 first enters the first chamber 1021, and then gradually slides along the guide slope 1021a of the first chamber 1021 to the second chamber 1022 until it abuts against the support surface. Due to the size limitation of the upper port of the second chamber 1022, the chip capacitor 1 can only enter the second chamber 1022 in an upright manner. After all the chip capacitors 1 have entered the corresponding guide hole 102 and abutted the bearing surface, the guide plate 10 is taken out upward. In this way, a batch of upright chip capacitors 1 can be obtained. Then, the upright chip capacitors 1 are fixed and transferred to the ultrasonic scanning device. Compared with the traditional method of manually standing up the chip capacitors 1 one by one, this utility model can turn the horizontally placed chip capacitors 1 into an upright position by using the guide hole 102 with the guide slope 1021a, which can simplify the operation and effectively improve the production efficiency.
[0037] Of course, in the above-mentioned guiding device, the first chamber 1021 of the guiding through hole 102 can be provided with one guiding ramp 1021a, or two or three guiding ramps 1021a. However, compared to the others, four guiding ramps 1021a make it easier for the chip capacitor 1 to slide into the guiding through hole 102. No matter where the chip capacitor 1 is placed on the edge of the guiding through hole 102, it can slide into the corresponding second chamber 1022 through the nearest guiding ramp 1021a, which helps to improve production efficiency.
[0038] To further eliminate the need for manual manipulation of the chip capacitor 1 near the feed through-hole 102, and to allow the chip capacitor 1 naturally scattered on the top surface of the feed guide plate 10 to automatically slide into the first chamber 1021, the top width of the partition wall 1000 between any two adjacent feed through-holes 102 is less than half the length L2 of the second side of the chip capacitor 1. This makes it easier for the center of gravity of any chip capacitor 1 scattered on the top surface of the feed guide plate 10 to fall above the feed through-hole 102, thus allowing the chip capacitor 1 to naturally fall into the corresponding feed through-hole 102 under its own weight. The smaller the top width of the partition wall 1000, the easier it is for the chip capacitor 1 to slide naturally into the first chamber 1021. The width of the upper port of the first chamber 1021 along the row direction D1 is less than the length L2 of the second side of the chip capacitor 1, so that the chip capacitor 1 needs to enter from the upper port of the first chamber 1021 at a certain angle, rather than being stuck horizontally at the upper port of the first chamber 1021.
[0039] In some embodiments, the position of the chip capacitor 1 extending from the lower port of the second chamber 1022 of the feed through-hole 102 is fixed to facilitate the transfer of a batch of chip capacitors 1 to the ultrasonic scanning inspection device. For example... Figure 5 As shown, the ultrasonic scanning and bonding device for the chip capacitor also includes a fixing member 20 detachably connected to the bottom of the guide plate 10. The fixing member 20 is specifically made of a material with adhesive properties, such as foam or tape. Before feeding, the fixing member 20 is first bonded to the bottom of the guide plate 10, covering the lower ports of all the guide holes 102 and the second chamber 1022. During feeding, guided by the guide slope 1021a, the chip capacitor 1 enters the second chamber 1022 vertically, causing one side of the ceramic body 1a to adhere to the fixing member 20. Then, the fixing member 20 is removed, and the fixing member 20 with the chip capacitor 1 is transferred to the ultrasonic scanning and testing device for ultrasonic scanning and testing of the chip capacitor 1.
[0040] The aforementioned fastener 20 can be a material with adhesive properties such as foam or tape, or it can be a fixing plate with a positioning groove. The positioning groove corresponds one-to-one with the material guide hole 102. The cross-section of the positioning hole is rectangular, the same as the cross-section of the second chamber 1022 of the material guide hole 102. The chip capacitor 1 that passes through the second chamber 1022 is fixed on the fixing plate by inserting into the positioning groove. Then the fixing plate with the chip capacitor 1 is moved to the ultrasonic scanning detection device for detection.
[0041] Furthermore, when a material with adhesive properties such as foam or tape is used as the fixing member 20, after the chip capacitor 1 is fixed to the fixing member 20, in order to more easily separate the fixing member 20 from the guide plate 10, 2n supporting bosses 104 (n≥1) are provided on the bottom surface of the guide plate body 100 to support the fixing member 20, so that there is a certain gap between the fixing member 20 and the bottom surface of the guide plate body 100. The height of the support boss 104 along the thickness direction of the guide plate 10 is less than 0.2-0.6 times the length of the first side L1 or the second side of the chip capacitor 1. If the height of the support boss 104 is too large, before the chip capacitor 1 contacts the fixing member 20, most of the volume of the chip capacitor 1 has already left the second chamber 1022, and the chip capacitor 1 is prone to displacement, which can lead to unstable adhesion or even tipping over. If the height of the support boss 104 is too small, when the chip capacitor 1 contacts the fixing member 20, most of the volume of the chip capacitor 1 is still located inside the second chamber 1022, which can cause the chip capacitor 1 to easily collide with the side wall of the second chamber 1022 and tip over during the removal of the fixing member 20. The cross-section of the support boss 104 along its height direction can be of any shape, such as square, rectangular, triangular, circular, or polygonal. Before feeding, the fastener 20 is flattened and bonded to the support boss 104 of the guide plate 10. At this time, the fastener 20 only contacts the support boss 104, while other parts have a certain gap with the guide plate body 100. In this way, the bonding area between the fastener 20 and the guide plate 10 is reduced, the bonding force between the two is weakened, and it is easier to separate the fastener 20 from the guide plate 10.
[0042] When the chip capacitor 1 exits from the lower port of the second chamber 1022, it adheres to the fixing member 20 solely by its own weight. Because the chip capacitor 1 is relatively light and has low gravity, the adhesion of the fixing member 20 to the chip capacitor 1 is often weak, making it prone to tipping over or even falling off during transfer due to unstable adhesion. To ensure a stable adhesion between the chip capacitor 1 and the fixing member 20, in some embodiments, the ultrasonic scanning and bonding device further includes a cover plate 30 that can be closed onto the top of the guide plate 10. Figure 6-7As shown, the cover plate 30 includes a cover plate body 300, and the bottom of the cover plate body 300 is provided with cover protrusions 302 corresponding to the guide holes 102. The sum of the height of the cover protrusions 302 along the thickness direction of the cover plate 30 and the first side of the chip capacitor 1 is greater than the depth of the guide hole 102. This ensures that when the cover plate 30 is closed on the top of the guide plate 10, the chip capacitor 1 sliding into the second chamber 1022 can apply pressure to the fixing member 20 through the pushing action of the cover protrusions 302, so that the two are tightly bonded. When the bottom of the guide plate 10 is provided with a support boss 104, the sum of the height of the cover protrusions 302 and the length L1 of the first side of the chip capacitor 1 is greater than the sum of the depth of the guide hole 102 and the height of the support boss 104, so that the chip capacitor 1 can contact the fixing member 20 at a certain distance from the guide plate 10 under the pushing action of the cover protrusions 302, and the two are tightly bonded. The cross-section of the cover protrusion 302 along its height direction can be of any shape, as long as the cover protrusion 302 can extend into the first chamber 1021. Preferably, it is a symmetrical shape to ensure uniform force applied to the chip capacitor 1.
[0043] Furthermore, to buffer the chip capacitor 1 during the process of the cover protrusion 302 pushing it, and to avoid damage to the chip capacitor 1, a buffer layer 304 is provided at the bottom of the cover protrusion 302 (e.g., Figure 6 As shown), the buffer layer 304 is made of an elastic material, which can be resin, latex or rubber or other materials with a certain degree of elasticity.
[0044] Furthermore, the guide plate 10 also includes a limiting structure 106. The limiting structure 106 is arranged along the outer periphery of the guide plate body 100 and forms an open loading cavity with the guide plate body 100. The same number of chip capacitors 1 as the number of guide holes 102 are introduced into the guide cavity, and then the chip capacitors 1 in the cavity are slowly shaken until all the chip capacitors 1 are in their corresponding guide holes 102 positions. This eliminates the tedious operation of manually pushing the chip capacitors 1 into the guide holes 102.
[0045] In addition, when the guide plate device also includes a cover plate 30, the limiting structure 106 provided on the guide plate body 100 can also limit the cover plate 30. In this embodiment, the shape of the limiting structure 106 is adapted to the outer periphery of the cover plate 30, so that when the cover plate 30 is covered on the guide plate 10, the outer periphery side of the cover plate body 300 finally abuts against the limiting structure 106, so that the cover plate 30 will not shift during the downward pressing process, and ensure that the cover plate 30 applies uniform force to the chip capacitor 1 in the guide plate 10.
[0046] Furthermore, the limiting structure 106 is provided with a cleaning port 1060 that connects the loading chamber to the external environment (e.g., Figure 2(As shown). The position of the material discharge port 1060 on the limiting structure 106 is offset from the position of the material guiding through-hole matrix. Its orthographic projection on the vertical plane extending along the direction D1 does not overlap with the orthographic projection of any material guiding through-hole 102 on the same vertical plane, wherein the vertical plane is perpendicular to the horizontal plane. In this way, Figure 1 The shown guide hole matrix forms a cleaning channel extending in the column direction D2 on one side, and the cleaning port 1060 is directly opposite the cleaning channel. When the number of chip capacitors 1 loaded into the loading cavity is greater than that of the guide holes 102, the excess chip capacitors 1 that fail to enter the guide holes 102 can be slid into the cleaning channel by tilting the guide plate 10 in the direction of the cleaning channel. Then, the guide plate 10 is tilted towards the cleaning port 1060 to discharge the excess chip capacitors 1 from the cleaning port 1060.
[0047] Compared to existing technologies, the ultrasonic scanning and bonding device for the chip capacitor of this invention converts the horizontally placed chip capacitor into an upright position through a guide hole with a guide slope, allowing the ceramic surface of the chip capacitor 1 to abut against the bearing surface, facilitating the ultrasonic scanning device to inspect the interior of the ceramic body. Furthermore, by providing a fixing member detachably connected to the guide plate, the position of the chip capacitor after its placement state has been converted by the guide plate is fixed, facilitating the transfer of the ultrasonic scanning device for inspection. Even further, by providing a cover plate detachably connected to the guide plate, force is applied to the chip capacitor that is in contact with the fixing member, ensuring a firm bond between the chip capacitor and the fixing member, preventing the chip capacitor from tipping over or falling off.
[0048] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of this application. The singular forms “a,” “the,” and “the” used in the embodiments and claims of this application are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that, unless otherwise stated, “a plurality” means two or more; the terms “first,” “second,” “third,” etc., are used only to distinguish and not to describe a particular order or sequence, nor should they be construed as indicating or implying relative importance. The term “and / or” as used herein refers to and includes any or all possible combinations of one or more associated listed items. When the above description relates to drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. In the description of this application, those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0049] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.
Claims
1. An ultrasonic scanning guide for chip capacitors, suitable for chip capacitors (1) in the form of hexahedrons, wherein The cross section of the chip capacitor (1) along its thickness direction is a quadrilateral enclosed by two opposite first edges and two opposite second edges, the length of the first edge is greater than the length of the second edge, and the thickness is less than the length of the second edge. The ultrasonic scanning guide device comprises a guide plate (10), and the guide plate comprises a guide plate body (100) provided with m guide holes (102) penetrating through the top surface and the bottom surface, wherein m≥1; the chip capacitor (1) can be inserted from the first port of the guide hole (102) and taken out from the second port. The guide hole (102) is composed of a first chamber (1021) and a second chamber (1022) which are in communication with each other. The first chamber (1021) is provided with a guide inclined surface (1021a) which is inclined from the outside to the inside from the first port of the guide hole (102), so that the single chip capacitor (1) inserted from the first port slides along the guide inclined surface (1021a) into the second chamber (1022). The cross section of the second chamber (1022) along its depth direction is rectangular, the length of the cross section is greater than or equal to the length of the second edge of the chip capacitor (1), the width is greater than the thickness of the chip capacitor (1) and less than the length of the second edge of the chip capacitor (1), so that the ceramic body of the chip capacitor (1) falling into the second chamber (1022) is directed towards the second port of the guide hole (102).
2. The ultrasonic scanning guide device for chip capacitors according to claim 1, wherein: The length of the cross section of the second chamber (1022) along its depth direction is 1.2-1.5 times the length of the first edge or the second edge of the chip capacitor (1), and the width is 1.2-1.5 times the thickness of the chip capacitor (1).
3. The ultrasonic scanning guide device for chip capacitors according to claim 1, wherein: The depth of the second chamber (1022) is 0.5-1.5 times the length of the first edge or the second edge of the chip capacitor (1).
4. The ultrasonic scanning guide device for chip capacitors according to claim 1, wherein: When m≥2, all the guide holes (102) form an array of a rows and b columns, wherein a≥1 and b≥1, and a*b=m; Any two adjacent guide holes (102) are separated by a partition wall (1000), and the width of the top of the partition wall (1000) is less than 1 / 2 of the length of the second edge of the chip capacitor (1).
5. The ultrasonic scanning guide device for chip capacitors according to claim 1, further comprising a fixing member (20) detachably connected to the bottom of the guide plate (10), when the fixing member (20) is connected to the bottom of the guide plate, the fixing member (20) covers the second port of the guide hole (102) to reversibly fix the chip capacitor (1) taken out from the second port. 6. The chip capacitor ultrasonic scanning guiding and pasting device according to claim 5, characterized in that: When the fixing member (20) has an adhesive surface, the material guiding plate body (100) is provided with 2n supporting bosses (104) on the bottom, wherein n≥1, and the supporting bosses (104) are symmetrically distributed on the bottom of the material guiding plate body (100). When the fixing member is connected to the bottom of the material guiding plate, the supporting bosses (104) abut against the fixing member (20) to form a gap between the fixing member (20) and the material guiding plate body (100).
7. The chip capacitor ultrasonic scanning guiding and pasting device according to claim 6, characterized in that: The height of the supporting boss (104) in the thickness direction of the material guiding plate (10) is 0.2-0.6 times the length of the first or second side of the chip capacitor (1).
8. The chip capacitor ultrasonic scanning guiding and pasting device according to claim 1, characterized in that: Further comprising a cover pressing plate (30) detachably covering the top of the material guiding plate (10), wherein the cover pressing plate (30) comprises a cover pressing plate body (300), the bottom of the cover pressing plate body (300) is provided with cover pressing bosses (302) corresponding to the material guiding through holes (102), the cover pressing bosses (302) can extend into the corresponding material guiding through holes (102), and the height of the cover pressing boss (302) in the thickness direction of the cover pressing plate (30) is greater than the depth of the material guiding through hole.
9. The chip capacitor ultrasonic scanning guiding and pasting device according to claim 8, characterized in that: The bottom of the cover pressing boss (302) is provided with a buffer layer (304), and the material of the buffer layer (304) is an elastic material.
10. The chip capacitor ultrasonic scanning guiding and pasting device according to claim 4, characterized in that: The material guiding plate (10) further comprises a limiting structure (106), the limiting structure (106) is arranged along the outer contour of the material guiding plate body (100) and encloses the top surface of the material guiding plate body (100) to form an open charging cavity; The limiting structure (106) is provided with a material cleaning opening (1060) communicating the charging cavity with the external environment, and the orthogonal projection of the material cleaning opening (1060) on a vertical plane extending in the row direction or column direction of the material guiding through hole array does not overlap with the orthogonal projection of any material guiding through hole (102) on the vertical plane, wherein the vertical plane is perpendicular to the horizontal plane.