Substrate jointing device for substrate processing
By introducing an ejection component and a stabilization structure into the substrate bonding device, the problem of inconvenient substrate handling is solved, and automated ejection and improved safety are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2026-03-06
AI Technical Summary
Existing substrate bonding devices are inconvenient for material removal, requiring manual insertion into the mold to remove the substrate, which is time-consuming, labor-intensive, and affects safety.
A substrate bonding device including an ejection assembly is designed. The ejection assembly consists of a buffer spring and a buffer plate. The automatic ejection of the substrate is facilitated by a buffer reset mechanism. Combined with the cooperation of a slide, a slider, a guide block and a guide rod, the movement stability and support stability are ensured.
It enables automatic ejection of the substrate, reduces manual operation time, improves safety and efficiency, and avoids the problems of shaking and falling off the substrate during the removal process.
Smart Images
Figure CN223978825U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of substrate processing, and in particular to a substrate bonding device for substrate processing. Background Technology
[0002] The substrate is the basic material for manufacturing PCBs. Generally, the substrate is a copper-clad laminate. In the manufacturing process of single-sided and double-sided printed circuit boards, selective hole processing, chemical copper plating, electroplating, etching, and other processes are carried out on the substrate material - copper-clad laminate - to obtain the required circuit pattern. The manufacturing of another type of multilayer printed circuit board also uses a thin copper-clad laminate as the base, and the conductive pattern layer and the prepreg are alternately laminated and bonded together in one step to form three or more conductive pattern layers interconnected. It has three functions: conductivity, insulation, and support. The performance, quality, processability, manufacturing cost, and manufacturing level of the printed circuit board largely depend on the substrate material. In the substrate processing process, substrate bonding devices are required.
[0003] However, existing technologies have some problems: existing substrate bonding devices are inconvenient for material handling. When using the substrate bonding device, the substrate cannot be ejected and needs to be manually removed from the mold, which is time-consuming, labor-intensive, and affects safety. Therefore, it is necessary to provide a substrate bonding device for substrate processing to solve the above-mentioned technical problems. Utility Model Content
[0004] This utility model provides a substrate bonding device for substrate processing, which solves the technical problems of existing substrate bonding devices, such as inconvenience in material handling, inability to eject the substrate when using the substrate bonding device, the need to manually insert it into the mold to remove it, which is time-consuming, labor-intensive and affects safety.
[0005] To solve the above-mentioned technical problems, this utility model provides a substrate bonding device for substrate processing, comprising:
[0006] A base, with a pressing mold fixedly connected to the upper end of the base, a placement plate provided above the pressing mold, a support plate provided above the base, a hydraulic rod fixedly connected to the upper end of the support plate, the output end of the hydraulic rod passing through to the lower end of the support plate and fixedly connected to a movable plate, and a pressing moving mold fixedly connected to the lower end of the movable plate.
[0007] An ejector assembly, located in the base, is used for buffering and resetting the placement plate.
[0008] Preferably, the ejection assembly includes a buffer spring, and a buffer plate is fixedly connected to the upper end of the buffer spring.
[0009] Preferably, buffer rods are fixedly connected around the upper edge of the buffer plate, and the upper ends of the buffer rods penetrate into the interior of the pressing mold and are fixedly connected to the lower end of the placement plate.
[0010] Preferably, guide blocks are fixedly connected to the front and rear ends of both sides of the buffer plate, and guide rods are slidably connected inside the guide blocks, with the guide rods being vertically fixed inside the base.
[0011] Preferably, side plates are fixedly connected to both sides of the lower end of the support plate, and the lower end of the side plates is fixedly connected to the upper end of the base.
[0012] Preferably, a groove is provided on one side of the side plate, and a slider is slidably connected inside the groove. One side of the slider is fixedly connected to both sides of the movable plate.
[0013] Compared with related technologies, the substrate bonding device for substrate processing provided by this utility model has the following advantages:
[0014] This utility model provides a substrate joining device for substrate processing. Through the cooperation of the sliding groove and the slider, the moving plate is moved smoothly during use, preventing the moving plate from shaking easily during use.
[0015] This utility model provides a substrate bonding device for substrate processing. The side plate provides a fixed and stable support plate during use, preventing the support plate from falling off easily.
[0016] This utility model provides a substrate bonding device for substrate processing. Through the cooperation of guide blocks and guide rods, the buffer plate is moved smoothly during use, preventing the buffer plate from shaking during use. Attached Figure Description
[0017] Figure 1 A schematic diagram of a preferred embodiment of a substrate bonding device for substrate processing provided by this utility model;
[0018] Figure 2 This is a partial cross-sectional view of the pressing mold structure of this utility model;
[0019] Figure 3 This is a cross-sectional view of the base structure of this utility model.
[0020] The following are the labels in the diagram: 1. Base; 2. Pressing mold; 3. Placement plate; 4. Support plate; 5. Hydraulic rod; 6. Moving plate; 7. Pressing moving mold; 8. Ejection assembly; 81. Buffer spring; 82. Buffer plate; 83. Buffer rod; 9. Guide block; 10. Guide rod; 11. Side plate; 12. Slide groove; 13. Slider. Detailed Implementation
[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.
[0022] Example 1:
[0023] Please see Figure 1-3 This utility model provides a technical solution: a substrate bonding device for substrate processing, comprising: a base 1, a pressing mold 2 fixedly connected to the upper end of the base 1, a placement plate 3 disposed above the pressing mold 2, a support plate 4 disposed above the base 1, a hydraulic rod 5 fixedly connected to the upper end of the support plate 4, the output end of the hydraulic rod 5 extending through to the lower end of the support plate 4 and fixedly connected to a moving plate 6, a pressing moving mold 7 fixedly connected to the lower end of the moving plate 6, and an ejection assembly 8 located in the base 1, the ejection assembly 8 being used for buffering and resetting the placement plate 3.
[0024] In this embodiment, the substrate component to be pressed is first placed on the placement plate 3. At this time, the hydraulic rod 5 drives the moving plate 6 to move downward. The moving plate 6 drives the slider 13 to slide in the slide groove 12. At the same time, the moving plate 6 drives the pressing moving mold 7 to press and press the placement plate 3 in the pressing fixed mold 2. The placement plate 3 is buffered on the buffer plate 82 by the buffer rod 83.
[0025] Example 2:
[0026] Please see Figure 1-3 As shown, based on Embodiment 1, this utility model provides a technical solution: the ejection assembly 8 includes a buffer spring 81, a buffer plate 82 is fixedly connected to the upper end of the buffer spring 81, a buffer rod 83 is fixedly connected to the four sides of the upper end of the buffer plate 82, the upper end of the buffer rod 83 penetrates into the interior of the pressing mold 2 and is fixedly connected to the lower end of the placement plate 3, guide blocks 9 are fixedly connected to the front and rear ends of both sides of the buffer plate 82, a guide rod 10 is slidably connected inside the guide block 9, the guide rod 10 is vertically fixedly connected to the interior of the base 1, side plates 11 are fixedly connected to both sides of the lower end of the support plate 4, the lower end of the side plate 11 is fixedly connected to the upper end of the base 1, a groove 12 is opened on one side of the side plate 11, a slider 13 is slidably connected inside the groove 12, and one side of the slider 13 is fixedly connected to both sides of the moving plate 6.
[0027] In this embodiment: the buffer plate 82 drives the guide block 9 to slide on the guide rod 10, and the synchronous buffer plate 82 is buffered on the buffer spring 81. When the pressing moving mold 7 and the pressing fixed mold 2 are pressed and reset, the buffer spring 81 drives the placement plate 3 to reset, so that the operator can take out the base plate.
[0028] The working principle of the substrate bonding device for substrate processing provided by this utility model is as follows:
[0029] Implementation steps for the first innovation point:
[0030] Step 1: First, the pressed base plate is placed on the placement plate 3. At this time, the hydraulic rod 5 drives the moving plate 6 to move downward, and the moving plate 6 drives the slider 13 to slide in the slide groove 12.
[0031] Step 2: Simultaneously, the moving plate 6 drives the pressing moving mold 7 to press and press the placement plate 3 in the pressing fixed mold 2. The placement plate 3 is buffered on the buffer plate 82 by the buffer rod 83.
[0032] Implementation steps for the second innovation point:
[0033] Step 1: The buffer plate 82 drives the guide block 9 to slide on the guide rod 10, and the buffer plate 82 is simultaneously buffered by the buffer spring 81;
[0034] Step 2: After the pressing moving mold 7 and the pressing fixed mold 2 are pressed and reset, the buffer spring 81 drives the placement plate 3 to reset, making it easier for the operator to remove the base plate.
[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A substrate bonding apparatus for substrate processing, characterized in that: Include: The base (1), the upper end of the base (1) is fixedly connected with the pressing die (2), the upper of the pressing die (2) is provided with the placing plate (3), the upper of the base (1) is provided with the support plate (4), the upper end of the support plate (4) is fixedly connected with the hydraulic rod (5), the output end of the hydraulic rod (5) penetrates to the lower end of the support plate (4) and is fixedly connected with the moving plate (6), the lower end of the moving plate (6) is fixedly connected with the pressing movable die (7); The ejector assembly (8) is located in the base (1), and the ejector assembly (8) is used for buffering reset of the placing plate (3).
2. The substrate processing substrate bonding apparatus according to claim 1, wherein The ejector assembly (8) includes a buffer spring (81), and the upper end of the buffer spring (81) is fixedly connected with a buffer plate (82).
3. The substrate processing substrate bonding apparatus according to claim 2, wherein The buffer plate (82) is fixedly connected with a buffer rod (83) around the upper end, the upper end of the buffer rod (83) penetrates into the inside of the pressing die (2) and is fixedly connected with the lower end of the placing plate (3).
4. The substrate processing substrate bonding apparatus according to claim 2, wherein The front end and the rear end of the buffer plate (82) on both sides are fixedly connected with guide blocks (9), the inside of the guide blocks (9) is slidably connected with guide rods (10), and the guide rods (10) are vertically fixedly connected in the inside of the base (1).
5. The substrate processing substrate bonding apparatus according to claim 1, wherein The lower end of the support plate (4) is fixedly connected with side plates (11) on both sides, and the lower end of the side plates (11) is fixedly connected with the upper end of the base (1).
6. The substrate processing substrate bonding apparatus according to claim 5, wherein One side of the side plate (11) is provided with a sliding groove (12), the inside of the sliding groove (12) is slidably connected with a sliding block (13), and one side of the sliding block (13) is fixedly connected with both sides of the moving plate (6).