Glue melting machine for printed circuit board
By introducing a limiting mechanism and a buffer holding structure into the melting glue machine, the problems of insufficient buffering of the holding force and inaccurate positioning of the core board are solved, achieving precise positioning and flexible holding of the core board, and improving the processing efficiency and quality of printed circuit boards.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-03-06
AI Technical Summary
Existing melt glue machines cannot buffer the holding force when pressing the core board, which can easily lead to deformation and damage of the core board. In addition, the core board is not placed accurately, which reduces processing efficiency.
A melt glue machine for printed circuit boards was designed, including a limiting mechanism and a buffer holding structure. The limiting mechanism achieves precise positioning of the core board through a T-shaped plate and a hydraulic push rod, while the buffer holding structure achieves flexible holding through an electric push rod, a cross plate and a buffer spring to avoid damage to the core board.
It achieves precise positioning and flexible pressing of the core board, improves bonding efficiency, avoids deformation and damage of the core board, and ensures the stability and precision of the pressing process.
Smart Images
Figure CN223978840U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of printed circuit board manufacturing technology, and in particular to a melt glue machine for printed circuit boards. Background Technology
[0002] Printed circuit boards are typically composed of multiple core layers. These core layers are made of a variety of materials, including fiberglass cloth substrates and paper-based copper-clad laminates. During the production of printed circuit boards, the core layers are pressed and bonded using a melt adhesive process. Furthermore, the melting time and temperature must be strictly controlled during the melt adhesive process to prevent the boards from deforming due to excessive heat.
[0003] Current melt glue machines require pressing the stacked core boards after melting the prepreg to bond them together. However, they cannot buffer the pressing force applied to the core boards. Excessive pressing force can easily cause deformation and damage to the core boards. Furthermore, when placing the stacked core boards under the pressure plate for pressing, it is difficult for operators to accurately place them directly under the pressure plate in one go, which reduces the bonding efficiency of printed circuit board processing. To address this, we provide a melt glue machine for printed circuit boards. Utility Model Content
[0004] This utility model provides a melt glue machine for printed circuit boards to solve the technical problems existing in the background art.
[0005] The purpose and effect of this utility model for a melt glue machine for printed circuit boards are achieved by the following specific technical means: A melt glue machine for printed circuit boards includes a frame, a tray and a burner disposed on the frame, a limiting mechanism for positioning stacked core boards is provided on the frame, a buffer holding structure is provided on the top of the frame, the buffer holding structure includes a frame plate fixedly connected to the inner side of the top of the frame and a buffer structure disposed below the frame plate, an electric push rod is installed on the bottom surface of the frame plate, the telescopic end of the electric push rod is connected to a pressure plate through the buffer structure, and a flexible pad is fixedly connected to the bottom surface of the pressure plate.
[0006] Preferably, the limiting mechanism includes a T-shaped plate slidably connected to the pallet and a hydraulic push rod installed on the bottom surface of the pallet, wherein the telescopic end of the hydraulic push rod is connected to the front surface of the T-shaped plate.
[0007] Preferably, two limiting plates are slidably connected to the T-shaped plate, and a dual-head motor is installed on the back of the T-shaped plate. Each of the two output ends of the dual-head motor is equipped with a threaded rod, and the outer surface of each threaded rod is threadedly connected to the limiting plate.
[0008] Preferably, an arc-shaped guide plate is fixedly connected to the front side of each of the limiting plates.
[0009] Preferably, the buffer structure of the buffer holding structure includes a cross plate installed on the telescopic end of the electric push rod, and two sets of sliding columns are slidably connected on the cross plate, with a buffer spring sleeved on the outside of each sliding column.
[0010] Preferably, a baffle is fixedly connected to the top of each sliding column, and the bottom surface of each baffle is in contact with the upper surface of the cross plate.
[0011] Preferably, the bottom surface of the frame plate is fixedly connected with two sets of guide columns, each guide column is fitted with a guide cylinder, and the bottom end of each guide cylinder is connected to the upper surface of the pressure plate.
[0012] Beneficial effects:
[0013] 1. Through the setting of the limiting mechanism, the placement area on the tray can be adjusted according to the different sizes of the core board, so that the workers can place the core board in a precise position, further improving the bonding efficiency between the core boards. Through the setting of the buffer holding structure, the pressure plate and the core board can make flexible contact, and the pressure applied by the pressure plate to the core board can be buffered, thereby avoiding damage to the core board.
[0014] 2. The guide columns and guide cylinders can guide the lifting and lowering of the pressure plate, effectively avoiding problems such as shaking and deviation during the movement of the pressure plate, thus ensuring that the pressure plate can accurately press the core plates between the layers. The arc-shaped guide plate can guide the movement direction of the core plates, allowing them to smoothly enter between the limiting plates. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model.
[0016] Figure 2 This is a three-dimensional structural schematic diagram of the pallet of this utility model, shown in a cross-sectional view.
[0017] Figure 3 This is a three-dimensional structural schematic diagram of the rear view of the T-shaped plate of this utility model.
[0018] Figure 4 This is a three-dimensional structural diagram of the buffer and pressure holding structure of this utility model.
[0019] Figure 1-4 In the diagram, the correspondence between component names and drawing numbers is as follows:
[0020] 1. Frame; 2. Support plate; 3. Limiting mechanism; 301. T-shaped plate; 302. Hydraulic push rod; 303. Limiting plate; 304. Dual-head motor; 305. Threaded rod; 306. Arc-shaped guide plate; 4. Burner; 5. Buffer and holding structure; 501. Support plate; 502. Electric push rod; 503. Pressure plate; 504. Flexible pad; 505. Cross plate; 506. Sliding column; 507. Buffer spring; 508. Baffle; 509. Guide column; 510. Guide cylinder. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.
[0022] As attached Figure 1 As shown: A melt glue machine for printed circuit boards includes a frame 1, a tray 2 disposed on the frame 1, and a burner 4. The burner 4 can be used to heat and melt the prepreg, thereby enabling the prepreg to bond between the core layers.
[0023] As attached Figure 1 Appendix Figure 2 With appendix Figure 3 As shown: Frame 1 is equipped with a limiting mechanism 3 for positioning stacked core boards. The limiting mechanism 3 includes a T-shaped plate 301 slidably connected to the support plate 2 and a hydraulic push rod 302 installed on the bottom surface of the support plate 2. The telescopic end of the hydraulic push rod 302 is connected to the front of the T-shaped plate 301. The telescopic movement of the hydraulic push rod 302 can drive the T-shaped plate 301 to move, thereby fixing the position of the placed core board on the rear side. Two limiting plates 303 are slidably connected to the T-shaped plate 301. A dual-head motor 304 is installed on the back of the T-shaped plate 301. Both output ends of the dual-head motor 304 are equipped with threaded rods 305. The threads of the 5 are opposite in direction. The outer surface of each threaded rod 305 is threadedly connected to the limiting plate 303. The operation of the double-headed motor 304 can drive the threaded rod 305 to rotate. At the same time, the two limiting plates 303 will move closer or further apart, thereby positioning the left and right sides of the core board. This makes it easier for the staff to place the core board. Each limiting plate 303 has an arc-shaped guide plate 306 fixedly connected to its front. When the staff places the core board in the designated position, the arc-shaped guide plate 306, with its unique curvature, can guide the movement direction of the core board, allowing it to smoothly enter the space between the limiting plates 303.
[0024] As attached Figure 1 With appendix Figure 4 As shown: A buffer holding structure 5 is provided at the top of the frame 1. The buffer holding structure 5 includes a frame plate 501 fixedly connected to the inner side of the top of the frame 1 and a buffer structure provided below the frame plate 501. An electric push rod 502 is installed on the bottom surface of the frame plate 501. The telescopic end of the electric push rod 502 is connected to a pressure plate 503 through the buffer structure. The buffer structure of the buffer holding structure 5 includes a cross plate 505 installed at the telescopic end of the electric push rod 502. Two sets of sliding columns 506 are slidably connected on the cross plate 505. Each sliding column 506 is fitted with a buffer spring 507. When the electric push rod 502 extends, it can push the cross plate 505. The cross plate 505 will push the buffer spring 507 and the pressure plate 503 to descend. The pressure plate 503 will press against the core board. As the electric push rod 502 continues to extend, the cross plate 505 will compress the buffer spring 507. During the compression process, it can... The buffer spring 507 effectively absorbs and disperses the pressure applied to the core plate. During this process, the buffer spring 507 transforms the rigid pressure output by the electric push rod 502 into a uniform and gentle force through its own elastic buffering mechanism, avoiding deformation and damage to the core plate due to excessive instantaneous pressure or uneven pressure distribution. Each sliding column 506 has a baffle 508 fixedly connected to its top, and the bottom surface of each baffle 508 is in contact with the upper surface of the cross plate 505. The baffle 508 can limit the sliding column 506, thereby preventing the sliding column 506 from separating from the cross plate 505. The bottom surface of the pressure plate 503 is fixedly connected to a flexible pad 504. The flexible pad 504 is made of high-temperature resistant silicone. When the pressure plate 503 descends to press the core plate, the flexible pad 504 will form a flexible contact with the core plate, effectively avoiding scratches and damage caused by hard collisions between the pressure plate 503 and the core plate.
[0025] As attached Figure 1 With appendix Figure 4 As shown: Two sets of guide posts 509 are fixedly connected to the bottom surface of the frame plate 501. Each guide post 509 is fitted with a guide cylinder 510. The bottom end of each guide cylinder 510 is connected to the upper surface of the pressure plate 503. By using the cooperation of the guide post 509 and the guide cylinder 510, the pressure plate 503 can be positioned and guided, ensuring that the pressure plate 503 always moves up and down along the predetermined vertical direction, effectively avoiding deviation or shaking caused by lateral force, and allowing the pressure plate 503 to be accurately positioned to the target position during each pressing operation.
[0026] Working principle: First, the T-shaped plate 301 and the limiting plate 303 are adjusted according to the stacked core boards. The hydraulic push rod 302 is controlled to push the T-shaped plate 301 to slide. Then, the double-head motor 304 is started to drive the threaded rod 305 to rotate. At the same time, the limiting plate 303 moves, which restricts the placement of the stacked core boards, making it more convenient for workers to place the stacked core boards. When pressing between the core boards, the electric push rod 502 is extended. The electric push rod 502 pushes the cross plate 505, which pushes the pressure plate 503 down. The flexible pad 504 will first contact the core board, and then the electric push rod 502 will extend. 2. As it continues to extend, the cross plate 505 will move further downward, compressing the buffer spring 507 installed below it. The buffer spring 507 has good elastic properties and will undergo elastic deformation when subjected to the pressure of the cross plate 505, effectively buffering the downward pressure applied to the core plate, thereby preventing damage to the core plate. Finally, the burner 4 is controlled to work, and the high-temperature airflow quickly acts on the prepreg, causing its temperature to rise rapidly. After being heated, the resin inside the prepreg begins to soften and melt, gradually exhibiting good fluidity. The prepreg can evenly fill the tiny gaps between the core plates and adhere tightly to the surface of the core plate.
Claims
1. A hot-melt glue machine for printed circuit boards, comprising a frame (1), a support plate (2) and a burner (4) arranged on the frame (1), characterized in that: The frame (1) is provided with a limiting mechanism (3) for positioning the stacked layer core board, the top of the frame (1) is provided with a buffer pressing structure (5), the buffer pressing structure (5) comprises a shelf plate (501) fixedly connected to the inner side surface of the top of the frame (1) and a buffer structure arranged below the shelf plate (501), the bottom surface of the shelf plate (501) is provided with an electric push rod (502), the telescopic end of the electric push rod (502) is connected with a pressing plate (503) through the buffer structure, and the bottom surface of the pressing plate (503) is fixedly connected with a flexible pad (504).
2. The paste dispenser according to claim 1, wherein: The limiting mechanism (3) comprises a T-shaped plate (301) slidably connected to the supporting plate (2) and a hydraulic push rod (302) installed on the bottom surface of the supporting plate (2), and the telescopic end of the hydraulic push rod (302) is connected with the front surface of the T-shaped plate (301).
3. The paste dispenser according to claim 2, wherein: The T-shaped plate (301) is slidably connected with two limiting plates (303), and the back surface of the T-shaped plate (301) is provided with a double-head motor (304), both output ends of the double-head motor (304) are provided with threaded rods (305), and the outer surfaces of the threaded rods (305) are threadedly connected with the limiting plates (303).
4. The paste dispenser according to claim 3, wherein: The front surface of each limiting plate (303) is fixedly connected with an arc-shaped guide plate (306).
5. The paste dispenser according to claim 1, wherein: The buffer structure of the buffer pressing structure (5) comprises a cross plate (505) installed on the telescopic end of the electric push rod (502), two groups of slide columns (506) are slidably connected to the cross plate (505), and the outer portions of the slide columns (506) are sleeved with buffer springs (507).
6. The paste dispenser according to claim 5, wherein: The top end of each slide column (506) is fixedly connected with a baffle (508), and the bottom surface of each baffle (508) is in contact with the upper surface of the cross plate (505).
7. The paste dispenser according to claim 1, wherein: The bottom surface of the shelf plate (501) is fixedly connected with two groups of guide columns (509), the outer portions of the guide columns (509) are sleeved with guide cylinders (510), and the bottom ends of the guide cylinders (510) are connected with the upper surface of the pressing plate (503).