Driving substrate
By employing a hollow coil and multiple long line segments at the via of the driving substrate, the problem of protrusion caused by the overflow of fluid conductive material is solved, ensuring the conductivity of the driving substrate and the integrity of the display layer.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2026-03-06
AI Technical Summary
During the fabrication of the driving substrate, fluid conductive material overflows at the via, forming protrusions that puncture the FPL display layer, causing display abnormalities.
The design employs a hollow coil and multiple long line segments, using coaxial arrangement and multi-point contact to control the coating of fluid conductive material, preventing overflow and ensuring conductivity and reliability.
It achieves precise control over the amount of fluid conductive material used, avoids the formation of front protrusions, and ensures the reliability of the circuit and the integrity of the display layer.
Smart Images
Figure CN223978810U_ABST
Abstract
Description
Technical Field
[0001] This application relates to an electronic paper display device, and more particularly to a driving substrate. Background Technology
[0002] like Figure 1 As shown, in electronic paper display devices, when a single-layer driving circuit is fabricated using a printing method, the relevant circuitry is printed on the back side of the driving substrate using a fluid conductive material and then cured. After the fluid conductive material has cured, the display driving layer is then printed on the front side of the driving substrate. However, as... Figure 1 and Figure 2 As shown, since there is a via B1 on the driving substrate that connects the back side of the circuit to the front side of the display driving layer, when the conductive circuit B2 is fluid-printed on the back side of the driving substrate, the solid base point B21 of the conductive circuit B2 will overflow at the via. This causes some of the fluid conductive material to enter the via B1 and flow through the via B1 to the front side of the driving substrate. After the fluid conductive material solidifies, this part of the fluid will form a protrusion B on the front side of the driving substrate. These protrusions B will cause the FPL (Front Panel Laminate) display layer to be punctured during subsequent processes, resulting in display abnormalities. Utility Model Content
[0003] This application provides a driving substrate that solves the problem that protrusions are formed on the front side of the driving substrate during the current fluid material printing process, which can damage the FPL display layer.
[0004] To solve the above-mentioned technical problems, this application is implemented as follows:
[0005] In a first aspect, a driving substrate is provided, comprising a substrate body, conductive lines, and a display driving layer. The substrate body includes a front side and a back side facing each other, and a via connecting the front and back sides. The conductive lines are printed on the back side of the substrate body. The conductive lines include a main line segment, a hollow coil connected to one end of the main line segment, and multiple long line segments located within the hollow coil. The hollow coil and the via are coaxially arranged. The multiple long line segments are spaced apart circumferentially along the via. One end of each long line segment is connected to the hollow coil, and the other end of each long line segment is connected to the via. The display driving layer is printed on the front side of the substrate body. The display driving layer corresponds to the conductive lines, and a portion of the display driving layer covers the multiple long line segments through the via.
[0006] In one embodiment, the substrate body uses a PET substrate.
[0007] In one embodiment, the hollow coil is circular.
[0008] In one embodiment, the width of the long line segment is the same as the width of the hollow coil.
[0009] In one embodiment, the conductive circuit further includes multiple short segments, which are spaced apart from multiple long segments along the circumference of the via. One end of each short segment is connected to a hollow coil, and the other end of each short segment has a certain gap with the via. Part of the display driving layer covers the multiple long segments and multiple short segments through the via.
[0010] In one embodiment, the gap between the other end of the short line segment and the via is between 0.3 mm and 0.5 mm.
[0011] In one embodiment, there are four long line segments and four short line segments, and the four long line segments and four short line segments are evenly spaced along the circumferential direction of the through hole.
[0012] In one embodiment, the width of the short line segment is the same as the width of the long line segment.
[0013] In one embodiment, the conductive lines are printed on the back of the substrate body using a fluid conductive material, including main lines, hollow coils, multiple long lines, and multiple short lines.
[0014] In one embodiment, it further includes: a flexible circuit board, one end of which is disposed on the back side of the substrate body and electrically connected to conductive lines.
[0015] In this embodiment, when printing conductive lines on the back side of the substrate body, hollow coils are used for coating at the via locations of the substrate body. Then, multiple long line segments connect the vias. This allows for precise control of the coating material, reduces the amount of coating material used, and prevents overflow of the coating material that could lead to protrusions on the front side of the driving substrate. Simultaneously, the conductive lines in this application achieve multi-point contact with the vias through multiple long line segments, ensuring line reliability. Attached Figure Description
[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:
[0017] Figure 1 This is a schematic diagram of the back side of the current driving substrate;
[0018] Figure 2 This is a cross-sectional schematic diagram of the vias on the current driving substrate;
[0019] Figure 3 This is a schematic diagram of the back side of the driving substrate of this application;
[0020] Figure 4This is a front view of the driving substrate of this application;
[0021] Figure 5 This is a cross-sectional schematic diagram of the long line segment printed at the via of the driving substrate of this application;
[0022] Figure 6 This is a cross-sectional schematic diagram of the display driving layer printed at the via of the driving substrate of this application;
[0023] Figure 7 This is another schematic diagram of the back side of the driving substrate of this application;
[0024] Figure 8 yes Figure 7 A magnified view of a portion of point S.
[0025] The following explanation is based on the accompanying diagram:
[0026] 1: Driving substrate; 2: Substrate body; 21: Front side; 22: Back side; 23: Through hole; 3: Conductive line; 31: Main line segment; 32: Hollow coil; 33: Long line segment; 34: Short line segment; 4: Display driving layer; 5: Flexible circuit board; A: Gap; B: Protrusion; B1: Through hole; B2: Conductive line; B21: Solid base point. Detailed Implementation
[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0028] In the description of this application, it should be understood that the terms "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0029] Please see Figure 3 and Figure 4These are, respectively, a back view and a front view of the driving substrate of this application; as shown, the driving substrate 1 of this embodiment is mainly used for display driving in electronic paper display devices, especially a BP (Back Plane) substrate using a fluid conductive material as the circuit. In this embodiment, the driving substrate 1 includes a substrate body 2, conductive lines 3, and a display driving layer 4. The substrate body 2 includes a front side 21 and a back side 22 facing each other, and a via 23 connecting the front side 21 and the back side 22. The substrate body 2 uses a PET substrate (Polyethylene Terephthalate Substrate). The conductive lines 3 are printed on the back side 22 of the substrate body 2, wherein... Figure 3 The diagram shows a schematic of four conductive lines 3 printed on the back side 22 of the substrate body 2, but this application is not limited thereto. The conductive lines 3 include a main line segment 31, a hollow coil 32 connected to one end of the main line segment 31, and multiple long lines 33 located inside the hollow coil 32.
[0030] Please see Figure 5 See also Figure 3 As shown, Figure 5 A cross-sectional schematic diagram of the printed long line segments at the vias of the driving substrate of this application is shown. As shown, the conductive lines 3 are printed with a main line segment 31, a hollow coil 32, and multiple long line segments 33 on the back side 22 of the substrate body 2 using a fluid conductive material. The hollow coil 32 is coaxially arranged with the via 23. The hollow coil 32 is circular. Multiple long line segments 33 are spaced apart along the circumference of the via 23. The width of the long line segments 33 is the same as the width of the hollow coil 32. One end of each long line segment 33 is connected to the hollow coil 32, and the other end is connected to the via 23. The width of each long line segment 33 is the same as the width of the hollow coil 32.
[0031] Please see Figure 6 See also Figures 3 to 5 As shown, Figure 6 This is a cross-sectional schematic diagram of the display driving layer printed at the vias of the driving substrate of this application; as shown, the display driving layer 4 is printed on the front side 21 of the substrate body 2. The display driving layer 4 corresponds to the conductive line 3, which means that a display driving layer 4 is disposed at the via 23 position of one conductive line 3. Part of the display driving layer 4 covers multiple long line segments 33 through the vias 23, thereby realizing the electrical connection between the conductive lines 3 on both sides of the front side 21 and back side 22 of the substrate body 2 and the display driving layer 4.
[0032] In this embodiment, when the conductive lines 3 are printed on the back side 22 of the substrate body 2, a hollow coil 32 is used to coat the via 23 position of the substrate body 2 with a fluid conductive material. Then, multiple long line segments 33 are connected to the via 23. In this way, the fluid conductive material can be precisely controlled, the amount of fluid conductive material used can be reduced, and overflow of fluid conductive material can be prevented, which would cause a protrusion on the front side 21 of the driving substrate. At the same time, the conductive lines 3 of the driving substrate 1 in this embodiment can make multiple contacts with the via 23 through multiple long line segments 33. This ensures that even when the hollow coil 32 is printed off-center, the conductive lines 3 can still make contact with the via 23 through at least one of the long line segments 33, thus ensuring the conductivity of the lines and improving the reliability of the lines.
[0033] For further details, please refer to Figure 7 and Figure 8 This is another schematic diagram of the back side of the driving substrate of this application. Figure 8 yes Figure 7 A partial enlarged view at point S; as shown, the conductive line 3 also includes multiple short segments 34. Multiple short segments 34 are printed on the back side 22 of the substrate body 2 using a fluid conductive material. The multiple short segments 34 and multiple long segments 33 are evenly spaced along the circumferential direction of the via 23. The width of the short segments 34 is the same as the width of the long segments 33. One end of each short segment 34 is connected to a hollow coil 32. A certain gap A exists between the other end of each short segment 34 and the via 23, with the gap A being between 0.3 mm and 0.5 mm. A portion of the display driving layer 4 covers the multiple long segments 33 and multiple short segments 34 through the via 23. In this embodiment, there are four long line segments 33 and four short line segments 34. The four long line segments 33 and the four short line segments 34 are evenly spaced along the circumference of the through hole 23. In this way, no matter which direction the hollow coil 32 is deflected, it can be ensured that the conductive line 3 contacts the through hole 23 through at least three line segments, so as to ensure the conductivity of the line and improve the reliability of the line.
[0034] In this embodiment, the driving substrate 1 further includes a flexible printed circuit board (FPC) 5. One end of the flexible circuit board 5 is disposed on the back side 22 of the substrate body 2 and is electrically connected to the conductive lines 3. The flexible circuit board 5 is a printed circuit made of a flexible insulating substrate, mainly used for connecting the conductive lines 3 on the substrate body 2 to external driving circuits.
[0035] In summary, this application provides a driving substrate. When printing conductive lines on the back side of the substrate body, hollow coils are used for coating at the via locations of the vias in the substrate body. Then, multiple long line segments connect the vias. This allows for precise control of the coating material, reduces the amount of coating material used, and prevents coating material overflow that could lead to protrusions on the front side of the driving substrate. Furthermore, the conductive lines in this application achieve multi-point contact with the vias through multiple long line segments, ensuring circuit reliability.
[0036] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.
[0037] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
Claims
1. A drive substrate, characterized by, The application relates to a substrate body comprising opposite front and back surfaces and a through hole connecting the front and back surfaces; a conductive circuit printed on the back surface of the substrate body, the conductive circuit comprising a main line segment, a hollow coil connected to one end of the main line segment, and a plurality of long line segments located in the hollow coil, the hollow coil being coaxially arranged with the through hole, the plurality of long line segments being arranged along the circumference of the through hole, one end of the plurality of long line segments being connected to the hollow coil, and the other end of the plurality of long line segments being connected to the through hole; and a display driving layer printed on the front surface of the substrate body, the display driving layer corresponding to the conductive circuit, and part of the display driving layer covering the plurality of long line segments through the through hole. The substrate body is made of PET. The hollow coil is circular. The long line segments have the same width as the hollow coil.
2. The drive substrate according to claim 1, wherein The conductive circuit further comprises a plurality of short line segments, the plurality of short line segments being arranged along the circumference of the through hole, one end of the plurality of short line segments being connected to the hollow coil, and the other end of the plurality of short line segments being spaced apart from the through hole, and part of the display driving layer covering the plurality of long line segments and the plurality of short line segments through the through hole.
3. The drive substrate according to claim 1, wherein The gap between the other end of the short line segments and the through hole is between 0.3 mm and 0.5 mm.
4. The drive substrate according to claim 1, wherein The number of the plurality of long line segments is four, and the number of the plurality of short line segments is four, the four long line segments and the four short line segments being uniformly arranged along the circumference of the through hole.
5. The drive substrate according to claim 1, wherein The short line segments have the same width as the long line segments.
6. The drive substrate according to claim 5, wherein The conductive circuit is printed on the back surface of the substrate body by using a fluid conductive material.
7. The drive substrate according to claim 5, wherein The application further relates to a flexible circuit board arranged on the back surface of the substrate body and electrically connected to the conductive circuit.
8. The drive substrate according to claim 5, wherein 9. The drive substrate according to claim 5, wherein 10. The drive substrate according to claim 1, wherein