PCB bonding pad protection system

Abstract

The utility model provides a PCB bonding pad protection system comprising a transport line, a bonding pad protection device is placed on the transport line, and the bonding pad protection device comprises a magnetic type buckle; a production line is arranged on the side close to the conveying line, and PCBs are placed on the production line and driven by the production line to move; disassembling and assembling mechanisms are arranged at the two ends, close to the conveying line, of the production line correspondingly and used for changing the adsorption state of the magnetic attraction type buckles so that the magnetic attraction type buckles can adsorb or loosen the PCBs. When the dismounting and mounting mechanism is used for mounting and dismounting the bonding pad protection device, the dismounting and mounting mechanism adsorbs or loosens the magnetic suction type buckle by powering on and powering off the dismounting and mounting mechanism, so that the adsorption state of the magnetic suction type buckle is changed, the magnetic suction type buckle can be clamped into a PCB or separated from the PCB, and automatic mounting and automatic dismounting of the PCB and the bonding pad protection device are achieved. The production efficiency is greatly improved, and meanwhile, the recyclable bonding pad protection device is used for protecting the PCB during welding, so that the cost is reduced, and the product quality is also improved.

Description

Technical Field

[0001] This utility model relates to the field of air conditioning technology, and in particular to a PCB pad protection system. Background Technology

[0002] The production of the controller motherboard is an important part of air conditioner production. According to the production technology requirements, the current production process requires that some electronic components be inspected and assembled first, then wave soldered, then the power module is inserted, and finally the power module is soldered using selective soldering.

[0003] In the aforementioned production situation, during wave soldering, solder may stick to the power module pads. To avoid this, an automatic adhesive tape application process is currently used to protect the power module pads. However, this increases production costs, manpower, and potential quality issues.

[0004] Therefore, there is a need for a reusable pad protection device to protect the PCB pad positions, while also enabling automatic disassembly and installation of the pad protection device. Utility Model Content

[0005] To overcome the problems existing in related technologies, the purpose of this utility model is to provide a PCB pad protection system. This system uses a reusable pad protection device to protect the PCB pad positions, and can automatically disassemble and install the pad protection device.

[0006] A PCB pad protection system includes a transport line with a pad protection device placed on the transport line, the pad protection device including a magnetic snap-fit; a production line is provided near one side of the transport line, the PCB is placed on the production line, and the production line drives the PCB to move; a disassembly mechanism is provided at both ends of the production line near the transport line, the disassembly mechanism being used to change the adsorption state of the magnetic snap-fit, so that the magnetic snap-fit ​​adsorbs or releases the PCB.

[0007] In a preferred embodiment of this invention, the magnetic buckle includes a sliding component and a connecting rod component. The sliding component is hinged to the connecting rod component, and the sliding component is used to drive the connecting rod component to move so as to stretch or fold the connecting rod component.

[0008] In a preferred embodiment of this invention, the sliding assembly includes a guide post, on which a slider is sleeved; the two sides of the slider are hinged to the connecting rod assembly, and the slider moves along the axial direction of the guide post to change the working state of the connecting rod assembly.

[0009] In a preferred embodiment of this invention, the sliding assembly further includes a fixing block and a snap-fit ​​housing, the fixing block being fixedly connected to the inner side of the snap-fit ​​housing, and the guide post penetrating through the fixing block.

[0010] In a preferred embodiment of this invention, the linkage assembly includes a first linkage and a second linkage. The first linkage has a first connecting end and a second connecting end on its two sides, and the second linkage has a third connecting end and a fourth connecting end on its two sides. The first connecting end is hinged to the slider, the second connecting end is hinged to the third connecting end, and the fourth connecting end is hinged to the fixing block.

[0011] In a preferred embodiment of this invention, the pad protection device further includes a protective fixture, into which the magnetic snap-fit ​​is inserted, and the protective fixture is used to protect the pads of the PCB.

[0012] In a preferred embodiment of this invention, guide mechanisms are provided at both ends of the transport line. Each guide mechanism includes two guide frames arranged opposite to each other, with a discharge port formed between the two guide frames.

[0013] In a preferred embodiment of this invention, a cylinder clamp is provided near the discharge port, and a gripper cylinder is connected below the cylinder clamp; the gripper cylinder is connected to a cylinder connecting plate, and a lifting cylinder is connected below the cylinder connecting plate.

[0014] In a preferred embodiment of this utility model, gantry supports are connected to both sides of the production line, and the disassembly and assembly mechanism is connected to the gantry supports; the disassembly and assembly mechanism includes a push cylinder, which is mounted on the gantry supports; a cylinder mounting plate is connected below the push cylinder, and an electromagnet is provided on the side of the cylinder mounting plate away from the push cylinder.

[0015] In a preferred embodiment of this invention, a wave soldering device is also included. The production line passes through the wave soldering device, and the disassembly and assembly mechanism is provided on both sides of the wave soldering device. The wave soldering device is used to perform wave soldering on the pads of the power module on the PCB.

[0016] In a preferred embodiment of this invention, a blocking cylinder is provided above the production line. The blocking cylinder is used to block two adjacent PCBs on the production line to control the flow time interval of the PCB boards.

[0017] The beneficial effects of this utility model are as follows:

[0018] This utility model provides a PCB pad protection system, including a transport line on which a pad protection device is placed. The pad protection device includes a magnetic snap-fit. A production line is located near one side of the transport line, on which a PCB is placed and moved. Disassembly / removal mechanisms are respectively located at both ends of the production line near the transport line. These mechanisms are used to change the magnetic snap-fit's adsorption state, causing it to adsorb or release the PCB. A first end of the transport line is near a first disassembly / removal mechanism, and a second end is near a second disassembly / removal mechanism. The first disassembly / removal mechanism is used to install the pad protection device onto the PCB, and the second disassembly / removal mechanism is used to remove the pad protection device from the PCB. The transport line moves the pad protection device from the second end to the first end, allowing the removed pad protection device to be reused on the PCB, significantly reducing production costs. When the disassembly and assembly mechanism installs or removes the pad protection device on the PCB, the mechanism is powered on and off to attract or release the magnetic clips, changing their attraction state so that they can be engaged with or detached from the PCB. This achieves automatic installation and disassembly of the PCB and pad protection device, significantly improving production efficiency. At the same time, the pad protection device protects the PCB, improving product quality. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the PCB pad protection system of this utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the transportation line and production line of this utility model;

[0021] Figure 3 This is a structural schematic diagram of the disassembly and assembly mechanism of this utility model;

[0022] Figure 4 This is a schematic diagram of the guide mechanism and cylinder clamp of this utility model;

[0023] Figure 5 This is a schematic diagram of the pad protection device of this utility model;

[0024] Figure 6 This is a schematic diagram of the magnetic buckle of this utility model in its unattached state;

[0025] Figure 7 This is a schematic diagram of the magnetic buckle of this utility model in the adsorption state.

[0026] Reference numerals: 1. Transport line; 2. Pad protection device; 3. Magnetic buckle; 4. Production line; 5. PCB; 6. Assembly / disassembly mechanism; 7. Sliding assembly; 8. Linkage assembly; 9. Guide column; 10. Slider; 11. Fixing block; 12. Buckle housing; 13. First link; 14. Second link; 15. Protective fixture; 16. Guide mechanism; 17. Guide frame; 18. Discharge port; 19. Cylinder clamp; 20. Grip cylinder; 21. Cylinder connecting plate; 22. Lifting cylinder; 23. Gantry bracket; 24. Pushing cylinder; 25. Cylinder mounting plate; 26. Electromagnet; 27. Wave soldering device; 28. Blocking cylinder. Detailed Implementation

[0027] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0028] Example 1

[0029] like Figures 1 to 7 As shown, this embodiment provides a PCB pad protection system, including a transport line 1, on which a pad protection device 2 is placed, the pad protection device 2 including a magnetic snap-fit ​​3; a production line 4 is arranged near one side of the transport line 1, on which a PCB 5 is placed, and the production line 4 drives the PCB 5 to move; a disassembly and assembly mechanism 6 is respectively arranged at both ends of the production line 4 near the transport line 1, the disassembly and assembly mechanism 6 is used to change the adsorption state of the magnetic snap-fit ​​3, so that the magnetic snap-fit ​​3 adsorbs or releases the PCB 5.

[0030] Transport line 1 is an arc-shaped transport line, with both ends located below production line 4. The first end of transport line 1 is close to the first disassembly / assembly mechanism 6, and the second end is close to the second disassembly / assembly mechanism 6. The first disassembly / assembly mechanism 6 is used to install the pad protection device 2, and the second disassembly / assembly mechanism 6 is used to disassemble the pad protection device 2. Transport line 1 is responsible for conveying the pad protection device 2 disassembled by the second disassembly / assembly mechanism 6 from the second end of transport line 1 to the first end of transport line 1, so that the pad protection device 2 can be installed and used by the first disassembly / assembly mechanism 6, allowing the pad protection device 2 to be reused by PCB 5.

[0031] The production line 4 is equipped with a first disassembly and assembly station and a second disassembly and assembly station. The first disassembly and assembly mechanism 6 is located above the first disassembly and assembly station, and the second disassembly and assembly mechanism 6 is located above the second disassembly and assembly station.

[0032] When the production line 4 moves the PCB5 to the first assembly / disassembly station, the first assembly / disassembly mechanism 6 moves downward until it contacts the magnetic clip 3 of the pad protection device 2. At this time, power is supplied to the first assembly / disassembly mechanism 6, which then begins to attract the magnetic clip 3, changing its state from unattached to attracted. When the magnetic clip 3 is in the attracted state, its position changes; it changes from a released state to a retracted state, allowing it to directly snap into the PCB5. After the magnetic clip 3 is in the PCB5, power is de-energized to the first assembly / disassembly mechanism 6, and it no longer attracts the magnetic clip 3, changing its state from attracted to unattached. When the magnetic snap-on clip 3 is not in the adsorption state, the magnetic snap-on clip 3 returns to its original position and changes from the retracted state to the released state, so that the magnetic snap-on clip 3 is directly fixed on the PCB5 after being inserted into the PCB5, thereby fixing the pad protection device 2 on the PCB5.

[0033] When the production line 4 moves the PCB5 with the pad protection device 2 fixed on it to the second disassembly / reassembly station, the second disassembly / reassembly mechanism 6 moves downward until it contacts the magnetic clip 3 of the pad protection device 2 fixed on the PCB5. At this time, power is supplied to the second disassembly / reassembly mechanism 6, and the mechanism begins to attract the magnetic clip 3. The magnetic clip 3 changes from an unattracted state to an attracted state, and then from a released state to a retracted state, causing it to detach from the PCB5. After the magnetic clip 3 detaches from the PCB5, power is cut off to the second disassembly / reassembly mechanism 6, and it stops attracting the magnetic clip 3. The clip 3 changes from an attracted state to a non-attracted state. Under the action of gravity, the pad protection device 2 falls directly onto the second end of the transport line 1. The transport line 1 transports the pad protection device 2 removed from the second disassembly / reassembly station to the first end of the transport line 1 for reuse on the PCB5 at the first disassembly / reassembly station.

[0034] This embodiment of a PCB pad protection system includes a transport line 1, on which a pad protection device 2 is placed. The pad protection device 2 includes a magnetic snap-fit ​​3. A production line 4 is arranged near one side of the transport line 1, on which a PCB 5 is placed, and the production line 4 drives the PCB 5 to move. Disassembly and assembly mechanisms 6 are respectively arranged at both ends of the production line 4 near the transport line 1. The disassembly and assembly mechanisms 6 are used to change the adsorption state of the magnetic snap-fit ​​3, so that the magnetic snap-fit ​​3 adsorbs or releases the PCB 5. A first end of the transport line 1 is close to a first disassembly and assembly mechanism 6, and a second end of the transport line 1 is close to a second disassembly and assembly mechanism 6. The first disassembly and assembly mechanism 6 is used to install the pad protection device 2 on the PCB 5, and the second disassembly and assembly mechanism 6 is used to remove the pad protection device 2 from the PCB 5. The conveyor line 1 transports the pad protection device 2 from the second end of the conveyor line 1 to the first end of the conveyor line 1, allowing the pad protection device 2 removed from the PCB 5 to be reused by the PCB 5, significantly reducing production costs. When the disassembly and assembly mechanism 6 installs or removes the pad protection device 2 from the PCB 5, by energizing and de-energizing the disassembly and assembly mechanism 6, the magnetic latch 3 is attracted or released, changing the attraction state of the magnetic latch 3 so that the magnetic latch 3 can be engaged with or detached from the PCB 5, thereby realizing the automatic installation and disassembly of the PCB 5 and the pad protection device 2, greatly improving production efficiency. At the same time, the pad protection device 2 protects the PCB 5, improving product quality.

[0035] Example 2

[0036] like Figures 1 to 7 As shown, this embodiment provides a PCB pad protection system, including a transport line 1, on which a pad protection device 2 is placed, the pad protection device 2 including a magnetic snap-fit ​​3; a production line 4 is arranged near one side of the transport line 1, on which a PCB 5 is placed, and the production line 4 drives the PCB 5 to move; a disassembly and assembly mechanism 6 is respectively arranged at both ends of the production line 4 near the transport line 1, the disassembly and assembly mechanism 6 is used to change the adsorption state of the magnetic snap-fit ​​3, so that the magnetic snap-fit ​​3 adsorbs or releases the PCB 5.

[0037] The magnetic buckle 3 includes a sliding component 7 and a connecting rod assembly 8. The sliding component 7 is hinged to the connecting rod assembly 8. The sliding component 7 is used to drive the connecting rod assembly 8 to move, so as to stretch or fold the connecting rod assembly 8.

[0038] The sliding assembly 7 includes a guide post 9, on which a slider 10 is sleeved; the two sides of the slider 10 are hinged to the connecting rod assembly 8, and the slider 10 moves along the axial direction of the guide post 9 to change the working state of the connecting rod assembly 8.

[0039] The sliding assembly 7 also includes a fixing block 11 and a snap-fit ​​housing 12. The fixing block 11 is fixedly connected to the inner side of the snap-fit ​​housing 12, and the guide post 9 passes through the fixing block 11.

[0040] The linkage assembly 8 includes a first linkage 13 and a second linkage 14. The first linkage 13 has a first connecting end and a second connecting end on its two sides, and the second linkage 14 has a third connecting end and a fourth connecting end on its two sides. The first connecting end is hinged to the slider 10, the second connecting end is hinged to the third connecting end, and the fourth connecting end is hinged to the fixing block 11.

[0041] The pad protection device 2 also includes a protection fixture 15, into which the magnetic buckle 3 is inserted. The protection fixture 15 is used to protect the pads of the PCB 5.

[0042] When the magnetic snap-on buckle 3 is attracted, the slider 10 moves away from the fixed block 11 along the axial direction of the guide post 9. The movement of the slider 10 drives the first connecting rod 13, which in turn drives the second connecting rod 14, until the first connecting rod 13 and the second connecting rod 14 are in the same vertical direction. At this point, the first connecting rod 13 and the second connecting rod 14 are fully stretched, and the slider 10 reaches its maximum movement distance. The slider 10 is then in a state of equilibrium and is stationary. The magnetic snap-on buckle 3 is in the attracted state, and the position of the connecting rod assembly 8 changes. The second connecting end of the first connecting rod 13 and the third connecting end of the second connecting rod 14 are displaced from the outside of the snap-on housing 12 to the inside of the snap-on housing 12, allowing the magnetic snap-on buckle 3 to pass through the mounting hole of the PCB 5.

[0043] When the magnetic snap-on buckle 3 disengages, the slider 10 moves along the guide post 9 towards the fixing block 11 under the action of gravity. The slider 10 drives the first connecting rod 13 and the second connecting rod 14 to move until the first connecting rod 13 and the second connecting rod 14 fold to the minimum angle. The slider 10 stops moving, and the working state of the magnetic snap-on buckle 3 is the non-attached state. The position of the connecting rod assembly 8 changes, and the second connecting end of the first connecting rod 13 and the third connecting end of the second connecting rod 14 are displaced from the inside of the snap-on housing 12 to the outside of the snap-on housing 12, so that the magnetic snap-on buckle 3 can be directly fixed on the PCB5 after passing through the mounting hole of the PCB5.

[0044] The magnetic snap-fit ​​3 has a columnar structure. The snap-fit ​​housing 12 of the magnetic snap-fit ​​3 is also equipped with a positioning post, located on the side of the snap-fit ​​housing 12 away from the fixing block 11. The protective fixture 15 has positioning holes, into which the positioning post is inserted to fix the magnetic snap-fit ​​3 onto the protective fixture 15. After the magnetic snap-fit ​​3 is snapped into the PCB 5, the magnetic snap-fit ​​3 causes the protective fixture 15 to be fixed onto the PCB 5, thus protecting the solder pads of the PCB 5.

[0045] The magnetic buckle 3 in this embodiment includes a sliding component 7 and a connecting rod component 8. The sliding component 7 is hinged to the connecting rod component 8. The sliding component 7 is used to drive the connecting rod component 8 to move, so as to stretch or fold the connecting rod component 8.

[0046] The sliding assembly 7 includes a guide post 9, on which a slider 10 is sleeved; the two sides of the slider 10 are hinged to the connecting rod assembly 8, and the slider 10 moves along the axial direction of the guide post 9 to change the working state of the connecting rod assembly 8. The sliding assembly 7 also includes a fixing block 11 and a snap-fit ​​housing 12, the fixing block 11 being fixedly connected to the inner side of the snap-fit ​​housing 12, and the guide post 9 passing through the fixing block 11. The connecting rod assembly 8 includes a first connecting rod 13 and a second connecting rod 14, the first connecting rod 13 having a first connecting end and a second connecting end on its two sides, and the second connecting rod 14 having a third connecting end and a fourth connecting end on its two sides; the first connecting end is hinged to the slider 10, the second connecting end is hinged to the third connecting end, and the fourth connecting end is hinged to the fixing block 11. The pad protection device 2 also includes a protective fixture 15, the magnetic snap-fit ​​3 being inserted into the protective fixture 15, and the protective fixture 15 being used to protect the pads of the PCB 5. When the magnetic snap-on clip 3 is attracted, the sliding component 7 drives the connecting rod assembly 8 to move upward, displacing the position of the connecting rod assembly 8 from the outside of the snap-on housing 12 to the inside of the snap-on housing 12, allowing the magnetic snap-on clip 3 to snap into the PCB 5. Then, the magnetic snap-on clip 3 is released, and the sliding component 7, under the influence of gravity, drives the connecting rod assembly 8 downward, returning it to its initial position. The position of the connecting rod assembly 8 is displaced from the inside of the snap-on housing 12 to the outside of the snap-on housing 12, so that the magnetic snap-on clip 3 is directly fixed to the PCB 5 after snapping into it, thereby protecting the solder pads of the PCB 5.

[0047] Example 3

[0048] like Figures 1 to 7As shown, this embodiment provides a PCB pad protection system, including a transport line 1, on which a pad protection device 2 is placed, the pad protection device 2 including a magnetic snap-fit ​​3; a production line 4 is arranged near one side of the transport line 1, on which a PCB 5 is placed, and the production line 4 drives the PCB 5 to move; a disassembly and assembly mechanism 6 is respectively arranged at both ends of the production line 4 near the transport line 1, the disassembly and assembly mechanism 6 is used to change the adsorption state of the magnetic snap-fit ​​3, so that the magnetic snap-fit ​​3 adsorbs or releases the PCB 5.

[0049] The two ends of the transport line 1 are provided with guiding mechanisms 16, and the guiding mechanism 16 includes two guide frames 17 arranged opposite to each other, and a discharge port 18 is formed between the two guide frames 17.

[0050] A cylinder clamp 19 is provided near the discharge port 18, and a gripper cylinder 20 is connected below the cylinder clamp 19; the gripper cylinder 20 is connected to a cylinder connecting plate 21, and a lifting cylinder 22 is connected below the cylinder connecting plate 21.

[0051] The guide frame 17 includes a vertical section and a bent section, which are connected or integrally formed. The first end of the bent section is connected to the side wall of the transport line 1, and the second end of the bent section is connected to the vertical section. A support rod is also connected to the side of the vertical section near the side wall of the transport line 1. The first end of the support rod is connected to the side wall of the transport line 1, and the second end of the support rod is connected to the side wall of the vertical section.

[0052] When the conveyor line 1 moves the pad protection device 2 to the guide mechanism 16, the guide frame 17 guides the pad protection device 2. The pad protection device 2 moves along the direction of the guide frame 17, passing through the bending part and the vertical part in sequence. The bending part guides the pad protection device 2 to the vertical part, and the vertical part guides the pad protection device 2 to the discharge port 18 until the pad protection device 2 moves to the discharge port 18.

[0053] When the pad protection device 2 is located at the discharge port 18, the gripper cylinder 20 is activated, driving the cylinder clamp 19 to move horizontally to clamp the pad protection device 2. After the cylinder clamp 19 clamps the pad protection device 2, the lifting cylinder 22 is activated, driving the cylinder connecting plate 21 to move upward. The cylinder connecting plate 21 drives the gripper cylinder 20 to move upward, and the gripper cylinder 20 then drives the cylinder clamp 19 to move upward, thus moving the pad protection device 2 towards the first assembly / disassembly station.

[0054] In this embodiment, guide mechanisms 16 are provided at both ends of the transport line 1. Each guide mechanism 16 includes two opposing guide frames 17, forming a discharge port 18 between the two guide frames 17. A cylinder clamp 19 is provided near the discharge port 18, and a gripper cylinder 20 is connected below the cylinder clamp 19. The gripper cylinder 20 is connected to a cylinder connecting plate 21, and a lifting cylinder 22 is connected below the cylinder connecting plate 21. When the transport line 1 moves the solder pad protection device 2 to the guide mechanism 16, the two guide frames 17 guide the solder pad protection device 2, guiding it to the discharge port 18. When the pad protection device 2 is located at the discharge port 18, the gripper cylinder 20 is activated, driving the cylinder clamp 19 to move horizontally and clamp the pad protection device 2. Then, the lifting cylinder 22 is activated, driving the cylinder connecting plate 21 to move upward. The cylinder connecting plate 21 drives the gripper cylinder 20 to move upward, and the gripper cylinder 20 drives the cylinder clamp 19 to move upward, so as to move the pad protection device 2 towards the first disassembly and assembly station, so as to achieve the purpose of accurately positioning the pad protection device 2 before installation.

[0055] Example 4

[0056] like Figures 1 to 7 As shown, this embodiment provides a PCB pad protection system, including a transport line 1, on which a pad protection device 2 is placed, the pad protection device 2 including a magnetic snap-fit ​​3; a production line 4 is arranged near one side of the transport line 1, on which a PCB 5 is placed, and the production line 4 drives the PCB 5 to move; a disassembly and assembly mechanism 6 is respectively arranged at both ends of the production line 4 near the transport line 1, the disassembly and assembly mechanism 6 is used to change the adsorption state of the magnetic snap-fit ​​3, so that the magnetic snap-fit ​​3 adsorbs or releases the PCB 5.

[0057] The production line 4 is connected to two sides of a gantry support 23, and the disassembly and assembly mechanism 6 is connected to the gantry support 23. The disassembly and assembly mechanism 6 includes a push cylinder 24, which is mounted on the gantry support 23. A cylinder mounting plate 25 is connected below the push cylinder 24, and an electromagnet 26 is provided on the side of the cylinder mounting plate 25 away from the push cylinder 24.

[0058] It also includes a wave soldering device 27, through which the production line 4 passes. The wave soldering device 27 is provided with the disassembly and assembly mechanism 6 on both sides. The wave soldering device 27 is used to perform wave soldering on the pads of the power module on the PCB 5.

[0059] A blocking cylinder 28 is provided above the production line 4. The blocking cylinder 28 is used to block two adjacent PCBs 5 on the production line 4 to control the flow time interval of the PCB 5 boards.

[0060] When the production line 4 moves the PCB5 to the first assembly / disassembly station, the blocking cylinder 28 is activated, and its lever extends to stop the PCB5 from moving further, thus stopping the PCB5 at the first assembly / disassembly station. Then, the lifting cylinder 22 moves the pad protection device 2 upward to the first target position. At the same time, the pushing cylinder 24 of the first assembly / disassembly mechanism 6 is activated, which moves the cylinder mounting plate 25 downward, thereby moving the electromagnet 26 downward to the second target position. The second target position is the contact position between the electromagnet 26 and the magnetic latch 3, and it is located above the first target position.

[0061] Next, power is supplied to electromagnet 26. After electromagnet 26 is energized, it begins to attract magnetic clip 3. The working state of magnetic clip 3 changes from a state of no attraction to a state of attraction, and the moving position of magnetic clip 3 changes. At the same time, the lifting cylinder 22 drives the pad protection device 2 to continue to move upward, thereby driving magnetic clip 3 to move upward. During the upward movement, magnetic clip 3 engages with the mounting hole of PCB 5 until it moves to the second target position and contacts electromagnet 26.

[0062] Then, power supply to electromagnet 26 is stopped. After electromagnet 26 is de-energized, it no longer attracts magnetic clip 3. The working state of magnetic clip 3 changes from attracted to unattached. The movable clip of magnetic clip 3 returns to its initial position, and pad protection device 2 is fixed on PCB5. At this time, the stop lever of blocking cylinder 28 retracts and no longer blocks PCB5. Production line 4 drives PCB5 to continue moving forward. At the same time, the push cylinder 24 of the first disassembly and assembly mechanism 6 moves upward, driving cylinder mounting plate 25 to its initial position. After pad protection device 2 is fixed on PCB5, gripper cylinder 20 drives cylinder clamp 19 to move, causing cylinder clamp 19 to release pad protection device 2. Then, lifting cylinder 22 moves downward, returning to the initial position.

[0063] Production line 4 drives PCB5, with pad protection device 2 installed, to continue moving forward. When passing wave soldering device 27, wave soldering device 27 performs wave soldering on the pads of the power module on PCB5, and pad protection device 2 protects the pads of the power module on PCB5. After wave soldering, PCB5 continues to move to the second disassembly / reassembly station. Blocking cylinder 28 extends to stop PCB5 from moving further, keeping PCB5 at the second disassembly / reassembly station. The pushing cylinder 24 of the second disassembly / reassembly mechanism 6 is activated, pushing cylinder 24 to move cylinder mounting plate 25 downward until the electromagnet 26 of cylinder mounting plate 25 contacts the magnetic latch 3. Power is supplied to electromagnet 26, and after electromagnet 26 is energized, it begins to attract magnetic latch 3, changing the position of the magnetic latch 3 and causing magnetic latch 3 to detach from PCB5. When the magnetic clip 3 detaches from the PCB5, the power supply to the electromagnet 26 stops, and the electromagnet 26 no longer attracts the magnetic clip 3. The pad protection device 2 falls onto the transport line 1 under the action of gravity. The transport line 1 drives the pad protection device 2 to the discharge port 18 to be provided to the first disassembly and assembly mechanism 6 for installation and use, so as to realize the reuse of the pad protection device 2.

[0064] In this embodiment, the production line 4 is connected to gantry supports 23 on both sides, and the disassembly / assembly mechanism 6 is connected to the gantry supports 23. The disassembly / assembly mechanism 6 includes a pushing cylinder 24, which is mounted on the gantry supports 23. A cylinder mounting plate 25 is connected below the pushing cylinder 24, and an electromagnet 26 is provided on the side of the cylinder mounting plate 25 away from the pushing cylinder 24. It also includes a wave soldering device 27, through which the production line 4 passes. The disassembly / assembly mechanism 6 is provided on both sides of the wave soldering device 27. The wave soldering device 27 is used to perform wave soldering on the pads of the power modules on the PCB 5. A blocking cylinder 28 is provided above the production line 4 to block two adjacent PCBs 5 on the production line 4, thereby controlling the flow time interval of the PCB 5 boards. After the blocking cylinder 28 blocks the PCB5, the first disassembly and assembly mechanism 6 installs the pad protection device 2 on the PCB5. This ensures that the pads of the power module on the PCB5 are protected during wave soldering by the wave soldering device 27, guaranteeing the product quality of the PCB5. After wave soldering, the blocking cylinder 28 blocks the PCB5 again, and the second disassembly and assembly mechanism 6 removes the pad protection device 2 from the PCB5. Under gravity, the pad protection device 2 falls onto the transport line 1, which then moves it to the outlet 18 for installation by the first disassembly and assembly mechanism 6, thus enabling the reuse of the pad protection device 2. By energizing and de-energizing the electromagnet 26 of the disassembly and assembly mechanism 6, the magnetic snap-fit ​​3 is activated, allowing for rapid disassembly and installation of the pad protection device 2 on the PCB5. This not only reduces labor costs but also significantly improves production efficiency.

[0065] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application. Any specific values ​​in all examples shown and discussed herein should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0066] It should be understood that spatial relative terms are intended to encompass different orientations of a device in use or operation, in addition to the orientation described in the figures. For example, if a device in the figures is inverted, a device described as "above" or "on top of" other devices or structures will subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below". The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0067] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0068] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A solder pad protection system for a PCB, characterized by, The application relates to a PCB production line, which comprises a conveying line, a solder pad protection device arranged on the conveying line, a production line arranged near one side of the conveying line, a PCB arranged on the production line, and a dismounting mechanism arranged on the production line near both ends of the conveying line.

2. The pad protection system of a PCB according to claim 1, wherein, The magnetic buckle comprises a sliding assembly and a connecting rod assembly, the sliding assembly is hinged to the connecting rod assembly, and the sliding assembly drives the connecting rod assembly to move so as to stretch or fold the connecting rod assembly.

3. The pad protection system of a PCB of claim 2, wherein, The sliding assembly comprises a guide column, and a sliding block is sleeved on the guide column; the sliding block is hinged to the connecting rod assembly on both sides, and the sliding block moves along the axial direction of the guide column to change the working state of the connecting rod assembly.

4. The pad protection system of claim 3, wherein, The sliding assembly further comprises a fixed block and a buckle shell, the fixed block is fixedly connected to the inner side of the buckle shell, and the guide column penetrates through the fixed block.

5. The pad protection system of claim 4, wherein, The connecting rod assembly comprises a first connecting rod and a second connecting rod, the first connecting rod is provided with a first connecting end and a second connecting end on both sides respectively, the second connecting rod is provided with a third connecting end and a fourth connecting end on both sides respectively; the first connecting end is hinged to the sliding block, the second connecting end is hinged to the third connecting end, and the fourth connecting end is hinged to the fixed block.

6. The pad protection system of the PCB of claim 1, wherein, The solder pad protection device further comprises a protection tool, the magnetic buckle is inserted into the protection tool, and the protection tool is used for protecting the solder pad of the PCB.

7. The solder pad protection system for a PCB of claim 1, wherein, Both ends of the conveying line are provided with a guide mechanism, the guide mechanism comprises two oppositely arranged guide frames, and a discharging port is formed between the two guide frames.

8. The solder pad protection system for a PCB of claim 7, wherein, A cylinder clamp is arranged near the discharging port, a clamping cylinder is connected below the cylinder clamp, a cylinder connecting plate is connected to the clamping cylinder, and a lifting cylinder is connected below the cylinder connecting plate.

9. The solder pad protection system for a PCB of claim 1, wherein, Both sides of the production line are connected with a gantry support, the dismounting mechanism is connected to the gantry support, the dismounting mechanism comprises a pushing cylinder, the pushing cylinder is arranged on the gantry support, a cylinder mounting plate is connected below the pushing cylinder, and an electromagnet is arranged on the side of the cylinder mounting plate away from the pushing cylinder.

10. The pad protection system of the PCB of claim 1, wherein, The production line further comprises a wave soldering device, the production line passes through the wave soldering device, the wave soldering device is provided with the dismounting mechanism on both sides, and the wave soldering device is used for wave soldering the solder pad of a power module on the PCB.

11. The solder pad protection system for a PCB of claim 1, wherein, A blocking cylinder is arranged above the production line, the blocking cylinder is used for blocking adjacent two PCBs on the production line to control the flow time interval of the PCBs.

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