Pulse heating accurate control device

Abstract

The utility model discloses a pulse heating accurate control device which comprises a base and a heat insulator fixedly connected with the bottom face of the base. A positive copper nose and a negative copper nose; the two ends of the heating body are electrically connected with the positive electrode copper nose and the negative electrode copper nose respectively, and the first face of the heating body makes contact with the bottom face of the heat insulator. The heat uniformizing plate is attached to and fixed to the second face of the heating body. And the temperature sensing line is arranged on the heat uniformizing plate. The pulse heating accurate control device can realize stable temperature control in the long-time liquefaction and solidification process of the ACF anisotropic conductive adhesive at different temperatures. According to the utility model, the temperature is fed back through the temperature sensing line, and long-time accurate temperature control at different temperatures is realized. The heat insulator is arranged, so that heat transferred to the base is reduced. The base is provided with the upper surface air inlet and outlet structure and the lower surface air inlet and outlet structure, redundant heat is transferred to other mechanisms, and it is guaranteed that the temperature of the heat uniformizing plate area is better controlled.

Description

Technical Field

[0001] This utility model relates to the back-end device of a micro LED screen, specifically to a pulse heating precision control device. Background Technology

[0002] Anisotropic conductive film (ACF) is a key material. ACF is a thin film containing conductive particles that can conduct electricity in specific directions under pressure while remaining insulating in others. The main function of ACF is to establish electrical connections between the Micro LED chip and the substrate, while also providing fixation and protection.

[0003] In the field of micro LED displays, new processes require ACF to be cured for a long time (140 seconds) while maintaining a temperature within ±3℃, which is difficult to achieve with conventional constant temperature control. Furthermore, the conductive particles of ACF are very small, only 3-5µm, requiring a high degree of surface levelness from the pressure head. Conventional pulse pressure heads experience significant changes in surface levelness after heating, leading to unstable and weak bonding.

[0004] In view of this, it is necessary to provide a control device to solve the above-mentioned technical problems. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a pulse heating precision control device that ensures stable temperature control during the long-term liquefaction and curing of ACF (Anisotropic Conductive Coating) at different temperatures, preventing reliability and resistance instability issues during the curing process and effectively improving product yield.

[0006] To solve the above-mentioned technical problems, this utility model provides the following solution: A pulse heating precision control device of this utility model, comprising:

[0007] Base;

[0008] A heat insulator fixed to the bottom surface of the base;

[0009] Positive and negative copper lugs are mounted on both sides of the heat insulator.

[0010] A heating element, wherein the two ends of the heating element are electrically connected to a positive copper lug and a negative copper lug respectively, and the first surface of the heating element is in contact with the bottom surface of the heat insulator;

[0011] A heat-equalizing plate is attached to and fixed to the second side of the heating element;

[0012] The temperature sensing line is located on the heat-dissipating plate.

[0013] Furthermore, the base has an upper surface heat dissipation structure and a lower surface heat dissipation structure, wherein the lower surface is the bottom surface of the base.

[0014] Furthermore, the upper surface heat dissipation structure is provided with a first heat dissipation channel in the base near the upper surface of the base, and the inlet and outlet of the first heat dissipation channel are respectively connected to a first air inlet and a first air outlet.

[0015] Furthermore, the lower surface heat dissipation structure is provided with a second heat dissipation channel located inside the base near the lower surface of the base, and the inlet and outlet of the second heat dissipation channel are respectively connected to a second air inlet and a second air outlet.

[0016] Furthermore, the pulse heating precision control device also includes an active heat dissipation plate, which has a U-shaped structure that is side-connected to the base and extends downward to form a shielding structure.

[0017] Furthermore, the U-shaped structure is connected to a folding plate that extends to the area below the heating element.

[0018] Compared with the prior art, the beneficial effects of this utility model are:

[0019] 1. The pulse heating precision control device of this utility model can achieve stable temperature control during the long-term liquefaction and curing process of ACF anisotropic conductive adhesive at different temperatures.

[0020] 2. This utility model uses a temperature sensing wire to provide temperature feedback, enabling precise temperature control over extended periods at different temperatures.

[0021] 3. This utility model incorporates a heat insulator to reduce heat transfer to the base.

[0022] 4. The base of this utility model is equipped with an upper surface air inlet and outlet structure and a lower surface air inlet and outlet structure to transfer excess heat to other mechanisms and ensure better temperature control in the heat distribution plate area.

[0023] 5. The active heat dissipation plate of this utility model has an active heat dissipation function, which actively absorbs the heat of the heated body and spreads it outward. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the pulse heating precision control device of this utility model.

[0025] The following are labeled in the attached diagram: First air inlet 1A, First air outlet 1B, Base 2, Second air inlet 3A, Second air outlet 3B, Positive copper nose 4A, Negative copper nose 4B, Heat insulator 5, Temperature sensing wire 6, Heated body 7, Heat equalizing plate 8, Active heat dissipation plate 9, Heating body 10. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present utility model. Obviously, the embodiments described in this utility model are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0028] Example 1: The specific structure of this utility model is as follows:

[0029] Please refer to the appendix. Figure 1 The present invention provides a pulse heating precision control device, comprising a base 2, a heat insulator 5, a positive copper nose 4A, a negative copper nose 4B, a heating element 10, a heat equalizing plate 8, and a temperature sensing wire 6.

[0030] The base 2 is a block shape, having an upper surface heat dissipation structure and a lower surface heat dissipation structure, wherein the lower surface is the bottom surface of the base 2. The upper surface heat dissipation structure consists of a first heat dissipation channel located within the base 2 near its upper surface, with its inlet and outlet connected to a first air inlet 1A and a first air outlet 1B, respectively. The lower surface heat dissipation structure consists of a second heat dissipation channel located within the base 2 near its lower surface, with its inlet and outlet connected to a second air inlet 3A and a second air outlet 3B, respectively.

[0031] Cold air enters through the first air intake port 1A. The cold air passes through the first heat dissipation channel, carrying away the heat, and is discharged from the first air outlet port 1B.

[0032] Cold air enters through the second air intake port 3A. The cold air passes through the second heat dissipation channel, carrying away the heat, and is discharged from the second air outlet port 3B.

[0033] The heat insulator 5 is fixed to the bottom surface of the base 2. The heat insulator 5 is a block structure. Its function is to insulate and reduce the heat transfer from below to the base 2. Since the base 2 is connected to other mechanisms, it prevents heat from being conducted to other mechanisms, thus ensuring the normal operation of other mechanisms.

[0034] Positive copper nose 4A and negative copper nose 4B are mounted on both sides of the heat insulator 5. The two ends of the heating element 10 are electrically connected to the positive copper nose 4A and negative copper nose 4B respectively, and the first surface of the heating element 10 is in contact with the bottom surface of the heat insulator 5. A heat equalizing plate 8 is attached to and fixed to the second surface of the heating element 10. A temperature sensing wire 6 is provided on the heat equalizing plate 8, and the heated body 7 is installed on the lower surface of the heat equalizing plate 8. After the positive copper nose 4A and negative copper nose 4B are powered on, the heating element 10 heats up. The positive copper nose 4A and negative copper nose 4B are input with a variable large current to control the temperature rise curve. The heat emitted by the heating element 10 is evenly conducted to the heated body 7 through the heat equalizing plate 8. The heated body 7 receives temperature feedback through the temperature sensing wire 6, realizing long-term precise temperature control and preventing the heated body 7 from overheating or underheating.

[0035] The heat insulator 5 reduces heat transfer and further reduces heat loss, while also reducing heat transfer to the base 2. The base 2 secures the entire pulse thermostatic heating device to other components.

[0036] The pulse heating precision control device also includes an active heat dissipation plate 9, which has a U-shaped structure that is laterally connected to the base 2 and extends downward to form a shielding structure. A folding plate is attached below the U-shaped structure, extending to the area below the heating element 10. The heating element 7 cures the ACF during the heating process.

[0037] In summary, the positive copper nose 4A and negative copper nose 4B receive the input current, which is then heated by the heating element 10 and transferred to the heated object 7. The heated object 7 receives temperature feedback via the temperature sensing wire 6, enabling precise temperature control at different temperatures. The heat insulator 5 isolates the heat generated by the heating element, protecting against heat loss and preventing heat transfer to the base. Simultaneously, the base also provides active heat dissipation, avoiding contact with other connecting components.

[0038] Currently, this novel pulse heating precision control device can fully achieve excellent results, with a high temperature level of 2µm and long-term 3-point temperature control of 1℃, thereby improving the yield of micro LED bonding products.

[0039] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural or procedural transformations made based on the contents of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. A pulse heating precision control device, characterized by, The application relates to a pulse heating precision control device. The device comprises: a base (2); a heat insulator (5) fixed to the bottom surface of the base (2); a positive copper nose (4A) and a negative copper nose (4B) respectively arranged on the two sides of the heat insulator (5); a heating body (10) electrically connected to the positive copper nose (4A) and the negative copper nose (4B) at two ends and having a first surface in contact with the bottom surface of the heat insulator (5); a uniform heating plate (8) attached to and fixed to the second surface of the heating body (10); 2. The pulse heating precision control device according to claim 1, wherein a temperature sensing wire (6) arranged on the uniform heating plate (8).

3. The pulse heating precision control device of claim 2, wherein, The base (2) has an upper surface heat dissipation structure and a lower surface heat dissipation structure, wherein the lower surface is the bottom surface of the base (2).

4. The pulse heating precision control device of claim 2, wherein, The upper surface heat dissipation structure is provided with a first heat dissipation channel arranged near the upper surface of the base (2), and the inlet and outlet of the first heat dissipation channel are respectively connected to a first air inlet interface (1A) and a first air outlet interface (1B).

5. The pulse heating precision control device of claim 1, wherein, The lower surface heat dissipation structure is provided with a second heat dissipation channel arranged near the lower surface of the base (2), and the inlet and outlet of the second heat dissipation channel are respectively connected to a second air inlet interface (3A) and a second air outlet interface (3B).

6. The pulse heating precision control device of claim 5, wherein, The pulse heating precision control device further comprises an active heat dissipation plate (9) having a U-shaped structure part, the U-shaped structure part is arranged on the side of the base (2) and downwardly extended to form a shielding structure. The U-shaped structure part is connected with a folded plate, and the folded plate extends to the area below the heating body (10).

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